JP2001091582A - Electronic component vacuum chucking apparatus and electronic component tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an economical electronic component tester and an electronic component vacuum chucking apparatus which avoids failing in vacuum chucking of electronic components and reduces the vacuum chuck release time while preventing the electronic components from dewing in low temperature tests. SOLUTION: The vacuum chucking apparatus comprises a vacuum head 304c for vacuum chucking an IC, an ejector 305c for enabling the vacuum head 304c to vacuum chuck, a burst valve 305e for blowing air on the IC from the vacuum sucking head 304c to release the vacuum head 304c from vacuum chucking, and a dehumidifier unit 305c for dehumidifying the air to be blown on the IC from the vacuum head 304c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component tester for testing electronic components such as IC chips at a predetermined temperature and an electronic component suction device used for the same. The present invention relates to an economical electronic component test device and an electronic component suction device that can prevent an electronic component from being sucked erroneously and reduce the suction release operation time.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip at room temperature or at a higher or lower temperature condition than room temperature is known. This is because, as a characteristic of the IC chip, it is necessary to guarantee that the IC chip operates well at normal temperature or at high or low temperature.

In this type of electronic component test apparatus, the upper part of a test head is covered with a chamber to form an enclosed space, and the interior of the chamber is maintained at a constant temperature such as room temperature, high temperature or low temperature, and then an IC chip is tested. The test is performed by transferring the IC chip to the test head and electrically connecting the IC chip to the test head. By such a test, the IC chip is satisfactorily tested and is classified into at least a good product and a defective product.

When the IC chip is transported onto the test head, the IC chip is sucked and held on the suction head by using a suction device that generates a negative pressure using an ejector.
Carry the C chip and put the IC on the contact part of the test head
After mounting the chip, release the suction. In addition, the tested IC chip is sucked again by the suction head of the suction device, transported to another place, and released to release the suction.
It can be transferred to a tray.

[0005]

However, in releasing the electronic component sucked by the suction head, simply stopping the application of the suction force often does not immediately release the IC chip smoothly. The smaller and lighter the IC chip is, the more the IC chip tends to maintain the state of being attracted to the suction head. This is because when the IC chip is lightweight, I
This is because it is difficult to drop the C chip. Further, even if the ejector is stopped, it takes time until air leaks from the suction port of the suction head and the degree of vacuum inside the suction port decreases. If the suction head is moved before the IC chip is set at the predetermined position, the IC chip cannot be moved to a desired position.

Therefore, conventionally, after the ejector is stopped, air leaks from the suction port of the suction head, the degree of vacuum inside the suction port is sufficiently reduced, and the IC chip is completely separated from the suction port. After waiting, the suction head is moved to perform the next sequence operation. For this reason, conventionally, there is a waste of the test process time corresponding to the waiting time.

In order to solve such a problem, the present inventors provide a suction device with a suction force destruction means, and forcibly supply a suction fluid such as air to an IC chip suction-held by a suction head. To release the IC chip smoothly by backflowing the IC chip to release the IC chip smoothly.

By providing such an attraction force breaking means, it is expected that the operation of releasing the attraction of the IC chip can be shortened. However, when such an adsorption force destruction means is used for an adsorption device used in a chamber for performing a low-temperature test, generally, the dew point temperature of air blown against the IC chip is lower than the ambient environmental temperature. Due to the high temperature, dew condensation occurs at the IC chip or the suction port of the suction head. If condensation occurs at the suction port, the condensed water becomes ice due to the ambient temperature, which may block the suction port, which may cause an IC chip suction error. If icing occurs in the suction port, the IC chip remains fixed to the suction port, and the IC chip may not be released from the suction head.

In order to solve such a problem, it is conceivable that all the air supplied from an air supply source for driving an ejector for generating a negative pressure at the suction port is dry air. However, such a method is not economical. The air for driving the ejector is used in large quantities and is only thrown away into the atmosphere.

[0010] The present invention has been made in view of such circumstances, and in particular, is an economical method that can prevent a suction error of an electronic component and shorten a suction release operation time while preventing dew condensation on an electronic component during a low-temperature test. It is an object of the present invention to provide a typical electronic component testing device and an electronic component suction device.

[0011]

In order to achieve the above object, an electronic component suction apparatus according to the present invention comprises: a suction head for sucking an electronic component; and a suction force applying means for applying a suction force to the suction head. Suction force destruction means for spraying a fluid from the suction head to the electronic component to release the suction force of the suction head, and dehumidification means for dehumidifying a fluid to be sprayed from the suction head to the electronic component. And

[0012] Further, an electronic component test apparatus according to the present invention comprises:
An electronic component test apparatus comprising: an electronic component suction device capable of holding and releasing suction of an electronic component; and a test head for testing an electronic component sucked and held and transported by using the electronic component suction device. The electronic component suction device suctions the electronic component, suction force applying means for applying a suction force to the suction head, and sprays a fluid from the suction head to the electronic component, and It is characterized by having suction force destruction means for releasing the suction force of the head, and dehumidification means for dehumidifying a fluid to be blown from the suction head to the electronic component.

It is preferable that the electronic component test apparatus according to the present invention further includes a chamber that covers the test head and the suction head and can lower the temperature of the electronic component test environment.

[0014] The electronic component suction apparatus according to the present invention includes a state in which a dried fluid is blown from the suction head to the electronic component, and a state in which undried fluid is blown from the suction head to the electronic component. It is preferable to further include a switching unit for switching the mode.

Preferably, the suction force applying means includes an ejector for generating a negative pressure in the suction head by utilizing a flow of a fluid supplied from a fluid supply source. It is preferable that the suction force destruction means includes a destruction valve for feeding a fluid supplied from a fluid supply source to the suction head. These fluid sources may be different but are preferably a common fluid source. This contributes to a reduction in the number of parts.

The dehumidifying means is not particularly limited as long as it has a function of dehumidifying. Preferably, the dehumidifying means has a hollow fiber membrane made of a polymer material, and is provided by passing a wet gas through the hollow fiber membrane. It is preferable to remove the moisture in the gas to the outside of the hollow paper membrane. Such a dehumidifying means does not require a power source, contributes to energy saving, and is compact regardless of the installation location.

In the present invention, the type of the fluid is not particularly limited, but air is more preferable in consideration of easy handling and low cost.

[0018]

In the electronic component suction device and the electronic component test device according to the present invention, the suction fluid such as air is forced to flow backward to the electronic component sucked and held by the suction head by using the suction force destruction means. By releasing the attraction force, the electronic component can be released smoothly and quickly. Therefore, it is possible to shorten the operation time for releasing the suction of the electronic component, and as a result, it is possible to shorten the test process time.

Moreover, even when the suction head is placed in the low-temperature test chamber, the fluid blown to the electronic components is preliminarily dried by the dehumidifying means, and condensed on the suction port of the suction head and / or the electronic components. Does not occur. For this reason, the suction port does not freeze, and it is possible to prevent a suction error of the electronic component and also to prevent a suction release error.

Further, in the present invention, the fluid supplied to the ejector for generating a negative pressure in the suction port of the suction head is an undried fluid that does not pass through the dehumidifying means, and the suction port of the suction head is passed through the suction force breaking means. By drying only the fluid to be blown out from the humidifier by the dehumidifying means, the production of the dry fluid (mainly dry air) can be minimized. Therefore it is economical.

Further, in the present invention, a state in which a dried fluid is blown from the suction head to the electronic component and a state in which an undried fluid is blown from the suction head to the electronic component are switched. By providing the switching means, it is not necessary to forcibly produce a dry fluid during a normal temperature test or a high temperature test other than the low temperature test.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus according to the present invention, FIG. 2 is a conceptual view showing a method of routing an IC under test in the electronic component test apparatus, and FIG.
Is a plan view schematically showing various transfer devices provided in the electronic component test apparatus, and FIG. 12 is a cross-sectional view (FIG. 12) for explaining a method of arranging an IC under test in a test chamber of the electronic component test apparatus. FIG. 13 is a cross-sectional view (XIII-XI of FIG. 3) for explaining a method of routing the IC under test in the unloader section of the electronic component test apparatus.
II line).

FIG. 2 and FIG. 3 are diagrams for understanding the method of handling the IC under test and the operating range of the transfer device in the electronic component test apparatus 1 of the present embodiment.
Actually, there is also a portion in which members arranged vertically are shown in plan. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

The electronic component test apparatus 1 of the present embodiment applies, for example, a normal temperature or a high temperature of about 125 ° C.
Alternatively, a device that tests (tests) whether or not the IC operates properly under a low temperature stress of, for example, about −30 ° C., and classifies the ICs according to the test result. In the operation test in the given state, an IC conveyed in the electronic component test apparatus 1 from a tray (not shown, but also referred to as a customer tray KT hereinafter) on which a large number of ICs to be tested are mounted.
The test is performed by mounting the IC under test on the carrier CR (see FIG. 5).

For this reason, as shown in FIGS. 1 and 2, the electronic component test apparatus 1 of the present embodiment stores ICs to be tested from now on, and classifies and stores tested ICs. A storage unit 100, a loader unit 200 for sending an IC under test sent from the IC storage unit 100 to the chamber unit 300, and a chamber unit 300 including a test head.
And tested ICs tested in the chamber section 300
And an unloader unit 400 for classifying and extracting the same.

[0026] The IC magazine 100 IC storage section 100, a pre-test IC stocker 101 for storing the IC before test, post-test IC stores the IC classified according to the result of the test stocker 102
Are provided.

Each of the pre-test IC stocker 101 and the tested IC stocker 102 includes a frame-shaped tray support frame, and an elevator that can enter from a lower portion of the tray support frame and move up and down. It is configured. A plurality of customer trays KT are stacked and supported on the tray support frame, and only the stacked customer trays KT are moved up and down by the elevator.

The pre-test IC stocker 101 includes:
While the customer trays KT storing the ICs to be tested to be tested are stacked and held,
In the C stocker 102, customer trays KT in which ICs to be tested after the test are appropriately classified are stacked and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIG. 1 and FIG. 2, one stocker LD is assigned to the pre-test stocker 101, and an empty stocker EMP sent to the unloader 400 next to it.
Is assigned, and the tested IC stocker 1
02, five stockers UL1, UL2, ..., UL5
, And can be sorted and stored in a maximum of five categories according to the test results. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

The customer tray KT which loader unit 200 described above, the lower device substrate 201 to the window 202 of the loader unit 200 by the tray transfer arm (not shown) provided between the IC storage section 100 and the device substrate 201 Carried from. And this loader unit 2
At 00, the IC under test loaded on the customer tray KT is once transferred to the pitch conversion stage 203 by the first transfer device 204, where the IC under test is
Of the pitch conversion stage 203 after correcting the mutual position of the
Is transferred to the IC carrier CR stopped at the position CR1 (see FIG. 4) in the chamber 300 using the second transfer device 205.

The pitch conversion stage 203 provided on the device substrate 201 between the window 202 and the chamber 300 has a relatively deep concave portion, and the peripheral portion of the concave portion has a shape surrounded by an inclined surface. Means for correcting the position of the IC and pitch change of the IC.
When the IC under test sucked into the IC chip 4 is dropped, the falling position of the IC under test is corrected on the inclined surface. Thereby, for example, the mutual positions of the four ICs to be tested are accurately determined, and the customer tray KT and the IC carrier CR are determined.
Even if the mounting pitch differs, the IC under test whose position has been corrected and the pitch has been changed is adsorbed by the second transfer device 205 and transferred to the IC carrier CR, whereby the IC carrier C is transferred.
The IC under test can be reloaded into the IC accommodating portion 14 formed in the R with high accuracy.

As shown in FIG. 3, a first transfer device 204 for transferring an IC under test from the customer tray KT to the pitch conversion stage 203 includes a rail 204a provided on an upper portion of the device substrate 201 and a rail 204a.
a movable arm 204b capable of reciprocating between the customer tray KT and the pitch conversion stage 203 (this direction is defined as a Y direction), and an X direction supported by the movable arm 204b along the movable arm 204b. And a movable head 204c that can move to

The movable head 2 of the first transfer device 204
The suction head 204d is attached to the downward direction of the suction tray 204d. The suction head 204d moves while sucking air, thereby sucking the IC under test from the customer tray KT, and moving the IC under test to the pitch conversion stage. 203. Such a suction head 204d is
For example, about four ICs are mounted on the movable head 204c, and four ICs to be tested can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC under test from the IC card 3 to the IC carrier CR1 in the chamber 300 has the same configuration, and as shown in FIGS.
A rail 205a erected above the test chamber 301, a movable arm 205b capable of reciprocating between the pitch conversion stage 203 and the IC carrier CR1 by the rail 205a, and a movable arm 205b supported by the movable arm 205b. Arm 205b
And a movable head 205c that can move in the X direction along the axis.

The movable head 2 of the second transfer device 205
At 05c, a suction head 205d is mounted in a downward direction. The suction head 205d moves while sucking air to suck the IC under test from the pitch conversion stage 203. The IC under test is transferred to the IC carrier CR1 through the opened entrance 303. Such a suction head 205
d indicates that about four ICs are mounted on the movable head 205c, and four ICs to be tested are
Can be transshipped to R1.

Chamber 300 The chamber 300 according to the present embodiment has an IC carrier C
The IC has a constant temperature function of applying a desired high-temperature or low-temperature stress to the IC under test loaded in the R. The IC under test to which the thermal stress has been applied is brought into contact with the contact portion 302a of the test head 302 at a constant temperature. Contact
Have a tester (not shown) perform the test.

By the way, in the electronic component test apparatus 1 of the present embodiment, when a low temperature stress is applied to the IC under test, the heat is removed by the hot plate 401 described later to prevent dew condensation on the IC under test. However, when a high temperature stress is applied to the IC under test, heat is removed by natural heat radiation. However, a separate heat removal tank or heat removal zone is provided,
When a high temperature is applied, the IC under test is cooled by blowing air to return it to room temperature, and when a low temperature is applied, the IC to be tested is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. You may comprise.

The test head 302 having the contact portion 302a is provided below the center of the test chamber 301, and the stationary position CR5 of the IC carrier CR is provided on both sides of the test head 302. Then, the IC under test placed on the IC carrier CR conveyed to this position CR5 is directly carried onto the test head 302 by the third transfer device 304, and the IC under test is brought into electrical contact with the contact portion 302a. The test is performed by letting it go.

Further, the IC under test that has completed the test is an IC under test.
An exit carrier EX that does not return to the carrier CR and moves to and from the position CR5 on both sides of the test head 102
It is remounted on T and carried out of the chamber 300. When a high temperature stress is applied, the heat is naturally removed after being carried out of the chamber section 300.

FIG. 4 is a perspective view of an essential part for explaining the transport path of the IC carrier in the present embodiment, FIG. 5 is a perspective view showing the embodiment of the IC carrier, and FIG. 6 is along the line VI-VI of FIG. FIG. 7 is a cross-sectional view (shutter open) along the line VII-VII in FIG. 5, and FIG. 8 is a plan view for explaining a test order of the IC under test in the chamber section 300.

First, the IC carrier CR of the present embodiment is
The wafer is conveyed while circulating in the chamber section 300. FIG. 4 shows this handling state. In the present embodiment, first, the loader unit 200 is provided at the front and the back of the chamber unit 300, respectively.
The IC carrier CR1 loaded with the IC under test sent from the
Is a horizontal position CR2 by a horizontal transport device (not shown).
Transported to

It should be noted that the I
Strictly speaking, the position for receiving C is the position CR shown in FIG.
The position is slightly higher than 1 (this position is indicated by a two-dot chain line in FIG. 4). This is because the IC carrier CR faces the entrance 303 opened on the ceiling of the test chamber 301 from below, and the entrance 303 is shielded by the IC carrier CR.
This is to prevent heat release in the chamber section 300. For this reason, the IC carrier CR slightly rises from the position CR1 when receiving the IC under test.

The IC carrier CR transported to the position CR2
Is transported in a vertically stacked state by the elevator 311 shown in FIG. 4 in a state where the IC carrier at the position CR5 becomes empty, and then the test head 302 is moved from the lowest position CR3 to the test head 302. The sheet is conveyed to a substantially same level position CR4 by a horizontal conveying device (not shown). Mainly during this transportation, a high or low temperature stress is applied to the IC under test.

Further, a horizontal transfer device (not shown) transfers the test head 302 from the position CR4 to the position CR5 in the horizontal direction, where only the IC under test is sent to the contact portion 302a of the test head 302. IC after the IC under test has been sent to contact section 302a
The carrier CR is transported from its position CR5 to a horizontal position CR6 by a horizontal transport device (not shown), then transported vertically upward by the elevator 314, and returns to the original position CR1.

As described above, since the IC carrier CR is circulated and conveyed only in the chamber section 300, once the temperature is increased or decreased, the temperature of the IC carrier itself is maintained as it is. The thermal efficiency in the part 300 will be improved.

FIG. 5 is a perspective view showing the structure of the IC carrier CR of the present embodiment. Eight concave portions 12 are formed on the upper surface of a strip-shaped plate 11, and the IC under test is placed in each of the concave portions 12. Are formed two by two.

In this embodiment, the IC accommodating portion 14 is
16 are formed along the longitudinal direction of the plate 11 by attaching the blocks 13, and the mounting pitches P ₁ (see FIG. 8) of the ICs to be tested in the longitudinal direction of the plate 11 are set at equal intervals.

Incidentally, a guide plate 17 in which a guide hole (see FIG. 6) 171 is formed between the concave portion 12 of the plate 11 and the blocks 13, 13 is held in the IC accommodating portion 14 of the present embodiment. I have. When the positioning accuracy cannot be ensured depending on the outer periphery of the package mold, such as the case where the IC under test is a BGA type IC of a chip size package, the guide hole 171 of the guide plate 17 is provided.
The solder ball terminal HB of the IC under test is positioned by the periphery of the IC, and thereby the contact accuracy with the contact pin can be improved.

As shown in FIG. 5, the IC carrier CR is used to open and close an upper opening surface of the IC under test accommodated in the IC accommodating portion 14 of the IC carrier CR in order to prevent displacement and pop-out. Shutter 15 is provided.

The shutter 15 is openable and closable with respect to the plate 11 by a spring 16. When the IC under test is housed in the IC housing 14 or taken out of the IC housing 14, the shutter opening / closing mechanism 182 is provided. By opening the shutter 15 as shown in FIG. 7, the IC under test is accommodated or taken out. On the other hand, when the shutter opening / closing mechanism 182 is released, the shutter 15 returns to the original state by the elastic force of the spring 16, and the opening surface of the IC housing portion 14 of the plate 11 is covered by the shutter 15 as shown in FIG. As a result, the IC under test accommodated in the IC accommodating section 14 is held without displacement or jumping out even during high-speed conveyance.

As shown in FIG. 5, the shutter 15 of this embodiment includes three pulleys 1 provided on the upper surface of the plate 11.
The pulley 112 at the center is engaged with an elongated hole 152 formed in the shutter 15, and the two pulleys 112 provided at both ends hold both end edges of the shutter 15.

However, the center pulley 112 and the shutter 15
Engagement with the long hole 152 is such that there is almost no backlash in the longitudinal direction of the plate 11, whereas a slight gap is provided between the pulleys 112 at both ends and both end edges of the shutter 15. Is provided. By doing so, even if a thermal stress acts on the IC carrier CR in the chamber section 300, the expansion or contraction due to the thermal stress is caused by the central pulley 1
It is distributed to both ends with the center at 12, and is appropriately absorbed by gaps provided at both ends. Therefore, the amount of expansion or contraction of the entire length of the shutter 15 in the longitudinal direction is halved even at both ends where the shutter 15 expands or contracts the most, whereby a difference between the amount of expansion and contraction of the plate 11 can be reduced.

The shutter opening / closing mechanism of this embodiment is configured as follows. First, in the circuit path of the IC carrier CR shown in FIG. 4, the position where the shutter 15 needs to be opened is the position CR1 for receiving the IC under test from the second transfer device 205 (strictly, a slightly upper window portion thereof). 3
03) and a position CR5 for transferring the IC under test to the contact portion 302a of the test head 302 by the third transfer device 304.

In the present embodiment, at the position CR1,
As shown in FIGS. 4, 6, and 7, a fluid pressure cylinder 182 that opens and closes by hooking an opening / closing block 181 provided on the upper surface of the shutter 15 is employed as a shutter opening / closing mechanism. The fluid pressure cylinder 182 is mounted on the test chamber 301 side. Then, as shown in FIG. 6 and FIG.
By retreating the rod of the fluid pressure cylinder 182 with respect to R, the opening / closing block 18
The user opens the shutter 15 while hooking it. When the mounting of the IC under test is completed, the shutter 15 is closed by moving the rod of the fluid pressure cylinder 182 forward.

On the other hand, at the position CR5 near the test head 302, since the IC carrier CR itself is moved by a horizontal transfer device (not shown), the shutter 15 is opened and closed by using this. For example, the IC carrier CR is transported horizontally from the position CR4 to the position CR5, and a stopper for opening and closing the shutter 15 is provided on the test chamber 301 side in the middle of the IC carrier CR.
When R moves from position CR4 to position CR5, it is provided at a position where it comes into contact with opening / closing block 181 of shutter 15.
The position where this stopper is provided is the position of the IC carrier CR.
Is also the position where the shutter 15 is fully opened when stopped at the position CR5. In this example, since two opening / closing blocks 181 are provided on the shutter 15, two stoppers are also provided. As a result, the shutter 15 is also fully opened with the horizontal transport of the IC carrier CR.

The IC carrier CR is moved from this position CR5 to C
When transporting to R6, the shutter 15 needs to be closed. Therefore, for example, a cam surface is formed on the above-described stopper, and the IC carrier CR is moved from the position CR5 to the position C.
When the sheet is transported toward R6, the rear end of the opening / closing block 181 of the shutter 15 keeps contacting the cam surface, so that the shutter 15 is gradually closed.

Incidentally, the movable heads 205c and 304b of the second transfer device 205 and the third transfer device 304 include:
Positioning pins for aligning the IC under test with the IC carrier CR when transferring the IC under test are provided.
As a representative example, FIG. 6 shows the movable head 205c of the second transfer device 205, but the movable head 304b of the third transfer device 304 has the same configuration.

As shown in the drawing, the movable head 205c is provided with two positioning pins 205e, 205e straddling one IC under test. Therefore, the positioning pins 2 are provided on the plate 11 side of the IC carrier CR.
Positioning holes 11 with which 05e and 205e engage respectively
3, 113 are formed. Although not particularly limited, in this example, one positioning hole 113 (right side in FIG. 6) is a perfect circular hole, and the other positioning hole (left side in FIG. 6) is a long oval hole in the width direction. As a result, the positioning is performed mainly in one positioning hole 113 and the positioning pin 205e is positioned in the other positioning hole 113.
And the position error of the position is absorbed. The positioning pins 20 are provided on the upper surface of each positioning hole 113.
A tapered surface for inviting 5e is formed.

Reference numeral "153" shown in FIG. 7 is an opening through which the positioning pin 205e can be engaged with the positioning hole 113 when the shutter 15 is opened.

In the electronic component test apparatus 1 of the present embodiment, the third position CR5 near the test head 302
When all the ICs to be tested are transferred to the test head 302 by the transfer device 304, the IC carrier CR is returned from the position CR5 to the position CR6.
The IC under test is placed in any of the IC accommodation sections 14 of the C carrier CR.
In order to confirm that no residue remains, a residue detection device is provided.

This residual detecting device is provided with a position CR shown in FIG.
5 to CR6, and irradiates and receives detection light in the Z-axis direction along the center line CL of the IC carrier CR shown in FIG. In order to allow the detection light to pass therethrough, through holes 111 are provided in the bottom surface of the IC accommodating portion 14 of the plate 11, and the through holes 15 are provided in the shutter 15 at positions corresponding to the respective IC accommodating portions 14.
4 are provided. As a result, when the IC carrier CR moves from the position CR5 to the position CR6 after completing the delivery of the IC under test, it receives a movement pulse signal from the encoder of the horizontal transfer device, and thereby receives the IC carrier CR.
The position timing of the IC accommodating portion 14 is confirmed, and the light receiving state of the photoelectric sensor at that timing is confirmed. Here, if the IC under test remains in the IC accommodating portion 14, since the light reception by the photoelectric sensor is not confirmed, for example, an alarm is issued to alert the user that the IC is abnormal.

The test head 302 of this embodiment has 8
Pieces of the contact portion 302a is provided at a predetermined pitch P _2, as shown in FIG. 8, the suction head 304c of the contact arm is also provided at the same pitch P _2. In addition, the IC carrier CR, 1 at a pitch _{P 1}
Six ICs to be tested are accommodated, and at this time, P ₂ = 2 ·
There is a relationship of P _1.

The ICs to be tested that are connected to the test head 302 at one time are different from the ICs to be tested arranged in one row × 16 columns as shown in FIG.
(Shaded area) are tested simultaneously.

That is, in the first test, 1, 3, 5,
Eight ICs to be tested arranged in rows 7, 9, 11, 13, and 15 are connected to the contact portion 302a of the test head 302 for testing. In the second test, the IC carrier CR is moved by P for one row pitch. Move _one , 2, 4, 6, 8,
ICs to be tested arranged in 10, 12, 14, and 16 columns are similarly tested. Therefore, IC carrier CR that has been transported to either side of the position CR5 the test head 302 is moved in the longitudinal direction by a horizontal transport device outside the drawing by a pitch P _1.

Incidentally, the result of this test is stored in, for example, an identification number given to the IC carrier CR and an address determined by the number of the IC under test allocated inside the IC carrier CR.

In the electronic component test apparatus 1 of the present embodiment, a third transfer device 304 is provided near the test head 302 for transferring the IC under test to the contact portion 302a of the test head 302 for testing. ing.

FIG. 9 is a front view (an arrow IX of FIG. 3) showing an embodiment of the suction device, FIG. 10 is a view showing a cross section of a main part and a circuit block of the suction device, and FIG. It is a figure which shows the principal part cross section and circuit block which concern on embodiment.

The third transfer device 304 shown in FIG.
Rest position CR5 of C carrier CR and test head 3
Rail 3 provided along the extension direction (Y direction) of 02
04a and the rail 304a, the test head 3
The movable head 304b is capable of reciprocating between a position 02 and the stationary position CR5 of the IC carrier CR, and a suction head 304c provided downward on the movable head 304b.

The suction head 304c is configured to be able to move up and down by a driving device (for example, a fluid pressure cylinder or an electric motor) not shown. By moving the suction head 304c up and down, the IC under test can be sucked and the IC under test can be pressed against the contact portion 302a.

The suction head 304c of this embodiment will be described in more detail. As shown in FIGS. 9 and 10, the suction head 304c is attached to a Z-axis direction driving device (not shown), and moves up and down with respect to the contact portion 302a, and the pusher base 304c1
And a movable base 304c3 attached to the movable base 304c3 via a floating mechanism 304c6.
04c2 is fixed.

FIG. 10 shows this state.
The suction head body 304c10 fixed to 04c3 is
It has a substantially rectangular parallelepiped shape, and has a through hole 304c11 formed therein for evacuating. In addition, the suction pad 304c2 made of an elastic material is provided on the suction head main body 304c1.
It is fixed within 0, and the suction force when vacuum is drawn is
The suction pad 304c2 is provided to a suction port 304c12 formed at the tip of the suction pad 304c2.

The suction head 304c is provided with a pneumatic circuit 305 shown in FIG. The pneumatic circuit 305 is provided with an air source 305 such as a factory air (air piping routed into the factory) or a dedicated compressor.
a (corresponding to the fluid supply source of the present invention), an ejector 305c for evacuating using compressed air as a driving source, and an ejector valve 305b for turning on / off the ejector 305c are connected in series. The suction force generated by the circuit is applied to the suction port 304c12 of the suction pad 304c2 through the through hole 304c11 of the suction head 304c.

Further, a destruction valve 305e is provided in a circuit branched in parallel from the air source 305a, and its tip is connected to the through hole 304c11 of the suction head 304c. The destruction valve 305e has a function of supplying air from the air source 305a to the suction pad 304c2 by opening the same, thereby releasing the IC under test attached to the suction pad 304c2. That is, when the IC under test is released, the release valve 305e is momentarily opened.

Particularly in this embodiment, a dehumidifying unit 305d as dehumidifying means is connected between the air source 305a and the destruction valve 305e. The dehumidifying unit 305d is
For example, it has a plurality of hollow fiber membranes made of a polymer material, and has a function of removing moisture in the gas to the outside of the hollow paper membrane by passing a moist gas through the hollow fiber membrane. Such a dehumidifying unit does not require a power source, contributes to energy saving, and is compact regardless of an installation place.
Further, since it also has a filter function, clean dry air can be produced.

The air dried in the dehumidifying unit 305d can be blown out from the suction port of the suction pad 304c2 toward the test IC through the release valve 305e. The opening and closing of the release valve 305e when the test IC is released from the suction head 304c is controlled by the control device 305.
When the test IC is sucked and held, the release valve 305e is closed and the ejector valve 305b is opened to hold the test IC. The contact part 30
When pressed against 2a, the ejector valve 305b also closes. At this time, since the test IC is fixed by the suction head 304c and the contact part 203a, the air source 305
a is unused.

After the IC test is completed, the control device 30
5f, the ejector valve 305b is opened and the ejector 3
05c to start the suction of the IC by the suction head 304c and transfer the IC sucked by the suction head 304c to the exit carrier EX at the position EXT1 shown in FIG.
Transfer over T. I sucked by the suction head 304c
When transferring C onto the exit carrier EXT at the position EXT1 shown in FIG. 12, the control device 305f shown in FIG. 10 sends a signal to the ejector valve 305b to stop driving the ejector 305c. At the same time, the control device 305f sends a drive signal to the release valve 305e to remove the air supplied from the air source 305a to the dehumidifying unit 30.
5d to dry air with extremely low dew point temperature,
The air is blown out from the suction port 304c12 toward the IC. As a result, the suction force at the suction port 304c12 can be quickly released, and the IC can be released smoothly and quickly. Therefore, it is possible to reduce the time required for the operation of releasing the suction of the IC, and as a result, it is possible to reduce the time required for the test process.

Further, the chamber section 3 where the low-temperature test is performed
The air blown to the IC from the suction head 304c located in the inner surface of the suction head 304c has been dried in advance by the dehumidifying unit 305d.
There is no condensation on c12 and / or IC.
Therefore, the suction port 304c12 does not freeze,
IC suction errors can be prevented, and suction release errors can also be prevented.

In this embodiment, a single air source 3
05d, the suction port 304c1 of the suction head 304c.
Air to be supplied to the ejector 305c for generating a negative pressure at 2 is undried air that does not pass through the dehumidifying unit 305d, and is supplied through the release valve 305e.
By drying only the air to be blown out from the suction port 304c12 of 4c by the dehumidifying unit 305d, the production of dry air can be minimized. Therefore it is economical.

Next, the pusher base 304c shown in FIG.
The floating mechanism 304c6 interposed between the movable base 1 and the movable base 304c3 will be described. First, a guide pin 304c5 which engages with a guide bush 302a2, which is one of the guide means described later, is fixed at its center to a movable base 304c3, and its base end is a small-diameter pin fixed to a pusher base 304c1. 304c7
Has been inserted. Thereby, the movable base 304c3
Can move with respect to the pusher base 304c1 by the space between the guide pin 304c5 and the small diameter pin 304c7 in the XY plane.

The movable base 304c3 can move upward in the Z-axis direction with respect to the pusher base 304c1, but a spring 304c interposed between the pusher base 304c1 and the movable base 304c3.
8, the movable base 304c3 becomes the pusher base 3
04c1. Therefore, when no external force acts, the state shown in FIG. 9 is maintained, but the guide pin 304c5 and the guide bush 302a
When an external force acts in the X direction or the Y direction at the time of engagement with the pusher base 304c, the movable base 304c3
1 is moved in the XY plane. In addition, a fluid pressure cylinder 304c4, which will be described later,
When the XY plane of the movable base 304c3 is tilted when the movable base 304c3 is pressed via c9, the movable base 304c3 resists the elastic force of the spring 304c8.
Changes its posture with respect to the pusher base 304c1.

In the suction head 304c of this embodiment, the base 304b1 on which the pusher base 304c1 is mounted
A hydraulic block 304c4 is fixed to the movable base 304c3, and a pressing block 304c9 is attached to the movable base 304c3. The rod end of the hydraulic cylinder 304c4 comes into contact with the upper surface of the pressing block 304c9 and presses it. The movable base 304c3 is pressed through the movable base 304c3.

The suction head 304c of this embodiment is provided such that eight movable bases 304c3 float independently of each other with respect to one common pusher base 304c1.
04c4 is also provided at an independent position (base 304b1) with respect to each movable base 304c3.

A guide pin 304c5 having a tapered end at the tip is fixed to the movable base 304c3, and a guide bush 302a2 is fixed to the contact portion 302a. The guide pin 304c5 and the guide bush 302a2 constitute guide means. When the suction head 304c descends toward the contact portion 302a, the guide pin 304c5 engages with the guide bush 302a2 from the tapered surface, so that the movable base is formed. 3
04c3 is aligned with the contact portion 302a.

When the type of the IC under test is changed and the type of the contact portion 302a is changed, the type of the suction head 304c is also changed. In this embodiment, the type is changed from the pusher base 304c1 shown in FIG. Are replaced as a change kit, and the base 304b1 and the fluid pressure cylinder 304c4 are used as they are. As a result, the components of the change kit can be minimized to reduce the cost, and the weight of the change kit can be minimized, thereby improving the exchange workability.

As shown in FIG. 12, in the third transfer device 304 of this embodiment, two movable heads 304b are provided on one rail 304a, and the distance between the movable heads 304b is equal to the distance between the test head 302 and the IC carrier CR. It is set equal to the distance from the stationary position CR5. The two movable heads 304b are simultaneously moved in the Y direction by one driving source (for example, a ball screw device), while the suction heads 304c are vertically moved by independent driving devices.

As described above, each suction head 3
04c can suck and hold eight ICs at a time, and the interval between them is set equal to the interval between the contact portions 302a.

[0088] The unloader section 400 unloader section 400, exit carriers EX for paying out the test IC described above from the chamber section 300
T is provided. This exit carrier EXT
Is a test head 30 as shown in FIGS.
2 and the unloader 40
It is configured to be able to reciprocate in the X direction between the position EXT2 at position 0. Position E on both sides of test head 302
In XT1, as shown in FIG. 12, in order to avoid interference with the IC carrier CR, the stationary position CR5 of the IC carrier is used.
It comes up and down slightly above and slightly below the suction head 304c of the third transfer device 304.

The specific structure of the exit carrier EXT is not particularly limited. However, as shown in FIG. 5, an IC carrier CR shown in FIG.
Individual) formed plates.

Two exit carriers EXT are provided on each side of the test head 302 for convenience. While one exit carrier EXT is moving to the position EXT1 of the test chamber 301, the other is located at the position EXT of the unloader unit 400.
An almost symmetric operation such as moving to step 2 is performed.

Returning to FIG. 3, in the electronic component test apparatus 1 of the present embodiment, a hot plate 401 is provided near the position EXT2 of the exit carrier EXT. The hot plate 401 is for heating the IC under test to a temperature at which dew condensation does not occur when a low temperature stress is applied to the IC under test. Therefore, when a high temperature stress is applied, the hot plate 401 is heated. 401 need not be used.

The hot plate 401 of the present embodiment has a structure corresponding to the fact that the suction head 404d of the fourth transfer device 404 described later can hold eight ICs to be tested at one time.
It is configured to be able to accommodate 32 ICs under test (columns × 16 rows). Then, the hot plate 401 is divided into four areas corresponding to the suction head 404d of the fourth transfer device 404, and the eight tested ICs sucked and held from the exit carrier EXT2 are sequentially placed in those areas.
The eight ICs under test heated the longest are sucked by the suction head 404d as they are and transferred to the buffer unit 402.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table 405 are provided.
Is provided. FIG. 13 is a sectional view taken along line XIII-XIII in FIG.
5 moves in the Z direction between the same level position (Z direction) as the exit carrier EXT2 and the hot plate 401 and a level position above it, specifically, the level position of the device substrate 201. The specific structure of the buffer section 402 is not particularly limited. For example, like the IC carrier CR and the exit carrier EXT, the buffer section 402 may be formed of a plate having a plurality of recesses (eight in this case) capable of accommodating the IC under test. Can be.

Further, the pair of elevating tables 405
Performs an almost symmetric operation such that while one is stationary at the ascending position, the other is stationary at the descending position.

The exit carrier EXT2 described above
Unloader section 400 ranging from buffer section 402 to buffer section 402
Is provided with a fourth transfer device 404. As shown in FIGS. 3 and 13, the fourth transfer device 404 includes a rail 404 a
And the exit carrier E by the rail 404a.
A movable arm 404b that can move between the XT2 and the buffer section 402 in the Y direction; and a suction head 404c that is supported by the movable arm 404b and that can move up and down in the Z direction with respect to the movable arm 404b. Moves in the Z direction and the Y direction while sucking air, thereby adsorbing the IC under test from the exit carrier EXT, and placing the IC under test on the hot plate 401.
And the IC under test is attracted from the hot plate 401 to drop the IC under test into the buffer unit 402. The eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight ICs under test at a time.

As shown in FIG. 13, the movable arm 404b and the suction head 404c are
02 is set at a position where it can pass through the level position between the ascending position and the descending position of the ascending / descending table 405, so that even if one ascending / descending table 405 is at the ascending position, the other ascending / descending table is not interfered The IC under test can be transferred to 405.

Further, the unloader unit 400 is provided with a fifth transfer device 406 and a sixth transfer device 407, and the test device transferred to the buffer unit 402 by the third and sixth transfer devices 406 and 407. The tested ICs are reloaded on the customer tray KT.

For this reason, the apparatus board 201 has a window 403 for arranging an empty customer tray KT carried from the empty stocker EMP of the IC storage unit 100 so as to face the upper surface of the apparatus board 201. One has been established.

As shown in FIG. 1, FIG. 3 and FIG. 13, the fifth transfer device 406 includes a rail 406a extending over the device substrate 201, and a buffer 404 and a window 403 formed by the rail 406a. A movable arm 406b that can move between the movable arms 406b in the Y direction; a movable head 406c that is supported by the movable arm 406b and that can move in the X direction with respect to the movable arm 406b;
c, and a suction head 406d attached downward and capable of moving up and down in the Z direction. Then, the suction head 406d moves in the X, Y and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. . Suction head 406d of the present embodiment
Are mounted on the movable head 406c, and can transfer two ICs at a time.

The fifth transfer device 406 of the present embodiment
The movable arm 406b is formed so as to be short so that the IC under test is transferred only to the customer tray KT set in the two rightmost windows 403. It is effective to set a customer tray KT of a category having a high category.

On the other hand, the sixth transfer device 406
As shown in FIGS. 1, 3 and 13, two rails 407a, 407a installed on the upper portion of the device substrate 201, and the buffer section 402 is formed by the rails 407a, 407a.
Arm 4 that can move in the Y direction between the window and the window 403
07b and supported by the movable arm 407b,
A movable head 407c that can move in the X direction with respect to the movable arm 407b; and a suction head 407d that is attached downward to the movable head 407c and that can move up and down in the Z direction.
And Then, the suction head 407d moves in the X, Y and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. . Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two ICs at a time.

While the above-described fifth transfer device 406 transfers the IC under test only to the customer tray KT set in the two rightmost windows 403, the sixth transfer device 4
07 can transfer the IC under test to the customer tray KT set in all the windows 403. Therefore, the IC under test of the category with a high frequency of occurrence is classified using the fifth transfer device 406 and the sixth transfer device 407, and the I under test of the category with a low frequency of occurrence is tested.
C can be classified only by the sixth transfer device 407.

The two transfer devices 406, 407
The rails 406a and 407a are provided at different heights as shown in FIGS. 1 and 13 so that the suction heads 406d and 407d do not interfere with each other. It is configured to hardly interfere. In this embodiment,
The fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.

Incidentally, although not shown, a lifting table for raising and lowering the customer tray KT is provided below the device substrate 201 of each window 403, and the tested ICs to be tested are reloaded. The customer tray KT, which is filled and filled, is lowered, and the full tray is transferred to a tray transfer arm.
Transported to L5. Further, the empty customer tray KT is transported from the empty stocker EMP by the tray transfer arm to the empty window portion 403 where the customer tray KT has been paid out, and is set on the window portion 403 after being replaced on the elevating table. You.

In one buffer unit 402 of this embodiment, 16 ICs to be tested can be stored.
There is provided a memory for storing the category of the IC under test stored in each IC storage location 02.

The category and position of the IC under test deposited in the buffer 402 are stored for each IC under test, and the IC under test deposited in the buffer 402 is stored.
The customer tray KT of the category to which the
00 (UL1 to UL5), and the third
Then, the tested ICs are stored in the corresponding customer trays KT by the sixth transfer devices 406 and 407.

Next, the operation will be described. The customer tray KT on which the IC before the test is mounted is stored in the stocker LD of the IC storage unit 100.
Is set in the window 202 of the loader unit 200. From the customer tray KT facing the upper surface of the device substrate 201, for example, four ICs to be tested are sucked at a time using the first transfer device 204, and once dropped into the pitch conversion stage 203 to be tested. IC position correction and pitch change are performed.

Next, by using the second transfer device 205, for example, four ICs to be tested dropped into the pitch conversion stage 203 are sucked at a time, for example, four ICs at the same time.
From the test chamber 301 to the position CR1
On the IC carrier CR that is stationary. Since two positions CR1 are provided in the test chamber 301, the second transfer device 205
The IC under test is carried alternately to the carrier CR. At this time, the shutter 15 of the IC carrier CR is opened and closed by the fluid pressure cylinder 182 (see FIG. 4).

At each position CR1, 16 ICs are tested.
When individually mounted, the IC carrier CR is transported in the test chamber 301 in the order of CR1 → CR2 →... → CR4 shown in FIG. 4, and during this time, high-temperature or low-temperature stress is applied to the IC under test.

An IC carrier CR on which a pre-test IC is mounted
Is transported to the position CR5 on both sides of the test head 302, the shutter 15 of the IC carrier 15 is opened by a stopper (not shown), and as shown in FIG. (Left here) 304
c descends and sucks every other IC under test (see FIG. 8), rises again, and stands by here. At the same time, the other suction head (here, right side) 304c presses the eight suctioned ICs to be tested against the contact portions 302a of the test head 302 to execute a test. When the IC under test is held by suction, the controller 305f sends the ejector valve 305b and the release valve 30 as shown in FIG.
A command signal is sent to 5e, and the release valve 305e is closed and the ejector valve 305b is opened.

At this time, no exit carrier EXT (indicated by a two-dot chain line) exists above the left IC carrier CR5, and has moved to a position EXT2 outside the test chamber 301. Also, an exit carrier EXT exists in EXT1 of the upper side of the right IC carrier CR5, and the IC under test sucked by the right suction head 304c.
Wait for the test to finish.

As shown in FIG. 9, the suction head 304c that has suctioned eight ICs to be tested on the suction pad 304c2
The whole is lowered by a Z-axis driving device (not shown), and at this time, the guide pin 304c5 is engaged with the guide bush 302a2, so that the movable base 304c3 floats at an appropriate position with respect to the contact portion 302a.

Before and after the solder ball terminal HB of the IC under test comes into contact with the contact pin 302a1 of the contact portion 302a, the fluid pressure cylinder 304c4 is actuated to advance the rod tip so that the pressing block 304c9 is pressed.
The upper surface of the movable base 304c3 is pressed via the. Due to this pressing action, even if the entire pusher base 304c1 of the suction head 304c is deformed due to thermal stress or processing failure, this can be absorbed, and each solder ball terminal HB of the IC under test is connected to each contact pin 302a1. The force pressed against is almost equal.

Further, the IC under test is formed in the contact portion 302a.
Is pressed, the controller 305f sends a command signal to the ejector valve 305b to close the ejector valve 305b.

When the test of the eight ICs to be tested sucked by the suction head 304c on the right side is completed in this way, FIG.
As shown in (B), these movable heads 304b, 3
04b is moved rightward, and the eight ICs to be tested sucked by the left suction head 304c are pressed against the contact portions 302a of the test head 302 to perform a test.

On the other hand, the eight tested ICs sucked by the suction head 304c on the right side are placed on the exit carrier EXT which is waiting, and then the exit carrier EXT on which the tested IC is placed is placed in the test chamber. 3
01 moves from the position EXT1 inside the test chamber 301 to the position EXT2 outside the test chamber 301. When the tested IC is replaced on the exit carrier EXT, as described above, the control device 305f shown in FIG.
To stop the drive of the ejector 305c. At the same time, the control device 305f sends a drive signal to the release valve 305e, converts the air supplied from the air source 305a to dry air having an extremely low dew point temperature in the dehumidifying unit 305d, and blows the air from the suction port 304c12 toward the IC. . As a result, the suction force at the suction port 304c12 can be quickly released, and the IC can be released smoothly and quickly. Therefore, it is possible to reduce the time required for the operation of releasing the suction of the IC, and as a result, it is possible to reduce the time required for the test process.

In addition, the chamber section 3 where the low-temperature test is performed
The air blown to the IC from the suction head 304c located in the inner surface of the suction head 304c has been dried in advance by the dehumidifying unit 305d.
There is no condensation on c12 and / or IC.
Therefore, the suction port 304c12 does not freeze,
IC suction errors can be prevented, and suction release errors can also be prevented.

In this embodiment, a single air source 3
05d, the suction port 304c1 of the suction head 304c.
Air to be supplied to the ejector 305c for generating a negative pressure at 2 is undried air that does not pass through the dehumidifying unit 305d, and is supplied through the release valve 305e.
By drying only the air to be blown out from the suction port 304c12 of 4c by the dehumidifying unit 305d, the production of dry air can be minimized. Therefore it is economical.

When the exit carrier EXT moves outside the test chamber 301, the right suction head 304c moves the IC carrier CR located at the right position CR5.
, And sucks the remaining eight ICs to be tested, rises again, and waits for the test of the ICs to be sucked to the left suction head 304c to be completed. Before the suction head 304c is adsorbed, IC carrier CR is the rest of the IC so as to be adsorbed by the suction heads 304c, moves by the pitch _{P 1} (see FIG. 8).

At about the same time, the left exit carrier EXT moves into the test chamber 301, and waits at this position EXT1 to end the test of the IC under test sucked by the left suction head 304c.

When the test of the IC under test sucked by the left suction head 304c is completed, the movable heads 304b and 304b are moved to the left, and the remaining eight test heads sucked by the right suction head 304c are moved. Test IC
Is pressed against the contact portion 302a of the test head 302 to perform a test.

On the other hand, the eight tested ICs sucked by the suction head 304c on the left side are mounted on the exit carrier EXT waiting, and then the exit carrier EXT on which the tested ICs are mounted is placed in the test chamber. 3
01 moves from the position EXT1 inside the test chamber 301 to the position EXT2 outside the test chamber 301.

Hereinafter, this operation is repeated, but the two suction heads 3 are applied to one contact portion 302a.
04c are alternately accessed, and one waits for the other test to end, so that the time for attracting the IC under test to one suction head 304c is absorbed by the other test time, The index time can be reduced.

On the other hand, the ICs to be tested which have been tested by the test head 302 described above are alternately moved to the test chamber 30 by two exit carriers EXT by eight.
It is paid out to the position EXT2 outside the position 1.

As shown in FIG. 13, the eight tested ICs discharged to the right position EXT2 by the exit carrier EXT are connected to the suction head 4 of the fourth transfer device 404.
04c is collectively adsorbed on the hot plate 401c.
On one of the two areas. In the following description of the present embodiment, it is assumed that a low-temperature thermal stress is applied. However, when a high-temperature thermal stress is applied, the buffer section 40 is directly transmitted from the exit carrier EXT.
It is carried to 2.

The suction head 404c of the fourth transfer device 404, which has carried the tested IC to one area of the hot plate 401, does not return to the original position. Then, the eight ICs with the longest elapsed time are sucked at that position, and the heated tested ICs are replaced on the lifting table 405 (here, the right side) of the buffer unit 402 at the lower position.

As shown in FIG. 13, the fourth transfer device 40
The lifting table 405 on the left on which the eight tested ICs are mounted by the previous operation of Step 4 moves to the lifting position, and accordingly, the lifting table 405 on the right.
Moves to the lowered position. Eight tested ICs are mounted on the left elevating table 405 moved to the ascending position, and the tested ICs are stored in the fifth and sixth transfer devices 406 and 407 as test result storage contents. Is transferred to the customer tray KT of the corresponding category according to FIG. 13 shows a test I
An example in which C is replaced on the customer tray KT is shown.

The above operation is repeated, and the tested I
C is reloaded to the customer tray KT of the corresponding category.
04 and the fifth or sixth transfer device 406, 407 at different levels, the fourth transfer device 404
And the fifth and sixth transfer devices 406 and 407 can be operated simultaneously, thereby increasing the throughput.

The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, as shown in FIG. 14, a three-way switching valve (switching means) 305g may be provided between the air source 305a and the dehumidifying unit 305d. In this embodiment, a bypass 305h is connected to the switching valve 305g, and the air from the air source 305a is supplied to the dehumidifying unit 3.
It is possible to switch between the case of leading to 05d and the case of directly leading to the destruction valve 305e through the bypass 305h.

In this embodiment, when a normal temperature test or a high temperature test other than the low temperature test is performed inside the chamber section 300, a signal is sent from the control device 305f to switch the switching valve 305g.
, The air from the air source 305a may be sent directly to the destruction valve 305e through the bypass 305h, and blown out from the suction port 304c12. When performing a room temperature test or a high temperature test, it is not necessary to dry the air because dew condensation does not pose a problem. No need to manufacture.

[0131]

As described above, according to the present invention, it is possible to prevent a suction error of an electronic component and to shorten a suction release operation time while preventing dew condensation on the electronic component particularly during a low temperature test. It is possible to provide a cost-effective electronic component test device and an electronic component suction device.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention.

FIG. 2 is a conceptual diagram showing a method of routing an IC under test in the electronic component test apparatus of FIG.

FIG. 3 is a plan view schematically illustrating various transfer devices provided in the electronic component test device of FIG.

FIG. 4 is a perspective view of a main part for describing a transport path of an IC carrier applied to the electronic component test apparatus of FIG. 1;

FIG. 5 is a perspective view showing an embodiment of an IC carrier applied to the electronic component test apparatus of FIG. 1;

FIG. 6 is a sectional view (shutter closed) along the line VI-VI of FIG. 5;

FIG. 7 is a sectional view taken along the line VII-VII of FIG. 5 (shutter open).
It is.

8 is a plan view for explaining a test order of an IC under test in a test chamber of the electronic component test apparatus of FIG. 1;

9 is a front view (an arrow IX in FIG. 3) showing an embodiment of the suction device of the present invention.

FIG. 10 is a diagram showing a cross section of a main part and a circuit block of an embodiment of the suction device of the present invention.

FIG. 11 is a diagram showing a cross section of a main part and a circuit block of another embodiment of the suction device of the present invention.

FIG. 12 is a cross-sectional view (corresponding to line XII-XII in FIG. 3) for explaining a method of arranging the IC under test in the test chamber of the electronic component test apparatus in FIG. 1;

FIG. 13 is a cross-sectional view (corresponding to line XIII-XIII in FIG. 3) for describing a method of arranging the IC under test in the unloader section of the electronic component test apparatus in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component testing apparatus 100 ... IC storage part 200 ... Loader part 300 ... Chamber part 301 ... Test chamber 302 ... Test head 302a ... Contact part 304 ... Third transfer device 304c ... Suction head (suction device) 304c10 ... Suction head Main body 304c11 ... through hole 304c12 ... suction port 305 ... pneumatic circuit 305a ... air source (fluid supply source) 305b ... ejector valve (adsorption force applying means) 305c ... ejector (adsorption force applying means) 305d ... dehumidifying unit 305e ... release valve ( Attraction force breaking means) 305f ... Control device (control means) 305g ... Switching valve (switching means) 400 ... Unloader part CR ... IC carrier EXT ... Exit carrier IC ... Electronic component HB ... Solder ball (terminal)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AC03 AD02 AD04 AF05 AF06 AG03 AG10 AG11 AG16 AH04 AH07 4M106 AA02 BA20 CA31 DG03 DG08 DG16 DG19 DG28 DJ33

Claims (7)

[Claims] A suction head that sucks an electronic component; a suction force applying unit that applies a suction force to the suction head; and a fluid that is sprayed from the suction head to the electronic component to reduce a suction force of the suction head. An electronic component suction device, comprising: a suction force destruction unit that cancels; and a dehumidification unit that dehumidifies a fluid to be blown from the suction head to the electronic component. 2. A switching means for switching between a state in which a dried fluid is blown from the suction head to the electronic component and a state in which an undried fluid is blown from the suction head to the electronic component. The electronic component suction device according to claim 1, further comprising: 3. The suction force imparting means includes an ejector that generates a negative pressure in the suction head by using a flow of a fluid supplied from a fluid supply source. Electronic parts suction device. 4. The electronic component suction apparatus according to claim 1, wherein the suction force breaking means includes a breaking valve for feeding a fluid supplied from a fluid supply source to the suction head. 5. The dehumidifying means has a hollow fiber membrane made of a polymer material, and removes moisture in the gas to the outside of the hollow paper membrane by passing a moist gas through the hollow fiber membrane. The electronic component suction device according to any one of claims 1 to 4, wherein: 6. An electronic device comprising: an electronic component suction device capable of holding and releasing suction of an electronic component; and a test head for testing an electronic component sucked, held, and conveyed by using the electronic component suction device. A component test apparatus, wherein the electronic component suction device includes: a suction head that suctions the electronic component; a suction force applying unit that applies a suction force to the suction head; and a fluid from the suction head to the electronic component. An electronic component testing device, comprising: suction force destruction means for spraying the suction head to release the suction force of the suction head; and dehumidifying means for dehumidifying a fluid to be sprayed from the suction head to the electronic component. . 7. The electronic component test apparatus according to claim 6, further comprising a chamber that covers a periphery of the test head and the suction head and that can set a test environment of the electronic component at a low temperature.