TW202233757A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TW202233757A
TW202233757A TW110142153A TW110142153A TW202233757A TW 202233757 A TW202233757 A TW 202233757A TW 110142153 A TW110142153 A TW 110142153A TW 110142153 A TW110142153 A TW 110142153A TW 202233757 A TW202233757 A TW 202233757A
Authority
TW
Taiwan
Prior art keywords
resin composition
mass
resin
component
manufactured
Prior art date
Application number
TW110142153A
Other languages
English (en)
Chinese (zh)
Inventor
川合賢司
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202233757A publication Critical patent/TW202233757A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW110142153A 2020-11-12 2021-11-12 樹脂組成物 TW202233757A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020189015 2020-11-12
JP2020-189015 2020-11-12

Publications (1)

Publication Number Publication Date
TW202233757A true TW202233757A (zh) 2022-09-01

Family

ID=81602430

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110142153A TW202233757A (zh) 2020-11-12 2021-11-12 樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2022102757A1 (ko)
KR (1) KR20230098808A (ko)
CN (1) CN116406332A (ko)
TW (1) TW202233757A (ko)
WO (1) WO2022102757A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11976231B2 (en) * 2022-09-13 2024-05-07 United States Of America As Represented By The Secretary Of The Air Force Highly aromatic and liquid-crystalline co- polyimides endcapped with aromatic groups and crosslinked products therefrom

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234328A (ja) * 2013-06-18 2013-11-21 Ajinomoto Co Inc エポキシ樹脂組成物
JP6992333B2 (ja) * 2017-09-06 2022-01-13 味の素株式会社 樹脂組成物
JP6752390B1 (ja) 2018-09-12 2020-09-09 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
JPWO2022102757A1 (ko) 2022-05-19
WO2022102757A1 (ja) 2022-05-19
KR20230098808A (ko) 2023-07-04
CN116406332A (zh) 2023-07-07

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