JPWO2022102757A1 - - Google Patents

Info

Publication number
JPWO2022102757A1
JPWO2022102757A1 JP2022562211A JP2022562211A JPWO2022102757A1 JP WO2022102757 A1 JPWO2022102757 A1 JP WO2022102757A1 JP 2022562211 A JP2022562211 A JP 2022562211A JP 2022562211 A JP2022562211 A JP 2022562211A JP WO2022102757 A1 JPWO2022102757 A1 JP WO2022102757A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022562211A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022102757A1 publication Critical patent/JPWO2022102757A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2022562211A 2020-11-12 2021-11-12 Pending JPWO2022102757A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020189015 2020-11-12
PCT/JP2021/041792 WO2022102757A1 (ja) 2020-11-12 2021-11-12 樹脂組成物

Publications (1)

Publication Number Publication Date
JPWO2022102757A1 true JPWO2022102757A1 (ko) 2022-05-19

Family

ID=81602430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022562211A Pending JPWO2022102757A1 (ko) 2020-11-12 2021-11-12

Country Status (5)

Country Link
JP (1) JPWO2022102757A1 (ko)
KR (1) KR20230098808A (ko)
CN (1) CN116406332A (ko)
TW (1) TW202233757A (ko)
WO (1) WO2022102757A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11976231B2 (en) * 2022-09-13 2024-05-07 United States Of America As Represented By The Secretary Of The Air Force Highly aromatic and liquid-crystalline co- polyimides endcapped with aromatic groups and crosslinked products therefrom

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234328A (ja) * 2013-06-18 2013-11-21 Ajinomoto Co Inc エポキシ樹脂組成物
JP2019044128A (ja) * 2017-09-06 2019-03-22 味の素株式会社 樹脂組成物
WO2020054526A1 (ja) * 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234328A (ja) * 2013-06-18 2013-11-21 Ajinomoto Co Inc エポキシ樹脂組成物
JP2019044128A (ja) * 2017-09-06 2019-03-22 味の素株式会社 樹脂組成物
WO2020054526A1 (ja) * 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
KR20230098808A (ko) 2023-07-04
WO2022102757A1 (ja) 2022-05-19
TW202233757A (zh) 2022-09-01
CN116406332A (zh) 2023-07-07

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