KR101511402B1 - Apparatus and method for transferring separated electronic component - Google Patents

Abstract

The first accommodating section S1 and the second accommodating section S2 are provided adjacent to each other on the table TA of the conveying device of the disengaged electronic part P, And a plurality of electronic components P fixed to the fixing member HA are selectively released to selectively hold the plurality of electronic components P in a fixed state, When the fixing member HA is positioned on the first accommodating section S1, the fixing device HA fixes one color of the checkered pattern among the plurality of electronic parts P sucked by the fixing member HA When the suction of the corresponding position is released and the fixing member HA moves onto the second accommodating portion S2, the suction of the plurality of other electronic components P attracted to the fixing member HA is released, All of the electronic parts P are arranged at a predetermined pitch in the first receiving part S1 and the second receiving part S2 in a gauze shape. There is also provided a transport mechanism for collectively picking up and transporting one line of electronic parts P along the X direction among the plurality of electronic parts P housed in the form of a pawl on the table TA.

Description

Technical Field [0001] The present invention relates to an apparatus and a method for transferring separated electronic components,

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a conveying device and a conveying method of a discrete electronic component. Particularly, in a case where a sealed substrate is formed by resin-sealing semiconductor chips or the like respectively mounted on a plurality of regions provided in a lattice pattern on a substrate, and the sealed substrate is divided into individual regions to manufacture a plurality of electronic components Lt; / RTI >

A method of separating a sealed substrate, which is one of the methods conventionally practiced for the purpose of efficiently manufacturing a plurality of electronic parts, will be described with reference to Fig. 5 (1) shows a state in which the sealed substrate is fixed on the stage ST, and Fig. 5 (2) shows a state in which the separated electronic components are placed on the two tables T1 and T2 Fig. Here, all of the drawings included in the present application document are drawn schematically by omitting or exaggerating them appropriately for easy understanding.

The sealed substrate M has a substrate made of a printed substrate, a lead frame or the like and a sealing resin formed on one side of the substrate (not shown). 5 (1), the sealed substrate M has a plurality of regions provided on the substrate, and these regions are divided into a plurality of electronic parts P (electronic parts shown in Fig. 5 (2) (P)), respectively. In Fig. 5 (1), in each area corresponding to a plurality of electronic parts, 11 to 15, 21 to 25, , And numerals 81 to 85 are attached. In Fig. 5 (2), numerals 11 to 15, 21 to 25, , And 81 to 85, respectively. Chip-like components (not shown) such as semiconductor chips are mounted on the respective regions of the sealed substrate M, respectively. Each region is partitioned by imaginary lines L and provided in a lattice pattern along a constant pitch (center-to-center spacing) in the X and Y directions. 5, the planar shape of each region is a square, and a constant pitch in the X direction and the Y direction is denoted by p.

In the manufacturing process of the electronic component, the sealed substrate M is fixed to the stage ST by means of suction, adhesion, or the like, and is cut along the imaginary line L )do. As a result, a plurality of discrete electronic components (refer to the electronic components P in Fig. 5 (2)) are manufactured. The fragmented electronic component is placed in a lattice on the stage ST shown in Fig. 5 (1). These electronic components are fixed by an adsorption jig and conveyed from the stage ST to a storage tray or a table (not shown) used in the next process (see, for example, Patent Document 1).

However, in recent years, there has been a tendency that electronic parts are downsized at the request of reduction in cost and size of electronic equipment. With this tendency, the following problems arise. Firstly, the interval between the suction heads provided at the tip of the suction jig is reduced, making it difficult to manufacture the suction jig. Secondly, it is difficult to manufacture the inclined surface portion provided on the inner bottom portion of the concave portion in which the electronic component is housed in the tray for storing the electronic component or the table used in the next process. The inclined surface portion is provided for guiding the electronic component around the inner bottom portion of the concave portion. Here, these problems are remarkable when the plane dimension of the electronic component is 3 mm or less on one side.

5 and 6, a conventional method for arranging a plurality of electronic components carried in order to cope with these problems is described. Figs. 6 (1) to (3) are schematic front views for explaining a process of transporting a plurality of fragmented electronic components from a stage ST and arranging them in a tabular shape on two tables T1 and T2 .

By the way, "arranging a plurality of electronic parts in a puzzle shape" means that a plurality of electronic parts are arranged in such a manner that other electronic parts exist on the inclined upper and lower sides of certain electronic parts, Placement of parts. In other words, "disposing a plurality of electronic components" in the form of a string is to arrange a plurality of electronic components at positions corresponding to one color of a checkered pattern. The " plaid pattern " means a pattern in which a cross pattern is arranged in an alternating pattern of navy blue and white. In the drawings included in the present application, an arrangement along the horizontal direction (X direction) is referred to as a "row", and an arrangement along the vertical direction (Y direction) is referred to as "column". In the stage ST in Fig. 5 (1), 40 electronic components in total of 8 rows x 5 columns are arranged.

In Fig. 6, the transport mechanism PU is provided with five adsorption heads H1 to H5. The adsorption heads H1 to H5 are provided with adsorption tubes V1 to V5, respectively. Further, the adsorption tubes (V1 to V5) are respectively connected to a decompression tank (not shown) via a valve. The decompression tank, the valve, and the adsorption tubes (V1 to V5) are included in the fixing and releasing mechanism for fixing and releasing the electronic component.

First, in the state shown in Fig. 6 (1), the transport mechanism PU is lowered, and each of the five adsorption heads H1 to H5 moves the separated electronic components 11 to 12 on the stage ST, 15) are collectively adsorbed. Then, the transport mechanism PU rises to move on the table T1 among the two tables used in the next step, and descends to release the adsorption on the adsorption tubes V1, V3 and V5. Thus, as shown in Fig. 6 (2), the electronic components 11, 13, and 15 are arranged on the table T1 so as to have a pitch of 2p.

Next, as shown in Fig. 6 (2), the transport mechanism PU rises and moves to the right in the drawing, and moves to the table T2 among the two tables used in the next step. Then, the transport mechanism PU is lowered to release the adsorption on the adsorption tubes V2 and V4. Thus, the electronic components 12 and 14 are arranged on the table T2 so as to have a pitch of 2p. By the steps up to this point, the electronic components 11 to 15 are arranged in the row on the most positive Y side (upper side in the figure) of each of the tables T1 and T2 in Fig. 5 (2). Specifically, the electronic components 11, 13 and 15 are arranged on the table T1 and the electronic components 12 and 14 are arranged on the table T2 so that the electronic components 12 and 14 have pitches of 2p on the tables T1 and T2, .

Thereafter, another adsorption jig (not shown) having an adsorption head having a pitch of 2p adsorbs the electronic components 11, 13, and 15 and the electronic components 12, 14 in a batch, And returned to the table used in the process. That is, first, the electronic components 11, 13, and 15 are collectively picked up and transported, and then the electronic components 12 and 14 are collectively picked up and transported. According to this conventional technique, a total of five electronic components (11, 13, 15) and three electronic components (12, 14), which are arranged in one row of each of the tables (T1, T2) (P) are divided and transported two times. In the case shown in Fig. 5 (2), a total of 40 electronic components are divided and transported 16 times. Therefore, it is difficult to increase the efficiency of transporting the electronic components arranged in a piece-like configuration.

Japanese Patent Application Laid-Open No. 2000-100757 (page 6)

A problem to be solved by the present invention is that the efficiency when the discrete electronic components placed in a lattice form on the stage are transported on a table and arranged in a grating form and transported from a table is low.

Hereinafter, the reference numerals and the like in parentheses in the description of "means for solving the problem", "effect of the invention" and "specific contents for carrying out the invention" . Note that the signs and the like of these are not limited to "the constituent elements shown in the drawings and interpret the meaning of the terms in the description".

In order to solve the above-mentioned problems, the transporting device of the fragmented electronic parts according to the present invention,

A plurality of electronic parts P manufactured by resin-sealing a chip mounted on each of a plurality of regions provided in a lattice pattern on a substrate to form a sealed substrate M to separate the sealed substrate M per region, A conveying device for an individualized electronic component to be conveyed,

A fixing member HA for collecting a plurality of electronic components P arranged at positions of all the cells of a checkered pattern collectively on the lower surface after the sealing completed substrate M is separated,

(V1 to V5) for selectively releasing the suction of a plurality of electronic parts (P) fixed to the fixing member (HA) to make the plurality of electronic parts (P)

A table TA which can be positioned below the fixing member HA,

A first accommodating portion S1 provided on the table TA,

A second accommodating portion S2 provided adjacent to the first accommodating portion S1 in the table TA,

And,

When the fixing member HA is positioned on the first accommodating section S1, the fixing release mechanisms V1 to V5 are arranged in the order of one color of the checkered pattern among the plurality of electronic parts P picked up by the fixing member HA And when the fixing member HA moves from the upper side of the first accommodating portion S1 to the upper side of the second accommodating portion S2, the other plurality of electrons All of the electronic parts P are arranged at a constant pitch in a gauze shape in the first housing portion S1 and the second housing portion S2 by releasing the attraction of the component P. [

Further, in the above-described carrying apparatus of the present invention,

And a moving mechanism for relatively moving the fixing member HA and / or the table TA,

When the electronic component P in the direction (X direction) orthogonal to the boundary line between the first accommodating portion S1 and the second accommodating portion S2 is an odd number, The fixing member HA and / or the table TA are moved in the direction (X direction) orthogonal to the boundary line after the component P is accommodated and the electronic component P in the direction (X direction) The fixing member HA and / or the table TA are moved in the direction (X direction) orthogonal to the boundary line after the electronic component P is received in the first accommodating portion S1 (Y) direction of the electronic component (P) when the electronic component (P) is arranged at the position of all the cells along a direction parallel to the boundary line (Y direction).

Further, in the above-described carrying apparatus of the present invention,

A conveying mechanism (not shown) for collectively picking up and conveying one line of electronic components P along one direction (X direction) of a checkered pattern among a plurality of electronic components P housed in a peg shape in the table TA PU)

A plurality of suction mechanisms H1 to H5 for picking up the electronic parts P respectively provided at predetermined center-to-center intervals 2p in the transport mechanism PU,

(P, 2p) of the adsorption mechanisms (H1 to H5) can be changed.

Further, according to the present invention,

A plurality of electronic parts P manufactured by resin-sealing a chip mounted on each of a plurality of regions provided in a lattice pattern on a substrate to form a sealed substrate M and separating the sealed substrate M per region, A method of conveying a fragmented electronic component to be conveyed,

A step of collectively collecting a plurality of electronic parts P arranged at positions of all the cells of the checkered pattern on the lower surface of the fixing member HA after the sealing completed substrate M is separated,

A step of aligning the fixing member HA and the first accommodating portion S1 provided on the table TA capable of accommodating a plurality of electronic components P,

The suction of the plurality of electronic parts P fixed to the fixing member HA is selectively released so that the electronic parts P located at positions corresponding to one color of the checkered pattern among the plurality of electronic parts P Accommodating portion S1,

A step of aligning the fixing member HA and the second accommodating portion S2 provided adjacent to the first accommodating portion S1 on the table TA,

The suction of the plurality of electronic parts P fixed to the fixing member HA can be selectively released so that the electronic parts P located at positions corresponding to different colors of the checkered pattern among the plurality of electronic parts P The step of arranging all of the electronic parts P in the first accommodating part S2 and the second accommodating part S2 in a pitched configuration at a constant pitch

And a control unit.

In addition, the method of conveying the individualized electronic parts according to the present invention is characterized in that, in the above-mentioned conveying method,

A step of relatively moving the fixing member HA and / or the table TA as occasion demands,

The number of the electronic parts P in the direction (X direction) perpendicular to the boundary line between the first accommodating section S1 and the second accommodating section S2 is an even number, After the electronic component P is accommodated, the fixing member HA and / or the table TA are moved in the direction (X direction) orthogonal to the boundary line, and all the above-mentioned all along the direction (Y direction) (P) of the electronic component (P) in the direction (Y direction) when the electronic component (P) is disposed at the position of the cell.

In addition, the method of conveying the individualized electronic parts according to the present invention is characterized in that, in the above-mentioned conveying method,

An electronic component P of one line along one direction (X direction) of the checkered pattern among the plurality of electronic components P housed in the form of a pawl in the table TA is transferred to the table TA using the transfer mechanism PU A step of collectively adsorbing and conveying,

The predetermined center-to-center spacing (p, 2p) in the plurality of adsorption mechanisms (H1 to H5) for adsorbing the electronic parts (P) 2p) of the first and second electrodes.

According to the present invention, a plurality of individual electronic components (P) are collectively picked up and conveyed by the fixing member (HA), and arranged so as to be housed in the form of a pawl in the table (TA). As a result, the efficiency of transporting the individualized electronic parts P is greatly improved.

According to the present invention, the number of electronic components (P) for one line along the direction (X direction) orthogonal to the boundary line between the first accommodating section (S1) and the second accommodating section (S2) , It is possible to efficiently arrange them in the form of a pawl.

Further, according to the present invention, the center-to-center spacing p, 2p of the plurality of adsorption mechanisms H1 to H5 of the transport mechanism PU can be changed. Therefore, even when the center-to-center spacing p of the plurality of separated electronic components P are variously different, by changing the center-to-center spacing p, 2p of the plurality of adsorption mechanisms H1 to H5, A plurality of electronic parts P can be transported.

Fig. 1 is a plan view showing an initial state of an electronic component to be transported by the transport apparatus according to the first embodiment from the upper side, and Fig. 1 (2) is a plan view showing a state in which the electronic component is being transported.
Figs. 2 (1) to (3) are schematic front views for explaining a process of transporting a plurality of electronic components arranged in a peg shape from a table.
Fig. 3 (1) shows the original state of the electronic component to be transported by the transport apparatus according to the second embodiment from the upper side, and Figs. 3 (2) and (3) Respectively.
Fig. 4 (1) shows the original state of the electronic component to be transported by the transport apparatus according to the second embodiment from the upper side, and Figs. 4 (2) and (3) Respectively.
Fig. 5 (1) shows a state in which the sealed substrate is fixed on the stage, Fig. 5 (2) shows a state in which the separated electronic components are transported on two tables, to be.
Figs. 6 (1) to (3) are schematic front views explaining a process of transporting discrete electronic components from a stage and arranging them on two tables, respectively, in the form of a string in the prior art.

A first accommodating portion S1 for accommodating the electronic component P at a position corresponding to one color of the checkered pattern among the plurality of electronic components P, A second accommodating portion S2 for accommodating electronic components P at positions corresponding to different colors is provided adjacently in the table TA. Among the plurality of electronic parts P housed in the shape of a peg at the same center-to-center spacing 2p in the table TA, one line of electronic parts P Are collectively adsorbed and transported by the transport mechanism PU. The transport mechanism PU is provided with a plurality of suction mechanisms H1 to H5 which are provided at predetermined center-to-center spacing 2p to pick up the electronic components P of one line, respectively. The electronic components P for one line along one direction (X direction) are arranged at the same center-to-center spacing 2p.

[Example 1]

A first embodiment of a transport apparatus for an electronic part according to the present invention will be described with reference to Figs. 1 and 2. Fig. Fig. 1 (1) is a perspective view showing an original state of an electronic component to be transported by a transport apparatus according to the present embodiment from above, and Fig. 1 (2) is a plan view showing a state in which an electronic component is transported. Figs. 2 (1) to (3) are schematic front views for explaining a process of transporting a plurality of electronic components arranged in a peg shape from a table. The present embodiment is directed to a case where the number of electronic parts P corresponding to one row (one line) in the stage ST in Fig. 5 (1) is an odd number.

As shown in Fig. 1 (1), the carrying device of the electronic component according to the present embodiment includes a holding member (hereinafter, referred to as " holding device ") for holding and fixing a plurality of electronic components collectively placed on the stage ST shown in Fig. HA). In the stage ST in Fig. 5 (1), a plurality of electronic parts cut (individualized) by a dicer using a rotary blade are arranged in eight lines in five lines / row, so that a total of forty lines are arranged.

The fixing member HA is provided movably in X, Y and Z directions in the figure. The fixing member HA has a structure in which a plurality of electronic parts P (electronic parts 11 to 15, 21 to 25, ..., 81 to 85) are collectively attracted and fixed to the lower surface thereof, (Not shown) for selectively releasing the electronic component P. The fixing and releasing mechanism includes a suction pipe provided corresponding to each electronic component P, and a pressure- Have a tank.

1 (2), the carrying device of the electronic component according to the present embodiment may be located below the stationary member HA, and may be provided with a plurality of electronic components 1 (TA) are provided. In the table TA, the first accommodating portion S1 and the second accommodating portion S2, which are two accommodating portions, are provided adjacent to each other without gaps as shown by a broken line in Fig. 1 (2). The receiving portions S1 and S2 are provided with recesses (not shown) corresponding to a plurality of electronic components to be accommodated, respectively. Fig. 1 (2) shows a state in which the electronic parts P are accommodated in all recesses.

These concave portions are formed so as to have a constant pitch of 2p in each of the first accommodating portion S1 and the second accommodating portion S2, (A position corresponding to one color of the checkered pattern) over the whole area. Since the first accommodating portion S1 and the second accommodating portion S2 are provided adjacent to each other without a gap therebetween, the boundary between the first accommodating portion S1 and the second accommodating portion S2 is interposed between the first accommodating portion S1 and the second accommodating portion S2 The pitch between two adjacent electronic components P is also 2p. Thus, the concave portions accommodating the plurality of electronic parts P are provided in the entirety of the first accommodating portion S1 and the second accommodating portion S2 in the shape of a pawl at a pitch of 2p.

Hereinafter, the operation of the transporting apparatus for the electronic component according to the present embodiment will be described with reference to Figs. 1 and 2. Fig. First, the fixing member HA collectively collects a plurality of electronic parts P placed on the stage ST shown in Fig. 5 (1) and fixes them on the lower surface of the fixing member HA. At this point, as shown in Fig. 1 (1), the electronic components 11 to 15, 21 to 25, ..., and 81 to 85 are arranged on the lower surface of the fixing member HA in the X- Pitch is fixed by suction. More specifically, five electronic components 11 to 15 are arranged in one row, and five electronic components 21 to 25, , And five electronic components 81 to 85 are arranged in one row and adsorbed and fixed.

Next, the fixing member HA moves to the upper side of the first accommodating portion S1 of the table TA to move the electronic components P (P) in the respective electronic components P and the first accommodating portion S1 ), And then descends. Then, the adsorption to a part of the electronic parts P to be described later is released, and these electronic parts P are arranged in the first housing part S1 at a pitch of 2p. The electronic parts 11, 13, 15, 22, 24, ..., 71, 73, 75, 82, 84 are disposed in the first accommodating portion S1 with the attraction being released.

Next, the fixing member HA moves to the upper side of the second accommodating portion S2 of the table TA, and the electronic components P (P ), And then descends. In this movement, the fixing member HA does not move in the Y direction. Then, the suction of the electronic parts P to be described later is released, and these electronic parts P are arranged in the second accommodating part S2 at a pitch of 2p. The electronic parts 12, 14, 21, 23, 25, ..., 72, 74, 81, 83, 85 are disposed in the second accommodating portion S2 with the attraction being released. As shown in Fig. 1 (2), the electronic components P in the table TA are arranged in five rows in each of the rows R1 to R8, And are arranged in the shape of a pawl with a pitch of 2p in the Y direction.

Next, as shown in Fig. 2 (1), in the transport mechanism PU having the adsorption heads H1 to H5 having the pitch of p, the pitch is changed to 2p. Here, it is possible to change the pitch of the adsorption heads H1 to H5 by employing a known technique of making the pitch of the pick-up unit variable in the transport apparatus (for example, Japanese Patent Application Laid-Open No. 2004-039706 Reference).

Next, as shown in Fig. 2 (2), the transport mechanism PU is lowered. As shown in Fig. 2 (3), the electronic parts P in one row (one line of the row R1) arranged along the X direction, that is, the electronic parts 11, 13, 15, 12, 14 are adsorbed by the adsorption heads H1 to H5, respectively, the transport mechanism PU rises.

Next, the transport mechanism PU transports the five electronic components P to the tray or the table used in the next process. The transport mechanism PU carries out all the 40 electronic components P (see FIG. 1 (2)) arranged on the table TA by repeating this operation for a total of 8 times.

As described above, according to the present embodiment, first, a plurality of individual electronic components P that have been separated are collectively picked up and conveyed by the fixing member HA, and in the table TA, As shown in Fig. Secondly, when the number of electronic parts P corresponding to one line (one line) is an odd number, the number of times of operation compared with the number of operations of the related art is equal to the number of times of operation, . Thus, the efficiency of transporting the individualized electronic parts P can be greatly improved.

[Example 2]

A second embodiment of a transport apparatus for an electronic component according to the present invention will be described with reference to Figs. 3 and 4. Fig. Fig. 3 (1) shows the initial state of the electronic component to be transported by the transport apparatus according to the present embodiment from the upper side, and Figs. 3 (2) and (3) show the defect occurring during the transportation of the electronic component Respectively. Fig. 4 (1) shows the original state of the electronic component to be transported by the transport apparatus according to the present embodiment from the upper side, and Figs. 4 (2) and (3) Respectively. The present embodiment is directed to a case where the number of electronic parts P corresponding to one row (one line) in the stage ST in Fig. 5 (1) is an even number.

As shown in Fig. 3 (1), the fixing member HA adsorbs and fixes 32 electronic components P arrayed in 4 rows / 8 rows. Here, when an operation similar to the operation described with reference to Fig. 1 is performed in order to arrange the electronic parts P in a pitched shape with a pitch of 2p in one table TA, the following two defects occur.

The first defect refers to a state in which the row (R1), the row (R3), ... In the case where the electronic components 11, 13, 12, 14, 31, 33, 32, 34 ... are arranged at a pitch of 2p, , And two electronic parts (P) are laid over each other. For example, the electronic component 24 and the electronic component 21 are overlapped at a position described as "X" in the row R2. The second failure is to avoid the first failure, so that the row (R2), ... In the case where the electronic components 22, 24, 21, 23, ... are arranged at a pitch of 2p in the row (R1), (R3), ... The electronic component P is not disposed at the position where the broken line square is described.

The operation of the transfer device for solving these defects will be described with reference to Fig. First, the fixing member HA collectively attracts a plurality of electronic parts P placed on the stage (see the stage ST shown in Fig. 5 (1)) and fixes them on the lower surface of the fixing member HA do. At this point, as shown in Fig. 4 (1), the electronic components 11 to 14, 21 to 24, ..., and 81 to 84 are arranged on the lower surface of the fixing member HA in the X- Pitch is fixed by suction.

Next, the fixing member HA is moved to the upper side of the first accommodating portion S1 of the table TA, and the electronic components P and the table TA are pressed against the respective electronic components P The concave portion provided corresponding thereto is aligned and then lowered. Then, the suction of the electronic parts P to be described later is released to arrange the electronic parts P in the first accommodating part S1 at a pitch of 2p. The electronic parts 11, 13, 22, 24, ..., 71, 73, 82, 84 are the electronic parts which are disengaged and arranged in the first accommodating portion S1 as shown in Fig. . At this point, the electronic components 12, 14, 21, 23, ..., 72, 74, 81, 83 are continuously fixed to the fixing member HA (see Fig. These electronic components are conveniently represented by reference numerals which are not enclosed in a square in Fig. 4 (2).

4 (1)) and the table TA are moved relative to each other in the Y direction by a distance equal to the pitch p in the Y direction from the state shown in Fig. 4 (2) . Specifically, the electronic components 12, 14, ... which are continuously fixed to the fixing member HA move so as to be located lower (or above) the original corresponding row by one row. In Fig. 4 (2), the electronic components 12 and 14 move to positions corresponding to the row R2. This movement is performed by a moving mechanism such as a motor. Either the fixing member HA or the table TA may move in the Y direction or both of them may move in the Y direction.

Next, the fixing member HA moves to the upper side of the second accommodating portion S2 of the table TA, and the electronic components P and the table TA are pressed against the respective electronic components P The concave portion provided corresponding thereto is aligned and then lowered. Then, the suction of the electronic parts P to be described later is released to arrange the electronic parts P in the second accommodating part S2 at a pitch of 2p. The electronic parts 12, 14, 21, 23, ..., 72, 74, 81, 83 are disposed in the second accommodating portion S2 after the attraction is released. As a result, for example, the electronic components 12 and 14 are moved in the second accommodating portion S2 as indicated by the broken line arrow in Fig. 4 (2). By these operations, finally, the electronic parts P are arranged as shown in Fig. 4 (3). Therefore, the electronic component P is divided into the upper row R1 and the lower row (not shown), and the remaining rows R2, R3, ... And in the entirety of the table TA, they are arranged in the form of a pawl with a pitch of 2p over nine rows.

Next, similarly to the case described with reference to Fig. 2, the electronic parts P arranged in the shape of a pawl on the table TA are carried. More specifically, the electronic component P (two or four) for one line (one line) is transported per operation by the transport mechanism PU (see Fig. 2 (2)). Then, this operation is repeated 9 times in total to transport all the 32 electronic components P arranged on the table TA.

As described above, according to the present embodiment, first, as in the first embodiment, a plurality of discrete pieces of electronic parts P are collectively picked up and conveyed by the fixing member HA, and the table TA In the form of a pawl. Secondly, when the number of electronic parts P corresponding to one line (one line) is an even number, the number of electronic parts P . As a result, the efficiency of transporting the individualized electronic parts P can be greatly improved.

However, in the description of each embodiment, it is assumed that the fixing member HA collectively picks up and transports a plurality of electronic components from the stage ST shown in Fig. 5 (1). The present invention is not limited thereto and the stage ST itself may be reversed to move the stage ST onto the first accommodating portion S1 and the second accommodating portion S2.

In order to change the pitches of the adsorption heads H1 to H5, a plurality of kinds of transport mechanisms PU each having a plurality of adsorption heads having different pitches are prepared, (PU) may be selected and used. Thereby, the pitches of the plurality of adsorption heads can be changed.

It is also assumed that the pitch of a plurality of regions provided on the substrate, that is, the pitches of the plurality of individual electronic components is p in both the X and Y directions. The present invention is not limited to this, and the present invention can also be applied to a case where pitches of a plurality of electronic components are different in the X direction and the Y direction.

Further, in the step of cutting (fragmenting) the encapsulated substrate M, a cutting apparatus (dicer) using a rotary blade is used. But the present invention is not limited to this, and a laser beam, a water jet, a wire saw, a band saw, and the like may be used. It is also possible to form the grooves (half cut) by cutting the sealed substrate M in the imaginary line L, and then to apply the external force to the sealed substrate M to separate them into the respective electronic components.

It is also assumed that the imaginary line L corresponding to the cutting line is a straight line, and the planar shape of the discrete electronic component P is square. However, the present invention is not limited to this, and the planar shape of the individual electronic component P may be rectangular. In addition, a curved line or a broken line may be included in the imaginary line L corresponding to the cut line. For example, the present invention can be applied to the case of manufacturing an electronic component (for example, any kind of memory card) in which a curved line or a broken line is included in a planar outer edge.

It should be noted that the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, changed, or selected as necessary within the scope of the present invention .

11-15, 21-25, ... , 81 to 85: Electronic parts
H1 to H5: Adsorption head (adsorption mechanism)
HA: Fixing member
L: virtual line
M: Sealed substrate
P: Electronic parts
PU:
R1 to R8:
S1: First accommodating portion
S2:
ST: Stage
TA: Table
V1 to V5: Fixing and releasing mechanism (releasing mechanism)

Claims (6)

A plurality of electronic parts manufactured by separating the encapsulated substrates into individual regions by dividing a chip mounted on each of a plurality of regions provided in a lattice on a substrate by resin sealing to form a sealed substrate, As a conveying device for a fragmented electronic component,
A fixing member for collectively attracting the plurality of electronic components disposed at positions of all the cells of the checkered pattern on the lower surface after the sealed substrate is separated,
A fixing mechanism for selectively releasing the suction of a plurality of electronic components fixed to the fixing member to bring the plurality of electronic components into an unfixed state,
A table which can be positioned below the fixing member,
A first accommodating portion provided on the table,
And a second accommodating portion provided adjacent to the first accommodating portion in the table,
And,
Wherein the fixing release mechanism releases the attraction of a position corresponding to one color of the checkered pattern among the plurality of electronic components attracted to the fixing member when the fixing member is positioned on the first housing portion, When the member moves from the first accommodating portion to the second accommodating portion, the attraction of the other plurality of electronic components adsorbed by the fixing member is released so that all of the electrons The parts are arranged in the shape of a pinch at a constant pitch,
And a moving mechanism for relatively moving the fixing member or the table,
Wherein when the electronic component in the direction orthogonal to the boundary line between the first accommodating portion and the second accommodating portion is an odd number, the moving mechanism moves the fixing member or the table to the boundary line after the electronic component is accommodated in the first accommodating portion, And when the electronic component in the direction orthogonal to the boundary line is an even number, the fixing member or the table is moved in a direction orthogonal to the boundary line after the electronic component is received in the first accommodating portion And is shifted along the direction parallel to the boundary line by an interval between centers of the electronic components in the direction when the electronic components are disposed at the positions of all the cells
And a conveying device for conveying the separated electronic component. delete The method according to claim 1,
A conveying mechanism that collectively picks up and transports one line of electronic components along one direction in the checkered pattern among a plurality of electronic components housed in a peg shape in the table,
And a plurality of adsorption mechanisms provided at predetermined center-to-center intervals in the transport mechanism for adsorbing the electronic components, respectively,
The center-to-center spacing of the adsorption mechanism can be changed
And a conveying device for conveying the separated electronic component. A method of manufacturing a semiconductor device, comprising the steps of: sealing a chip mounted on a plurality of regions provided in a lattice pattern on a substrate by resin sealing to form a sealed substrate; And
A step of collectively collecting the plurality of electronic parts arranged at positions of all the cells of the checkered pattern on the lower surface of the fixing member after the completion of the sealing of the sealing substrate,
A step of aligning the fixing member and a first accommodating portion provided on a table capable of accommodating the plurality of electronic components,
A step of selectively releasing the suction of a plurality of electronic components fixed to the fixing member to accommodate the electronic component in a position corresponding to one color of the checkered pattern in the first accommodation portion of the plurality of electronic components;
A step of aligning the fixing member and a second accommodating portion provided adjacent to the first accommodating portion on the table;
By selectively releasing the suction of a plurality of electronic components fixed to the fixing member to accommodate the electronic component in the second accommodation portion corresponding to a different color of the checkered pattern among the plurality of electronic components, A step of disposing all the electronic parts in the housing portion and the second housing portion in a pitched shape at a constant pitch
/ RTI >
A step of relatively moving the fixing member or the table as the case may be,
In the moving step, when the number of electronic parts in the direction orthogonal to the boundary line between the first accommodating part and the second accommodating part is an even number, after the electronic part is accommodated in the first accommodating part, And moving the electronic component by the distance between the centers of the electronic components when the electronic component is disposed at the position of all of the cells along the direction parallel to the boundary line
And the method further comprises the step of transferring the separated electronic component. delete The method of claim 4,
A step of collectively picking up and transporting one line of electronic components along one direction in the checkered pattern among a plurality of electronic components housed in a form of a pawl on the table using a transport mechanism,
And a step of changing the predetermined center-to-center spacing in the plurality of adsorption mechanisms each of which adsorbs the electronic components, which are provided at predetermined center-to-center intervals in the transport mechanism
And the method further comprises the step of transferring the separated electronic component.

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