TW202324517A - Workbench cleaning device, and cutting and sorting equipment and method for semiconductor package body characterized by having no loss of tact time while the equipment running - Google Patents

Abstract

The embodiment of the present invention provides : a workbench cleaning device, capable of performing a cleaning operation on a workbench component on which the semiconductor package body is arranged; and a cutting and sorting equipment and a method for the semiconductor package body. The workbench cleaning device according to an embodiment of the present invention may include: a brush unit capable of moving onto the workbench component; a first driving unit used to allow the brush unit to move in a vertical direction; and an air jet unit capable of moving with the brush unit together.

Description

Table cleaning device and semiconductor package cutting and sorting device and method

The present invention relates to a table cleaning device, a semiconductor package cutting and sorting device equipped with the same, and a semiconductor package cutting and sorting method using the same.

The semiconductor manufacturing process includes, for example, exposure, vapor deposition, etching, ion implantation, cleaning, and the like as a process for manufacturing a semiconductor element on a wafer. Semiconductor package cutting and sorting equipment separates tapes with multiple packages into individual packages, and separates and loads them by cleaning, drying, and inspecting each package to distinguish between normal and defective. To the final storage container is the tray.

Contamination of bench tools supporting packages occurs frequently in the package handling area due to water used in cutting or particles generated by cutting. Contamination of workbench tools may affect the video inspection of each package, which may cause contamination in the package and cause quality problems of the package.

Therefore, if the workbench tool is polluted, the cleaning process of the workbench tool is performed. The current cleaning process of the workbench tool needs to be set up after the operator separates the workbench tool from the equipment and directly cleans it. During this period, there is a problem that the productivity of the machine is interrupted due to the interruption of the operation of the equipment.

Therefore, an object of an embodiment of the present invention is to provide semiconductor package dicing and sorting equipment including a cleaning device that automates a cleaning process of table members to improve operator convenience.

Another object is to provide semiconductor package dicing and sorting equipment provided with a cleaning device that cleans table components without loss of tact time while the equipment is in operation.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and those skilled in the art can clearly understand other unmentioned problems from the following description.

According to an embodiment of the present invention, a workbench cleaning device may be provided, including: a brush unit capable of moving horizontally on a workbench supporting semiconductor packages; moving in the vertical direction; and an air injection part capable of moving together with the brush unit.

In one embodiment, the stage cleaning device may be mounted on a unit picker that picks up and transports the singulated semiconductor packages in the first direction and moves on the stage member.

In an embodiment, the workbench cleaning device may be that the unit picker, the brush unit, and the air injection part are arranged in a row along the first direction.

In an embodiment, at least one of the brush unit and the air injection part may be connected to the unit picker.

In an embodiment, it may be that the workbench cleaning device further includes a second air injection part.

In an embodiment, the second air injection part may be configured such that the unit picker and the brush unit are located in a space between the second air injection part and the air injection part.

In one embodiment, the table cleaning device may further include a second drive unit for vertically moving the air jetting unit.

In an embodiment, the driving of the first driving part and the driving of the second driving part may be independently controlled.

In an embodiment, the work table part may include: a chuck table supporting the semiconductor package in the cutting area; a reverse table supporting the semiconductor package in the inspection area; and a pallet table, The semiconductor packages are supported in a sorting area.

According to an embodiment of the present invention, a semiconductor package cutting and sorting device may be provided, including: a loading module for carrying semiconductor strips configured with a plurality of semiconductor packages; a cutting module including a cutting area, and The semiconductor strip is cut and singulated into a plurality of semiconductor packages; the classification module includes an inspection area and a classification area, and inspects the individualized semiconductor packages and classifies them according to the inspection results; a unit picker , absorbing the semiconductor package and transferring it from the chuck table in the cutting area to the pallet table of the sorting module via the reverse table in the inspection area; and a workbench cleaning device, cleaning the chuck including the The table, the reversing table, and the table parts of the pallet table, the table cleaning device includes: a brush unit that can move in the horizontal direction on the table supporting the semiconductor package; the first drive a part that moves the brush unit in a vertical direction; and an air injection part that can move together with the brush unit.

In an embodiment, it may be that the workbench cleaning device is arranged on the unit picker.

In an embodiment, the semiconductor package cutting and sorting equipment may further include: a control unit configured to make the table cleaning device work at regular intervals.

In an embodiment, the workbench cleaning device may further include: a second driving part, used to vertically move the air injection part, and independently control the first driving part and the second driving part drive.

According to an embodiment of the present invention, a semiconductor package cutting and sorting method may be provided, comprising: a loading step, a semiconductor strip configured with a plurality of semiconductor packages is supplied; a cutting step, cutting the supplied semiconductor strip; an inspection step of inspecting the semiconductor packages singulated by the cutting step; a sorting step of sorting the semiconductor packages according to a result of the inspection step; And the table cleaning device of the air jet department cleans the table parts.

In an embodiment, the step of cleaning the workbench parts may include: positioning the workbench cleaning device above the workbench part to be cleaned; lowering the workbench cleaning device toward the workbench parts steps; the step of cleaning said table part; and the step of raising said table cleaning device from said table part.

In an embodiment, the cleaning step of the table components may be included in the cutting step, the checking step and the sorting step respectively.

In an embodiment, the step of cleaning the workbench parts can be performed simultaneously with one of the cutting step, the checking step, and the sorting step.

In one embodiment, when the stage member cleaning step is included in the cutting step, the stage member to be cleaned may be a chuck table supporting the semiconductor package in a cutting area.

In one embodiment, when the stage member cleaning step is included in the inspection step, the stage member to be cleaned may be a reverse stage supporting the semiconductor package in an inspection area.

In one embodiment, when the stage member cleaning step is included in the sorting step, the stage member to be cleaned may be a pallet supporting the semiconductor package in a sorting area.

According to an embodiment of the present invention, a cleaning device capable of moving in the vertical direction (Z-axis direction) is provided on the unit picker and the cleaning cycle is set, so that the table tool used for package transfer can be automatically cleaned, and the table tool can be prevented from The occurrence of package contamination caused by contamination and the resulting quality degradation.

In addition, according to the embodiment of the present invention, the time for separating and reassembling the table tool from the equipment is omitted, and the table tool in the standby state is cleaned without interrupting the operation of the equipment, thereby preventing the loss of tact time and shortening the working time to improve productivity. (UPH).

The effects of the present invention are not limited to the effects mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement. The present invention can be implemented in various ways and is not limited to the embodiments described here.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals are attached to the same or similar constituent elements throughout the entire specification.

In addition, among the plurality of embodiments, only representative embodiments will be described by using the same reference numerals for components having the same configuration, and only configurations different from the representative embodiments will be described in the remaining other embodiments.

Throughout the specification, when it is expressed that a certain part is "connected (or combined)" with other parts, it is not only the case of "directly connected (or combined)", but also "indirectly connected (or combined)" with other parts interposed. "Case. In addition, when it is stated that a certain part "includes" a certain constituent element, as long as there is no special contrary statement, it means that other constituent elements may also be included rather than excluded.

Unless defined differently, all terms used herein including technical or scientific terms have the same meaning as generally understood by a person having ordinary knowledge in the technical field to which the present invention pertains. Terms such as terms defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings they have in the relevant technical context, and as long as they are not clearly defined in this application, they will not be ideally or excessively interpreted as formal meaning.

The semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention may include a cutting area for performing cutting operations on semiconductor strips S, an inspection area for performing inspection operations on cut and singulated semiconductor packages P, and an inspection area for inspected semiconductor packages P. A sorting area where semiconductor packages P are sorted.

The table cleaning apparatus according to the present invention may be used to clean a table member supporting the semiconductor package P in a processing area where processing is performed on the semiconductor package P. Referring to FIG. For example, the table components may include various tables of semiconductor package cutting and sorting equipment (saw sorter) such as a chuck table, a reversing table, and a pallet table.

FIG. 1 shows a schematic configuration of a semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention.

Referring to FIG. 1 , a semiconductor package cutting and sorting device 10 according to an embodiment of the present invention includes a loading module 100 that supports a semiconductor strip S configured with a plurality of packages, and a package for cutting and singulating the semiconductor strip S. Cutting module 200 that transports packages P, sorting module 300 that inspects packages P and stores them in trays, and a table cleaning device (table cleaning unit) that cleans table parts on which packages P are placed in each processing area 400.

The loading module 100 transfers the semiconductor strip S loaded from the outside to the cutting module 200 . Although not shown in detail in FIG. 1 , the loading module 100 may include a magazine for carrying the semiconductor strip S and a push rod for pushing the semiconductor strip S to be transferred.

The tape picker 210 can pick up the semiconductor tape S from the loading module 100 and transfer it to the chuck table 220 . The tape picker 210 can be lowered to pick up the semiconductor tape S, and can be raised and lowered to move the semiconductor tape S after being picked up. The tape picker 210 can reach the position of the chuck table 220 and then descend to place the semiconductor tape S on the chuck table.

The chuck table 220 may transfer the semiconductor strip S and the package P between the strip picker 210 and the cutter 230 and between the cutter 230 and the unit picker 240 , respectively. The chuck station 220 may include a first chuck station 222 and a second chuck station 224 . The chuck table 220 can move in the Y-axis direction, can rotate around the Z-axis direction, and can be placed on the semiconductor tape S conveyed by the tape picker 210 . The chuck table 220 may absorb and transfer the semiconductor tape S transferred by the tape picker 210 to the cutting machine 230 . In addition, the chuck table 220 may transfer the plurality of packages P cut by the cutter 230 to the unit picker 240 . When the lower area of the cutter 230 where the cutting work is performed is referred to as a cutting area, the chuck table 220 may reciprocate between the cutting area and the lower area of the unit picker 240 . At this time, the movement of the first chuck table 222 and the second chuck table 224 may be independently controlled. The semiconductor packages P singulated by the dicing machine 230 in the dicing area may be picked up and transferred by the unit picker 240 .

The unit picker 240 may transfer the semiconductor package P cut by the dicing machine 230 and transferred by the chuck table 220 in a vacuum suction manner to transfer in the first direction. Here, the first direction refers to the X-axis direction in which the loading module 100 , the cutting module 200 , and the sorting module 300 are arranged in a line in FIG. 1 . The guide frame 250 provides a path for the unit picker 240 to move in the X-axis direction. The unit picker 240 may transfer the semiconductor package P from the chuck table 220 to the reverse table 310 along the guide frame 250 . The unit picker 240 may include a plurality of vacuum holes (not shown) for vacuum-adsorbing the semiconductor package P, and may move vertically and horizontally by a picker driving unit (not shown). The unit picker 240 may include a table cleaning unit 400 described later, and a picker driving unit (not shown) may move the unit picker 240 in the vertical direction so that the brush unit 410 included in the table cleaning unit 400 The unit picker 240 is brought into contact with the table member T, and the unit picker 240 is reciprocated in the horizontal direction to remove foreign materials such as pollutants from the table member T. FIG. As an example, the pickup driver (not shown) may include an X-axis driver for moving the unit pickup 240 in the X-axis direction and a Z-axis driver for moving the unit pickup 240 in the Z-axis direction. The axis drive section, the X-axis drive section and the Z-axis drive section include motors. In addition, the unit picker 240 may transfer the semiconductor package P on the reversing table 310 that has been inspected to the pallet packages 342 , 344 .

The semiconductor package P transferred to the reversing stage 310 by the unit picker 240 may be transferred to an inspection area where the inspection unit 330 is disposed. The inversion table 310 may include a first inversion table 312 and a second inversion table 314 . The reversing tables 312 , 314 may be configured to move back and forth along the transport guide 320 .

The sorting module 300 sorts the semiconductor packages P according to the inspection results of the semiconductor packages P respectively. The sorting module 300 may include an inspection unit 330 for inspecting the semiconductor packages P on the reversing tables 312 , 314 . As an example, the inspection unit 330 may include a video camera for video inspection of the semiconductor package P. Referring to FIG. It may be that the semiconductor package inspected by the inspection unit 330 is transferred to the first pallet stage 342 and the second pallet stage 344, and the semiconductor package P carried in the first pallet stage 342 and the second pallet stage 344 Pick up individually according to the inspection results and transfer to the take-out tray.

At this time, the inspected semiconductor packages can be transferred from the first reversing table 312 and the second reversing table 314 to the first palletizing table 342 and the second palletizing table 344 through the unit picker 240 . The first pallet table 342 and the second pallet table 344 can be arranged below the first reverse table 312 and the second reverse table 314, and the transfer paths of the reverse tables 312, 314 and the moving paths of the pallet tables 342, 344 can be Laminated construction provided.

The sorting module 300 may include a sorter 370 , a sorter driving part 380 , a first carry-out tray 352 , a second carry-out tray 354 , a first carry-out tray drive part 351 and a second carry-out tray drive part 353 .

The sorter 370 picks up the semiconductor packages P that have been inspected by the inspection unit 330 and carried on the first pallet table 342 and the second pallet table 344 respectively, and transfers them to the first carry-out tray 352 and the second carry-out tray 354 described later. . Hereinafter, the lower area of the sorter 370 is referred to as a sorting area.

The sorter driving part 380 is formed in the shape of a rail and is provided in the X-axis direction to move the sorter 370 in the X-axis direction. The sorter driving part 380 for this purpose may have a built-in driving member for moving the sorter 370 .

The first carry-out tray 352 and the second carry-out tray 354 can load each good-quality semiconductor package P and defective semiconductor package P and carry them out to the outside of the facility. On the other hand, the first carry-out tray 352 and the second carry-out tray 354 may also classify the semiconductor packages P according to the state of manufacture, and may place the semiconductor packages P according to the rank. For example, the first carry-out tray 352 may place A-grade semiconductor packages P thereon, and the second carry-out tray 354 may carry B-grade semiconductor packages P in a manufacturing state lower than A-grade.

If the sorter 370 picks up the semiconductor packages P from the first pallet 342 and the second pallet 344 and places them on each of the first carry-out tray 352 or the second carry-out tray 354, the first carry-out tray 352 Alternatively, the second carry-out tray 354 may move in the Y-axis direction to carry out the semiconductor package P to the outside of the facility.

The first delivery tray drive unit 351 moves the first delivery tray 352 . The first carry-out tray driving unit 351 may incorporate a drive member for moving the first carry-out tray 352 .

The second carry-out tray drive unit 353 moves the second carry-out tray 354 . The second carry-out tray driving unit 353 may incorporate a drive member for moving the second carry-out tray 354 .

On the other hand, although not shown in detail, the semiconductor package cutting and sorting apparatus 10 according to the embodiment of the present invention may further include performing cleaning and drying operations on the semiconductor packages P transferred to the sorting module 300 through the cutting module 200 cleaning unit (not shown).

The semiconductor package dicing and sorting apparatus 10 can sort and discharge the semiconductor ribbon S to the outside after dicing, cleaning, drying, and inspecting as described above. On the other hand, the unit picker 240 according to the embodiment of the present invention is not limited to be included in the semiconductor package cutting and sorting apparatus 10, but may be applicable to a general semiconductor package manufacturing system. Hereinafter, the table cleaning apparatus for cleaning the table member which supports the semiconductor package P in each processing area, and the semiconductor package sorting and dicing method provided with the same are demonstrated.

Generally, in the semiconductor package cutting and sorting apparatus 10 , the transfer of the semiconductor package P may be performed by the unit picker 240 and the table part T. Referring to FIG. Specifically, the transfer of the semiconductor package P from the cutting module 200 to the sorting module 300 can be performed by the unit picker 240, and each processing area inside the cutting module 200 and the sorting module 300 (for example: cutting area, inspection area , sorting area) can be performed by the table part T to move the semiconductor package P. As an example, the table member T may include a chuck table 220 , a reversing table 310 , and pallet tables 342 and 344 .

FIG. 2 is a diagram for explaining a table cleaning device (table cleaning unit) 400 for cleaning the table member T. As shown in FIG. Referring to FIG. 2 , the table cleaning unit 400 according to an embodiment of the present invention may include a brush unit 410 , a first driving part 420 and an air spraying part 430 .

The brush unit 410 may be configured to be movable onto the table member T to be cleaned, and may be moved in the vertical direction by the first drive unit 420 . The brush unit 410 may be provided in a form including a brush for contacting the table member T to remove foreign matter from the table member T, and a pillar structure such as a rod for supporting the brush. As an example, the fur brush may be formed of polyvinyl alcohol (Polyvinyl Alcohol; PVA) fibers that are excellent in hygroscopicity and cleaning power, or may be formed of materials such as nylon wool and lint-free cloth.

Hereinafter, the example of the brush unit 410 is illustrated as a brush form in the embodiments of the present invention and the accompanying drawings, but a brush, a sponge, EVA (ethylene-vinyl acetate copolymer, ethylene-vinyl acetate copolymer, etc.) can also be used. ) materials and their combination forms and other forms of cleaning members. In the case of brushes, various types of brushes such as fixed brushes, rotating brushes, vibrating brushes, and velvet sponge brushes can also be used.

The first drive unit 420 can lower the brush unit 410 to bring the brush unit 410 close to the table member T, or can raise the brush unit 410 that has been lowered. As an example, the first driving unit 420 may include a pneumatic cylinder for moving the brush unit 410 in the vertical direction.

The air spray part 430 may be provided to be movable together with the brush unit 410 and spray air toward the table member T in order to remove particles or moisture remaining on the table member T after cleaning by the brush unit 410 . The operation of the air spraying part 430 may be performed simultaneously with the operation of the brush unit 410, or may be performed independently. As an example, the air injection unit 430 may be provided in the form of an air knife. The air spray part 430 may move in a horizontal direction together with the brush unit 410 .

As an example, the air injection unit 430 may be provided in combination with the brush unit 410 and vertically move toward the table member T by the first driving unit 420 .

Alternatively, the table cleaning device 400 may further include a second drive unit 440 for vertically moving the air spray unit 430 . The second drive unit 440 may lower the air injection unit 430 to approach the table member T, or may cause the lowered air injection unit 430 to rise again. As an example, the second drive unit 440 may include a pneumatic cylinder for moving the air injection unit 430 in the vertical direction.

Operations of the first driving part 420 and the second driving part 440 may be independently controlled. Therefore, the descending of the brush unit 410 and the ascending and descending work of the air spray part 430 may be performed independently.

As shown in FIG. 2 , the table cleaning device 400 may be provided in a form of being mounted on the unit picker 240 . As an example, the table cleaning device 400 can be arranged in a line in the first direction (X-axis direction) in which the unit picker 240, the brush unit 410, and the air injection unit 430 are arranged along the conveying direction of the unit picker 240, that is, the first direction (X-axis direction). Installed on one side of the unit picker 240 . At this time, one side surface of the unit picker 240 to which the table cleaning device 400 is mounted is preferably a surface perpendicular to the first direction, which is the moving direction of the unit picker 240 .

The table cleaning device 400 installed on the unit picker 240 may move onto the table part T to be cleaned by the horizontal movement of the unit picker 240 .

The table cleaning unit 400 can be positioned above the cleaning target table part T by the horizontal movement of the unit picker 240 , and the brush unit 410 can come into contact with the cleaning target table part T by vertical movement (down) of the unit picker 240 . In addition, after the brush unit 410 comes into contact with the table member T to be cleaned, the unit picker 240 is reciprocated in the horizontal direction, and foreign matter can be removed from the table member T accordingly.

The table part T cleaned by the table cleaning unit 400 may be the chuck tables 222 and 224 for transferring the semiconductor strip S on which a plurality of semiconductor packages are arranged to the dicing area, and for transporting the singulated semiconductor packages P to the inspection area. One of the transfer reversing stages 312 and 314 and the pallet stages 342 and 344 that transfer the inspected semiconductor package P to the sorting area. The table cleaning unit 400 can clean the table parts T one by one.

The table cleaning device 400 installed to the unit picker 240 may be connected to the unit picker 240 by at least one of the brush unit 410 and the air spray part 430 .

FIG. 3 and FIG. 4 are diagrams for explaining an arrangement example of the unit picker 240 and the stage cleaning device 400 .

As an example, as shown in (a) of FIG. 3 , the brush unit 410 may be connected to the unit picker 240 and the brush unit 410 and the air injection unit 430 may be combined (that is, integrated).

Alternatively, as shown in (b) of FIG. 3 , the unit pickup 240 may be connected to the air spray unit 430 and the brush unit 410 and the air spray unit 430 may be combined (integrated).

Alternatively, as shown in (c) of FIG. 3 , the brush unit 410 and the air injection part 430 may be respectively connected to the unit picker 240 .

Alternatively, as shown in FIG. 4 , the table cleaning device 400 installed to the unit picker 240 may further include a second air injection part 435 . At this time, the second air spraying part 435 may be configured such that the unit picker 240 and the brush unit 410 are located in a space between the second air spraying part 435 and the air spraying part 430 . That is, the second air injection part 435, the unit picker 240, the brush unit 410, and the air injection part 430 may be arranged in a row along the first direction. According to the table cleaning unit 400 that further includes the second air spraying unit 435, the removal of residual particles and moisture on the table member T becomes independent of the moving direction of the unit picker 240, so that the cleaning of the table member T can be improved. Residual particles and moisture removal efficiency.

On the other hand, although not shown in detail, the positions of the brush unit 410 and the air injection unit 430 based on the unit picker 240 may cross each other as necessary.

5 to 8 are schematic views for explaining the operation of the table cleaning unit 400 .

Referring to FIG. 5 , the table cleaning unit 400 may be positioned above the cleaning object table part T by the unit picker 240 horizontally moving along the guide frame 250 .

Referring to FIG. 6 , the table cleaning unit 400 positioned above the table member T to be cleaned can lower the brush unit 410 and the air spray unit 430 to approach the table member T. Referring to FIG. At this time, the brush unit 410 and the air injection part 430 may be lowered by the first driving part 420 . Thereby, the brush unit 410 and the air injection part 430 may protrude from the unit picker 240 .

Afterwards, the height of the brush unit 410 may be controlled again as the unit picker 240 moves vertically. Referring to FIG. 7 , the brush unit 410 may contact the table part T by the descent of the unit picker 240 . The brush unit 410 in a state of contacting the table part T may remove foreign matter present on the table part T as the unit picker 240 reciprocates in the horizontal direction along the guide frame 250 .

At this time, the Y-axis length of the brush included in the brush unit 410 may be provided to be equal to or greater than the Y-axis length of the table part T. Referring to FIG. Alternatively, in the cleaning step of the table member T, the table member T is moved in the horizontal direction (Y-axis direction) perpendicular to the guide frame 250 in the lower area of the table cleaning unit 400 by the table member drive unit. move. Thus, the cleaning work can be performed on the entire area of the table member T. As shown in FIG.

When the cleaning operation of the table member T by the brush unit 410 is completed, the air spray unit 430 descending together with the brush unit 410 can be operated. Moisture and particles remaining on the table member T can be removed by opening the air injection unit 430 and injecting air to the table member T. FIG. On the other hand, the operation of the air spray unit 430 may be performed simultaneously with the cleaning operation of the table member T by the brush unit 410 .

When the removal process of removing moisture and particles remaining on the table member T is completed, the operation of the air spray unit 430 is stopped, and the lowered brush unit 410 and air spray unit 430 are raised. After that, a process of raising the descended unit picker 240 again may be performed.

On the other hand, as shown in FIGS. 8 and 9 , when the second drive unit 440 for vertically moving the air spraying unit 430 is also provided, the vertical movement of the brush unit 410 and the vertical movement of the air spraying unit 430 can be independently form. It is judged that the process added along with the provision of the second drive unit 440 can be easily understood by a person skilled in the art, and a detailed description thereof will be omitted.

According to an embodiment of the present invention, the aforementioned semiconductor package cutting and sorting equipment 10 may further include a control unit for controlling the operation of the table cleaning unit 400 in order to automate the table cleaning device. The control unit may set the cleaning operation of the table cleaning unit 400 to be performed every certain time so that the cleaning operation of the table cleaning unit 400 is performed periodically. The execution cycle of the cleaning job can be set by the operator. By periodically cleaning the table parts T, the maintenance of the table parts T is automatically performed every cycle even if it is not performed by the operator, so the convenience of maintenance is improved, and the cleaning work of the table parts T is performed every fixed cycle , it is possible to prevent the occurrence of equipment errors caused by the contamination of the table part T and the occurrence of contamination in the package.

FIG. 10 is a flow chart illustrating a semiconductor package cutting and sorting method according to an embodiment of the present invention. A semiconductor package cutting and sorting method according to an embodiment of the present invention may include a loading step ( S1 ), a cutting step ( S2 ), an inspection step ( S3 ), a sorting step ( S4 ), and a table component cleaning step ( S5 ).

The semiconductor package cutting and sorting method according to an embodiment of the present invention may be performed by a semiconductor package cutting and sorting device provided with the aforementioned workbench cleaning device according to an embodiment of the present invention.

The loading step ( S1 ) may include transferring the semiconductor strip S loaded from the outside to the dicing module 200 as a step of loading the semiconductor strip S configured with a plurality of semiconductor packages P into the semiconductor package cutting and sorting equipment. step. The loading module 100 can take out one semiconductor strip S from a magazine containing a plurality of semiconductor strips S and transfer it to the cutting module 200 . The semiconductor strip S delivered from the loading module 100 can be placed on the chuck table 220 by the strip picker 210 .

The cutting step ( S2 ) is a step of cutting the loaded semiconductor strip S to singulate the semiconductor strip S into a plurality of semiconductor packages P. If the chuck table 220 on which the semiconductor strip S is placed moves below the cutting machine 230, the cutting step (S2) is performed by the cutting machine 230, and the cut and individualized semiconductor packages P can be transferred to the unit picker 240 . That is, the chuck table 220 may reciprocate the lower area (cutting area) of the cutter 230 and the lower area of the unit picker 240 in the Y-axis direction. At this time, the chuck table 220 may include a first chuck table 222 and a second chuck table 224, and the movement of the first chuck table 222 and the second chuck table 224 may be independently controlled.

The inspection step ( S3 ) may be performed by the inspection unit 330 as a step for inspecting the semiconductor packages P singulated by the dicing step ( S2 ). The semiconductor package P transferred from the chuck table 220 to the unit picker 240 may be placed on the reversing table 310 by the unit picker 240 , and the inspection step ( S3 ) is performed by moving the reversing table 310 to an inspection area under the inspection unit 330 . The inversion stage 310 may include a first inversion stage 312 and a second inversion stage 314 .

The sorting step ( S4 ) may be performed by the sorter 370 as a step of sorting the semiconductor packages P based on the inspection result of the inspection step ( S3 ). It may be that the inspected semiconductor packages P are transferred to the first pallet table 342 and the second pallet table 344, and the semiconductor packages P placed on the first pallet table 342 and the second pallet table 344 pass through the sorter 370 are picked up and placed on the first carry-out tray 352 or the second carry-out tray 354, respectively. The reference to be loaded on the first carry-out tray 352 or the second carry-out tray 354 can be determined based on the inspection result in the inspection step ( S3 ). After the sorting step ( S4 ) by the sorter 370 is completed, the first carry-out tray 352 or the second carry-out tray 354 can move in the Y-axis direction to carry out the semiconductor packages P to the outside of the facility.

The table member cleaning process (S5) is a process of cleaning the table member which supports and conveys a semiconductor package from a dicing process (S2) to a sorting process (S4). The table component cleaning step ( S5 ) can be performed by the above-described table cleaning device 400 .

FIG. 11 is a flowchart for explaining the table part cleaning step ( S5 ) according to the embodiment of the present invention.

The workbench parts cleaning step (S5) may include a workbench cleaning device horizontally moving step (S51), a workbench cleaning device lowering step (S52), a workbench part cleaning step (S53), and a workbench cleaning device raising step (S54).

Step S51 is a step of moving the table cleaning device 400 horizontally to position the table cleaning device 400 above the table member T to be cleaned. The step of S51 may be performed by horizontally moving the unit picker 240 to which the stage cleaning apparatus 400 is installed.

Step S52 is a step for bringing the table cleaning device 400 close to and in contact with the table member T to be cleaned. Step S52 may include a step of lowering the brush unit 410 and the air injection unit 430 by the first driving unit 420 and a step of lowering the unit picker 240 so that the brush unit 410 contacts the table part T. Referring to FIG. The brush unit 410 and the air spray part 430 may protrude from the unit picker 240 toward the table part T through the first driving part 420 , and the brush unit 410 may contact the table part T by the descent of the unit picker 240 .

Step S53 may include a cleaning step by the brush unit 410 contacting the table part T and a cleaning step by the air spray part 430 close to the table part T. Referring to FIG.

The cleaning step by the brush unit 410 may be performed by reciprocating the unit picker 240 in the first direction (X-axis direction). As the unit picker 240 in contact with the table member T to be cleaned reciprocates in the horizontal direction (X-axis direction), foreign matter or the like on the table member T to be cleaned can be removed by the brush unit 410 .

The cleaning step by the air spray part 430 may be performed by operating the air spray part 430 . By operating the air injection unit 430 close to the table member T to be cleaned, foreign matter, water, and the like remaining on the table member T can be removed. The cleaning step by the air spray part 430 may be performed simultaneously with the cleaning step by the brush unit 410, or may be performed after the cleaning step by the brush unit 410 is completed.

Step S54 is a step for separating the table cleaning device 400 from the table member T to be cleaned. The S54 step may include the steps of making the brush unit 410 and the air injection part 430 descended by the first driving part 420 rise again after completing the S53 step and making the unit picker 240 descended by the picker driving part (not shown) rise again A step of. The brush unit 410 protruding from the unit picker 240 toward the table part T and the air spray part 430 may be recovered through the first driving part 420 .

On the other hand, when the air spraying part 430 is independently vertically moved relative to the brush unit 410 by another second driving part 440, the second driving part 440 may also include a function of lowering or raising the air spraying part 430 in each section. step. For example, the step of vertically moving the air spraying part 430 together with the brush unit 410 by the first driving part 420 in steps S52 to S54 may further include a step of vertically moving the air spraying part 430 by the second driving part 440 . On the other hand, the step of vertically moving the air spraying part 430 by the second driving part 440 may be performed simultaneously with the step of vertically moving the brush unit 410 by the first driving part 420 , or may be performed at the same time as the step of moving the brush unit 410 by the first driving part 420 . The vertical movement steps of the brush unit 410 are all completed and executed. Alternatively, the vertical movement of the brush unit 410 and the vertical movement of the air injection part 430 may be alternately performed one by one.

The table part washing step ( S5 ) may be included in the cutting step ( S2 ), the checking step ( S3 ), the sorting step ( S4 ).

The cleaning target table part T included in the table part cleaning step (S5) in the cutting step (S2) may be the chuck table 222 capable of delivering the semiconductor strip S to the cutting area and supporting the semiconductor tape S in the cutting area. , 224. The table cleaning operation on the first chuck table 222 and the table cleaning operation on the second chuck table 224 may be performed sequentially. In one embodiment, when performing the cutting process on the semiconductor strip S placed on the first chuck table 222 , the second chuck table 224 in the standby state may perform a table cleaning operation. On the contrary, when the cutting process is performed on the semiconductor strip S placed on the second chuck table 224 , the table cleaning operation can be performed on the first chuck table 222 in the standby state.

The table part T to be cleaned in the table part cleaning step (S5) included in the inspection step (S3) may be capable of transporting and supporting the semiconductor packages P singulated in the dicing step to the inspection area. Inverting stages 312, 314 of the semiconductor package P. The table cleaning operation on the first reversing table 312 and the table cleaning operation on the second reversing table 314 may be performed sequentially.

In one embodiment, when the inspection process is performed on the semiconductor package P placed on the first reversing table 312 , the workbench cleaning operation may be performed on the second reversing table 314 in the standby state. On the contrary, when the inspection process is performed on the semiconductor package P mounted on the second reversing table 314 , the stage cleaning operation may be performed on the first reversing table 312 in the standby state.

The cleaning target table part T included in the table part cleaning step (S5) in the sorting step (S4) may be capable of transferring the inspected semiconductor package P to the sorting area and supporting the semiconductor package P in the sorting area. Pallet tables 342,344. The workbench cleaning operation on the first pallet platform 342 and the workbench cleaning operation on the second pallet platform 344 may be performed sequentially.

In one embodiment, when the sorting process is performed on the semiconductor packages P placed on the first pallet 342 , the workbench cleaning operation may be performed on the second pallet 344 in the standby state. On the contrary, when the sorting process is performed on the semiconductor packages P mounted on the second pallet stage 344 , the stage cleaning operation may be performed on the first pallet stage 342 in the standby state.

As such, the stage part cleaning step ( S5 ) for one stage part T may be performed simultaneously with the processing of the semiconductor package P mounted on the stage part T. Referring to FIG. In addition, the stage component cleaning step ( S5 ) may also be performed on the semiconductor package P placed on the stage component T as needed.

Above, referring to FIG. 1 to FIG. 11 , the table cleaning device 400 , the conductor package cutting and sorting device 10 having the same and the semiconductor package cutting and sorting method according to the present invention have been described. The workbench cleaning device according to the embodiment of the present invention is used to clean the workbench parts T on which the semiconductor package P is placed, such as the chuck table 220, the reverse table 310, the pallet table 342, 344, etc., at a certain period of time. device. The stage cleaning device 400 can be automatically executed in the equipment without being separated from the equipment, and can be executed simultaneously with the processing process of the semiconductor package. Therefore, the work time required for the conventional table cleaning process can be significantly shortened, and productivity (UPH) can be improved. In addition, it is possible to prevent package contamination and quality degradation caused by contamination of stage components.

As mentioned above, although it demonstrated with reference to the limited Example and drawing, it is only an Example, and it is obvious to those skilled in the art that various deformation|transformation can be implemented within the range of the technical concept of this invention. All or some of the embodiments can be selectively combined to implement. Therefore, the protection scope of the present invention should be determined by the description of the scope of the patent application and its equivalent scope.

10: Classification equipment 100: Loading mods 200: cutting module 210: tape picker 220: chuck table 222: The first chuck table 224: The second chuck table 230: cutting machine 240: Unit Picker 250: guide frame 300:Classification module 310: reverse station 312: reverse station 314: reverse station 320: transmission guide 330: check unit 342: The first pallet 344: Second pallet platform 351: The first unloading tray driving part 352: The first pallet is moved out 353: The second unloading tray driving part 354: The second unloading pallet 370: sorting machine 380:Sorter drive components 400: Bench cleaning device 410: Brush unit 420: The first driving department 430: Air Injection Department 435:Second air injection part 440:Second drive unit P: Package S: Semiconductor tape S1: step S2: step S3: step S4: step S5: step S51: step S52: step S53: step S54: step T: Workbench Parts X: X-axis Y: Y-axis Z: Z-axis

FIG. 1 is a diagram illustrating a semiconductor package cutting and sorting apparatus according to an embodiment of the present invention.

Fig. 2 is an enlarged view for explaining the table cleaning device shown in Fig. 1 .

3 and 4 are plan views schematically showing an arrangement example of the table cleaning device.

5 to 9 are schematic diagrams for explaining the operation of the table cleaning device.

FIG. 10 is a flow chart illustrating a semiconductor package cutting and sorting method according to an embodiment of the present invention.

Fig. 11 is a flow chart for explaining the table cleaning method of Fig. 10 .

10: Classification equipment

100: Loading mods

200: cutting module

210: tape picker

220: chuck table

222: The first chuck table

224: The second chuck table

230: cutting machine

240: Unit Picker

250: guide frame

300:Classification module

310: reverse station

312: reverse station

314: reverse station

320: transmission guide

330: check unit

342: The first pallet

344: Second pallet platform

351: The first unloading tray driving part

352: The first pallet is moved out

353: The second unloading tray driving part

354: The second unloading pallet

370: sorting machine

380:Sorter drive components

400: Bench cleaning device

P: Package

S: Semiconductor tape

X: X-axis

Y: Y-axis

Claims (20)

A workbench cleaning device, comprising: A brush unit capable of moving in the horizontal direction on a table supporting the semiconductor package; a first drive unit to move the brush unit in a vertical direction; and The air injection unit can move together with the brush unit. The workbench cleaning device according to claim 1, wherein, The stage cleaning device is installed in a unit picker that picks up the singulated semiconductor packages and conveys them in a first direction to move on the stage member. The workbench cleaning device according to claim 2, wherein, In the table cleaning device, the unit picker, the brush unit, and the air injection unit are arranged in a row along the first direction. The workbench cleaning device according to claim 3, wherein, At least one of the brush unit and the air injection part is connected to the unit picker. The workbench cleaning device according to claim 4, wherein, The table cleaning device further includes a second air injection unit. The workbench cleaning device according to claim 5, wherein, The second air spraying part is configured such that the unit picker and the brush unit are located in a space between the second air spraying part and the air spraying part. The workbench cleaning device according to claim 1, wherein, The table cleaning device further includes a second driving unit for vertically moving the air jetting unit. The workbench cleaning device according to claim 7, wherein, The driving of the first driving part and the second driving part are independently controlled. The workbench cleaning device according to claim 1, wherein, The workbench components include: a chuck table supporting the semiconductor package in the dicing area; a reversing table supporting the semiconductor package in the inspection area; and A pallet supports the semiconductor packages in the sorting area. A semiconductor package cutting and sorting device, comprising: The loading module carries the semiconductor strips equipped with multiple semiconductor packages; a dicing module, including a dicing area, and dicing the semiconductor strip to singulate a plurality of the semiconductor packages; The classification module includes an inspection area and a classification area, and inspects the individualized semiconductor packages and classifies them according to the inspection results; a unit picker that absorbs the semiconductor package and transfers it from the chuck table of the cutting area to the pallet table of the sorting module via the reversing table of the inspection area; and a workbench cleaning device for cleaning the workbench parts including the chuck table, the reversing table and the pallet table, The workbench cleaning device includes: a brush unit capable of moving in a horizontal direction on a table supporting the semiconductor package; a first drive unit to move the brush unit in a vertical direction; and The air injection unit can move together with the brush unit. According to the semiconductor package cutting and sorting equipment described in claim 10, wherein, The workbench cleaning device is arranged on the unit picker. According to the semiconductor package cutting and sorting equipment described in claim 10, wherein, The semiconductor package cutting and sorting equipment also includes: A control unit for operating the table cleaning device at regular intervals. According to the semiconductor package cutting and sorting equipment described in claim 10, wherein, The workbench cleaning device also includes: a second drive unit for vertically moving the air injection unit, The driving of the first driving part and the second driving part are independently controlled. A semiconductor package cutting and sorting method, comprising: a loading step of being supplied with a semiconductor strip configured with a plurality of semiconductor packages; a cutting step of cutting the supplied semiconductor strip; an inspection step of inspecting the semiconductor packages singulated by the cutting step; a sorting step of sorting the semiconductor packages according to a result of the checking step; and In the table member cleaning step, the table member is cleaned with a table cleaning device including a brush unit and an air jetting unit. According to the semiconductor package cutting and sorting method described in claim 14, wherein, The cleaning steps of the workbench parts include: A step of positioning the workbench cleaning device above the workbench parts to be cleaned; the step of lowering said bench cleaning device towards said bench member; the step of cleaning said table components; and A step of raising the table cleaning device from the table member. According to the semiconductor package cutting and sorting method described in claim 15, wherein, The table member washing step is included in the cutting step, the inspecting step, and the sorting step, respectively. According to the semiconductor package cutting and sorting method described in claim 16, wherein, The table member cleaning step can be performed simultaneously with one of the cutting step, the inspection step, and the sorting step. According to the semiconductor package cutting and sorting method described in claim 16, wherein, When the table part cleaning step is included in the cutting step, The cleaning target table member is a chuck table supporting the semiconductor package in a dicing area. According to the semiconductor package cutting and sorting method described in claim 16, wherein, When said table part cleaning step is included in said inspection step, The cleaning target table member is a reversing table supporting the semiconductor package in an inspection area. According to the semiconductor package cutting and sorting method described in claim 16, wherein, When the table part cleaning step is included in the sorting step, The cleaning target table member is a pallet supporting the semiconductor package in the sorting area.

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