JP5108481B2 - Device and method for conveying individualized electronic components - Google Patents

Description

  The present invention relates to a transport apparatus and a transport method for an individual electronic component. In particular, a sealed substrate is formed by resin-sealing semiconductor chips and the like that are respectively mounted in a plurality of regions provided in a grid pattern on the substrate, and the sealed substrate is separated into regions. The present invention relates to a transfer technique used when manufacturing a plurality of electronic components.

  With reference to FIG. 5, a method of separating a sealed substrate, which is one of methods conventionally used for the purpose of efficiently producing a plurality of electronic components, will be described. FIG. 5A is a schematic plan view showing a state where the sealed substrate is fixed to the stage, and FIG. 5B is a schematic plan view showing a state where the separated electronic components are conveyed and arranged on two tables. FIG. In addition, in order to make it easy to understand, any figure included in this application document is schematically omitted or exaggerated as appropriate.

  The sealed substrate M includes a substrate made of a printed circuit board, a lead frame, and the like, and a sealing resin formed on one surface of the substrate (all not shown). Further, as shown in FIG. 5A, the sealed substrate M has a plurality of regions provided on the substrate, and these regions are included in a plurality of electronic components P (FIG. 5B). Corresponding to the electronic component P shown). In FIG. 5 (1), reference numerals of 11 to 15, 21 to 25,..., 81 to 85 are given to the respective regions corresponding to a plurality of electronic components for convenience, and in FIG. The electronic components P are denoted by reference numerals 11 to 15, 21 to 25,. In each region of the sealed substrate M, chip-shaped components (not shown) such as semiconductor chips are mounted. Each region is partitioned by an imaginary line L, and is provided in a lattice shape according to a constant pitch (inter-center spacing) in the X direction and the Y direction. In FIG. 5, the planar shape of each region is a square, and a constant pitch in the X direction and the Y direction is indicated by p.

  In the manufacturing process of the electronic component, the sealed substrate M is fixed to the stage ST by means such as suction or adhesion, and cut (full cut) along the virtual line L by a dicer using a rotary blade. As a result, a plurality of individual electronic components (see the electronic component P in FIG. 5B) are manufactured. The separated electronic components are placed in a grid pattern on the stage ST shown in FIG. These electronic components are fixed by a suction jig, and are transported from above the stage ST to a storage tray or a table (both not shown) used in the next process (for example, see Patent Document 1). .

  By the way, in recent years, electronic components tend to be miniaturized due to demands for lower prices and miniaturization of electronic devices. Along with this trend, the following problems have arisen. First, the distance between the suction heads provided at the tips of the suction jigs has become smaller, making it difficult to manufacture the suction jigs. Secondly, in a tray for storing electronic components and a table used in the next process, it has become difficult to manufacture a slope portion provided around the inner bottom portion of a recess in which each electronic component is stored. The slope is provided to guide the electronic component around the inner bottom of the recess. In addition, these problems are remarkable when the planar dimension of an electronic component is 3 mm or less on one side.

  With reference to FIG. 5 and FIG. 6, a conventional method for conveying a plurality of electronic components and arranging them in a staggered manner, which is performed to cope with these problems, will be described. 6 (1) to 6 (3) are schematic front views illustrating a process in which a plurality of separated electronic components are transported from the stage and are arranged on the two tables in a staggered manner.

  By the way, “arranging a plurality of electronic components” means that a plurality of electronic components are present diagonally above and below a certain electronic component, and other electronic components are not present on the top, bottom, left and right. This means arranging the electronic parts. In other words, “arranging a plurality of electronic components in a staggered manner” means arranging a plurality of electronic components at positions corresponding to one color of a checkered pattern. And, “checkerboard pattern” originally means “patterns in which a board and stripes are lined up in a different way” (for example, “Kojitsu 5th Edition”, Debut of Shinmura, Iwanami Shoten, November 1998) 11th, P.159). In the drawings included in the present application document, the arrangement along the horizontal direction (X direction) is referred to as “row”, and the arrangement along the vertical direction (Y direction) is referred to as “column”. A total of 40 electronic components of 8 rows × 5 columns are arranged on the stage ST in FIG.

  In FIG. 6, the transport mechanism PU is provided with five suction heads H1 to H5. The suction heads H1 to H5 are provided with suction tubes V1 to V5, respectively. Further, the adsorption tubes V1 to V5 are each connected to a decompression tank (all not shown) via valves. The decompression tank, the valve, and the adsorption tubes V1 to V5 are included in a fixing / fixing release mechanism that fixes the electronic component and releases the fixing.

  First, the transport mechanism PU is lowered from the state shown in FIG. 6 (1), and the electronic components 11 to 15 separated on the stage ST are bundled together by each of the five suction heads H1 to H5. Adsorb. Then, the transport mechanism PU moves up, moves onto the table T1 of the two tables used in the next process, moves down, and releases the suction in the suction pipes V1, V3, and V5. Thereby, as shown in FIG. 6B, the electronic components 11, 13, and 15 are arranged on the table T1 so as to have a pitch of 2p.

  Next, as shown in FIG. 6 (2), the transport mechanism PU moves up and moves in the right direction in the drawing, and moves to above the table T2 of the two tables used in the next process. Then, the transport mechanism PU is lowered and the suction is released in the suction pipes V2 and V4. Thereby, the electronic components 12 and 14 are arranged on the table T2 so as to have a pitch of 2p. Through the steps so far, the electronic components 11 to 15 are arranged in the row closest to the positive Y direction (upward in the drawing) of each table T1 and T2 in FIG. Specifically, the electronic components 11, 13, and 15 are arranged on the table T1, and the electronic components 12 and 14 are arranged on the table T2 so as to have a pitch of 2p in each of the tables T1 and T2.

  After that, another suction jig (not shown) having a suction head having a pitch of 2p sucks the electronic components 11, 13, 15 and the electronic components 12, 14 together in order, and the tray or the next Transport to the table used in the process. That is, the electronic components 11, 13, and 15 are first picked up and transported together, and then the electronic components 12 and 14 are picked up and transported collectively. According to this conventional technique, a total of five electronic components P including three and two electronic components 11, 13, 15 and electronic components 12, 14 arranged in one row of each table T1, T2, respectively. Are transported in two steps. In the case shown in FIG. 5 (2), a total of 40 electronic components are conveyed in 16 batches. Therefore, it is difficult to increase the efficiency of conveying the electronic components that are separated into pieces and arranged in a staggered manner.

JP 2000-10077A (page 6)

  The problem to be solved by the present invention is that when individual electronic parts placed in a grid on a stage are transported on a table and arranged in a staggered manner, and further transported from the table The efficiency is low.

  Hereinafter, reference numerals in parentheses in the descriptions of “means for solving the problem”, “effect of the invention”, and “best mode for carrying out the invention” are the terms used in the description and the configuration shown in the drawings. It is described for the purpose of facilitating comparison with elements. Further, these symbols and the like do not mean that “the meaning of the terms in the description is limited to the components shown in the drawings”.

In order to solve the above-mentioned problems, the device for transporting singulated electronic components according to the present invention seals a chip mounted on each of a plurality of regions provided in a lattice shape on a substrate by resin sealing. An apparatus for transporting separated electronic components that transports a plurality of electronic components (P) manufactured by forming a stopped substrate (M) and separating the sealed substrate (M) into regions. A fixing member (HA) that collectively sucks a plurality of electronic components (P) arranged like checkerboard squares on the lower surface after the sealed substrate (M) is separated into pieces. And a release mechanism (V1 to V5) for selectively releasing the adsorption of the plurality of electronic components (P) fixed to the fixing member (HA) so that the plurality of electronic components (P) are not fixed. Can be positioned below the fixed member (HA) and accommodates multiple electronic components (P) Rukoto a table (TA) which can, first to accommodate the tables plurality of electronic components in the position corresponding to one color of a checkered pattern among the plurality of electronic components provided in (TA) (P) (P ) 1 And a plurality of electronic components (P) provided in the table (TA) adjacent to the first storage portion (S1) at positions corresponding to other colors of the checkered pattern . 1 along the one direction (X direction) in the checkered pattern among the second accommodating portion (S2) for accommodating the electronic component (P) and the plurality of electronic components (P) accommodated in a staggered pattern in the table (TA). A transport mechanism (PU) that picks up and transports electronic components (P) for one line at a time, and an electronic component (P) for one line provided at a predetermined center-to-center distance (2p) in the transport mechanism (PU). With multiple adsorption mechanisms (H1 to H5) Rutotomoni, one line electronic component along one direction (X direction) (P) is characterized in that it is arranged at equal center-to-center spacing (2p).

In addition, according to the present invention, there is provided a device for transporting an individualized electronic component including a moving mechanism for relatively moving the fixing member (HA) and the table (TA) in the above-described transport device. When the number of electronic parts (P) for one line is an odd number, it stops during the period in which the electronic parts (P) are housed in the first housing part (S1) and the second housing part (S2). If the number of electronic components (P) for one line is an even number, the electronic component (P) is placed first in one of the first housing portion (S1) and the second housing portion (S2). After being accommodated, it moves by a center-to-center distance (p) for one line along another direction (Y direction) orthogonal to one direction in the checkered pattern.

  In addition, in the above-described transport apparatus, the transport apparatus for the separated electronic parts according to the present invention is characterized in that the predetermined center-to-center distance (p, 2p) in the transport mechanism (PU) can be changed. .

In addition, according to the present invention, a method for transporting individualized electronic components includes sealing a substrate (M) by resin-sealing chips that are respectively mounted in a plurality of regions provided in a lattice shape on the substrate. A method for transporting individual electronic components (P) that is formed and transports a plurality of electronic components (P) manufactured by separating individual substrates (M) into regions. After the substrate (M) is separated into pieces, a plurality of electronic components (P) arranged like checkered squares are collectively sucked on the lower surface of the fixing member (HA); HA) and a first housing part (S1) provided in a table (TA) capable of housing a plurality of electronic components (P), and a plurality of parts fixed to the fixing member (HA) A plurality of electronic components (P) are selectively removed by selectively desorbing the electronic components (P). A step of accommodating a plurality of electronic components in the position corresponding to one color checkered the (P) to the first housing portion (S1), the fixed member second provided (HA) and the table (TA) The step of aligning the housing portion (S2) of the first electronic component and the check of the plurality of electronic components (P) by selectively releasing the adsorption of the plurality of electronic components (P) fixed to the fixing member (HA). A plurality of electronic components (P) at positions corresponding to other colors are accommodated in the second accommodating portion (S2), and the transport mechanism (PU) is used to stagger the table (TA). And a step of collectively sucking and transporting one line of electronic components (P) along one direction (X direction) in a checkered pattern among the plurality of electronic components (P) accommodated. The accommodating portion (S1) and the second accommodating portion (S2) are provided adjacent to each other in one direction ( Direction) one line electronic components along the (P) is characterized in that it is arranged at equal center-to-center spacing (2p).

In addition, the method for transporting individualized electronic components according to the present invention includes a step of relatively moving the fixing member (HA) and the table (TA) according to circumstances in the above transport method, In the step of moving, when there is an even number of electronic parts (P) for one line, the electronic parts (S1) and the second containing part (S2) are preceded by electronic parts ( After the accommodation of P), it moves by the center-to-center spacing (p) for one line along the other direction (Y direction) orthogonal to one direction in the checkered pattern.

  Further, according to the present invention, there is provided a method for transporting individualized electronic components. In the transport method described above, the transport mechanism (PU) is provided with a predetermined center-to-center distance (p, 2p) and electronic components for one line ( The step of changing the predetermined center-to-center spacing (p, 2p) in the plurality of suction mechanisms (H1 to H5) that collectively suck P) is characterized.

  According to the present invention, first, a plurality of separated electronic components (P) are collectively sucked and conveyed by the fixing member (HA), and are accommodated in a staggered pattern on the table (TA). Arrange like this. Second, on the table (TA), one line of electronic parts (P) along one direction (X direction) is collectively sucked and transported by the transport mechanism (PU). Therefore, the plurality of electronic components (P) arranged in a staggered pattern on the table (TA) can be transported by the number of operations equal to the number of lines. By these, the efficiency which conveys the separated electronic component (P) improves significantly.

  Further, according to the present invention, in the plurality of electronic components (P) housed in a staggered pattern on the table (TA), the number of one line along one direction (X direction) is even and odd. In any case, the transport mechanism (PU) collectively sucks and transports the electronic components (P) for one line. Accordingly, since the plurality of electronic components (P) accommodated in the table (TA) can be transported by the number of operations approximately equal to the number of lines, the electronic components (P) separated into individual pieces and arranged in a staggered manner. The efficiency of conveying is greatly improved.

  Moreover, according to this invention, the predetermined | prescribed center space | interval (p, 2p) in the some adsorption | suction mechanism (H1-H5) which a conveyance mechanism (PU) has is changeable. Therefore, even when the distances (p) between the centers of the plurality of individual electronic components (P) are different, the distances (p, 2p) between the centers in the plurality of suction mechanisms (H1 to H5) are changed. Thus, the plurality of electronic components (P) can be transported.

  A first accommodating portion (S1) that accommodates an electronic component (P) in a position corresponding to one color of a checkered pattern among the plurality of electronic components (P) in the separated electronic component conveying device; A second accommodating portion (S2) that accommodates the electronic component (P) at a position corresponding to the other color of the checkered pattern is provided adjacent to the table (TA). In addition, among a plurality of electronic components (P) accommodated in a staggered pattern at equal center-to-center intervals (2p) in the table (TA), one line of electronic components (P) along one direction (X direction) in a checkered pattern ) Are collectively collected and transported (PU). The transport mechanism (PU) is provided with a plurality of suction mechanisms (H1 to H5) that are provided at predetermined center-to-center intervals (2p) and each suck one line of electronic components (P). The electronic components (P) for one line along one direction (X direction) are arranged at equal center-to-center intervals (2p).

  [Embodiment 1] Embodiment 1 of an electronic component transport apparatus according to the present invention will be described with reference to FIGS. FIG. 1 (1) shows an initial state of an electronic component that is a conveyance target of the conveyance device according to the present embodiment from above, and FIG. 1 (2) shows a state in the middle of the conveyance of the electronic component. FIG. 2 (1) to 2 (3) are schematic front views illustrating a process of conveying a plurality of electronic components arranged in a staggered pattern from a table. The present embodiment is intended for the case where there are an odd number of electronic components P corresponding to one row (one line) in the stage ST of FIG.

  As shown in FIG. 1 (1), the electronic component transport apparatus according to the present embodiment collectively sucks the plurality of electronic components placed on the stage ST shown in FIG. 5 (1). And a fixing member HA for fixing. In the stage ST of FIG. 5 (1), a plurality of electronic components cut (divided) by a dicer using a rotary blade is 5 pieces / row, and only 8 rows are arranged, so a total of 40 electronic components are arranged. It will be.

  The fixing member HA is provided so as to be movable in each of the X, Y, and Z directions in the figure. The fixing member HA adsorbs and fixes a plurality of electronic components P (electronic components 11 to 15, 21 to 25,. It has a fixing / unlocking mechanism (not shown) for releasing automatically. This fixing / unlocking mechanism has an adsorption pipe provided corresponding to each electronic component P and a decompression tank connected via a valve connected to each of them.

  Further, as shown in FIG. 1B, the electronic device transport apparatus according to the present embodiment can be positioned below the fixing member HA and receives a plurality of electronic components from the fixing member HA. One table TA is provided. The table TA is provided with two accommodation parts, a first accommodation part S1 and a second accommodation part S2, adjacent to each other without a gap, as indicated by a broken line in FIG. . Each housing part S1, S2 is provided with a recess (not shown) corresponding to a plurality of electronic components to be housed. FIG. 1B shows a state in which the electronic component P is accommodated in all the recesses.

  These recesses have a pitch of 2p in each of the first housing portion S1 and the second housing portion S2, and over the entire first housing portion S1 and the second housing portion S2. It is provided in a zigzag pattern (in a position corresponding to one color of a checkered pattern). Further, since the first storage portion S1 and the second storage portion S2 are provided adjacent to each other without a gap, the first storage portion S1 and the second storage portion S2 are sandwiched in the same row. Thus, the pitch between two adjacent electronic components P is also 2p. By these things, the recessed part in which the some electronic component P is each accommodated in the whole 1st accommodating part S1 and 2nd accommodating part S2 is provided in the zigzag pattern with the pitch of 2p.

  The operation of the electronic component transport device according to the present embodiment will be described below with reference to FIGS. First, the fixing member HA collectively sucks and fixes the plurality of electronic components P placed on the stage ST shown in FIG. 5A to the lower surface of the fixing member HA. At this point, as shown in FIG. 1 (1), electronic components 11-15, 21-25,..., 81-85 are placed on the lower surface of the fixing member HA in the X direction and the Y direction. Adsorbed and fixed at a pitch of p. More specifically, five electronic components 11 to 15 are arranged in one row, and similarly, five electronic components 21 to 25,..., And five electronic components 81 to 85 are each in one row. Lined up, are adsorbed and fixed.

  Next, the fixing member HA moves above the first housing portion S1 in the table TA, and positions each electronic component P and the recess provided corresponding to each electronic component P in the first housing portion S1. Go down after matching. And the adsorption | suction with respect to the one part electronic component P mentioned later is cancelled | released, and those electronic components P are arrange | positioned at 1p pitch at 1st accommodating part S1. The electronic components that are released from the suction and are arranged in the first housing portion S1 are the electronic components 11, 13, 15, 22, 24, ..., 71, 73, 75, 82, and 84.

  Next, the fixing member HA moves above the second housing portion S2 in the table TA, and positions each electronic component P and the recess provided corresponding to each electronic component P in the second housing portion S2. Go down after matching. In this movement, the fixing member HA does not move in the Y direction. And the adsorption | suction with respect to the one part electronic component P mentioned later is cancelled | released, and those electronic components P are arrange | positioned at 2p pitch in 2nd accommodating part S2. The electronic components which are released from the suction and are arranged in the second housing portion S2 are the electronic components 12, 14, 21, 23, 25, ..., 72, 74, 81, 83, 85. Through the steps so far, as shown in FIG. 1B, five electronic components P are arranged in each of the rows R1,..., R8 in the table TA, and 2p in the X direction and the Y direction. It is arranged in a staggered pattern at a pitch of.

  Next, as shown in FIG. 2A, in the transport mechanism PU having the suction heads H1 to H5 having a pitch of p, the pitch is changed to 2p. Here, it is possible to change the pitch of the suction heads H <b> 1 to H <b> 5 by adopting a known technique for changing the pitch of the pickup unit in the transport device (for example, Japanese Patent Application Laid-Open No. 2004-039706). reference).

  Next, the transport mechanism PU is lowered as shown in FIG. Then, as shown in FIG. 2 (3), the electronic parts P for one row (one line of the row R1) arranged along the X direction, that is, the electronic parts 11, 13, 15, 12, 14 After the suction heads H1 to H5 suck each other, the transport mechanism PU rises.

  Next, the transport mechanism PU transports five electronic components P to a tray or a table used in the next process. The transport mechanism PU repeats this operation a total of eight times, thereby transporting all 40 electronic components P (see FIG. 1B) arranged on the table TA.

  As described so far, according to the present embodiment, first, a plurality of separated electronic parts P are collectively sucked and conveyed by the fixing member HA, and accommodated in a staggered manner on the table TA. Arrange as described. Secondly, when there are an odd number of electronic components P corresponding to one row (one line), the electronic components P arranged in a staggered manner are operated by half the number of operations compared to the number of operations of the prior art. Transport. By these, the efficiency which conveys the separated electronic component P can be improved significantly.

  A second embodiment of the electronic component conveying apparatus according to the present invention will be described with reference to FIGS. FIG. 3A shows the initial state of the electronic component that is the conveyance target of the conveyance device according to the present embodiment as seen through from above, and FIGS. 3B and 3C show the electronic component in the middle of conveyance. It is each a top view which shows the malfunction which generate | occur | produces. FIG. 4 (1) shows the initial state of the electronic component that is the conveyance target of the conveyance device according to the present embodiment from above, and FIGS. 4 (2) and 4 (3) are in the middle of the conveyance of the electronic component. It is a top view which shows a state, respectively. The present embodiment is intended for the case where there are an even number of electronic components P corresponding to one row (one line) in the stage ST of FIG. 5A.

  As shown in FIG. 3 (1), the fixing member HA adsorbs and fixes 32 electronic components P, which are 4 / row and arranged in only 8 rows, in a lump. Here, when the electronic parts P are arranged in a staggered pattern at a pitch of 2p on one table TA and the same operation as that described with reference to FIG. 1 is performed, the following two problems occur. .

  The first problem is that the electronic components 11, 13, 12, 14, 31, 33, 32, 34,... Are arranged at a pitch of 2p in the rows R1, R3,. In this case, the two electronic components P are arranged to overlap each other at the position indicated by “X” in the rows R2, R4,. For example, the electronic component 24 and the electronic component 21 overlap each other at the position described as “X” in the row R2. The second problem is that when the electronic components 22, 24, 21, 23,... Are arranged at a pitch of 2p in the row R2,... To avoid the first problem, the rows R1, R3. The electronic component P is not arranged at a position where a broken-line square in FIG.

  The operation of the transport apparatus for solving these problems will be described with reference to FIG. First, the fixing member HA collectively sucks and fixes the plurality of electronic components P placed on the stage (see the stage ST shown in FIG. 5A) to the lower surface of the fixing member HA. At this time, as shown in FIG. 4 (1), electronic components 11-14, 21-24,..., 81-84 are placed on the lower surface of the fixing member HA in the X direction and the Y direction. Adsorbed and fixed at a pitch of p.

  Next, the fixing member HA moves above the first accommodating portion S1 in the table TA, and moves down after aligning each electronic component P and the recess provided corresponding to each electronic component P in the table TA. To do. And the adsorption | suction with respect to the one part electronic component P mentioned later is cancelled | released, and those electronic components P are arrange | positioned at 1p pitch at 1st accommodating part S1. As shown in FIG. 4 (2), the electronic components that are released from the suction and are disposed in the first accommodating portion S1 are the electronic components 11, 13, 22, 24, 71, 73, 82, 84. At this time, the electronic components 12, 14, 21, 23,..., 72, 74, 81, and 83 are continuously fixed to the fixing member HA (see FIG. 4A). These electronic components are conveniently indicated by reference numerals not surrounded by squares in FIG.

  Next, from the state shown in FIG. 4 (2), the fixing member HA (see FIG. 4 (1)) and the table TA move relatively in the Y direction by a distance equal to the pitch p in the Y direction. To do. Specifically, the electronic components 12, 14,... That are subsequently fixed to the fixing member move so as to be positioned lower (or upper) by one row in the drawing than the original corresponding row. In FIG. 4B, the electronic components 12 and 14 are moved to a position corresponding to the row R2. This movement is performed by a moving mechanism such as a motor. Further, either one of the fixing member HA and the table TA may move in the Y direction, or both may move in the Y direction.

  Next, the fixing member HA moves above the second housing portion S2 in the table TA, and moves down after aligning each electronic component P and the recess provided corresponding to each electronic component P in the table TA. To do. And the adsorption | suction with respect to the one part electronic component P mentioned later is cancelled | released, and those electronic components P are arrange | positioned at 2p pitch in 2nd accommodating part S2. The electronic components that are released from the suction and are disposed in the second housing portion S2 are the electronic components 12, 14, 21, 23, ..., 72, 74, 81, and 83. Thereby, for example, the electronic components 12 and 14 are moved and arranged in the second housing portion S2 as indicated by the broken arrows in FIG. By these operations, the electronic component P is finally arranged as shown in FIG. Accordingly, two electronic components P are arranged in each of the upper row R1 and the lower row (not shown), and four in the remaining rows R2, R3,. The entire table TA is arranged in a staggered manner at a pitch of 2p over 9 rows.

  Next, as in the case described with reference to FIG. 2, the electronic components P arranged in a staggered pattern on the table TA are conveyed. Specifically, one line (one line) of electronic components P (two or four) is transported per operation by the transport mechanism PU (see FIG. 2B). Then, by repeating this operation a total of 9 times, all 32 electronic components P arranged on the table TA are transported.

  As described so far, according to the present embodiment, first, similarly to the first embodiment, a plurality of individual electronic components P are collectively sucked and conveyed by the fixing member HA, and the table is set. Arranged so as to be staggered in TA. Second, in the case where there are an even number of electronic components P corresponding to one row (one line), the electronic components P arranged in a staggered manner can be operated approximately half as many times as the number of operations in the prior art. Transport. By these, the efficiency which conveys the separated electronic component P can be improved significantly.

  In the description of each embodiment, the fixing member HA picks up and conveys a plurality of electronic components from the stage ST shown in FIG. Not limited to this, the stage ST itself may be reversed, and the stage ST may be moved above the first storage unit S1 and the second storage unit S2.

  Moreover, in order to be able to change the pitch of the suction heads H1 to H5, a plurality of types of transport mechanisms PU each having a plurality of suction heads having different pitches are prepared, and according to the pitch of the electronic component The transport mechanism PU may be selected and used. As a result, the pitch of the plurality of suction heads can be changed.

  In addition, the pitch of the plurality of regions provided on the substrate, that is, the pitch of the plurality of separated electronic components is p in both the X direction and the Y direction. The present invention is not limited to this, and the present invention can also be applied when the pitch of the plurality of electronic components is different in the X direction and the Y direction.

  In the process of cutting (separating) the sealed substrate M, a cutting device (a dicer) that uses a rotary blade is used. However, the present invention is not limited to this, and a cutting device using a laser beam, a water jet, a wire saw, a band saw or the like may be used. In addition, the encapsulated substrate M can be cut along the virtual line L to form a groove (half cut), and then an external force can be applied to the encapsulated substrate M to separate the electronic components.

  Further, the virtual line L corresponding to the cutting line is a straight line, and the planar shape of the separated electronic component P is a square. Not only this but the planar shape of the separated electronic component P may be a rectangle. Furthermore, the virtual line L corresponding to the cutting line may include a curve or a broken line. For example, the present invention can be applied to the case of manufacturing an electronic component (for example, a certain type of memory card) in which a curved or broken line is included in the outer edge of the planar shape.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

FIG. 1 (1) shows the initial state of an electronic component that is a transfer target of the transfer apparatus according to the first embodiment from above, and FIG. 1 (2) shows a state in which the electronic component is being transferred. FIG. 2 (1) to 2 (3) are schematic front views illustrating a process of conveying a plurality of electronic components arranged in a staggered pattern from a table. FIG. 3A shows the initial state of the electronic component that is the conveyance target of the conveyance apparatus according to the second embodiment as seen through from above, and FIGS. 3B and 3C show the electronic component in the middle of conveyance. It is each a top view which shows the malfunction which generate | occur | produces. FIG. 4A shows an initial state of an electronic component that is a conveyance target of the conveyance apparatus according to the second embodiment from above, and FIGS. 4B and 4C show a state in which the electronic component is being conveyed. It is a top view which shows a state, respectively. FIG. 5 (1) shows a state in which the sealed substrate is fixed to the stage in the prior art, and FIG. 5 (2) shows a state in which the separated electronic components are transported to two tables. FIG. 6 (1) to 6 (3) are schematic front views for explaining the process of conveying the separated electronic components from the stage and arranging them in a staggered manner on two tables in the prior art. .

11-15, 21-25, ..., 81-85 Electronic parts H1-H5 Suction head (Suction mechanism)
HA fixing member L virtual line M sealed substrate P electronic component PU transport mechanism R1 to R8 rows S1 first accommodating portion S2 second accommodating portion ST stage TA table V1 to V5 fixing / fixing releasing mechanism (fixing releasing mechanism)

Claims (6)

It is manufactured by forming a sealed substrate by resin-sealing chips mounted in a plurality of regions provided in a grid pattern on the substrate, and dividing the sealed substrate into individual regions. A device for transporting individual electronic components that transports a plurality of electronic components,
After the sealed substrate is singulated, a fixing member that collectively sucks the plurality of electronic components arranged like checkerboard squares on the lower surface,
A fixing release mechanism that selectively releases adsorption of a plurality of electronic components fixed to the fixing member, and puts the plurality of electronic components in an unfixed state;
A table that can be positioned below the fixing member and can accommodate the plurality of electronic components;
A first accommodating portion that accommodates a plurality of electronic components provided at the table and located at a position corresponding to one color of the checkered pattern among the plurality of electronic components;
A second housing portion that is provided adjacent to the first housing portion in the table and houses a plurality of electronic components at positions corresponding to other colors of the checkered pattern among the plurality of electronic components;
A transport mechanism for collectively sucking and transporting electronic components for one line along one direction in the checkered pattern among the plurality of electronic components housed in a staggered pattern in the table;
A plurality of suction mechanisms that are provided at predetermined center-to-center intervals in the transport mechanism and suck each of the electronic components for one line;
The electronic component conveying apparatus according to claim 1, wherein the electronic components for one line along the one direction are arranged at equal center intervals. In the conveying device of the separated electronic component according to claim 1,
While having a moving mechanism for relatively moving the fixing member and the table,
When the number of electronic components for one line is an odd number, the moving mechanism is stopped during a period in which the electronic components are accommodated in the first accommodating portion and the second accommodating portion. When the number of electronic components for a line is an even number, the one direction in the checkerboard pattern after the electronic components are first accommodated in one of the first accommodating portion and the second accommodating portion. A device for transporting individualized electronic components, which moves by an interval between centers of one line along another direction orthogonal to . In the conveying apparatus of the separated electronic component according to claim 1 or 2,
The apparatus for transporting separated electronic components, wherein the predetermined center-to-center distance in the transport mechanism is changeable. It is manufactured by forming a sealed substrate by resin-sealing chips mounted in a plurality of regions provided in a grid pattern on the substrate, and dividing the sealed substrate into individual regions. A method of transporting individual electronic parts that transports a plurality of electronic parts,
After the sealed substrate is singulated, a step of collectively adsorbing the plurality of electronic components arranged like checkered squares on the lower surface of the fixing member;
Aligning the fixing member and a first accommodating portion provided in a table capable of accommodating the plurality of electronic components;
The first accommodation of a plurality of electronic components at a position corresponding to one color of the checkered pattern among the plurality of electronic components by selectively releasing adsorption of the plurality of electronic components fixed to the fixing member A process of housing in a section;
Aligning the fixing member and a second accommodating portion provided on the table;
The second accommodation of a plurality of electronic components at positions corresponding to other colors of the checkered pattern among the plurality of electronic components by selectively releasing the adsorption of the plurality of electronic components fixed to the fixing member A process of housing in a section;
And using a transport mechanism to collectively suck and transport one line of electronic components along one direction in the checkered pattern among the plurality of electronic components housed in a staggered pattern in the table. ,
The first accommodating portion and the second accommodating portion are provided adjacent to each other,
A method of transporting individualized electronic components, wherein the electronic components for one line along the one direction are arranged at equal center intervals. In the conveying method of the separated electronic component according to claim 4,
While comprising a step of relatively moving the fixing member and the table according to circumstances,
In the step of moving, when the number of electronic components for one line is an even number, the electronic component has already been accommodated in one of the first accommodating portion and the second accommodating portion. A method of transporting individualized electronic components, characterized in that it is moved by an interval between the centers of one line along another direction orthogonal to the one direction in the checkered pattern later. In the conveying method of the separated electronic component according to claim 4 or 5,
Singulation characterized by comprising the step of changing the predetermined center-to-center spacing in a plurality of suction mechanisms that are provided at predetermined center-to-center intervals in the transport mechanism and collectively suck the electronic components for one line. Method for transporting electronic components.

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