JP7853790B2 - 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム - Google Patents

硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム

Info

Publication number
JP7853790B2
JP7853790B2 JP2021578055A JP2021578055A JP7853790B2 JP 7853790 B2 JP7853790 B2 JP 7853790B2 JP 2021578055 A JP2021578055 A JP 2021578055A JP 2021578055 A JP2021578055 A JP 2021578055A JP 7853790 B2 JP7853790 B2 JP 7853790B2
Authority
JP
Japan
Prior art keywords
curable resin
meth
formula
resin composition
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021578055A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022138407A1 (https=
Inventor
さやか 脇岡
健太郎 北條
悠 中村
幸平 竹田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2022138407A1 publication Critical patent/JPWO2022138407A1/ja
Application granted granted Critical
Publication of JP7853790B2 publication Critical patent/JP7853790B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021578055A 2020-12-23 2021-12-16 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム Active JP7853790B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020213595 2020-12-23
JP2020213595 2020-12-23
PCT/JP2021/046401 WO2022138407A1 (ja) 2020-12-23 2021-12-16 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム

Publications (2)

Publication Number Publication Date
JPWO2022138407A1 JPWO2022138407A1 (https=) 2022-06-30
JP7853790B2 true JP7853790B2 (ja) 2026-04-30

Family

ID=82159259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021578055A Active JP7853790B2 (ja) 2020-12-23 2021-12-16 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム

Country Status (3)

Country Link
JP (1) JP7853790B2 (https=)
TW (1) TW202233794A (https=)
WO (1) WO2022138407A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002006490A (ja) 2000-06-26 2002-01-09 Ube Ind Ltd イミド系感光性樹脂組成物、絶縁膜およびその形成法
JP2004502859A (ja) 2000-07-06 2004-01-29 スリーエム　イノベイティブ　プロパティズ　カンパニー ポリイミドハイブリッド接着剤
WO2017169574A1 (ja) 2016-03-30 2017-10-05 東レ株式会社 感光性接着剤組成物、硬化物、感光性接着剤シート、積層基板および接着剤パターン付積層基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270852A (ja) * 1985-05-24 1986-12-01 Nitto Electric Ind Co Ltd 半導体装置
JP2003162055A (ja) * 2001-11-26 2003-06-06 Ube Ind Ltd 感光性樹脂組成物、感光性フィルム、絶縁膜およびその形成法
JP2007091799A (ja) * 2005-09-27 2007-04-12 Kaneka Corp 熱硬化性樹脂組成物、及びその利用
US9783631B2 (en) * 2014-12-19 2017-10-10 The University Of Akron Synthesis and characterization of UV-curable maleimide-terminated imide oligomers
CN115197421A (zh) * 2017-01-27 2022-10-18 积水化学工业株式会社 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂
CN110461818B (zh) * 2017-04-21 2023-11-14 积水化学工业株式会社 酰亚胺低聚物、固化剂、粘接剂和酰亚胺低聚物的制造方法
WO2021241548A1 (ja) * 2020-05-28 2021-12-02 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002006490A (ja) 2000-06-26 2002-01-09 Ube Ind Ltd イミド系感光性樹脂組成物、絶縁膜およびその形成法
JP2004502859A (ja) 2000-07-06 2004-01-29 スリーエム　イノベイティブ　プロパティズ　カンパニー ポリイミドハイブリッド接着剤
WO2017169574A1 (ja) 2016-03-30 2017-10-05 東レ株式会社 感光性接着剤組成物、硬化物、感光性接着剤シート、積層基板および接着剤パターン付積層基板の製造方法

Also Published As

Publication number Publication date
WO2022138407A1 (ja) 2022-06-30
TW202233794A (zh) 2022-09-01
JPWO2022138407A1 (https=) 2022-06-30

Similar Documents

Publication Publication Date Title
JP7184641B2 (ja) 硬化性樹脂組成物、及び、接着剤
JP7018942B2 (ja) 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
WO2018139559A1 (ja) 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、フレキシブル銅張積層板、及び、回路基板
JP7305315B2 (ja) 硬化性樹脂組成物、接着剤、接着フィルム、カバーレイフィルム、及び、フレキシブル銅張積層板
JP7689917B2 (ja) 硬化性樹脂組成物、接着剤、及び、接着フィルム
JP2022188991A (ja) 熱硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物
JP7853790B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7132084B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7265474B2 (ja) 硬化性樹脂組成物、接着剤、接着フィルム、カバーレイフィルム、及び、フレキシブル銅張積層板
WO2021241548A1 (ja) 硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物
JP7667633B2 (ja) 硬化性樹脂組成物、接着剤、接着剤ワニス、接着フィルム、及び、硬化物
JP2022121514A (ja) 硬化性樹脂組成物
JP7168325B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、フレキシブル銅張積層板、及び、回路基板
JP7563988B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7767112B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
WO2023136098A1 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7207863B2 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
WO2023032723A1 (ja) 硬化性樹脂組成物及び層間絶縁材料
JP2021155493A (ja) 熱硬化性接着フィルム
JP2022173783A (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP2023118258A (ja) 硬化性樹脂組成物及び層間絶縁材料
JP2021155494A (ja) 硬化性樹脂組成物、接着剤、及び、接着フィルム
WO2022220253A1 (ja) 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240903

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250902

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20251104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251118

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260331

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260417