CN114551276A - Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device - Google Patents

Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device Download PDF

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Publication number
CN114551276A
CN114551276A CN202111259103.6A CN202111259103A CN114551276A CN 114551276 A CN114551276 A CN 114551276A CN 202111259103 A CN202111259103 A CN 202111259103A CN 114551276 A CN114551276 A CN 114551276A
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CN
China
Prior art keywords
package
horizontal direction
unit
drying
chamber
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Pending
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CN202111259103.6A
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Chinese (zh)
Inventor
李龙焕
李济秀
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN114551276A publication Critical patent/CN114551276A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

Embodiments of the invention provide a semiconductor tape cutting and sorting apparatus, a package drying device and a carrying device. A package drying apparatus according to an embodiment of the present invention is for drying singulated packages in a semiconductor tape cutting and sorting apparatus, wherein the package drying apparatus includes: a flipping table that adsorbs the package and can rotate upward or downward; a chamber disposed below the flipping table and configured to accommodate the moisture scattered from the package; an upper air injection unit configured to be movable in a horizontal direction inside the chamber and inject air toward the package; and a suction unit disposed at a lower end of the chamber to suck the moisture.

Description

Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device
Technical Field
The present invention relates to a package drying device in a semiconductor tape cutting and sorting apparatus, and more particularly, to a device for rapidly and efficiently drying singulated packages.
Background
Semiconductor manufacturing processes include, for example, exposure, evaporation, etching, ion implantation, cleaning, and the like as processes for manufacturing semiconductor elements on a wafer. The semiconductor tape cutting and sorting apparatus cuts and singulates a tape in which a plurality of packages are arranged in package units, and sorts and loads the tape into trays, which are final storage containers, in a normal or defective state by cleaning, drying, and inspecting each package.
Inspection of each package is performed by a visual inspection apparatus such as a camera, and for precise inspection, each package needs to remove foreign matter that may hinder the inspection. Since the cleaning liquid used for cleaning the cut packages may also be an obstacle in the inspection process, it is necessary to manage so that the cleaning liquid does not remain in the packages.
Disclosure of Invention
Accordingly, embodiments of the present invention provide a package drying device capable of quickly and efficiently removing a cleaning solution remaining in singulated semiconductor packages, and a semiconductor tape cutting and sorting apparatus having the package drying device.
The problem to be solved by the present invention is not limited to the above-mentioned problem, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.
A package drying apparatus according to an embodiment of the present invention is for drying singulated packages in a semiconductor tape cutting and sorting apparatus, wherein the package drying apparatus includes: a flipping table that adsorbs the package and can rotate upward or downward; a chamber disposed below the flipping table and configured to accommodate the moisture scattered from the package; an upper air injection unit configured to be movable in a horizontal direction inside the chamber and inject air toward the package; and a suction unit disposed at a lower end of the chamber to suck the moisture.
According to an embodiment of the present invention, the inverting table may suck the package in an upward state and rotate downward in the upward state to guide moisture of the package to drop to the chamber.
According to an embodiment of the present invention, the turn table may have a first length along a first horizontal direction and a second length longer than the first length along a second horizontal direction orthogonal to the first horizontal direction, and the upper air injection unit may be configured to move along the first horizontal direction.
According to an embodiment of the present invention, it may be that the upper air injection unit includes: a housing; an air inlet formed at one side of the housing; a heater disposed around the air inlet inside the housing; a heat conductive film transferring heat energy generated from the heater; and an exhaust port formed at the other side of the case.
According to an embodiment of the present invention, the exhaust port may include: a first discharge port formed in a vertical direction perpendicular to the horizontal direction; a second discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a first horizontal direction; and a third discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a direction opposite to the first horizontal direction.
According to an embodiment of the present invention, the package drying apparatus may further include: and side air injection units respectively arranged on both side surfaces of the chamber and injecting air downward.
According to an embodiment of the present invention, the package drying apparatus may further include: a dividing wall located above the suction unit inside the chamber.
According to the embodiment of the invention, the cavity for containing the moisture is arranged below the overturning platform for sucking the packaging body, and the upper air injection unit and the suction unit are formed in the cavity, so that the moisture of the packaging body can be quickly and effectively removed.
The effects of the present invention are not limited to the above-mentioned ones, and other effects not mentioned can be clearly understood by those skilled in the art from the following descriptions.
Drawings
Fig. 1 shows a schematic structure of a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention.
Fig. 2 and 3 show the inverting table in a state where the package is sucked.
Fig. 4 illustrates a package drying apparatus according to an embodiment of the present invention.
Fig. 5 and 6 illustrate an arrangement and a moving direction of the package drying device according to the embodiment of the present invention.
Fig. 7a and 7b illustrate an upper air injection unit according to an embodiment of the present invention.
Fig. 8 illustrates a package drying apparatus according to another embodiment of the present invention.
Fig. 9 to 12 illustrate a drying and inspection process of a package according to an embodiment of the present invention.
Fig. 13 illustrates a drying process of a package according to still another embodiment of the present invention.
(description of reference numerals)
100: the loading unit 200: cutting unit
205: temporary storage unit 210: tape picker
220: picking up the data 230: guide frame
240: the chuck 250: cutting knife
260: the cleaning unit 300: classification unit
310: the overturning platform 320: drying unit
330B: ball check unit 330M: mark inspection unit
340: first pallet driving part 341: first pallet
345: second pallet driving part 346: second pallet table
350: first discharge tray driving unit 351: first carrying out tray
352: second carry-out tray 355: carry-out tray driving part
356: second carry-out tray 360: inspection section
370: the sorting picker 380: sorting picker driving component
800: a classification part P: semiconductor package
S: semiconductor strip
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the art to which the present invention pertains can easily carry out the embodiments. The invention may be implemented in various different ways and is not limited to the embodiments described herein.
In order to clearly explain the present invention, portions that are not related to the description are omitted, and the same or similar constituent elements are denoted by the same reference numerals throughout the specification.
In addition, in the embodiments, only the representative embodiment will be described using the same reference numerals for constituent elements having the same structure, and only the structure different from the representative embodiment will be described in the other embodiments.
In the entire specification, when it is stated that a certain portion is "connected (or coupled)" to another portion, it includes not only a case of "directly connecting (or coupled)" but also a case of "indirectly connecting (or coupled)" with another portion interposed therebetween. In addition, when a certain portion is "included" in a certain constituent element, unless otherwise stated, it means that other constituent elements may be included instead of excluding other constituent elements.
Unless otherwise defined, all terms used herein including technical and scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 shows a schematic structure of a semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention. Referring to fig. 1, a semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100, a cutting unit 200, and a sorting unit 300.
The semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100 that loads a semiconductor tape S configured with a plurality of packages, a cutting unit 200 that cuts the semiconductor tape S and conveys the singulated packages P, and a sorting unit 300 that dries and inspects the packages P and receives them in a tray.
The loading unit 100 transfers the semiconductor strip S transferred from the outside to the temporary storage unit 205 of the cutting unit 200. Although not shown in detail in fig. 1, the loading unit 100 may include a magazine for loading the semiconductor strips S and a pusher for pushing and transferring the semiconductor strips S. The semiconductor strips S supplied to the loading unit 100 may be located at the temporary storage unit 205.
The tape picker 210 holds the semiconductor tape S located in the temporary storage unit 205 and transfers the semiconductor tape S to the chuck 240. The package pickup 220 holds the package P cut by the cutter 250 and transferred by the chuck 240 by a vacuum suction method, and transfers the package P to the cleaning unit 260 and the inverting stage 310. The guide 230 provides a path for the tape picker 210 and the package picker 220 to move in the X-axis direction. The guide frame 230 may be coupled with a driving part for moving the tape picker 210 and the package picker 220.
The chuck 240 may transfer the semiconductor strip S and the packages P between the strip picker 210 and the cutter 250 and between the cutter 250 and the package picker 220, respectively. The chuck 240 may move in the Y-axis direction and may rotate centering on the Z-axis direction, and may mount the semiconductor strip S. The chuck 240 sucks the semiconductor strip S transferred by the strip picker 210 and transfers it toward the cutter 250. In addition, the chuck 240 transfers the plurality of packages P cut by the cutter 250 to the package picker 220. That is, the chuck 240 may reciprocate between the cutting knife 250 and the first guide 230. The package pickup 220 may adsorb the semiconductor packages P washed in the washing unit 260 and transfer the semiconductor packages P to the flipping table 310, and the semiconductor packages P transferred to the flipping table 310 may be dried by the drying unit 320. The flipping table 310 may be moved along a second guide frame 315.
The sorting unit 300 sorts the semiconductor packages P according to the inspection result for each semiconductor package P. The sorting unit 300 may be referred to as a carrying device for carrying the singulated packages P. More specifically, the sorting unit 300 picks up the semiconductor packages P loaded on the first and second pallet stages 341 and 346 upon completion of the inspection by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 independently, sorts them in order according to the inspection result, and transfers them to other places. First pallet table 341 and second pallet table 346 may be moved by first pallet driving part 340 and second pallet driving part 345, respectively.
The sorting unit 300 for this may include a sorting pickup 370, a sorting pickup driving part 380, a first carry-out tray 351, a second carry-out tray 356, a first carry-out tray driving part 350, and a second carry-out tray driving part 355.
The sorting picker 370 picks up the semiconductor packages P loaded on the first pallet 341 and the second pallet 346 by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 and transfers the semiconductor packages P to a first carry-out tray 351 and a second carry-out tray 356, which will be described later.
The sorting pickup driving part 380 may be formed in a rail shape and disposed along the X-axis direction, a portion of which is disposed adjacent to the alignment checking unit 360. The sorting pickup driving part 380 moves the sorting pickup 370 in the X-axis direction. The sorting picker driving part 380 for this purpose may be built in with a driving tool for moving the sorting picker 370.
The first and second carry-out trays 351 and 356 can be loaded with the non-defective semiconductor packages P and the non-defective semiconductor packages P, respectively, and carried out to other places. In contrast, first carry-out tray 351 and second carry-out tray 356 may be loaded with semiconductor packages P rated according to the manufacturing state. For example, the first carry-out tray 351 may be loaded with a level a semiconductor packages P, and the second carry-out tray 356 may be loaded with a level B semiconductor packages P whose manufacturing state is lower than the level a.
When the sorting picker 370 picks up the semiconductor packages P from the first pallet 341 and the second pallet 346 and loads them on the first carry-out tray 351 or the second carry-out tray 356, the first carry-out tray 351 or the second carry-out tray 356 moves in the Y-axis direction and transfers the semiconductor packages P to another place.
The first discharge tray driving unit 350 moves the first discharge tray 351. The first carry-out tray driving member 350 may incorporate a driving tool for moving the first carry-out tray 351.
The second discharge tray driving unit 355 moves the second discharge tray 356. The second carry-out tray driving member 355 may have a driving tool built therein for moving the second carry-out tray 356.
The semiconductor strip cutting and sorting apparatus 10 may sort and discharge the semiconductor strips S to other places after cutting, washing, drying and inspection as described above. On the other hand, the package pickup 220 according to the embodiment of the present invention is not limited to be included in the semiconductor tape cutting and sorting apparatus 10, and may be applied to a general semiconductor package manufacturing system. Hereinafter, an apparatus and a method for rapidly and efficiently drying the package P in the drying unit 320 using the cleaning liquid in the cleaning unit 260 will be described.
Generally, the semiconductor strip S and the package P are composed of a spherical surface B on which balls (balls) for electrical connection are formed and a mark surface M on which a mark of each package P is engraved. On the other hand, a state in which the spherical surface B of the package P faces upward and the mark surface M faces downward is referred to as Dead Bug (Dead Bug), and a state in which the mark surface M of the package P faces upward and the spherical surface B faces downward is referred to as Live Bug (Live Bug). The cutting and cleaning processes in the cutting unit 200 are performed in a dead-worm state in which the spherical surface B faces upward, and the respective packages P are transferred to the flipping table 310 through the package pickup 220 in the dead-worm state.
Referring to fig. 2 (a) and 3 (a), the flipping table 310 includes: a peripheral frame 311 movable in the horizontal direction; an adsorption stage 312 for adsorbing and fixing the package P; and a rotation shaft 313 that rotates the suction table 312 with respect to the peripheral frame 311. The suction table 312 may rotate around the rotation axis 313 with the mark surface M of the package P sucked, so that the spherical surface B of the package P faces upward as shown in fig. 2 (a), or so that the spherical surface B of the package P faces downward as shown in fig. 3 (B).
According to the embodiment of the present invention, in a state where the package P is directed downward as in fig. 3, drying is performed and air is sprayed upward from below, so that the cleaning liquid remaining in the package P is separated from the package P by gravity and the pressure of the air. In addition, according to the embodiment of the present invention, the container accommodating the cleaning liquid separated from the package P is disposed below and the cleaning liquid is sucked at the lower end, so that the cleaning liquid can be quickly and efficiently collected and discharged. Hereinafter, a drying apparatus for the package P according to an embodiment of the present invention will be described in detail.
Fig. 4 illustrates a package drying apparatus according to an embodiment of the present invention. Referring to fig. 4, in the semiconductor tape cutting and sorting apparatus 10 according to the embodiment of the present invention, a package drying device for drying singulated packages P includes: a flipping table 310 capable of adsorbing the package P and rotating to face upward or downward; a chamber 3210 disposed below the flipping table and configured to accommodate the moisture scattered from the package; an upper air injection unit 3220 configured to be movable in a horizontal direction (for example, x direction) inside the chamber 3210 and inject air toward the package P; and a pumping unit 3230 disposed at a lower end of the chamber 3210 to pump moisture.
As shown in fig. 2 and 3, the flipping table 310 includes: a peripheral frame 311 movable in the horizontal direction; an adsorption stage 312 for adsorbing and fixing the package P; and a rotation shaft 313 that rotates the suction table 312 with respect to the peripheral frame 311. The suction table 312 may rotate around the rotation axis 313 with the mark surface M of the package P sucked, so that the spherical surface B of the package P faces upward as shown in fig. 2 (a), or so that the spherical surface B of the package P faces downward as shown in fig. 3 (B).
According to the embodiment of the present invention, the flipping table 310 may suck the package P in an upward state and rotate downward in the state of sucking the package P to guide the moisture of the package P to fall toward the chamber 3210. Therefore, as compared with the case where drying is performed in a state where the spherical surface B of the package P faces upward as shown in fig. 2, the cleaning liquid drops into the chamber 3210 by gravity, and thus the cleaning liquid can be more effectively removed.
The cavity 3210, which is a container for receiving moisture from the package P, may be provided in a shape that is narrowed from top to bottom. An upper end of the chamber 3210 may be provided in an open form for containing the cleaning solution, and a lower end of the chamber 3210 may be connected to a suction unit 3230 drawing in the cleaning solution and a discharge line discharging the cleaning solution. On the other hand, a guide (not shown) for moving the upper air blowing unit 3220 in the horizontal direction may be formed in the chamber 3210.
According to an embodiment of the present invention, the package drying apparatus (the drying unit 320) may further include side air injection units 3240 respectively disposed at both side surfaces of the chamber 3210 to inject air downward. The moisture in the chamber 3210 is guided downward by the air injected through the side injection unit 3240, and thus the moisture remaining in the chamber 3210 can be sucked by the lower suction unit 3230 without being splashed upward.
In addition, the package drying device (drying unit 320) may further include a dividing wall 3250 inside the chamber 3210 above the suction unit 3230. The partition wall 3250 may include a partition wall formed in a vertical direction at a middle region of the chamber 3210 as shown in fig. 4 and a blocking wall formed above the partition wall, through which air injected by the side injection unit 3240 forms a vortex, which may guide moisture in the chamber 3210 not to be splashed upward but to be sucked by the suction unit 3230.
Fig. 5 and 6 illustrate an arrangement and a moving direction of the package drying device according to the embodiment of the present invention.
According to an embodiment of the present invention, the flipping table 310 may have a first length (e.g., 230mm) along a first horizontal direction (e.g., x-direction) and a second length (e.g., 330mm) longer than the first length along a second horizontal direction (e.g., y-direction) orthogonal with respect to the first horizontal direction. For example, as shown in fig. 5, the flipping table 310 may have a shape elongated in the y direction.
Here, the upper blowing unit 3220 may be configured to move in a first horizontal direction (e.g., x-direction). The upper air blowing unit 3220 may move along a guide disposed inside the chamber 3210, or may move together with the movement of the chamber 3210. As shown in fig. 5 and 6, the drying unit 320 is configured to be long in the second horizontal direction (for example, the y direction) and to be capable of reciprocating in the first horizontal direction (for example, the x direction), as represented by a chamber 3210 and an air blowing unit 3220. Therefore, the reciprocating movement path can be made shorter than the case of moving in the second horizontal direction (for example, the y direction), and the time required for drying can be shortened.
On the other hand, when drying is performed by one drying unit 320, the plurality of flipping tables 310 may be configured such that the drying unit 320 (chamber 3210) reciprocates in a first direction (for example, x direction) to dry the packages P as shown in fig. 13. In this case, the chamber 3210 and the upper air blowing unit 3220 are moved in the first direction (e.g., x direction) formed to be shorter than that in the second direction (e.g., y direction), so that the drying time can also be shortened.
Fig. 7a and 7b illustrate an upper air injection unit 3220 according to an embodiment of the present invention. As shown in fig. 7a, the upper air injection unit 3220 according to the embodiment of the present invention may include a case 3221, an air inlet 3222 formed at one side of the case 3221, a heater 3223 disposed around the air inlet 3222 in the interior of the case 3221, a heat conductive film 3224 transferring heat energy generated from the heater 3223, and an air outlet 3225 formed at the other side of the case 3221.
The housing 3221 may be formed long in the second direction (e.g., y direction) inside the chamber 3210, and may be configured to be movable in combination with a guide for moving in the first direction (e.g., x direction). An air inlet 3222 formed at one side of the case 3221 is connected to a line through which air flows, and the air flowing in through the air inlet 3222 is supplied to the inside of the case 3221. The heater 3223 applies thermal energy to the air supplied through the air inlet 3222, and the thermal conductive film 3224 uniformly transfers the thermal energy released by the heater 3223 to the space inside the case 3221. By the thermal energy, the air of high temperature may be discharged through the exhaust port 3225 to remove moisture from the package body P. According to the embodiment of the present invention, the upper air blowing unit 3220 blows the air of high temperature toward the package P, and the heat energy of the air of high temperature like a blower can evaporate and remove the moisture of the package P, so that the package P can be dried more rapidly and efficiently.
According to an embodiment of the present invention, as shown in fig. 7b, the exhaust port 3225 includes: a first outlet (3225A) formed in a vertical direction (for example, the z direction) perpendicular to the horizontal direction (for example, the x and y directions); a second discharge port 3225B formed in a direction inclined at a predetermined angle from a vertical direction (for example, the z direction) to a first horizontal direction (for example, the x direction); and a third discharge port 3225C formed in a direction inclined at an angle from the vertical direction (e.g., z-direction) to the opposite direction of the first horizontal direction (e.g., -x-direction). As shown in fig. 7b, the upper air blowing unit 3220 blows air not only in the vertical direction but also in an inclined direction through the air outlet 3225, and thus blows air also into a space where moisture is often condensed, such as a side surface of the package P, and can effectively remove moisture.
Fig. 8 illustrates a package drying apparatus according to another embodiment of the present invention. The package drying apparatus according to fig. 8 further includes an air curtain forming unit 3260 formed at both side surfaces of the cavity 3210 and forming an air curtain by injecting air upward. The air curtain forming unit 3260 discharges air in a vertical direction (e.g., z direction), and forms an air curtain so that the cleaning solution dropped by the air jetted by the upper air jetting unit 3220 does not escape to the outside. Since the cleaning liquid is contained in the chamber 3210 without being released to the outside, it is possible to prevent moisture from being scattered to devices around the drying unit 320, such as the ball check unit 330B.
In addition, in the semiconductor tape cutting and sorting apparatus 10 according to the embodiment of the present invention, the package conveyance device for conveying the singulated packages P includes: a flipping table 310 configured to attract the mark surface M of the package P downward in a state where the spherical surface B of the package P faces upward, and rotate the package P such that the spherical surface B faces downward; a drying unit 320 located below the flipping table 310 to dry the package P; a ball inspection unit 330B which is located below the flipping table 310 and inspects the spherical surface B of the package P; pallet tables 341 and 346 for accommodating the package P from the inverting table 310 in a state where the spherical surface B faces downward; and a mark inspection unit 330M located above the pallet tables 341, 346 to inspect the mark surface M of the package P. Here, the drying unit 320 may include: a chamber 3210 disposed below the flipping table 310 and configured to receive the moisture scattered from the package P; an upper air injection unit 3220 configured to be movable in a horizontal direction inside the chamber 3210 and inject air toward the package P; and a suction unit 3230 disposed at a lower end of the chamber 3210 to suck moisture.
The semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention includes: a loading unit 100 for loading a semiconductor strip S on which a plurality of packages are arranged; a cutting unit 200 for cutting the semiconductor strip S to transfer the singulated semiconductor packages; and a sorting unit 300 for drying and inspecting the semiconductor packages P and accommodating them in the trays 351 and 356. The classification unit 300 includes: a flipping table 310 configured to attract the mark surface M of the package P downward in a state where the spherical surface B of the package P faces upward, and rotate the package P such that the spherical surface B faces downward; a drying unit 320 located below the flipping table 310 to dry the package P; a ball inspection unit 330B which is located below the flipping table 310 and inspects the spherical surface B of the package P; pallet tables 341 and 346 for accommodating the package P from the inverting table 310 in a state where the spherical surface B faces downward; and a mark inspection unit 330M located above the pallet tables 341, 346 to inspect the mark surface M of the package P. Here, the drying unit 320 may include: a chamber 3210 disposed below the flipping table 310 and configured to receive the moisture scattered from the package P; an upper air injection unit 3220 configured to be movable in a horizontal direction inside the chamber 3210 and inject air toward the package P; and a suction unit 3230 disposed at a lower end of the chamber 3210 to suck moisture.
Fig. 9 to 12 illustrate a drying and inspection process of the package P according to an embodiment of the present invention. Referring to fig. 9, as described above, the package P is transferred to the flipping table 310, and the spherical surface B of the package P sucked by the flipping table 310 faces downward by the rotation of the flipping table 310. As described above, the drying unit 320 is located below the flipping table 310 to remove moisture from the package P.
Thereafter, as shown in fig. 10, the inspection of the package P is performed by the ball inspection unit 330B positioned below the flipping table 310, and when the inspection is completed, the flipping table 310 is positioned above the pallet tables 341 and 346 as shown in fig. 11. Thereafter, the inverting table 310 is lowered or the pallet tables 341 and 346 are raised to bring the pallet tables 341 and 346 into contact with the package P, and the vacuum suction of the inverting table 310 is released to place the package P on the pallet tables 341 and 346. At this time, the package P placed on the pallet stages 341 and 346 is in a live insect state with the label surface M facing upward. Thereafter, the pallet tables 341, 346 where the packages P are mounted are moved by the pallet driving parts 340, 345 while performing inspection by the mark inspection unit 330M located above.
According to an embodiment of the present invention, the drying by the drying unit 320 and the inspection by the ball inspection unit 330B are sequentially performed together. According to the embodiment of the present invention, by performing the inspection and the drying at once, the package P can be more rapidly transported, and finally, the processing efficiency of the package P can be increased.
Although the case where the flipping table 310 is one is illustrated in fig. 1, the flipping table 310 may be provided in plurality as the first flipping table 310-1 and the second flipping table 310-2. In this case, as shown in FIG. 13, the drying unit 320 may reciprocate along a first direction (e.g., x-direction) and dry the packages P adsorbed to the first and second flipping tables 310-1 and 310-2.
The present embodiment and the drawings attached to the present specification are merely part of the technical idea included in the present invention, and it is apparent that modifications and specific embodiments which can be easily derived by those skilled in the art within the scope of the technical idea included in the specification and the drawings are included in the scope of the right of the present invention.
Therefore, the inventive concept should not be limited to the described embodiments, but rather should be construed in breadth and scope in accordance with the appended claims, and any and all equivalents thereof.

Claims (20)

1. A package drying device for drying a singulated package in a semiconductor tape cutting and sorting apparatus, wherein the package drying device comprises:
a flipping table that adsorbs the package and can rotate upward or downward;
a chamber disposed below the flipping table and configured to accommodate the moisture scattered from the package;
an upper air injection unit configured to be movable in a horizontal direction inside the chamber and inject air toward the package; and
and a pumping unit disposed at a lower end of the chamber to pump the moisture.
2. The package drying apparatus according to claim 1,
the overturning platform sucks the packaging body in an upward state, and rotates downwards in the state of sucking the packaging body to guide the moisture of the packaging body to fall into the cavity.
3. The package drying apparatus according to claim 1,
the flipping table has a first length along a first horizontal direction and a second length longer than the first length along a second horizontal direction orthogonal with respect to the first horizontal direction,
the upper air injection unit is configured to move in the first horizontal direction.
4. The package drying apparatus according to claim 1,
the upper air injection unit comprises:
a housing;
an air inlet formed at one side of the housing;
a heater disposed around the air inlet inside the casing;
a heat conductive film transferring heat energy generated from the heater; and
and an exhaust port formed at the other side of the case.
5. The package drying apparatus according to claim 4,
the exhaust port includes:
a first discharge port formed in a vertical direction perpendicular to the horizontal direction;
a second discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a first horizontal direction; and
and a third discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a direction opposite to the first horizontal direction.
6. The package drying apparatus according to claim 1,
the package drying device further includes:
and side air injection units respectively arranged on both side surfaces of the chamber and injecting air downward.
7. The package drying apparatus according to claim 1,
the package drying device further includes:
a dividing wall located above the suction unit inside the chamber.
8. A package conveyance device for conveying singulated packages in a semiconductor tape cutting and sorting apparatus, wherein the package conveyance device comprises:
the overturning platform adsorbs the marking surface of the packaging body from the lower part in a state that the spherical surface of the packaging body faces upwards, and rotates to form that the spherical surface of the packaging body faces downwards;
a drying unit located below the flipping table to dry the package;
a ball inspection unit located below the flipping table to inspect the spherical surface of the package;
a pallet table for accommodating the package from the inverting table in a state where the spherical surface faces downward; and
a mark inspection unit which is located above the pallet and inspects a mark surface of the package,
the drying unit includes:
a chamber disposed below the flipping table and configured to accommodate the moisture scattered from the package;
an upper air injection unit configured to be movable in a horizontal direction inside the chamber and inject air toward the package; and
and a pumping unit disposed at a lower end of the chamber to pump the moisture.
9. The package handling apparatus of claim 8,
the overturning platform sucks the packaging body in an upward state, and rotates downwards in the state of sucking the packaging body to guide the moisture of the packaging body to fall into the cavity.
10. The package handling apparatus of claim 8,
the flipping table has a first length along a first horizontal direction and a second length longer than the first length along a second horizontal direction orthogonal with respect to the first horizontal direction,
the upper air injection unit is configured to move in the first horizontal direction.
11. The package handling apparatus of claim 8,
the upper air injection unit includes:
a housing;
an air inlet formed at one side of the housing;
a heater disposed around the air inlet inside the housing;
a heat conductive film transferring heat energy generated from the heater; and
and an exhaust port formed at the other side of the case.
12. The package handling apparatus of claim 11,
the exhaust port includes:
a first discharge port formed in a vertical direction perpendicular to the horizontal direction;
a second discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a first horizontal direction; and
and a third discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a direction opposite to the first horizontal direction.
13. The package handling apparatus of claim 8,
the drying unit further includes:
and side air injection units respectively arranged on two side surfaces of the chamber and injecting air downwards.
14. The package handling apparatus of claim 8,
the drying unit further includes:
a dividing wall located above the suction unit inside the chamber.
15. A semiconductor strip dicing and sorting apparatus comprising:
a loading unit for loading the semiconductor strip provided with a plurality of packages;
a cutting unit cutting the semiconductor strip and transferring the singulated semiconductor packages; and
a sorting unit drying and inspecting the semiconductor packages and housing the semiconductor packages in a tray,
the classification unit includes:
the overturning platform adsorbs the marking surface of the packaging body from the lower part in a state that the spherical surface of the packaging body faces upwards, and rotates to form that the spherical surface of the packaging body faces downwards;
a drying unit located below the flipping table to dry the package;
a ball inspection unit located below the flipping table to inspect the spherical surface of the package;
a pallet table for accommodating the package from the inverting table in a state where the spherical surface faces downward; and
a mark inspection unit which is positioned above the pallet and inspects a mark surface of the package,
the drying unit includes:
a chamber disposed below the flipping table and configured to contain the moisture scattered from the package;
an upper air injection unit configured to be movable in a horizontal direction inside the chamber and inject air toward the package; and
and a pumping unit disposed at a lower end of the chamber to pump the moisture.
16. The semiconductor tape cutting and sorting apparatus of claim 15,
the overturning platform sucks the packaging body in an upward state, and rotates downwards in the state of sucking the packaging body to guide the moisture of the packaging body to fall into the cavity.
17. The semiconductor tape cutting and sorting apparatus of claim 15,
the flipping table has a first length along a first horizontal direction and a second length longer than the first length along a second horizontal direction orthogonal with respect to the first horizontal direction,
the upper air injection unit is configured to move in the first horizontal direction.
18. The semiconductor tape cutting and sorting apparatus of claim 15,
the upper air injection unit includes:
a housing;
an air inlet formed at one side of the housing;
a heater disposed around the air inlet inside the housing;
a heat conductive film transferring heat energy generated from the heater; and
and an exhaust port formed at the other side of the case.
19. The semiconductor tape cutting and sorting apparatus of claim 18,
the exhaust port includes:
a first discharge port formed in a vertical direction perpendicular to the horizontal direction;
a second discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a first horizontal direction; and
and a third discharge port formed in a direction inclined at a predetermined angle from the vertical direction to a direction opposite to the first horizontal direction.
20. The semiconductor tape cutting and sorting apparatus of claim 15,
the drying unit further includes:
side air injection units respectively arranged on two side surfaces of the chamber and injecting air downwards; and
a dividing wall located above the suction unit inside the chamber.
CN202111259103.6A 2020-11-19 2021-10-28 Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device Pending CN114551276A (en)

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JPH07135193A (en) * 1993-11-09 1995-05-23 Hitachi Ltd Liquid removal device, testing device for semiconductor device and cooling device
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KR100799208B1 (en) * 2002-02-26 2008-01-29 삼성테크윈 주식회사 Method and apparatus for inspecting and sorting semiconductor package
JP2004273931A (en) * 2003-03-11 2004-09-30 Okutekku:Kk Substrate drier
KR20050118015A (en) * 2004-06-12 2005-12-15 삼성전자주식회사 Cleaning apparatus and method of csp sawing and sorting apparatus
KR100854436B1 (en) * 2006-11-20 2008-08-28 한미반도체 주식회사 Handling Apparatus for Semiconductor Package
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KR101414690B1 (en) * 2013-04-22 2014-07-08 한미반도체 주식회사 Semiconductor Strip Sawing Apparatus
KR20150076752A (en) * 2013-12-27 2015-07-07 세메스 주식회사 Apparatus for drying semiconductor packages
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