TW202230582A - Transportation mechanism, cutting device, and method for manufacturing cut article - Google Patents

Abstract

Provided are a transportation mechanism, a cutting device, and a method for manufacturing a cut article in which it is possible to simplify the configuration. This transportation mechanism has disposed therein a plurality of suction nozzles configured from suction nozzles of a first group and suction nozzles of a second group, the transportation mechanism comprising: a first motor for raising/lowering the suction nozzles of the first group; a second motor for raising/lowering the suction nozzles of the second group; a third motor for rotating the plurality of suction nozzles in a plane intersecting the direction in which the plurality of suction nozzles are raised/lowered; and a raising/lowering position maintenance mechanism that is capable of maintaining a discretionary suction nozzle, from among the plurality of suction nozzles, at a prescribed raised position irrespective of the driving of the first motor and the second motor.

Description

Conveying mechanism, cutting device, and manufacturing method of cut product

The present invention relates to a technology related to a conveying mechanism, a cutting device, and a method of manufacturing a cut product.

Patent Document 1 discloses a technique of a semiconductor package processing system including a mechanism (transfer portion) for sucking and conveying a semiconductor package. Specifically, the semiconductor package processing system described in Patent Document 1 includes: a plurality of nozzles for sucking the semiconductor package; a motor (first drive unit) provided corresponding to each nozzle to vertically move the nozzle; and a motor (second drive unit) ), one for each of the two nozzles to rotate the nozzles.

In the semiconductor packaging processing system configured as described above, the nozzles can be individually raised and lowered by the first drive unit, and the nozzles can be rotated by the second drive unit. By combining the operations of these nozzles, the semiconductor package can be sucked and transported smoothly. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-207326

[The problem to be solved by the invention]

However, in the technique described in Patent Document 1, in order to operate (elevate and rotate) the nozzles, motors 1.5 times the number of nozzles are required (for example, in the example described in Patent Document 1, compared to 8 12 motors are required for one nozzle), it is difficult to simplify the structure, and there is room for improvement in this aspect.

The present invention has been made in view of the above-mentioned situation, and an object to be solved by the present invention is to provide a conveyance mechanism, a cutting device, and a method for manufacturing a cut product that can simplify the structure. [Means of Solving Problems]

The problem to be solved by the present invention is as described above, and in order to solve the problem, the transport mechanism of the present invention is provided with a plurality of suction nozzles composed of a first group of suction nozzles and a second group of suction nozzles, and the transport mechanism includes: The first motor moves the first group of suction nozzles up and down; the second motor moves the second group of suction nozzles up and down; the third motor moves the plurality of suction nozzles in the lifting direction of the plurality of suction nozzles rotation in the intersecting plane; and a lift position maintaining mechanism capable of maintaining any suction nozzle among the plurality of suction nozzles at a predetermined raised position irrespective of driving of the first motor and the second motor.

Moreover, the cutting apparatus of this invention includes the said conveyance mechanism.

Moreover, the manufacturing method of the cut product of this invention manufactures a cut product using the said cutting apparatus. [Effect of invention]

According to the present invention, simplification of the structure can be achieved.

<Overall structure of cutting device 1> First, the structure of the cutting device 1 and the manufacturing method of the cut product using the cutting device 1 according to one embodiment of the present invention will be described with reference to FIGS. 1 and 2 . In the present embodiment, for example, the configuration of the cutting device 1 in the case of using a package substrate P to which electronic components such as a semiconductor wafer are connected will be described as the object to be cut by the cutting device 1 . The substrate is resin-sealed.

As the package substrate P, for example, a Ball Grid Array (BGA) package substrate, a Land Grid Array (LGA) package substrate, a Chip Size Package (CSP) package substrate, and a light emitting diode can be used. Body (Light emitting diode, LED) packaging substrate, etc. In addition, as the object to be cut, not only the package substrate P but also a sealed lead frame formed by resin-sealing a lead frame to which electronic components such as a semiconductor chip are connected may be used.

Hereinafter, the surface on the side of the package substrate P sealed with resin, ie, the surface on the package side, is referred to as a mold surface, and the surface on the substrate side opposite to the mold surface is referred to as a ball/lead surface.

The cutting device 1 includes a cutting module A and an inspection module B as components. Each component is detachable and replaceable with respect to other components. Hereinafter, the configuration of the cutting module A and the inspection module B, and the operation procedure using the cutting module A and the inspection module B will be described in order.

<Cut Module A> The cutting module A is a component that mainly performs cutting of the package substrate P. As shown in FIG. The cutting module A mainly includes a substrate supply mechanism 2 , a positioning mechanism 3 , a cutting table 4 , a spindle unit 5 , a first cleaner 6 , a transfer mechanism 7 , a second cleaner 8 , and a control unit 9 .

In the cutting module A, first, the supply step S2 is performed. The supplying step S2 is a step of supplying the package substrate P using the substrate supply mechanism 2 . The substrate supply mechanism 2 pushes out the package substrates P one by one from a magazine M that accommodates a plurality of package substrates P, and supplies them to the positioning mechanism 3 described later. The package substrate P is configured with the ball/lead face up.

Next, in the cutting module A, the positioning step S4 is performed. The positioning step S4 is a step of positioning the package substrate P supplied from the substrate supply mechanism 2 using the positioning mechanism 3 . The positioning mechanism 3 arranges and positions the package substrate P pushed out from the substrate supply mechanism 2 on the rail portion 3a. Then, the positioning mechanism 3 conveys the positioned package substrate P to a cutting table 4 to be described later.

Next, in the cutting module A, the cutting step S6 is performed. The cutting step S6 is a step of cutting the package substrate P using the cutting table 4 and the spindle portion 5 to obtain the electronic component package S as a cut product.

The cutting stage 4 holds the package substrate P to be cut. In this embodiment, the cutting apparatus 1 of the double cutting table structure which has two cutting tables 4 is illustrated. The cutting table 4 is provided with a holding member 4a that suction-holds the package substrate P conveyed by the positioning mechanism 3 from below. In addition, the cutting table 4 is provided with a rotation mechanism 4b capable of rotating the holding member 4a in the θ direction in the drawing, and a moving mechanism 4c capable of moving the holding member 4a in the Y direction in the drawing.

The main shaft portion 5 serving as a cutting mechanism cuts the package substrate P and separates it into a plurality of electronic component packages S (see FIG. 3 ). In the present embodiment, the cutting device 1 having a double-spindle structure having two spindle portions 5 is exemplified. The main shaft portion 5 is movable in the X direction and the Z direction in the figure. A rotary blade 5 a for cutting the package substrate P is attached to the spindle portion 5 .

The main shaft portion 5 is provided with a cutting water nozzle for spraying cutting water to the rotating blade 5a rotating at a high speed, a cooling water nozzle for spraying cooling water, and a cleaning water nozzle for spraying cleaning water for cleaning cutting chips and the like (none of which are shown in the figure). )Wait.

After the cutting stage 4 sucks the package substrate P, the position of the package substrate P is confirmed by the first position confirmation camera 4d. Then, the cutting table 4 moves so as to approach the main shaft portion 5 along the Y direction in the drawing. After the cutting table 4 is moved below the spindle portion 5 , the package substrate P is cut by relatively moving the cutting table 4 and the spindle portion 5 . Every time the package substrate P is cut by the spindle portion 5 , the position and the like of the package substrate P are confirmed by the second position confirmation camera 5b.

Here, the confirmation by the 1st position confirmation camera 4d can confirm the position of the mark which shows the cutting position provided in the package board|substrate P, for example. The confirmation by the 2nd position confirmation camera 5b can confirm the position where the package board|substrate P is cut, the cut|disconnected width, etc., for example. In addition, the confirmation by the confirmation camera may be performed using only the second position confirmation camera 5b instead of the first position confirmation camera 4d.

Next, in the cutting module A, the first cleaning step S8 and the first drying step S10 are performed. The first cleaning step S8 is a step of cleaning the plurality of electronic component packages S obtained by cutting the package substrate P and singulated into pieces using the first cleaner 6 . In addition, the first drying step S10 is a step of drying the cleaned electronic component package S using the first cleaner 6 .

After the cutting of the package substrate P is completed, the cutting stage 4 moves away from the main shaft portion 5 along the Y direction in the figure in a state in which the plurality of electronic component packages S singulated are adsorbed. At this time, the first cleaner 6 cleans the upper surface (ball/lead surface) of the electronic component package S using an appropriate cleaning liquid (first cleaning step S8 ). Moreover, the 1st cleaner 6 sprays gas (air) to the upper surface of the electronic component package S, and dries the upper surface of the electronic component package S (1st drying step S10).

Next, in the cutting module A, a transfer step S12, a second cleaning step S14 as a cleaning step, and a second drying step S16 as a suction drying step are performed. The transfer step S12 is a step of transferring the electronic component package S to the inspection table 11 of the inspection module B using the transfer mechanism 7 . In addition, the second cleaning step S14 is a step of cleaning the electronic component package S using the second cleaner 8 . In addition, the second drying step S16 is a step of drying the cleaned electronic component package S using the second cleaner 8 .

The transfer mechanism 7 sucks the electronic component package S held by the cutting table 4 from above, and transfers it to the inspection module B (transfer step S12 ). In addition, in the middle of the path in which the electronic component package S is transferred to the inspection module B by the transfer mechanism 7 , the lower surface (mold surface) of the electronic component package S is cleaned by the second cleaner 8 (second cleaning step S14 ). and drying (second drying step S16).

Specifically, the second cleaner 8 includes a cleaning mechanism 8a and a suction drying mechanism 8b. The cleaning mechanism 8a includes a rotatable brush (not shown). The cleaning mechanism 8 a cleans the electronic component package S by contacting the lower surface (mold surface) of the electronic component package S while rotating the brush containing the cleaning liquid (second cleaning step S14 ). In addition, the suction drying mechanism 8b performs drying of the electronic component package S by sucking the cleaning liquid adsorbed on the lower surface (mold surface) of the electronic component package S (second drying step S16).

The operations of the above-mentioned parts of the cutting module A (the substrate supply mechanism 2 , the positioning mechanism 3 , the cutting table 4 , the spindle part 5 , the first cleaner 6 , the transfer mechanism 7 , the second cleaner 8 , etc.) The control unit 9 controls. In addition, the operation of each unit of the cutting module A can be arbitrarily changed (adjusted) using the control unit 9 .

<Check Module B> The inspection module B is a structural element that mainly performs inspection of the electronic component package S. As shown in FIG. The inspection module B mainly includes an inspection table 11 , a first optical inspection camera 12 , a second optical inspection camera 13 , an arrangement mechanism 14 , a conveyance mechanism 15 , and a control unit 16 .

In the inspection module B, first, the inspection step S18 is performed. The inspection step S18 is a step of optically inspecting the electronic component package S using the inspection table 11 , the first optical inspection camera 12 , and the second optical inspection camera 13 .

The inspection table 11 holds the electronic component package S in order to perform an optical inspection on the electronic component package S. As shown in FIG. The inspection table 11 is movable in the X direction in the drawing. In addition, the inspection table 11 can be reversed up and down. The inspection table 11 is provided with a holding member 11a for holding the electronic component package S by suction.

The first optical inspection camera 12 and the second optical inspection camera 13 optically inspect the surface (ball/lead surface and die surface) of the electronic component package S. The first optical inspection camera 12 and the second optical inspection camera 13 are arranged in the vicinity of the inspection table 11 facing upward. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively provided with illumination devices (not shown) capable of irradiating light during inspection.

The first optical inspection camera 12 inspects the mold surface of the electronic component package S transferred to the inspection table 11 by the transfer mechanism 7 . Then, the transfer mechanism 7 places the electronic component package S on the holding member 11 a of the inspection table 11 . After the holding member 11a adsorbs and holds the electronic component package S, the inspection table 11 is turned upside down. The inspection table 11 is moved above the second optical inspection camera 13 , and the ball/lead surface of the electronic component package S is inspected by the second optical inspection camera 13 .

For example, the first optical inspection camera 12 can inspect the notch of the electronic component package S or the characters marked on the electronic component package S, and the like. In addition, for example, the second optical inspection camera 13 may inspect the size or shape of the electronic part package S, the positions of balls/leads, and the like.

The placement mechanism 14 is used to place the electronic component packages S that have been inspected. The arrangement mechanism 14 is movable along the Y direction in the drawing. The inspection table 11 arranges the electronic component package S, which has been inspected by the first optical inspection camera 12 and the second optical inspection camera 13 , on the arrangement mechanism 14 .

Next, in the inspection module B, the accommodating step S20 is performed. The accommodating step S20 is a step of conveying (transferring) the electronic component packages S arranged in the arrangement mechanism 14 using the conveying mechanism 15 and accommodating them in a tray. Based on the inspection results obtained by the first optical inspection camera 12 and the second optical inspection camera 13 , the electronic component packages S classified into good products and defective products are stored in the tray by the conveyance mechanism 15 . At this time, the conveyance mechanism 15 accommodates the good product in the electronic component package S in the good product tray 15a, and accommodates the defective product in the defective product tray 15b. When the tray is filled with the electronic part packages S, it is appropriately supplied to other empty trays.

The operations of the above-described parts of the inspection module B (the inspection table 11 , the first optical inspection camera 12 , the second optical inspection camera 13 , the arrangement mechanism 14 , the conveyance mechanism 15 , and the like) are controlled by the control unit 16 . In addition, the operation of each unit of the inspection module B can be arbitrarily changed (adjusted) using the control unit 16 .

As described above, the cutting device 1 of the present embodiment can cut the package substrate P and separate it into a plurality of electronic component packages S. As shown in FIG.

<Conveying Mechanism 15> Next, the structure of the conveyance mechanism 15 used in the said accommodation step S20 is demonstrated. In addition, the directions indicated by arrows U, arrows D, arrows L, arrows R, arrows F, and arrows Rr shown in the drawings are defined as the upward direction, the downward direction, the left direction, the right direction, the front direction and the rear direction, respectively. directions to explain. The left-right direction is the direction along the X direction shown in FIG. 1 , the front-rear direction is the direction along the Y direction shown in FIG. 1 , and the up-down direction is the direction along the Z direction shown in FIG. 1 .

The conveyance mechanism 15 shown in FIGS. 3 and 4 sucks and conveys the electronic component package S. As shown in FIG. The conveying mechanism 15 mainly includes the suction nozzle 110 , the first lifting motor 120 , the first lifting power transmission mechanism 130 , the second lifting motor 140 , the second lifting power transmission mechanism 150 , the nozzle holding mechanism 160 , the lifting position maintaining mechanism 170 , and the rotation motor 180 and rotational power transmission mechanism 190.

<Suction nozzle 110> The suction nozzle 110 shown in FIGS. 3 to 6 is used to suction the electronic component package S. As shown in FIG. The adsorption nozzle 110 is formed in a substantially cylindrical shape with the longitudinal direction oriented up and down. A plurality of suction nozzles 110 are arranged in a row in the left-right direction. In this embodiment, the example in which 12 adsorption nozzles 110 are arrange|positioned is shown. As will be described later, the suction nozzle 110 is supported so as to be able to move up and down and to be rotatable.

A suction device (not shown) such as a vacuum pump is connected to the upper end of the adsorption nozzle 110 . A suction pad (not shown) formed of an elastic material such as rubber is provided at the lower end of the suction nozzle 110 . When the electronic component package S is adsorbed, the elastic adsorption pad is brought into contact with the electronic component package S, thereby preventing damage to the electronic component package S and easily adsorbing the electronic component package S.

The plurality of suction nozzles 110 are divided into two groups based on differences in power sources (a first lift motor 120 and a second lift motor 140 to be described later) for moving up and down. Specifically, the plurality of suction nozzles 110 are divided into two groups of suction nozzles 110 that are moved up and down by the first lift motor 120 and suction nozzles 110 that are moved up and down by the second lift motor 140 .

Hereinafter, for convenience of description, the suction nozzles 110 moved up and down by the first lift motor 120 are referred to as the first group, and the suction nozzles 110 moved up and down by the second lift motor 140 are referred to as the second group. In addition, in order to distinguish the adsorption nozzles 110 of the two groups, the adsorption nozzles 110 of the first group are sometimes referred to as adsorption nozzles 110A, and the adsorption nozzles 110 of the second group are referred to as adsorption nozzles 110B.

In this embodiment, the suction nozzles 110A of the first group are arranged at odd-numbered positions from the left. In addition, the suction nozzles 110B of the second group are arranged at even-numbered positions from the left. That is, the suction nozzles 110A of the first group and the suction nozzles 110B of the second group are alternately arranged. As described above, in the present embodiment, at least one set of the suction nozzles 110 is arranged in a positional relationship between the suction nozzles 110 of the other set.

<First lift motor 120> The first lift motor 120 shown in FIGS. 3 to 5 is a power source for moving the first group of suction nozzles 110A up and down. In addition, the 1st lift motor 120 is one Embodiment of the 1st motor of this invention. The first elevating motor 120 is constituted by, for example, a servo motor capable of controlling fine rotation. The first lift motor 120 is arranged so that the output shaft faces rightward. The first lift motor 120 is fixed to a suitable support member (not shown).

<First lift power transmission mechanism 130> The first elevating power transmission mechanism 130 shown in FIGS. 4 and 5 transmits the power of the first elevating motor 120 to the first group of suction nozzles 110A. In addition, the 1st raising/lowering power transmission mechanism 130 is one Embodiment of the 1st power transmission mechanism of this invention. The first lifting power transmission mechanism 130 mainly includes a lifting pinion 131 , a lifting rack 132 , a lifting block 133 and a lifting guide 134 .

The lift pinion 131 is a gear fixed to the output shaft of the first lift motor 120 .

The lift rack 132 is a rod-shaped gear that moves up and down with the rotation of the lift pinion 131 . The elevating rack 132 is arranged so that the longitudinal direction thereof is directed up and down. The lift rack 132 is arranged to engage with the lift pinion 131 from the front.

The lift block 133 is a member that transmits the power of the first lift motor 120 to the suction nozzle 110A by moving up and down together with the lift rack 132 . The lifting block 133 is formed in a rod shape with the longitudinal direction oriented to the left and right. The lifting block 133 is fixed on the front side of the lifting rack 132 . A plurality of protrusions 133 a are formed on the lifting block 133 .

The protruding portion 133 a is a portion formed to protrude forward from the front surface of the lift block 133 . A plurality of protrusions 133a are formed in a line in the left-right direction. The interval between the adjacent protrusions 133a is formed to be the same as the left-right interval of the suction nozzles 110 (first group suction nozzles 110A) arranged at odd-numbered positions. Thereby, the protruding part 133a is formed in the position corresponding to 110 A of adsorption|suction nozzles of the 1st group.

The lift guide 134 is a member that guides the movement of the lift block 133 in the up-down direction. The lifting guides 134 are respectively disposed on the left and right ends of the lifting block 133 .

In the first elevating power transmission mechanism 130 configured as described above, the elevating block 133 can be moved up and down by the power of the first elevating motor 120 . Specifically, when the first lift motor 120 is driven, the lift pinion 131 rotates. With the rotation of the lift pinion 131 , the lift rack 132 moves up and down. A lift block 133 is provided on the lift rack 132 , so that the lift block 133 moves up and down while being guided by the lift guide 134 . By the lifting and lowering of the lifting block 133, the first group of suction nozzles 110A can be lifted up and down as described later.

<Second lift motor 140> The second lift motor 140 shown in FIGS. 3 to 5 is a power source for moving the second group of suction nozzles 110B up and down. In addition, the 2nd lift motor 140 is one Embodiment of the 2nd motor of this invention. The second lift motor 140 is constituted by, for example, a servo motor capable of controlling fine rotation. The 2nd lift motor 140 is arrange|positioned so that an output shaft may face left. The second lift motor 140 is disposed to the right of the first lift motor 120 . The second lift motor 140 is fixed to a suitable support member (not shown).

<Second Lifting Power Transmission Mechanism 150> The second elevating power transmission mechanism 150 shown in FIGS. 4 and 5 transmits the power of the second elevating motor 140 to the second group of suction nozzles 110B. In addition, the second elevating power transmission mechanism 150 is an embodiment of the second power transmission mechanism of the present invention. The second elevating power transmission mechanism 150 has substantially the same structure as the first elevating power transmission mechanism 130 . Specifically, the second lift power transmission mechanism 150 mainly includes a lift pinion 151 , a lift rack 152 , a lift block 153 , and a lift guide 154 .

The lift pinion 151 is fixed on the output shaft of the second lift motor 140 . The lift rack 152 is arranged to engage with the lift pinion 151 from the front.

The lift block 153 is a member that transmits the power of the second lift motor 140 to the suction nozzle 110B by moving up and down together with the lift rack 152 . The lifting block 153 is fixed on the front side of the lifting rack 152 . The lifting block 153 is arranged below the lifting block 133 of the first lifting power transmission mechanism 130 . A plurality of protrusions 153 a are formed on the lifting block 153 .

The protruding portion 153 a is a portion formed to protrude forward from the front surface of the lift block 153 . A plurality of protrusions 153a are formed in a line in the left-right direction. The interval between the adjacent protrusions 153a is formed to be the same as the left-right interval of the suction nozzles 110 (the second group of suction nozzles 110B) arranged at the even-numbered positions. Thereby, the protrusion part 153a is formed in the position corresponding to the adsorption|suction nozzle 110B of the 2nd group.

The lift guide 154 is a member that guides the movement of the lift block 153 in the up-down direction. The lifting guides 154 are respectively disposed on the left and right ends of the lifting block 153 .

In the second elevating power transmission mechanism 150 configured as described above, the elevating block 153 can be moved up and down by the power of the second elevating motor 140 . By the lifting and lowering of the lifting block 153, the suction nozzles 110B of the second group can be lifted up and down as described later.

<Nozzle holding mechanism 160> The nozzle holding mechanism 160 shown in FIGS. 3 and 6 to 8 holds the suction nozzle 110 so as to be able to move up and down and to be able to rotate. The nozzle holding mechanism 160 mainly includes a base portion 161 , a bearing 162 , a rotation support portion 163 , and a spline nut 164 .

The base portion 161 is a member for holding the suction nozzle 110 . The base portion 161 is formed in a substantially rectangular parallelepiped shape with the longitudinal direction oriented to the left and right. The base portion 161 is fixed to a suitable support member (not shown). A through hole 161 a is formed in the base portion 161 .

The through hole 161a shown in FIGS. 8 and 9 is a hole formed so as to penetrate the base portion 161 up and down. A plurality of through holes 161 a are formed at positions corresponding to the plurality of suction nozzles 110 (the first group of suction nozzles 110 and the second group of suction nozzles 110 ).

The bearing 162 rotatably supports a rotation support portion 163 to be described later. The bearings 162 are provided as an upper and lower pair. The bearing 162 is fixed to the base portion 161 by being fitted into the through hole 161a.

The rotation support portion 163 supports a spline nut 164 to be described later. The rotation support portion 163 is formed in a hollow cylindrical shape whose longitudinal direction is directed up and down. The lower portion of the rotation support portion 163 is rotatably supported by the bearing 162 . A rotation gear 194 to be described later is formed on the upper portion of the rotation support portion 163 .

The spline nut 164 holds the suction nozzle 110 so as to be able to move up and down. The spline nut 164 is provided with an upper and lower pair. The spline nut 164 is fixed to the rotation support portion 163 by being fitted into the hollow portion of the rotation support portion 163 . Thereby, the spline nut 164 can be rotated integrally with the rotation support portion 163 . The suction nozzle 110 is inserted into the spline nut 164 . The spline nut 164 is spline fitted to the suction nozzle 110 . Thereby, the spline nut 164 can be rotated integrally with the suction nozzle 110 . In addition, the suction nozzle 110 can move up and down relative to the spline nut 164 so as to ascend and descend.

<Elevating position maintaining mechanism 170 > The raising and lowering position maintaining mechanism 170 shown in FIGS. 3 , 8 , and 9 maintains the suction nozzle 110 at a position raised to a certain height (hereinafter, this position is referred to as a “raised position”). The lifting position maintaining mechanism 170 mainly includes a bracket 171 , a bearing 172 , a cylinder 173 , a first stop block 174 and a second stop block 175 .

The holder 171 connects the suction nozzle 110 to the air cylinder 173 described later, and transmits the power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the suction nozzle 110 . In addition, the holder 171 is one embodiment of the transmission member of the present invention. The bracket 171 is formed in a substantially rectangular plate shape. Through holes penetrating through the bracket 171 up and down are respectively formed at the front and the rear of the bracket 171 .

The bearing 172 rotatably supports the suction nozzle 110 . The bearing 172 is fixed to the bracket 171 by being fitted into a through hole formed in the front portion of the bracket 171 . The bearing 172 is fixed in a state where the upper part of the suction nozzle 110 is inserted. Thereby, the suction nozzle 110 is attached so as to be rotatable with respect to the holder 171 and unable to ascend and descend (not to move up and down with respect to the holder 171 ).

Here, the holder 171 and the bearing 172 are respectively provided with respect to the plurality of suction nozzles 110 . As shown in FIG. 3 , FIG. 9 , etc., the brackets 171 corresponding to the suction nozzles 110B of the second group are provided at positions slightly lower than the brackets 171 corresponding to the suction nozzles 110A of the first group.

As shown in FIG. 8 , the brackets 171 corresponding to the suction nozzles 110A of the first group are arranged in a state of being mounted on the lifting blocks 133 (protrusions 133 a ) of the first lifting power transmission mechanism 130 , respectively. The bracket 171 tries to move downward due to its own weight, but is supported from below by the lifting block 133 , so that the downward movement of the bracket 171 is restricted.

Similarly, as shown in FIG. 9 , the brackets 171 corresponding to the suction nozzles 110B of the second group are arranged in a state of being mounted on the lifting blocks 153 (protrusions 153 a ) of the second lifting power transmission mechanism 150 , respectively.

The air cylinder 173 is used to block the transmission of power from the first elevating power transmission mechanism 130 and the second elevating power transmission mechanism 150 to the bracket 171 to maintain the suction nozzle 110 in the ascending position. In addition, the air cylinder 173 is an embodiment of the actuator of the present invention. The cylinder 173 is constituted by a single-solenoid single-acting cylinder. The air cylinder 173 is arranged in a state in which the expandable and contractible rod 173a faces downward. The air cylinder 173 is fixed in a state of being inserted into a through hole formed in the rear portion of the bracket 171 . When the air cylinder 173 is actuated (opened (ON)), the rod 173a is in an extended state. In addition, when the air cylinder 173 is stopped (OFF), the rod 173a is in a retracted state.

The first stopper 174 shown in FIGS. 8 and 9 is used to limit the descending of the first group of suction nozzles 110A. The first stopper 174 is arranged below the cylinder 173 provided corresponding to the first group of suction nozzles 110A. The first stop 174 is fixed to a suitable support member (not shown).

The second stopper 175 shown in FIG. 9 is used to limit the descending of the second group of adsorption nozzles 110B. The second stopper 175 is arranged below the cylinder 173 provided corresponding to the second group of suction nozzles 110B. The second stopper block 175 is disposed at a position slightly lower than the first stopper block 174 . The second stop 175 is fixed to a suitable support member (not shown).

<Rotary Motor 180> The rotation motor 180 shown in FIGS. 3 to 5 is a power source for rotating the adsorption nozzle 110 . In addition, the rotary motor 180 is an embodiment of the third motor of the present invention. The rotation motor 180 is constituted by, for example, a servo motor capable of controlling fine rotation. The rotation motor 180 is arranged to the left of the plurality of suction nozzles 110 . The rotary motor 180 is arranged so that the output shaft faces downward. The rotary motor 180 is secured to a suitable support member (not shown).

<Rotational Power Transmission Mechanism 190> The rotational power transmission mechanism 190 shown in FIGS. 3 and 4 transmits the power of the rotational motor 180 to the suction nozzle 110 . In addition, the rotational power transmission mechanism 190 is one embodiment of the third power transmission mechanism of the present invention. The rotational power transmission mechanism 190 mainly includes a rotational pinion 191 , a rotational rack 192 , a rotational rack guide 193 , and a rotational gear 194 .

The rotary pinion 191 is a gear fixed to the output shaft of the rotary motor 180 .

The rotating rack 192 shown in FIGS. 5 and 6 is a rod-shaped gear that moves left and right in accordance with the rotation of the rotating pinion 191 . The rotating rack 192 is arranged so that its longitudinal direction is directed to the left and right. The rotary rack 192 is arranged so as to span the rotary motor 180 and the plurality of suction nozzles 110 . The rotating rack 192 is arranged to mesh with the rotating pinion 191 from the rear.

The rotary rack guide 193 shown in FIGS. 5 to 7 is a member that guides the movement of the rotary rack 192 in the left-right direction. The rotating rack guides 193 are respectively provided on the left and right end portions of the rotating rack 192 . The rotating rack guide 193 is supported by the base portion 161 .

The rotating gear 194 shown in FIGS. 6 to 8 is a gear that rotates along with the leftward and rightward movement of the rotating rack 192 . The rotation gear 194 is integrally formed on the upper part of the rotation support part 163 provided in each suction nozzle 110 . The rotating gear 194 is arranged to engage with the rotating rack 192 from the front. Furthermore, the rotation gear 194 can also be formed separately (separate member) from the rotation support portion 163 .

In the rotary power transmission mechanism 190 configured as described above, the suction nozzle 110 can be rotated by the power of the rotary motor 180 . Specifically, when the rotary motor 180 is driven, the rotary pinion 191 is rotated. The rotary rack 192 moves left and right in accordance with the rotation of the rotary pinion 191 . Since the rotating gear 194 meshes with the rotating rack 192 , the rotating gear 194 rotates with the movement of the rotating rack 192 . With the rotation of the rotation gear 194, the rotation support portion 163 on which the rotation gear 194 is provided and the spline nut 164 rotate. Since the suction nozzle 110 is spline-fitted with the spline nut 164 , the suction nozzle 110 can be rotated around its axis (in a plane intersecting the lifting direction of the suction nozzle 110 ) along with the rotation of the spline nut 164 .

In addition, the conveyance mechanism 15 comprised as mentioned above can move arbitrarily in the X direction (left-right direction) by the movement mechanism which is not shown in figure.

<Basic operation of the suction nozzle 110> The conveying mechanism 15 can raise and lower and rotate any suction nozzle 110 by appropriately driving three motors (the first elevating motor 120 , the second elevating motor 140 , and the rotation motor 180 ) and each air cylinder 173 . Thereby, the electronic component package S can be sucked by any suction nozzle 110, or the sucked electronic component package S can be mounted on a desired location. Hereinafter, the basic operation of each part when sucking the electronic component package S will be described by taking the first group of suction nozzles 110A as an example. In addition, below, for convenience of description, it demonstrates using the figure (FIG.11(a)-FIG.11(d) etc.) which shows the structure of the conveyance mechanism 15 typically.

When the suction nozzle 110A is not raised and lowered, the air cylinder 173 provided corresponding to the suction nozzle 110A operates, and the rod 173a is in an extended state (step S101 in FIG. 10 , and FIG. 11( a )).

In the state where the rod 173a is extended, when the air cylinder 173 is about to descend, the lower end of the rod 173a touches the upper surface of the first stopper 174 at a predetermined position. Therefore, regardless of the operation of the first lift motor 120, the air cylinder 173 does not descend to a lower position than a predetermined position. Thereby, the suction nozzle 110A is maintained at the predetermined ascending position, and does not descend to a position lower than the position (step S102 in FIG. 10 , and FIG. 11( b )).

On the other hand, when the suction nozzle 110A is raised and lowered, the air cylinder 173 provided corresponding to the suction nozzle 110A is stopped, and the rod 173a is in a retracted state (step S103 in FIG. 10 , FIG. 11( c )).

When the rod 173a is in a retracted state, the rod 173a does not come into contact with the first stopper 174 . In this state, when the first lift motor 120 is driven and the lift block 133 descends, the bracket 171 placed on the lift block 133 also descends due to its own weight. Thereby, the suction nozzle 110A descends so as to follow the lifting block 133 (step S104 in FIG. 10 , and FIG. 11( d )).

After the suction nozzle 110A descends to a predetermined position, the first lift motor 120 is stopped. In this state, the operation of the suction device connected to the suction nozzle 110A is controlled. For example, when sucking the electronic component package S, the suction device operates to suck the electronic component package S to the lower end of the suction nozzle 110A. In addition, when the electronic component package S adsorbed by the adsorption nozzle 110A is placed on a predetermined place, the suction device is stopped to release the adsorption of the electronic component package S by the adsorption nozzle 110A (step S105 in FIG. 10 ).

Furthermore, when the suction nozzle 110A is lowered (refer to FIG. 11( d )), when the thickness of the electronic component package S is thicker than expected, there is a concern that the suction nozzle 110A collides with the suction nozzle 110A before descending to a predetermined position. to electronic parts package S. However, in this embodiment, the bracket 171 supporting the suction nozzle 110 is placed on the lifting block 133 , so even if the suction nozzle 110 hits the electronic component package S, the bracket 171 can be kept away from the lifting block 133 Escape up. Thereby, it is possible to prevent the electronic component package S from being damaged due to the excessive load applied to the electronic component package S due to the downward power of the lifting block 133 .

After the suction and the like of the electronic component package S by the suction nozzle 110A are completed, the first lift motor 120 is driven and the lift block 133 is raised. When the lifting block 133 rises, the bracket 171 placed on the lifting block 133 also rises. Thereby, the suction nozzle 110A ascends so as to follow the lifting block 133 (step S106 in FIG. 10 ).

After the suction nozzle 110A is raised to a predetermined position, the first lift motor 120 is stopped (step S107 in FIG. 10 ). Then, the air cylinder 173 of the suction nozzle 110A which does not need to be lowered is operated, and the suction nozzle 110A is maintained at a predetermined ascending position (steps S101 and S102 in FIG. 10 , and FIG. 11( b )).

As described above, only the suction nozzle 110A can be raised and lowered by driving the first lift motor 120 in a state where the air cylinder 173 of the suction nozzle 110A to be lowered is stopped (the rod 173a is contracted). Thereby, among the adsorption nozzles 110A of the first group, only the desired adsorption nozzles 110A can be raised and lowered.

Furthermore, in the above example, the operation of the first group of suction nozzles 110A is described as an example, and the operation when the second group of suction nozzles 110B is raised and lowered is also substantially the same. In addition, the mechanism for raising and lowering the suction nozzles 110A of the first group (the first raising and lowering motor 120, the first raising and lowering power transmission mechanism 130, etc.) and the mechanism for raising and lowering the suction nozzles 110B of the second group (the second raising and lowering motor 140, The second elevating power transmission mechanism 150 and the like) are independent of each other, so that the first group of suction nozzles 110A and the second group of suction nozzles 110B can be raised and lowered at arbitrary timings, respectively.

<Operation when electronic component package S is transported> In the conveyance mechanism 15 of this embodiment, it is assumed that the electronic component package S is conveyed by raising and lowering the plurality of suction nozzles 110 alternately from one end (from the left in this embodiment). Hereinafter, the case of conveyance of the electronic component package S by the conveyance mechanism 15 is demonstrated concretely.

In addition, for convenience of description, it demonstrates focusing on the raising and lowering of the suction nozzle 110 from the fourth one from the left among the 12 suction nozzles 110 . FIGS. 12( a ) to 12 ( f ) show a plurality of electronic component packages S to be conveyed arranged in a left-right arrangement, and the operating states (ON/ OFF), the working state of the first lift motor 120 and the second lift motor 140 , and the lifting and lowering of the four suction nozzles 110 .

First, as shown in FIG.12(a), the conveyance mechanism 15 is moved to the upper direction of the electronic component package S by the moving mechanism which is not shown in figure. In the cutting device 1 (refer to FIG. 1 ) of the present embodiment, the conveying mechanism 15 is appropriately moved in the X direction, and is moved above the arrangement mechanism 14 in which the electronic component package S is arranged.

Next, as shown in FIG. 12( a ), when the first lift motor 120 and the second lift motor 140 are stopped, the cylinders 173 corresponding to the two suction nozzles 110 from the left stop working, and the other cylinders 173 work.

Next, as shown in FIG.12(b), the 1st raising/lowering motor 120 operates so that the suction nozzle 110A descends. Thereby, among the adsorption nozzles 110A of the first group, only the adsorption nozzle 110A (the adsorption nozzle 110 at the left end) whose operation of the cylinder 173 is stopped is lowered.

Next, as shown in FIG.12(c), when the suction nozzle 110 of the left end contacts with the electronic component package S, the 1st lift motor 120 stops operating. In this state, the suction device operates, and the electronic component package S at the left end is sucked by the suction nozzle 110 at the left end.

Next, as shown in FIG.12(d), the 1st raising/lowering motor 120 operates to raise the suction nozzle 110A. In addition, while the suction nozzle 110 at the left end is ascending, the second elevating motor 140 operates to lower the suction nozzle 110B. Thereby, among the suction nozzles 110B of the second group, the suction nozzle 110B (the second suction nozzle 110 from the left) in which the operation of the cylinder 173 is stopped is lowered.

Next, as shown in FIG.12(e), after the suction nozzle 110 of the left end rises to a predetermined position, the 1st raising/lowering motor 120 stops operating. Then, the air cylinder 173 corresponding to the adsorption nozzle 110 at the left end operates, and the air cylinder 173 corresponding to the third adsorption nozzle 110 from the left is stopped.

Furthermore, when the second suction nozzle 110 from the left comes into contact with the electronic component package S, the second lift motor 140 stops operating. In this state, the suction device operates, and the second electronic component package S from the left is sucked by the second suction nozzle 110 from the left.

Next, as shown in FIG.12(f), the 2nd raising/lowering motor 140 is operated so that the suction nozzle 110B is raised. In addition, during the ascent of the second suction nozzle 110 from the left, the first elevating motor 120 operates to lower the suction nozzle 110A. Thereby, among the suction nozzles 110A of the first group, the suction nozzle 110A (the third suction nozzle 110 from the left) in which the operation of the cylinder 173 is stopped is lowered.

After that, the above-described operations are sequentially performed, and a required number of electronic component packages S are sucked by each suction nozzle 110 . After the suction of the electronic component package S is completed, the conveyance mechanism 15 is moved to a position to be a transfer destination of the electronic component package S by a moving mechanism not shown. In the cutting device 1 (see FIG. 1 ) of the present embodiment, the conveying mechanism 15 is appropriately moved in the X direction and moved above the tray (the good tray 15 a or the defective tray 15 b ) in which the electronic component package S is accommodated.

When storing the electronic component package S sucked by the suction nozzle 110 in the tray, similarly to the example shown in FIGS. 12( a ) to 12 ( f ), the suction nozzle 110 is moved up and down alternately, and then the suction nozzle 110 is lowered. In the state where the electronic component package S is released from the suction, the electronic component package S can be accommodated in the tray.

In addition, when the electronic component package S is accommodated in the tray, the rotation motor 180 is properly operated, whereby the direction of the electronic component package S (rotational position in a plane intersecting the lifting direction of the suction nozzle 110 ) can be adjusted. Specifically, when the conveyance mechanism 15 is moved from the arrangement mechanism 14 to the tray, the direction of the electronic component package S is detected by a detection mechanism such as a camera from below, and a necessary direction adjustment amount (rotation correction amount) is calculated. Then, before the electronic component package S is accommodated in the tray (in a state in which the electronic component package S is attracted to the suction nozzle 110 ), the rotation motor 180 is properly operated to rotate the electronic component package S to adjust the direction. Thereby, the electronic component package S can be accurately accommodated in the tray.

12( a ) to FIG. 12( f ) show an example in which the electronic component packages S are arranged at the same interval (pitch) as the suction nozzle 110 , the conveying mechanism 15 of the present embodiment can also be suctioned to The electronic component packages S arranged at different intervals from the nozzles 110 are sucked and conveyed. Specifically, each time one electronic component package S is sucked, the conveying mechanism 15 itself is moved left and right so that the suction nozzle 110 to be sucked next is aligned with the position of the electronic component package S, whereby various intervals can be performed. Conveying of the arranged electronic component package S.

As described above, the conveying mechanism 15 of the present embodiment is provided with a plurality of suction nozzles 110, The plurality of suction nozzles 110 are composed of a first group of suction nozzles 110A and a second group of suction nozzles 110B, and the conveying mechanism 15 includes: a first lift motor 120 (a first motor) to lift and lower the first group of adsorption nozzles 110A; The second lift motor 140 (second motor) lifts the second set of adsorption nozzles 110B; rotating the motor 180 (third motor) to rotate the plurality of suction nozzles 110 in a plane intersecting with the lifting direction of the plurality of suction nozzles 110; and The lifting position maintaining mechanism 170 can maintain any suction nozzle 110 of the plurality of suction nozzles 110 at a predetermined rising position regardless of the driving of the first lifting motor 120 and the second lifting motor 140 .

By configuring as described above, the simplification of the structure can be achieved. That is, the operation of raising and lowering the plurality of suction nozzles 110 individually and the operation of rotating can be realized by the three motors. As described above, the adsorption nozzles 110 can be operated by three motors irrespective of the number of the adsorption nozzles 110 , so that the structure can be simplified, and further, cost reduction and maintenance simplification can be achieved.

In addition, the plurality of adsorption nozzles 110 are arranged in a row, and another group of adsorption nozzles 110 is disposed between at least any one group of adsorption nozzles 110 in the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B.

With the above-described configuration, the timing of the operation (lifting and lowering) of the adjacent different groups of the suction nozzles 110 can be arbitrarily shifted, whereby the electronic component package S can be conveyed efficiently. For example, as in the present embodiment, while the suction nozzles 110A of the first group are raised, the suction nozzles 110B of the adjacent second group are lowered, whereby the suction of the plurality of electronic component packages S can be efficiently performed.

In addition, the conveying mechanism 15 further includes: The nozzle holding mechanism 160 holds the plurality of suction nozzles 110 so as to be able to move up and down respectively, and is held to be rotatable in a plane intersecting with the lifting direction of the plurality of suction nozzles 110; a first lifting power transmission mechanism 130 (first power transmission mechanism), which transmits the power of the first lifting motor 120 to the first group of adsorption nozzles 110A; The second lift power transmission mechanism 150 (second power transmission mechanism), which transmits the power of the second lift motor 140 to the second group of adsorption nozzles 110B; and The rotary power transmission mechanism 190 (third power transmission mechanism) transmits the power of the rotary motor 180 to the plurality of adsorption nozzles 110 .

With the above-described configuration, the mechanism for raising and lowering and rotating the plurality of suction nozzles 110 by three motors can be relatively simple.

The lifting position maintaining mechanism 170 includes: A plurality of brackets 171 (transmission members) are provided corresponding to the plurality of suction nozzles 110, respectively, and transmit the power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the first lifting power transmission mechanism 150, respectively. a set of adsorption nozzles 110A and the second set of adsorption nozzles 110B; and The air cylinders 173 (actuators) are respectively provided corresponding to the plurality of brackets 171 , and can block the transmission of power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the brackets 171 . .

With the above-described configuration, the operation of the air cylinder 173 can be controlled, whereby an arbitrary suction nozzle 110 can be maintained at a predetermined ascending position.

In addition, the actuator is constituted by an air cylinder 173 .

With the above-described configuration, the up-and-down position maintaining mechanism 170 can have a relatively simple structure.

In addition, the conveying mechanism 15 controls the operations of the first elevating motor 120 , the second elevating motor 140 and the elevating position maintaining mechanism 170 , so that one of the two adjacent suction nozzles 110 can be sucked. During the ascent of 110, the other adsorption nozzle 110 is lowered.

With the above-described configuration, the transfer using the suction nozzle 110 can be efficiently performed.

In addition, the cutting device 1 of the present embodiment includes the above-described conveyance mechanism 15 .

By configuring as described above, the simplification of the structure can be achieved.

In addition, the manufacturing method of the cut product of this embodiment uses the said cutting apparatus 1 to manufacture a cut product.

By configuring as described above, the cutting device 1 (conveying mechanism 15 ) with a simple structure can be used, and further, cost reduction, simplification of maintenance, and the like can be achieved.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change suitably within the range of the technical idea of the invention described in the claim.

For example, the configuration of the cutting device 1 exemplified in the above embodiment is an example, and the specific configuration can be appropriately changed.

For example, in the above-described embodiment, the cutting module A and the inspection module B each include the control units (the control unit 9 and the control unit 16 ), but the present invention is not limited to this, and the respective control units may be combined into one One control unit, or divided into three or more control units. In addition, although the cutting apparatus 1 of this embodiment has a double cutting table structure having two cutting tables 4, the present invention is not limited to this, and only one cutting table 4 may be included. In addition, although the cutting device 1 of the present embodiment has a double-spindle structure having two spindle parts 5 , the present invention is not limited to this, and only one spindle part 5 may be provided.

In addition, in the said embodiment, although the conveyance mechanism 15 provided with 12 adsorption|suction nozzles 110 was illustrated, this invention is not limited to this, and the number of objects of the adsorption|suction nozzle 110 can be changed arbitrarily. In addition, in the conveyance mechanism 15 of the present embodiment, the suction nozzles 110 can be operated by three motors (the first elevating motor 120 , the second elevating motor 140 , and the rotation motor 180 ) regardless of the number of the suction nozzles 110 . (lifting and rotating).

In addition, in the above-mentioned embodiment, the example in which the suction nozzles 110A of the first group and the suction nozzles 110B of the second group are alternately arranged in units of one is shown, but the present invention is not limited to this, and the suction nozzles 110 of the two groups can be Arbitrary configuration. For example, two groups of adsorption nozzles 110 may be alternately arranged in units of two or randomly arranged. However, when the suction nozzles 110 arranged in a row as in the present embodiment are sequentially raised and lowered, the operation of the first lift motor 120 and the second lift motor 140 or the air cylinder 173 suppresses generation of the suction nozzles 110 From the viewpoint of vibration or shock, it is desirable to alternately arrange the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B with different power sources on a one-by-one basis.

In addition, in the above-described embodiment, the air cylinder 173 is exemplified as the actuator for maintaining the suction nozzle 110 at the predetermined ascending position, but the present invention is not limited to this, and any actuator can be used. For example, a solenoid actuator, a hydraulic cylinder, a normal induction motor, etc. can also be used as an actuator.

In addition, in the said embodiment, although the servomotor was shown as the 1st raising/lowering motor 120, the 2nd raising/lowering motor 140, and the rotation motor 180, this invention is not limited to this, Arbitrary motors can be used. For example, as the first lift motor 120 or the like, a stepping motor or the like can also be used. However, from the viewpoint of precisely raising and lowering the suction nozzle 110 in order to suction the electronic component package S, it is desirable to use a servo motor as the first lift motor 120 or the like.

In addition, in the above-mentioned embodiment, the example in which the power of the first lift motor 120 , the second lift motor 140 , and the rotation motor 180 is transmitted by the gears (rack/pinion) is shown, but the present invention is not limited to Therefore, an arbitrary mechanism can be used to transmit power. For example, it is also possible to transmit power using a pulley provided on the output shaft of the motor and a belt wound around the pulley.

In addition, in the said embodiment, the example in which the adsorption|suction nozzle 110 (holder 171) descend|falls so that it may follow the raising/lowering block 133 by dead weight was shown, but this invention is not limited to this. For example, an urging member (a spring or the like) that urges the suction nozzle 110 downward may be provided. Thereby, the suction nozzle 110 can be easily followed by the lifting block 133 .

In addition, the operation|movement of the conveyance mechanism 15 demonstrated in the said embodiment is an example, and it can change arbitrarily. For example, in the above-described embodiment, the example in which the plurality of suction nozzles 110 are raised and lowered sequentially from the left in one unit is shown, but the present invention is not limited to this, and the order of raising and lowering can be arbitrarily changed. In addition, in the above-mentioned embodiment, the example in which one of the adjacent suction nozzles 110 is raised and the other is lowered has been shown, but the present invention is not limited to this, and it is also possible to use one of them. Make the other descend after the ascent is completely complete.

In addition, in the said embodiment, the example in which the adsorption|suction nozzle 110 was raised, lowered, and rotated using three motors was shown, but the number of motors is not limited to this. For example, in the above-described embodiment, the plurality of suction nozzles 110 are divided into two groups, and the two groups are moved up and down by separate motors (two motors). Each suction nozzle 110 is divided into three or more groups, and each group is moved up and down by a separate motor (three or more motors).

1: cutting device 2: Substrate supply mechanism 3: Positioning mechanism 3a: Track Department 4: cutting table 4a, 11a: Holding member 4b: Rotary Mechanism 4c: Mobile Mechanism 4d: First position confirmation camera 5: Spindle part 5a: Rotary knife 5b: Second position confirmation camera 6: The first cleaner 7: Transfer mechanism 8: Second cleaner 8a: Cleaning mechanism 8b: Suction drying mechanism 9, 16: Control Department 11: Examination table 12: The first optical inspection camera 13: Second optical inspection camera 14: Configuration mechanism 15: Conveying mechanism 15a: Good product tray 15b: defective product tray 110, 110A, 110B: adsorption nozzle 120: The first lift motor 130: The first lifting power transmission mechanism 131, 151: Lifting pinion 132, 152: Lifting rack 133, 153: Lifting block 133a, 153a: protrusions 134, 154: Lifting guide 140: Second lift motor 150: Second lift power transmission mechanism 160: Nozzle retention mechanism 161: Base part 161a: Through hole 162, 172: Bearings 163: Rotary support 164: Spline Nut 170: Lifting position maintenance mechanism 171: Bracket 173: Cylinder 173a: Rod 174: First stop 175: Second stop 180: Rotary Motor 190: Rotary power transmission mechanism 191: Rotary pinion 192: Rotary rack 193: Rotary rack guide 194: Rotary Gear A: Cut off the module B: Check the module M: Cartridge P: Package substrate S: Electronic parts packaging S2: Supply step S4: Positioning step S6: Cut off step S8: First cleaning step S10: First drying step S12: Transfer step S14: Second cleaning step S16: Second drying step S18: Inspection steps S20: Containment Procedures S101～S107: Steps

FIG. 1 is a schematic plan view showing the overall configuration of a cutting device according to an embodiment of the present invention. FIG. 2 is a flowchart showing a method of manufacturing a cut product. 3 is a front perspective view showing the overall structure of the conveying mechanism according to the embodiment of the present invention. 4 is a rear perspective view showing the overall configuration of the conveying mechanism according to the embodiment of the present invention. 5 is a partially exploded plan view showing the overall structure of the conveying mechanism according to the embodiment of the present invention. 6 is a front view showing the overall configuration of the conveying mechanism according to the embodiment of the present invention. 7 is a side view showing the overall configuration of the conveying mechanism according to the embodiment of the present invention. FIG. 8 is a cross-sectional view taken along line A-A of FIG. 6 . FIG. 9 is a B-B cross-sectional view of FIG. 6 . FIG. 10 is a flowchart showing the basic operation of the suction nozzle. (a) to (d) of FIG. 11 are schematic diagrams showing the basic operation of the suction nozzle. (a) to (f) of FIG. 12 are schematic diagrams showing the operation of a plurality of adsorption nozzles.

15: Conveying mechanism

110A, 110B: adsorption nozzle

120: The first lift motor

132, 152: Lifting rack

134, 154: Lifting guide

140: Second lift motor

160: Nozzle retention mechanism

161: Base part

163: Rotary support

170: Lifting position maintenance mechanism

171: Bracket

173: Cylinder

180: Rotary Motor

190: Rotary power transmission mechanism

191: Rotary pinion

192: Rotary rack

193: Rotary rack guide

194: Rotary Gear

Claims (8)

A conveying mechanism is provided with a plurality of adsorption nozzles composed of a first group of adsorption nozzles and a second group of adsorption nozzles, and the conveying mechanism includes: a first motor to lift and lower the first group of adsorption nozzles; a second motor to lift and lower the second group of adsorption nozzles; a third motor to rotate the plurality of suction nozzles in a plane intersecting with the lifting direction of the plurality of suction nozzles; and The raising and lowering position maintaining mechanism can maintain any suction nozzle among the plurality of suction nozzles at a predetermined raised position regardless of the driving of the first motor and the second motor. The conveying mechanism according to claim 1, wherein: The plurality of adsorption nozzles are arranged in a row, and another group of adsorption nozzles is arranged between at least any one group of adsorption nozzles in the first group of adsorption nozzles and the second group of adsorption nozzles. The conveying mechanism according to claim 1 or claim 2, further comprising: a nozzle holding mechanism for holding the plurality of suction nozzles to be able to move up and down respectively and to be rotatable in a plane intersecting with the lifting direction of the plurality of suction nozzles; a first power transmission mechanism, which transmits the power of the first motor to the first group of adsorption nozzles; a second power transmission mechanism that transmits the power of the second motor to the second group of adsorption nozzles; and A third power transmission mechanism transmits the power of the third motor to the plurality of suction nozzles. The conveying mechanism according to claim 3, wherein: The lifting position maintaining mechanism includes: A plurality of transmission members are provided corresponding to the plurality of adsorption nozzles, respectively, and transmit power from the first power transmission mechanism and the second power transmission mechanism to the first group of adsorption nozzles and the second group of adsorption nozzles, respectively. set of suction nozzles; and The actuators are respectively provided corresponding to the plurality of transmission members, and are capable of blocking transmission of power from the first power transmission mechanism and the second power transmission mechanism to the transmission members. The conveying mechanism according to claim 4, wherein: The actuator is constituted by a cylinder. The conveying mechanism according to any one of claim 1 to claim 5, wherein, Control the operation of the first motor, the second motor and the lifting position maintaining mechanism, so that during the rising process of one of the two adjacent suction nozzles, the other suction nozzle is suctioned The nozzle is lowered. A cutting device comprising the conveying mechanism according to any one of claim 1 to claim 6. A method of manufacturing a cut product using the cutting device according to claim 7 to manufacture a cut product.

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