TW202233794A - 硬化性樹脂組成物、硬化物、接著劑、及接著膜 - Google Patents

硬化性樹脂組成物、硬化物、接著劑、及接著膜 Download PDF

Info

Publication number
TW202233794A
TW202233794A TW110147229A TW110147229A TW202233794A TW 202233794 A TW202233794 A TW 202233794A TW 110147229 A TW110147229 A TW 110147229A TW 110147229 A TW110147229 A TW 110147229A TW 202233794 A TW202233794 A TW 202233794A
Authority
TW
Taiwan
Prior art keywords
curable resin
meth
resin composition
mentioned
acrylate
Prior art date
Application number
TW110147229A
Other languages
English (en)
Chinese (zh)
Inventor
脇岡紗香
北條健太郎
中村悠
竹田幸平
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202233794A publication Critical patent/TW202233794A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110147229A 2020-12-23 2021-12-16 硬化性樹脂組成物、硬化物、接著劑、及接著膜 TW202233794A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-213595 2020-12-23
JP2020213595 2020-12-23

Publications (1)

Publication Number Publication Date
TW202233794A true TW202233794A (zh) 2022-09-01

Family

ID=82159259

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147229A TW202233794A (zh) 2020-12-23 2021-12-16 硬化性樹脂組成物、硬化物、接著劑、及接著膜

Country Status (3)

Country Link
JP (1) JP7853790B2 (https=)
TW (1) TW202233794A (https=)
WO (1) WO2022138407A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270852A (ja) * 1985-05-24 1986-12-01 Nitto Electric Ind Co Ltd 半導体装置
JP2002006490A (ja) * 2000-06-26 2002-01-09 Ube Ind Ltd イミド系感光性樹脂組成物、絶縁膜およびその形成法
US6294259B1 (en) * 2000-07-06 2001-09-25 3M Innovative Properties Company Polyimide hybrid adhesives
JP2003162055A (ja) * 2001-11-26 2003-06-06 Ube Ind Ltd 感光性樹脂組成物、感光性フィルム、絶縁膜およびその形成法
JP2007091799A (ja) * 2005-09-27 2007-04-12 Kaneka Corp 熱硬化性樹脂組成物、及びその利用
US9783631B2 (en) * 2014-12-19 2017-10-10 The University Of Akron Synthesis and characterization of UV-curable maleimide-terminated imide oligomers
WO2017169574A1 (ja) 2016-03-30 2017-10-05 東レ株式会社 感光性接着剤組成物、硬化物、感光性接着剤シート、積層基板および接着剤パターン付積層基板の製造方法
CN115197421A (zh) * 2017-01-27 2022-10-18 积水化学工业株式会社 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂
CN110461818B (zh) * 2017-04-21 2023-11-14 积水化学工业株式会社 酰亚胺低聚物、固化剂、粘接剂和酰亚胺低聚物的制造方法
WO2021241548A1 (ja) * 2020-05-28 2021-12-02 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物

Also Published As

Publication number Publication date
WO2022138407A1 (ja) 2022-06-30
JP7853790B2 (ja) 2026-04-30
JPWO2022138407A1 (https=) 2022-06-30

Similar Documents

Publication Publication Date Title
JP7184641B2 (ja) 硬化性樹脂組成物、及び、接着剤
JP2020007397A (ja) 硬化性樹脂組成物、イミド化合物、接着剤、接着フィルム、カバーレイフィルム、及び、フレキシブル銅張積層板
JP7689917B2 (ja) 硬化性樹脂組成物、接着剤、及び、接着フィルム
JP7103940B2 (ja) イミドオリゴマー組成物、硬化剤、接着剤、及び、イミドオリゴマー組成物の製造方法
JP2022188991A (ja) 熱硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物
JP7132084B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7853790B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
TW201925336A (zh) 硬化性樹脂組成物、硬化物、接著劑、及接著膜
JP7667633B2 (ja) 硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物
JP7265474B2 (ja) 硬化性樹脂組成物、接着剤、接着フィルム、カバーレイフィルム、及び、フレキシブル銅張積層板
WO2021241548A1 (ja) 硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物
JP7563988B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7767112B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP5098624B2 (ja) ポリアミド樹脂及びその製造方法、ポリアミド樹脂を含む硬化性樹脂組成物
WO2019083006A1 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
WO2023136098A1 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7207863B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP2021155494A (ja) 硬化性樹脂組成物、接着剤、及び、接着フィルム
JP2021155493A (ja) 熱硬化性接着フィルム
TW202323380A (zh) 硬化性樹脂組成物及層間絕緣材料
JP2023118258A (ja) 硬化性樹脂組成物及び層間絶縁材料
JP2022173783A (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
TW202248342A (zh) 絕緣樹脂片、積層體、及半導體裝置
CN116964156A (zh) 固化性树脂组合物、固化物、粘接剂及粘接膜