TWI785885B - Conveying mechanism, cutting device, and method of manufacturing cut products - Google Patents

Abstract

The present invention provides a conveying mechanism, a cutting device, and a method of manufacturing a cut product capable of simplifying the structure. A conveying mechanism, which is equipped with a plurality of adsorption nozzles composed of a first group of adsorption nozzles and a second group of adsorption nozzles, and the conveyance mechanism includes: a first motor to lift the first group of adsorption nozzles; a second motor , to lift the second group of adsorption nozzles; a third motor, to rotate the plurality of adsorption nozzles in a plane intersecting the lifting direction of the plurality of adsorption nozzles; and a lifting position maintaining mechanism capable of moving the plurality of adsorption nozzles Any one of the suction nozzles is maintained at a predetermined raised position regardless of the driving of the first motor and the second motor.

Description

Conveying mechanism, cutting device, and method of manufacturing cut products

The present invention relates to a technology for a conveying mechanism, a cutting device, and a method for manufacturing a cut product.

Patent Document 1 discloses a technique of a semiconductor package processing system including a mechanism (transfer unit) that absorbs and transports a semiconductor package. Specifically, the semiconductor package processing system described in Patent Document 1 includes: a plurality of nozzles, which adsorb the semiconductor package; a motor (first drive unit), which is provided corresponding to each nozzle, and moves the nozzle vertically; ), set one for each of the two nozzles, and make the nozzles rotate.

In the semiconductor package processing system configured as described above, the nozzles can be individually raised and lowered by the first drive unit, and the nozzles can be rotated by the second drive unit. The operation of these nozzles can be combined to smoothly absorb and transport the semiconductor package. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-207326

[Problem to be Solved by the Invention]

However, in the technology described in Patent Document 1, in order to operate (lift and rotate) the nozzles, motors 1.5 times the number of nozzles are required (for example, in the example described in Patent Document 1, compared to 8 need 12 motors for each nozzle), it is difficult to simplify the structure, and there is room for improvement in this respect.

The present invention is made in view of the above situation, and the problem to be solved is to provide a conveying mechanism, a cutting device, and a method of manufacturing a cut product that can achieve simplification of the structure. [Means to solve the problem]

The problem to be solved by the present invention is as described above. In order to solve the problem, the conveying mechanism of the present invention is equipped with a plurality of adsorption nozzles consisting of a first group of adsorption nozzles and a second group of adsorption nozzles, and the conveying mechanism includes: The first motor lifts the first group of adsorption nozzles; the second motor lifts the second group of adsorption nozzles; the third motor moves the plurality of adsorption nozzles in the same direction as the plurality of adsorption nozzles rotation in intersecting planes; and a lifting position maintaining mechanism capable of maintaining any one of the plurality of suction nozzles at a predetermined raised position regardless of driving of the first motor and the second motor.

Moreover, the cutting apparatus of this invention includes the said conveyance mechanism.

Moreover, the manufacturing method of the cut product of this invention manufactures a cut product using the said cutting apparatus. [Effect of the invention]

According to the present invention, the simplification of the structure can be realized.

<Overall structure of cutting device 1> First, a structure of a cutting device 1 according to an embodiment of the present invention and a method of manufacturing a cut product using the cutting device 1 will be described with reference to FIGS. 1 and 2 . In this embodiment, for example, a description will be given of the structure of the cutting device 1 when using a package substrate P to which electronic components such as semiconductor chips are connected, as an object to be cut by the cutting device 1. The substrate is sealed with resin.

As the packaging substrate P, for example, a ball grid array (BGA) packaging substrate, a land grid array (Land Grid Array, LGA) packaging substrate, a chip size package (Chip size package, CSP) packaging substrate, a light emitting diode Body (Light emitting diode, LED) package substrate, etc. In addition, not only the package substrate P but also a sealed lead frame obtained by resin-sealing a lead frame to which electronic components such as semiconductor chips are connected is used as an object to be cut.

Hereinafter, of the both surfaces of the package substrate P, the surface sealed with resin, that is, the surface on the package side is called a mold surface, and the surface on the substrate side opposite to the mold surface is called a ball/lead surface.

The cutting device 1 includes a cutting module A and an inspection module B as constituent elements. Each structural element is detachable and replaceable with respect to other structural elements. Hereinafter, the structures of the cutting module A and the inspection module B, and the operation steps using the cutting module A and the inspection module B will be described in order.

＜Cutting Module A＞ The cutting module A is a component that mainly cuts the package substrate P. As shown in FIG. The cutting module A mainly includes a substrate supply mechanism 2 , a positioning mechanism 3 , a cutting table 4 , a spindle part 5 , a first cleaner 6 , a transfer mechanism 7 , a second cleaner 8 and a control part 9 .

In the cutting module A, first, the supply step S2 is performed. The supply step S2 is a step of supplying the package substrate P using the substrate supply mechanism 2 . The substrate supply mechanism 2 pushes out the package substrates P one by one from a magazine M accommodating a plurality of package substrates P, and supplies them to a positioning mechanism 3 described later. The package substrate P is arranged with the ball/leads facing upward.

Next, in the cutting module A, the positioning step S4 is performed. The positioning step S4 is a step of positioning the package substrate P supplied from the substrate supply mechanism 2 using the positioning mechanism 3 . The positioning mechanism 3 arranges and positions the package substrate P pushed out from the substrate supply mechanism 2 on the rail portion 3a. Then, the positioning mechanism 3 transports the positioned package substrate P to a cutting table 4 described later.

Next, in the cutting module A, the cutting step S6 is performed. The cutting step S6 is a step of cutting the package substrate P using the cutting table 4 and the spindle unit 5 to obtain an electronic component package S as a cut product.

The cutting table 4 holds the package substrate P to be cut. In this embodiment, the cutting device 1 having a double cutting table structure having two cutting tables 4 is exemplified. On the cutting table 4 is provided a holding member 4 a that sucks and holds the package substrate P conveyed by the positioning mechanism 3 from below. In addition, the cutting table 4 is provided with a rotation mechanism 4b capable of rotating the holding member 4a in the θ direction in the figure, and a moving mechanism 4c capable of moving the holding member 4a in the Y direction in the figure.

The spindle unit 5 serving as a cutting mechanism cuts the package substrate P and separates it into a plurality of electronic component packages S (see FIG. 3 ). In this embodiment, a cutting device 1 having a double-spindle structure having two main shaft parts 5 is exemplified. The main shaft part 5 is movable in the X direction and the Z direction in the figure. A rotary blade 5 a for cutting the package substrate P is attached to the spindle portion 5 .

The spindle portion 5 is provided with a cutting water nozzle for spraying cutting water to the high-speed rotating rotary blade 5a, a cooling water nozzle for spraying cooling water, and a cleaning water nozzle for spraying cleaning water for cleaning cutting chips and the like (both are not shown in the figure). )Wait.

After the cutting table 4 suctions the package substrate P, the position of the package substrate P is confirmed by the first position confirmation camera 4d. Then, the cutting table 4 moves toward the main shaft portion 5 in the Y direction in the figure. After the cutting table 4 moves below the main shaft part 5, the cutting table 4 and the main shaft part 5 are moved relatively, and the package substrate P is cut|disconnected. Every time the package substrate P is cut by the spindle portion 5, the position of the package substrate P and the like are confirmed by the second position checking camera 5b.

Here, the position of the mark indicating the cutting position provided on the package substrate P can be confirmed, for example, by the confirmation by the first position confirmation camera 4d. The confirmation by the second position confirmation camera 5 b can confirm, for example, the cut position of the package substrate P, the cut width, and the like. Furthermore, the confirmation by the confirmation camera may be performed by using only the second position confirmation camera 5b instead of the first position confirmation camera 4d.

Next, in the cutting module A, the first cleaning step S8 and the first drying step S10 are performed. The first cleaning step S8 is a step of cleaning the plurality of electronic component packages S obtained by cutting and singulating the package substrate P using the first cleaner 6 . In addition, the first drying step S10 is a step of drying the cleaned electronic component package S using the first cleaner 6 .

After the cutting of the package substrate P is completed, the cutting table 4 moves away from the main shaft 5 along the Y direction in the drawing while the plurality of electronic component packages S that have been singulated are attracted. At this time, the first cleaner 6 cleans the upper surface (ball/lead surface) of the electronic component package S using an appropriate cleaning solution (first cleaning step S8 ). Moreover, the 1st cleaner 6 sprays gas (air) to the upper surface of the electronic component package S, and dries the upper surface of the electronic component package S (1st drying process S10).

Next, in the cutting module A, the transfer step S12, the second washing step S14 as a washing step, and the second drying step S16 as a suction drying step are performed. The transfer step S12 is a step of transferring the electronic component package S to the inspection table 11 of the inspection module B using the transfer mechanism 7 . In addition, the second cleaning step S14 is a step of cleaning the electronic component package S using the second cleaner 8 . In addition, the 2nd drying process S16 is a process of drying the cleaned electronic component package S using the 2nd cleaner 8. As shown in FIG.

The transfer mechanism 7 suctions the electronic component package S held by the cutting table 4 from above, and transfers it to the inspection module B (transfer step S12 ). In addition, the second cleaner 8 is used to clean the lower surface (mold surface) of the electronic component package S in the middle of the route of transferring the electronic component package S to the inspection module B by the transfer mechanism 7 (second cleaning step S14 ). and drying (second drying step S16).

Specifically, the second cleaner 8 includes a cleaning mechanism 8a and a suction drying mechanism 8b. The cleaning mechanism 8a includes a rotatable brush (not shown). The cleaning mechanism 8 a cleans the electronic component package S by contacting the lower surface (mold surface) of the electronic component package S while rotating the brush containing the cleaning liquid (second cleaning step S14 ). In addition, the suction drying mechanism 8 b dries the electronic component package S by suctioning the cleaning liquid adhered to the lower surface (mold surface) of the electronic component package S (second drying step S16 ).

The operation of each part of the cutting module A (substrate supply mechanism 2, positioning mechanism 3, cutting table 4, spindle part 5, first cleaner 6, transfer mechanism 7, second cleaner 8, etc.) The control unit 9 controls. In addition, the operation of each part of the cutting module A can be changed (adjusted) arbitrarily using the control part 9 .

<Check module B> The inspection module B is a component that mainly performs inspection of the electronic component package S. As shown in FIG. The inspection module B mainly includes an inspection table 11 , a first optical inspection camera 12 , a second optical inspection camera 13 , an arrangement mechanism 14 , a transport mechanism 15 and a control unit 16 .

In the inspection module B, firstly, the inspection step S18 is performed. The inspection step S18 is a step of optically inspecting the electronic component package S using the inspection table 11 , the first optical inspection camera 12 , and the second optical inspection camera 13 .

The inspection table 11 holds the electronic component package S for optical inspection of the electronic component package S. As shown in FIG. The inspection table 11 is movable in the X direction in the drawing. In addition, the inspection table 11 can be reversed up and down. On the inspection table 11, the holding member 11a which suction-holds the electronic component package S is provided.

The first optical inspection camera 12 and the second optical inspection camera 13 optically inspect the surface of the electronic component package S (ball/lead surface and die surface). The first optical inspection camera 12 and the second optical inspection camera 13 are disposed near the inspection table 11 facing upward. The first optical inspection camera 12 and the second optical inspection camera 13 are each provided with an illuminating device (not shown) capable of irradiating light during inspection.

The first optical inspection camera 12 inspects the die surface of the electronic component package S transferred to the inspection table 11 by the transfer mechanism 7 . Then, the transfer mechanism 7 mounts the electronic component package S on the holding member 11 a of the inspection table 11 . After the holding member 11a absorbs and holds the electronic component package S, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13 , and the ball/lead surface of the electronic component package S is inspected by the second optical inspection camera 13 .

For example, the first optical inspection camera 12 can inspect the notch of the electronic component package S or the text marked on the electronic component package S, and the like. In addition, for example, the second optical inspection camera 13 may inspect the size or shape of the electronic part package S, the position of balls/leads, and the like.

The arrangement mechanism 14 is used to arrange the electronic component package S that has been inspected. The arrangement mechanism 14 is movable in the Y direction in the figure. The inspection table 11 arranges the electronic component package S that has been inspected by the first optical inspection camera 12 and the second optical inspection camera 13 on the arrangement mechanism 14 .

Next, in the inspection module B, the receiving step S20 is performed. The storing step S20 is a step of transporting (transferring) the electronic component packages S arranged on the arrangement mechanism 14 using the transport mechanism 15 and storing them in a tray. Based on the inspection results obtained by the first optical inspection camera 12 and the second optical inspection camera 13 , the electronic component packages S classified into good and defective are stored in a tray by the transport mechanism 15 . At this time, the conveyance mechanism 15 accommodates the good product in the electronic component package S in the tray 15a for good products, and accommodates a defective product in the defective product tray 15b. When the tray is filled with electronic component packages S, it is appropriately supplied to other empty trays.

The operation of each part of the above-mentioned inspection module B (the inspection table 11 , the first optical inspection camera 12 , the second optical inspection camera 13 , the arrangement mechanism 14 , the transport mechanism 15 , etc.) is controlled by the control unit 16 . In addition, the operation of each part of the inspection module B can be arbitrarily changed (adjusted) using the control unit 16 .

As described above, the cutting device 1 according to the present embodiment can cut the package substrate P and separate it into a plurality of electronic component packages S. As shown in FIG.

＜Conveying mechanism 15＞ Next, the configuration of the transport mechanism 15 used in the storing step S20 will be described. Furthermore, the directions indicated by arrow U, arrow D, arrow L, arrow R, arrow F, and arrow Rr shown in the figure are respectively defined as an upward direction, a downward direction, a left direction, a right direction, a front direction, and a rear direction. direction to explain. The left-right direction is a direction along the X direction shown in FIG. 1 , the front-rear direction is a direction along the Y direction shown in FIG. 1 , and the up-down direction is a direction along the Z direction shown in FIG. 1 .

The conveyance mechanism 15 shown in FIG. 3 and FIG. 4 adsorbs and conveys the electronic component package S. The conveying mechanism 15 mainly includes an adsorption nozzle 110, a first lifting motor 120, a first lifting power transmission mechanism 130, a second lifting motor 140, a second lifting power transmission mechanism 150, a nozzle holding mechanism 160, a lifting position maintaining mechanism 170, a rotating motor 180 and the rotating power transmission mechanism 190.

<Adsorption nozzle 110> The adsorption nozzle 110 shown in FIGS. 3 to 6 is used to adsorb the electronic component package S. As shown in FIG. The adsorption nozzle 110 is formed in a substantially cylindrical shape with its longitudinal direction facing up and down. The suction nozzles 110 are arranged in a single row in the left-right direction, and a plurality of them are arranged. In this embodiment, an example in which twelve adsorption nozzles 110 are arranged is shown. As will be described later, the adsorption nozzle 110 is supported vertically and rotatably.

A suction device (not shown) such as a vacuum pump is connected to the upper end of the adsorption nozzle 110 . A suction pad (not shown) made of elastic material such as rubber is provided at the lower end of the suction nozzle 110 . When the electronic component package S is adsorbed, the electronic component package S can be prevented from being damaged by making the elastic adsorption pad contact the electronic component package S, and the electronic component package S can be easily adsorbed.

The plurality of suction nozzles 110 are divided into two groups based on differences in power sources (first lift motor 120 and second lift motor 140 to be described later) for moving up and down. Specifically, the plurality of adsorption nozzles 110 are divided into two groups: the adsorption nozzles 110 vertically raised and lowered by the first lifting motor 120 and the adsorption nozzles 110 vertically raised and lowered by the second lifting motor 140 .

Hereinafter, for convenience of description, the adsorption nozzles 110 raised and lowered by the first lift motor 120 are referred to as the first group, and the adsorption nozzles 110 raised and lowered by the second lift motor 140 are referred to as the second group. In addition, in order to distinguish the adsorption nozzles 110 of the two groups, sometimes the adsorption nozzles 110 of the first group are called adsorption nozzles 110A, and the adsorption nozzles 110 of the second group are called adsorption nozzles 110B.

In the present embodiment, the first group of adsorption nozzles 110A are arranged at odd-numbered positions from the left. In addition, the second group of adsorption nozzles 110B are arranged at even-numbered positions from the left. That is, the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B are alternately arranged. As described above, in the present embodiment, at least one set of adsorption nozzles 110 is arranged in a positional relationship between another set of adsorption nozzles 110 .

<First lift motor 120> The first elevating motor 120 shown in FIGS. 3 to 5 is a power source for elevating the first group of adsorption nozzles 110A up and down. In addition, the 1st elevation motor 120 is one embodiment of the 1st motor of this invention. The first lift motor 120 is constituted by, for example, a servo motor capable of controlling fine rotation. The first lift motor 120 is arranged such that the output shaft faces rightward. The first lift motor 120 is fixed on a suitable support member (not shown).

<First Lifting Power Transmission Mechanism 130> The first lifting power transmission mechanism 130 shown in FIGS. 4 and 5 transmits the power of the first lifting motor 120 to the first group of adsorption nozzles 110A. In addition, the first lifting power transmission mechanism 130 is an embodiment of the first power transmission mechanism of the present invention. The first lifting power transmission mechanism 130 mainly includes a lifting pinion 131 , a lifting rack 132 , a lifting block 133 and a lifting guide 134 .

The lift pinion 131 is a gear fixed on the output shaft of the first lift motor 120 .

The elevating rack 132 is a rod-shaped gear that moves up and down as the elevating pinion 131 rotates. The elevating rack 132 is disposed so that the longitudinal direction faces up and down. The elevating rack 132 is disposed so as to engage with the elevating pinion 131 from the front.

The lift block 133 is a member that transmits the power of the first lift motor 120 to the suction nozzle 110A by moving up and down together with the lift rack 132 . The elevating block 133 is formed in a bar shape with its longitudinal direction facing left and right. The lifting block 133 is fixed on the front side of the lifting rack 132 . A plurality of protrusions 133 a are formed on the lifting block 133 .

The protruding portion 133 a is a portion formed to protrude forward from the front side of the lift block 133 . A plurality of protruding portions 133a are aligned in the left-right direction. The distance between adjacent protruding portions 133a is formed to be the same as the left-to-right distance between the suction nozzles 110 arranged at odd-numbered positions (the first group of suction nozzles 110A). Thereby, the protruding portion 133a is formed at a position corresponding to the first group of adsorption nozzles 110A.

The lift guide 134 is a member that guides the vertical movement of the lift block 133 . The lift guides 134 are respectively provided on the left and right ends of the lift block 133 .

In the first lift power transmission mechanism 130 configured as described above, the lift block 133 can be moved up and down by the power of the first lift motor 120 . Specifically, when the first lift motor 120 is driven, the lift pinion 131 rotates. The elevating rack 132 moves up and down with the rotation of the elevating pinion 131 . Since the lifting block 133 is provided on the lifting rack 132 , the lifting block 133 moves up and down while being guided by the lifting guide 134 . By raising and lowering the lifting block 133, the first group of adsorption nozzles 110A can be moved up and down as will be described later.

<Second lift motor 140> The second elevating motor 140 shown in FIGS. 3 to 5 is a power source for elevating the second group of adsorption nozzles 110B up and down. In addition, the second lift motor 140 is an embodiment of the second motor of the present invention. The second lift motor 140 is constituted by, for example, a servo motor capable of fine rotation control. The second lift motor 140 is arranged such that the output shaft faces leftward. The second lift motor 140 is disposed on the right side of the first lift motor 120 . The second lift motor 140 is fixed on a suitable support member (not shown).

<Second Lifting Power Transmission Mechanism 150> The second lifting power transmission mechanism 150 shown in FIG. 4 and FIG. 5 transmits the power of the second lifting motor 140 to the second group of adsorption nozzles 110B. In addition, the second lifting power transmission mechanism 150 is an embodiment of the second power transmission mechanism of the present invention. The second lifting power transmission mechanism 150 has substantially the same structure as the first lifting power transmission mechanism 130 . Specifically, the second lifting power transmission mechanism 150 mainly includes a lifting pinion 151 , a lifting rack 152 , a lifting block 153 and a lifting guide 154 .

The lift pinion 151 is fixed on the output shaft of the second lift motor 140 . The elevating rack 152 is disposed so as to engage with the elevating pinion 151 from the front.

The lift block 153 is a member that transmits the power of the second lift motor 140 to the adsorption nozzle 110B by moving up and down together with the lift rack 152 . The lifting block 153 is fixed on the front side of the lifting rack 152 . The lifting block 153 is disposed below the lifting block 133 of the first lifting power transmission mechanism 130 . A plurality of protrusions 153 a are formed on the lifting block 153 .

The protruding portion 153 a is a portion formed to protrude forward from the front side of the lift block 153 . A plurality of protruding portions 153a are aligned in the left-right direction. The distance between adjacent protruding portions 153a is formed to be the same as the left-to-right distance between the suction nozzles 110 arranged at even-numbered positions (the second group of suction nozzles 110B). Thereby, the protrusion part 153a is formed in the position corresponding to the adsorption nozzle 110B of the 2nd group.

The lift guide 154 is a member that guides the vertical movement of the lift block 153 . The lift guides 154 are respectively provided at both left and right ends of the lift block 153 .

In the second lift power transmission mechanism 150 configured as described above, the lift block 153 can be moved up and down by the power of the second lift motor 140 . By raising and lowering the lifting block 153, the second group of adsorption nozzles 110B can be moved up and down as will be described later.

<Nozzle holding mechanism 160> The nozzle holding mechanism 160 shown in FIGS. 3 , 6 to 8 holds the adsorption nozzle 110 in a liftable and rotatable manner. The nozzle holding mechanism 160 mainly includes a base portion 161 , a bearing 162 , a rotation support portion 163 and a spline nut (Spline nut) 164 .

The base portion 161 is a member for holding the adsorption nozzle 110 . The base portion 161 is formed in a substantially rectangular parallelepiped shape with its longitudinal direction facing left and right. The base portion 161 is fixed to an appropriate supporting member (not shown). A through hole 161 a is formed in the base portion 161 .

The through hole 161 a shown in FIGS. 8 and 9 is a hole formed to penetrate the base portion 161 up and down. A plurality of through-holes 161 a are formed at positions corresponding to the plurality of adsorption nozzles 110 (the first group of adsorption nozzles 110 and the second group of adsorption nozzles 110 ).

The bearing 162 rotatably supports a later-described rotation support portion 163 . The bearing 162 is provided with an upper and lower pair. The bearing 162 is fixed to the base part 161 by being fitted in the through-hole 161a.

The rotation support portion 163 supports a spline nut 164 which will be described later. The rotation support portion 163 is formed in a hollow cylindrical shape with its longitudinal direction facing up and down. The lower portion of the rotation support portion 163 is rotatably supported by the bearing 162 . A rotation gear 194 to be described later is formed on an upper portion of the rotation support portion 163 .

The spline nut 164 holds the adsorption nozzle 110 in a movable manner. The spline nut 164 is provided with a pair of upper and lower. The spline nut 164 is fixed to the rotation support part 163 by fitting in the hollow part of the rotation support part 163 . Thereby, the spline nut 164 can rotate integrally with the rotation support part 163 . The suction nozzle 110 is inserted into the spline nut 164 . The spline nut 164 is spline-fitted to the adsorption nozzle 110 . Thereby, the spline nut 164 can rotate integrally with the suction nozzle 110 . In addition, the suction nozzle 110 can move up and down with respect to the spline nut 164 .

<Elevating position maintaining mechanism 170> The raising and lowering position maintaining mechanism 170 shown in FIGS. 3 , 8 and 9 is used to maintain the suction nozzle 110 at a position raised to a certain height (hereinafter, this position is referred to as "raised position"). The lifting position maintaining mechanism 170 mainly includes a bracket 171 , a bearing 172 , a cylinder 173 , a first stopper 174 and a second stopper 175 .

The bracket 171 connects the suction nozzle 110 to an air cylinder 173 described later, and transmits power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the suction nozzle 110 . In addition, the bracket 171 is an embodiment of the transmission member of the present invention. The bracket 171 is formed in a substantially rectangular plate shape. Through-holes penetrating the bracket 171 up and down are respectively formed at the front and the rear of the bracket 171 .

The bearing 172 rotatably supports the adsorption nozzle 110 . The bearing 172 is fixed to the bracket 171 by being fitted into a through hole formed in the front portion of the bracket 171 . The upper part of the adsorption nozzle 110 is fixed to the bearing 172 in a state where it is inserted. Thereby, the adsorption nozzle 110 is attached so that rotation is possible with respect to the bracket 171, and it cannot move up and down (it cannot move up and down with respect to the bracket 171).

Here, the bracket 171 and the bearing 172 are provided with respect to the plurality of adsorption nozzles 110, respectively. As shown in FIG. 3 and FIG. 9 , the holder 171 corresponding to the second group of adsorption nozzles 110B is provided at a position slightly lower than the holder 171 corresponding to the first group of adsorption nozzles 110A.

As shown in FIG. 8 , the brackets 171 corresponding to the first group of adsorption nozzles 110A are placed on the lift blocks 133 (protrusions 133 a ) of the first lift power transmission mechanism 130 . The bracket 171 tends to move downward due to its own weight, but the downward movement of the bracket 171 is restricted by being supported from below by the elevating block 133 .

Similarly, as shown in FIG. 9 , the brackets 171 corresponding to the second group of adsorption nozzles 110B are placed on the lift blocks 153 (protrusions 153 a ) of the second lift power transmission mechanism 150 .

The air cylinder 173 is used to block the transmission of power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the support 171 and maintain the adsorption nozzle 110 at the raised position. In addition, the air cylinder 173 is an embodiment of the actuator of this invention. The air cylinder 173 is constituted by a single-solenoid single-acting air cylinder. The air cylinder 173 is arranged in a state in which a telescopic rod 173a faces downward. The air cylinder 173 is fixed in a state of being inserted into a through hole formed in the rear portion of the bracket 171 . When the air cylinder 173 operates (turns ON), the rod 173a is extended. In addition, when the operation of the air cylinder 173 is stopped (OFF), the rod 173a is in a contracted state.

The first stopper 174 shown in FIG. 8 and FIG. 9 is used to limit the descent of the first group of adsorption nozzles 110A. The first stopper 174 is disposed below the cylinder 173 corresponding to the first group of adsorption nozzles 110A. The first stopper 174 is fixed on a suitable support member (not shown).

The second stop block 175 shown in FIG. 9 is used to limit the descent of the second group of adsorption nozzles 110B. The second stopper 175 is disposed below the cylinder 173 corresponding to the second group of adsorption nozzles 110B. The second stopper 175 is disposed slightly lower than the first stopper 174 . The second stop block 175 is fixed on a suitable supporting member (not shown).

＜Rotary motor 180＞ The rotation motor 180 shown in FIGS. 3 to 5 is a power source for rotating the adsorption nozzle 110 . In addition, the rotation motor 180 is an embodiment of the third motor of the present invention. The rotation motor 180 is constituted by, for example, a servo motor capable of fine rotation control. The rotary motor 180 is disposed on the left of the plurality of adsorption nozzles 110 . The rotary motor 180 is arranged such that the output shaft faces downward. The rotary motor 180 is secured to a suitable support member (not shown).

<Rotary power transmission mechanism 190> The rotary power transmission mechanism 190 shown in FIGS. 3 and 4 transmits the power of the rotary motor 180 to the adsorption nozzle 110 . In addition, the rotational power transmission mechanism 190 is an embodiment of the third power transmission mechanism of the present invention. The rotary power transmission mechanism 190 mainly includes a rotary pinion 191 , a rotary rack 192 , a rotary rack guide 193 , and a rotary gear 194 .

The rotary pinion 191 is a gear fixed to the output shaft of the rotary motor 180 .

The rotary rack 192 shown in FIGS. 5 and 6 is a rod-shaped gear that moves left and right with the rotation of the rotary pinion 191 . The rotary rack 192 is disposed so that the longitudinal direction faces left and right. The rotary rack 192 is disposed across the rotary motor 180 and the plurality of adsorption nozzles 110 . The rotary rack 192 is arranged to engage with the rotary pinion 191 from the rear.

The rotary rack guide 193 shown in FIGS. 5 to 7 is a member that guides the movement of the rotary rack 192 in the left-right direction. The rotary rack guides 193 are respectively provided at both left and right ends of the rotary rack 192 . The rotary rack guide 193 is supported by the base portion 161 .

The rotary gear 194 shown in FIGS. 6 to 8 is a gear that rotates as the rotary rack 192 moves left and right. The rotation gear 194 is integrally formed on the upper portion of the rotation support portion 163 provided on each adsorption nozzle 110 . The rotary gear 194 is disposed so as to engage with the rotary rack 192 from the front. In addition, the rotation gear 194 can also be formed separately from the rotation support part 163 (a separate member).

In the rotary power transmission mechanism 190 configured as described above, the suction nozzle 110 can be rotated by the power of the rotary motor 180 . Specifically, when the rotary motor 180 is driven, the rotary pinion 191 rotates. As the rotary pinion 191 rotates, the rotary rack 192 moves left and right. Since the rotating gear 194 meshes with the rotating rack 192 , the rotating gear 194 rotates as the rotating rack 192 moves. With the rotation of the rotation gear 194 , the rotation support portion 163 and the spline nut 164 provided with the rotation gear 194 rotate. Since the suction nozzle 110 is spline-fitted to the spline nut 164 , the rotation of the spline nut 164 rotates the suction nozzle 110 around its axis (in a plane intersecting the lifting direction of the suction nozzle 110 ).

In addition, the conveyance mechanism 15 comprised as mentioned above can arbitrarily move in the X direction (left-right direction) by the movement mechanism which is not shown in figure.

<Basic operation of suction nozzle 110> The transport mechanism 15 can lift and rotate any adsorption nozzle 110 by appropriately driving three motors (the first lift motor 120 , the second lift motor 140 , and the rotation motor 180 ) and each air cylinder 173 . Thereby, the electronic component package S can be adsorbed by arbitrary adsorption nozzles 110, or the adsorbed electronic component package S can be mounted on a desired position. Hereinafter, using the first group of suction nozzles 110A as an example, the basic operation of each part when picking up the electronic component package S will be described. In addition, below, for convenience of description, it demonstrates using the figure (FIG. 11(a) - FIG. 11(d) etc.) which schematically shows the structure of the conveyance mechanism 15. FIG.

When the adsorption nozzle 110A is not raised and lowered, the air cylinder 173 provided corresponding to the adsorption nozzle 110A is operated, and the rod 173 a is extended (step S101 of FIG. 10 , FIG. 11( a )).

When the air cylinder 173 is about to descend while the rod 173a is extended, the lower end of the rod 173a hits the upper surface of the first stopper 174 at a predetermined position. Therefore, regardless of the operation of the first lift motor 120, the air cylinder 173 does not descend to a lower position than a predetermined position. Thereby, 110 A of adsorption nozzles are maintained in the predetermined rising position, and do not fall to the position lower than this position (step S102 of FIG. 10, FIG.11(b)).

On the other hand, when the adsorption nozzle 110A is raised and lowered, the air cylinder 173 provided corresponding to the adsorption nozzle 110A stops, and the rod 173a is contracted (step S103 of FIG. 10 , FIG. 11( c )).

In the contracted state of the rod 173a, the rod 173a will not contact the first stop block 174 . In this state, when the first elevating motor 120 is driven and the elevating block 133 is lowered, the bracket 171 placed on the elevating block 133 is also lowered by its own weight. Thereby, 110 A of adsorption nozzles descend|fall so as to follow the lifting block 133 (step S104 of FIG. 10, FIG.11(d)).

After the suction nozzle 110A descends to a predetermined position, the first lift motor 120 stops. In this state, the operation of the suction device connected to the adsorption nozzle 110A is controlled. For example, when the electronic component package S is adsorbed, the suction device operates, and the electronic component package S is adsorbed to the lower end of 110A of adsorption nozzles. In addition, when the electronic component package S adsorbed by the adsorption nozzle 110A is placed on a predetermined place, the suction device stops, and the adsorption of the electronic component package S by the adsorption nozzle 110A is released (step S105 in FIG. 10 ).

Furthermore, when the suction nozzle 110A is lowered (see FIG. 11( d )), if the thickness of the electronic component package S is thicker than expected, there is a possibility that the suction nozzle 110A may collide before falling to a predetermined position. to the electronics package S. However, in this embodiment, the bracket 171 supporting the adsorption nozzle 110 is placed on the lifting block 133, so even if the adsorption nozzle 110 touches the electronic component package S, the bracket 171 can be kept away from the lifting block 133. Flee upwards. Accordingly, it is possible to prevent the electronic component package S from being damaged due to excessive load applied to the electronic component package S by the power of the lowering of the lifting block 133 .

After the suction of the electronic component package S by the suction nozzle 110A is completed, the first lift motor 120 is driven to raise the lift block 133 . When the lifting block 133 rises, the bracket 171 mounted on the lifting block 133 also rises. Thereby, 110 A of adsorption nozzles rise so that it may follow the lifting block 133 (step S106 of FIG. 10).

After 110 A of suction nozzles are raised to a predetermined position, the 1st elevating motor 120 is stopped (step S107 of FIG. 10). Then, the air cylinder 173 of the suction nozzle 110A that does not need to be lowered is operated, and the suction nozzle 110A is maintained at a predetermined raised position (step S101 and step S102 of FIG. 10 , FIG. 11( b )).

As described above, by driving the first elevating motor 120 while stopping the operation of the air cylinder 173 of the suction nozzle 110A to be lowered (the rod 173 a is contracted), only the suction nozzle 110A can be raised and lowered. Thereby, among the first group of adsorption nozzles 110A, only desired adsorption nozzles 110A can be raised and lowered.

In addition, in the above-mentioned example, the case of raising and lowering the first group of adsorption nozzles 110A has been described as an example, and the operation when raising and lowering the second group of adsorption nozzles 110B is substantially the same. In addition, the mechanism (first lift motor 120, first lift power transmission mechanism 130, etc.) for raising and lowering the first group of adsorption nozzles 110A and the mechanism for raising and lowering the second group of adsorption nozzles 110B (second lift motor 140, The second lifting power transmission mechanism 150 and the like) are independent of each other, so the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B can be raised and lowered at any timing.

＜Operation when transporting electronic component package S＞ In the conveyance mechanism 15 of this embodiment, it is assumed that the electronic component package S is conveyed by alternately raising and lowering a plurality of suction nozzles 110 from one end (from the left in this embodiment). Hereinafter, the state of conveyance of the electronic component package S by the conveyance mechanism 15 is demonstrated concretely.

In addition, for the sake of convenience of description, the description will be given focusing on the up-and-down of the adsorption nozzles 110 that are fourth from the left among the twelve adsorption nozzles 110 . 12( a ) to FIG. 12( f ) show a plurality of electronic component packages S to be conveyed arranged side by side, and the operating states (ON/ OFF), the working state of the first lifting motor 120 and the second lifting motor 140 and the lifting and lowering of the four adsorption nozzles 110 .

First, as shown in FIG.12(a), the conveyance mechanism 15 is moved to the upper direction of the electronic component package S by the movement mechanism not shown. In the cutting apparatus 1 (refer FIG. 1) of this embodiment, the conveyance mechanism 15 moves suitably in the X direction, and moves above the arrange|positioning mechanism 14 in which the electronic component package S was arrange|positioned.

Next, as shown in FIG. 12( a ), when the first lifting motor 120 and the second lifting motor 140 are stopped, the cylinders 173 corresponding to the two adsorption nozzles 110 from the left stop working, and the other cylinders 173 work.

Next, as shown in FIG. 12( b ), the first lift motor 120 is operated to lower the adsorption nozzle 110A. Thereby, among 110 A of adsorption nozzles of the 1st group, only the adsorption nozzle 110A (the adsorption nozzle 110 at the left end) whose cylinder 173 stops operating descends.

Next, as shown in FIG. 12( c ), at the timing when the suction nozzle 110 at the left end comes into contact with the electronic component package S, the operation of the first lift motor 120 is stopped. In this state, the suction device operates, and the electronic component package S at the left end is sucked by the suction nozzle 110 at the left end.

Next, as shown in FIG. 12( d ), the first lift motor 120 is operated to lift the adsorption nozzle 110A. In addition, while the suction nozzle 110 at the left end is rising, the second elevating motor 140 is operated to lower the suction nozzle 110B. Thereby, among the second group of adsorption nozzles 110B, the adsorption nozzle 110B (the second adsorption nozzle 110 from the left) in which the cylinder 173 is stopped descends.

Next, as shown in FIG. 12( e ), after the adsorption nozzle 110 at the left end is raised to a predetermined position, the first lift motor 120 stops operating. Then, the air cylinder 173 corresponding to the adsorption nozzle 110 at the left end operates, and the air cylinder 173 corresponding to the third adsorption nozzle 110 from the left stops operating.

Furthermore, at the timing when the second adsorption nozzle 110 from the left comes into contact with the electronic component package S, the operation of the second lift motor 140 is stopped. In this state, the suction device works, and the second electronic component package S from the left is sucked by the second suction nozzle 110 from the left.

Next, as shown in FIG. 12(f), the second lift motor 140 is operated to lift the adsorption nozzle 110B. In addition, the first lift motor 120 is operated to lower the adsorption nozzle 110A while the adsorption nozzle 110 is raised second from the left. Thereby, among the first group of adsorption nozzles 110A, the adsorption nozzle 110A (the third adsorption nozzle 110 from the left) in which the cylinder 173 is stopped descends.

Thereafter, the operations as described above are sequentially performed, and a required number of electronic component packages S are sucked by each suction nozzle 110 . After the suction of the electronic component package S is completed, the conveyance mechanism 15 moves to the position which becomes the transfer destination of the electronic component package S by the movement mechanism which is not shown in figure. In the cutting device 1 (see FIG. 1 ) of this embodiment, the conveyance mechanism 15 moves appropriately in the X direction and moves above the tray (good product tray 15 a or defective product tray 15 b ) that accommodates electronic component packages S.

When storing the electronic component package S sucked by the suction nozzle 110 in the tray, the suction nozzle 110 is alternately raised and lowered, and the suction nozzle 110 is lowered, similarly to the example shown in FIG. The electronic component package S can be accommodated in the tray by releasing the adsorption of the electronic component package S in the state.

In addition, when the electronic component package S is accommodated in the tray, the rotation motor 180 is properly operated to adjust the direction of the electronic component package S (rotation position in a plane intersecting the lifting direction of the suction nozzle 110 ). Specifically, when the conveyance mechanism 15 moves from the arrangement mechanism 14 to the tray, the direction of the electronic component package S is detected from below by a detection mechanism such as a camera, and a necessary direction adjustment amount (rotation correction amount) is calculated. Then, before storing the electronic component package S in the tray (in the state where the electronic component package S is attracted to the suction nozzle 110 ), the rotation motor 180 is properly operated to rotate the electronic component package S to adjust the direction. Thereby, the electronic component package S can be accommodated precisely in a tray.

Furthermore, in Fig. 12(a) to Fig. 12(f) an example in which the electronic component packages S are arranged at the same interval (pitch) as the adsorption nozzles 110 is shown, and the conveying mechanism 15 of this embodiment can also be adsorbed to match the The electronic component packages S arranged at different intervals of the nozzles 110 are sucked and conveyed. Specifically, each time one electronic component package S is sucked, the transfer mechanism 15 itself moves left and right so that the position of the suction nozzle 110 to be sucked next is aligned with the position of the electronic component package S. Transport of the placed electronic component package S.

As described above, the transport mechanism 15 of this embodiment is provided with a plurality of suction nozzles 110, The plurality of adsorption nozzles 110 are composed of a first group of adsorption nozzles 110A and a second group of adsorption nozzles 110B, and the conveying mechanism 15 includes: The first lifting motor 120 (the first motor) lifts the first group of adsorption nozzles 110A; The second lift motor 140 (second motor) lifts the second group of adsorption nozzles 110B; rotating the motor 180 (third motor) to rotate the plurality of adsorption nozzles 110 in a plane intersecting the lifting direction of the plurality of adsorption nozzles 110; and The lift position maintaining mechanism 170 is capable of maintaining an arbitrary suction nozzle 110 among the plurality of suction nozzles 110 at a predetermined lift position regardless of the driving of the first lift motor 120 and the second lift motor 140 .

By constituting as described above, the structure can be simplified. That is, the operation of raising and lowering the plurality of adsorption nozzles 110 individually and the operation of rotating them can be realized by the three motors. As described above, since the adsorption nozzles 110 can be operated by three motors regardless of the number of the adsorption nozzles 110, the structure can be simplified, and further, the cost reduction and maintenance simplification can be realized.

In addition, the plurality of adsorption nozzles 110 are arranged in a row, and another group of adsorption nozzles 110 is arranged between at least any one group of adsorption nozzles 110 in the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B.

With the configuration as described above, the electronic component packages S can be conveyed efficiently by arbitrarily shifting the timing of the operation (lifting and descending) of the suction nozzles 110 of different adjacent groups. For example, as in the present embodiment, when the first group of suction nozzles 110A is raised, the adjacent second group of suction nozzles 110B is lowered, whereby the suction of a plurality of electronic component packages S can be efficiently performed.

In addition, the conveying mechanism 15 further includes: The nozzle holding mechanism 160 is used to hold the plurality of adsorption nozzles 110 to be able to lift respectively, and to hold them to be able to rotate in a plane intersecting the lifting direction of the plurality of adsorption nozzles 110; The first lifting power transmission mechanism 130 (first power transmission mechanism), which transmits the power of the first lifting motor 120 to the first group of adsorption nozzles 110A; The second lift power transmission mechanism 150 (second power transmission mechanism) transmits the power of the second lift motor 140 to the second group of adsorption nozzles 110B; and The rotary power transmission mechanism 190 (third power transmission mechanism) transmits the power of the rotary motor 180 to the plurality of adsorption nozzles 110 .

By configuring as described above, a mechanism for moving up and down and rotating a plurality of adsorption nozzles 110 by three motors can be made into a relatively simple structure.

The lifting position maintaining mechanism 170 includes: A plurality of brackets 171 (transmission members) are respectively arranged corresponding to the plurality of adsorption nozzles 110, and transmit the power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the first lifting power transmission mechanism 150 respectively. a set of adsorption nozzles 110A and said second set of adsorption nozzles 110B; and Cylinders 173 (actuators) are respectively arranged corresponding to the plurality of brackets 171, and can block the transmission of power from the first lifting power transmission mechanism 130 and the second lifting power transmission mechanism 150 to the brackets 171 .

By controlling the operation of the air cylinder 173 by configuring as described above, it is possible to maintain an arbitrary suction nozzle 110 at a predetermined raised position.

In addition, the actuator is constituted by an air cylinder 173 .

By configuring as described above, the elevating position maintaining mechanism 170 can have a relatively simple structure.

In addition, the conveying mechanism 15 controls the operation of the first lifting motor 120 , the second lifting motor 140 and the lifting position maintaining mechanism 170 , so that one of the two adjacent suction nozzles 110 absorbs During the ascent of 110, another adsorption nozzle 110 is lowered.

By configuring as described above, conveyance using the adsorption nozzle 110 can be performed efficiently.

In addition, the cutting device 1 of this embodiment includes the above-mentioned conveyance mechanism 15 .

By constituting as described above, the structure can be simplified.

In addition, the manufacturing method of the cut product of this embodiment manufactures a cut product using the cutting apparatus 1 mentioned above.

By configuring as described above, the cutting device 1 (transport mechanism 15 ) having a simple structure can be used, and cost reduction, simplification of maintenance, and the like can be achieved.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change suitably within the range of the technical idea of invention described in the claim.

For example, the structure of the cutting device 1 illustrated in the above-mentioned embodiment is an example, and the specific structure can be changed appropriately.

For example, in the above-described embodiment, the cutting module A and the inspection module B each include a control unit (the control unit 9 and the control unit 16), but the present invention is not limited thereto, and the respective control units can also be aggregated into One control unit, or divided into three or more control units. In addition, the cutting device 1 of the present embodiment has a double cutting table structure having two cutting tables 4 , but the present invention is not limited thereto, and may include only one cutting table 4 . In addition, the cutting device 1 of the present embodiment has a double-spindle structure having two main shaft parts 5 , but the present invention is not limited thereto, and may have only one main shaft part 5 .

Moreover, in the said embodiment, although the conveyance mechanism 15 which included 12 adsorption nozzles 110 was illustrated, this invention is not limited to this, and the number of objects of the adsorption nozzles 110 can be changed arbitrarily. In addition, in the transport mechanism 15 of this embodiment, the adsorption nozzles 110 can be operated by three motors (the first lift motor 120, the second lift motor 140, and the rotation motor 180) regardless of the number of the suction nozzles 110. (lift and rotate).

In addition, in the above-described embodiment, an example in which the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B are alternately arranged in units of one is shown, but the present invention is not limited thereto, and the two groups of adsorption nozzles 110 can be Arbitrary configuration. For example, two sets of adsorption nozzles 110 may be alternately arranged or randomly arranged in units of two. However, when the suction nozzles 110 arranged in a row are raised and lowered sequentially as in the present embodiment, the operation of the first lifting motor 120 and the second lifting motor 140 or the air cylinder 173 is used to suppress the air generated in the suction nozzles 110. From the viewpoint of vibration or shock, it is desirable to alternately arrange the first group of adsorption nozzles 110A and the second group of adsorption nozzles 110B having different power sources in units of one.

In addition, in the above-mentioned embodiment, the air cylinder 173 was exemplified as the actuator for maintaining the adsorption nozzle 110 at the predetermined raised position, but the present invention is not limited thereto, and any actuator can be used. For example, a solenoid actuator, a hydraulic cylinder, a general induction motor, etc. can also be used as an actuator.

In addition, in the above-described embodiment, servo motors were listed as the first lift motor 120 , the second lift motor 140 , and the swing motor 180 , but the present invention is not limited thereto, and arbitrary motors can be used. For example, a stepping motor or the like can also be used as the first lift motor 120 or the like. However, from the viewpoint of precisely raising and lowering the adsorption nozzle 110 in order to adsorb the electronic component package S, it is desirable to use a servo motor as the first elevation motor 120 and the like.

In addition, in the said embodiment, the example which transmits the power of the 1st lift motor 120, the 2nd lift motor 140, and the rotation motor 180 by the gear (rack/pinion) was shown, but this invention is not limited to Therefore, any mechanism can be used to transmit power. For example, power can also be transmitted using a pulley provided on the output shaft of the motor and a belt wound around the pulley.

In addition, in the above-described embodiment, an example was shown in which the suction nozzle 110 (holder 171 ) descends by its own weight so as to follow the lifting block 133 , but the present invention is not limited thereto. For example, an urging member (a spring, etc.) that urges the suction nozzle 110 downward may also be provided. Thereby, the suction nozzle 110 can be easily followed by the lifting block 133 .

In addition, the operation|movement of the conveyance mechanism 15 demonstrated in the said embodiment is an example, and can change arbitrarily. For example, in the above-described embodiment, an example was shown in which the plurality of adsorption nozzles 110 are raised and lowered sequentially from the left in units of one, but the present invention is not limited thereto, and the order of raising and lowering can be changed arbitrarily. In addition, in the above-mentioned embodiment, an example was shown in which one of the adjacent suction nozzles 110 was raised while the other was lowered, but the present invention is not limited thereto, and one of them can be raised. The other descends after the ascent is fully completed.

In addition, in the said embodiment, the example which raised and lowered and rotated the adsorption nozzle 110 using three motors was shown, but the number of motors is not limited to this. For example, in the above-mentioned embodiment, the example in which the plurality of suction nozzles 110 are divided into two groups and the two groups are raised and lowered by individual motors (two motors) is shown, but it is also possible to configure the plurality of Each adsorption nozzle 110 is divided into three or more groups, and each group is raised and lowered by an individual motor (three or more motors).

1: cutting device 2: Substrate supply mechanism 3: Positioning mechanism 3a: track part 4: Cutting table 4a, 11a: holding member 4b: Rotary mechanism 4c: Mobile Mechanism 4d: First position confirmation camera 5: Main shaft 5a: Rotary Knife 5b: Second location confirmation camera 6: First Cleaner 7: transfer mechanism 8: Second cleaner 8a: cleaning mechanism 8b: Suction drying mechanism 9, 16: Control Department 11: Examination table 12: The first optical inspection camera 13: Second optical inspection camera 14: Configuration mechanism 15: Transport mechanism 15a: Trays for good products 15b: Defective product tray 110, 110A, 110B: Adsorption nozzles 120: The first lifting motor 130: The first lifting power transmission mechanism 131, 151: lifting pinion 132, 152: lifting rack 133, 153: lifting block 133a, 153a: protrusions 134, 154: lifting guide 140: The second lifting motor 150: The second lifting power transmission mechanism 160: nozzle holding mechanism 161: base part 161a: through hole 162, 172: Bearing 163: rotating support part 164: spline nut 170: Lifting position maintenance mechanism 171: Bracket 173: Cylinder 173a: Rod 174: The first stop block 175: the second stop block 180:Rotary motor 190: rotating power transmission mechanism 191:Rotary pinion 192:Rotary rack 193: Rotary Rack Guide 194:Rotary gear A: cut off module B: Check the module M: Box P: package substrate S: Packaging of electronic components S2: Supply step S4: Positioning step S6: cut off step S8: the first cleaning step S10: the first drying step S12: Transfer step S14: the second cleaning step S16: the second drying step S18: Inspection steps S20: Containment Procedure S101～S107: Steps

Fig. 1 is a schematic plan view showing the overall structure of a cutting device according to an embodiment of the present invention. Fig. 2 is a flow chart showing a method of manufacturing a cut product. Fig. 3 is a front perspective view showing the overall structure of a transport mechanism according to an embodiment of the present invention. Fig. 4 is a rear perspective view showing the overall structure of a transport mechanism according to an embodiment of the present invention. Fig. 5 is a partially exploded plan view showing the overall structure of a transport mechanism according to an embodiment of the present invention. Fig. 6 is a front view showing the overall structure of a transport mechanism according to an embodiment of the present invention. Fig. 7 is a side view showing the overall structure of a transport mechanism according to an embodiment of the present invention. FIG. 8 is a cross-sectional view along line A-A of FIG. 6 . Fig. 9 is a B-B sectional view of Fig. 6 . Fig. 10 is a flowchart showing the basic operation of the suction nozzle. (a) to (d) of FIG. 11 are schematic views showing the basic operation of the adsorption nozzle. (a) to (f) of FIG. 12 are schematic diagrams showing the operation of a plurality of adsorption nozzles.

15: Transport mechanism

110A, 110B: Adsorption nozzles

120: The first lifting motor

132, 152: lifting rack

134, 154: lifting guide

140: The second lifting motor

160: nozzle holding mechanism

161: base part

163: rotating support part

170: Lifting position maintenance mechanism

171: Bracket

173: Cylinder

180:Rotary motor

190: rotating power transmission mechanism

191:Rotary pinion

192:Rotary rack

193: Rotary Rack Guide

194:Rotary gear

Claims (8)

A conveying mechanism, which is equipped with a plurality of adsorption nozzles composed of a first group of adsorption nozzles and a second group of adsorption nozzles, and the conveyance mechanism includes: a first motor to lift the first group of adsorption nozzles; a second motor , to lift the second group of adsorption nozzles; a third motor, to rotate the plurality of adsorption nozzles in a plane intersecting the lifting direction of the plurality of adsorption nozzles; and a lifting position maintaining mechanism capable of moving the plurality of adsorption nozzles Any one of the suction nozzles is maintained at a predetermined raised position regardless of the driving of the first motor and the second motor. The conveying mechanism according to claim 1, wherein the plurality of adsorption nozzles are arranged in a row, and are arranged between at least any one group of adsorption nozzles in the first group of adsorption nozzles and the second group of adsorption nozzles Another set of adsorption nozzles. The conveying mechanism according to claim 1 or claim 2, further comprising: a nozzle holding mechanism for holding each of the plurality of adsorption nozzles so as to be able to move up and down, and to hold each of the plurality of adsorption nozzles so as to be able to move in the direction of elevation with respect to the plurality of adsorption nozzles. Rotate in intersecting planes; the first power transmission mechanism transmits the power of the first motor to the first group of adsorption nozzles; the second power transmission mechanism transmits the power of the second motor to the second a group of adsorption nozzles; and a third power transmission mechanism that transmits the power of the third motor to the plurality of adsorption nozzles. The conveying mechanism according to claim 3, wherein the lifting position maintaining mechanism includes: a plurality of transmission members, which are respectively arranged corresponding to the plurality of suction nozzles, and receive power from the first power transmission mechanism and the second The power of the power transmission mechanism is respectively transmitted to the first group of adsorption nozzles and the second group of adsorption nozzles; and the actuators are respectively arranged corresponding to the plurality of transmission members and can block the power from the first power The transmission mechanism and the transmission of the second power transmission mechanism to the transmission member. The transfer mechanism according to claim 4, wherein the actuator is constituted by an air cylinder. The conveying mechanism according to claim 1 or claim 2, wherein the operation of the first motor, the second motor and the lifting position maintaining mechanism is controlled so that two adjacent suction During the ascent of one of the adsorption nozzles among the nozzles, the other adsorption nozzle is lowered. A cutting device, comprising the conveying mechanism according to any one of Claim 1 to Claim 6. A method of manufacturing a cut-off product, using the cutting device according to Claim 7 to manufacture a cut-off product.

Images