JP2006337044A - Ic handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten the takt time of an IC handler used for transferring electronic components between a component inspection apparatus and a plurality of trays. <P>SOLUTION: The tray supporters 12 are installed to which trays T are positioned where the electronic components 5 are stored. The inspection sockets 6 to be loaded with the electronic components 5 are installed. First and second component transfer devices 3 and 4 for transferring the electronic components 5 between the inspection sockets 6 and the tray supporter 12 are provided. The tray supporters 12 are arranged, in a direction perpendicular to the direction (X-direction) leaving from the inspection sockets 6 in a plan view. The 1st and the 2nd component transfer devices 3 and 4 are provided with suction nozzles for moving between the tray T of the tray supporter 12 and the inspection socket 6, while sucking without releasing the electronic components 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC handler that moves an electronic component between a tray and an inspection apparatus.

  Examples of conventional IC handlers include those disclosed in Patent Document 1 and Patent Document 2. In the IC handler shown in Patent Document 1, an inspection area where an electronic component inspection apparatus is located is provided on one side of a base. The inspection area is provided with an inspection socket into which electronic components are loaded from above and the electronic component inspection apparatus connected to the inspection socket.

  The electronic components are supplied onto the base in a state of being accommodated in a tray and loaded into the inspection socket by a plurality of component moving devices. A plurality of trays are used such as a component supply tray, a non-defective product tray, and a defective product tray, and are arranged in two rows from the electronic component inspection device toward the other side of the base. The electronic component is moved between these trays and the component inspection device by a plurality of component moving devices.

  The plurality of component moving devices are a slide type moving device positioned between a component region where a plurality of trays are located and the inspection region, and an electronic component is moved between the slide type moving device and each tray. The first suction-type moving device and the second suction-type moving device that moves the electronic component between the slide-type moving device and the inspection socket.

On the other hand, the IC handler shown in Patent Document 2 is a component movement in which an electronic component adsorbed on the tray is loaded into an inspection socket without releasing it, and the electronic component after inspection is transferred to a non-defective product tray or a defective product tray. Equipment.
The plurality of trays in the IC handler shown in Patent Document 2 are arranged so as to be arranged from the electronic component inspection apparatus toward the other side of the base.

The component moving device includes a rail extending in parallel with these trays, and a head unit configured to be movable in parallel along the rail and in a direction perpendicular to the extending direction of the rail. I have. This head unit is provided with a suction head having a suction nozzle at its lower end so as to be movable in the vertical direction.
Japanese Patent Laid-Open No. 11-333775 (FIG. 3) Japanese Patent Laid-Open No. 2003-262658 (FIG. 1)

  In the conventional IC handler described in Patent Document 1 or Patent Document 2, trays are arranged in a direction away from the component inspection apparatus. For this reason, when an electronic component is taken out from a tray at a position far away from the component inspection apparatus, or when an electronic component after inspection is placed on the tray at such a position, the moving distance of the electronic component is long. As a result, there is a problem that the tact time becomes long.

  The present invention has been made to solve such problems, and it is an object of the present invention to provide an IC handler capable of shortening tact time when moving an electronic component between a component inspection apparatus and a plurality of trays. Objective.

  In order to achieve this object, an IC handler according to the present invention includes a component region in which a tray in which a large number of electronic components are stored is positioned, an inspection region having an inspection socket in which the electronic components are loaded, and the inspection region. In an IC handler comprising a component moving device that moves an electronic component between a region and the component region, a plurality of the component regions are provided in a direction orthogonal to the direction away from the inspection region in plan view. The component moving device includes a suction nozzle that moves while sucking without releasing an electronic component between the tray in the inspection area and the socket for inspection.

An IC handler according to a second aspect of the present invention is the IC handler according to the first aspect, wherein the component region is configured by a plurality of tray support devices that hold the tray so that movement is restricted, and the tray support A plurality of stockers arranged in a state parallel to the direction in which the tray support devices are arranged on the opposite side of the inspection area with respect to the apparatus, and a stocker that accommodates the plurality of trays stacked in the vertical direction,
A tray transfer device for moving the tray between the stocker and the tray support device;

  An IC handler according to a third aspect of the present invention is the IC handler according to the first aspect, wherein the component region is configured by a plurality of tray support devices that hold the tray so that movement is restricted, and the tray support A plurality of stockers arranged in a direction parallel to a direction in which the tray support devices are arranged on the opposite side of the inspection area with respect to the apparatus, and a stocker that accommodates the plurality of trays in a vertically stacked state, and the stocker and the tray And a tray transfer device for moving the tray to and from the support device. The stocker has a tray loading / unloading port at the bottom, a holding position for holding the tray in the vicinity of the tray loading / unloading port, and a lower tray. A tray holding means that can move between the loading and unloading position, and the tray transfer device is configured to move the tray in the stocker. And later causing lifting device, in which and a conveyor for supporting the tray below the stocker.

  An IC handler according to a fourth aspect of the present invention is the IC handler according to any one of the first to third aspects, comprising a plurality of component moving devices, and these component moving devices are used for inspecting electronic components. They are arranged symmetrically so as to be alternately loaded into the socket.

  An IC handler according to a fifth aspect of the present invention is the IC handler according to any one of the first to third aspects, wherein the component moving device includes a suction head that raises and lowers the suction nozzle and rotates the suction nozzle. A head unit that supports a plurality of the suction heads and a moving device for the head unit that moves the head unit in the horizontal direction are provided.

  The IC handler according to the invention described in claim 6 is the IC handler according to claim 1, wherein the component region is constituted by a plurality of stockers that accommodate a plurality of trays stacked in the vertical direction. In addition to an elevating device for elevating and lowering the tray, an opening is provided at the top, and a tray transfer device for taking out the tray from this opening and transferring it to another stocker is provided.

  According to the present invention, all electronic components are moved between the tray and the inspection socket by the component moving device without moving the component moving device beyond the tray in a direction away from the inspection socket side. Can do. Therefore, in the IC handler according to the present invention, all trays can be arranged at positions that are the same distance as the tray that is closest to the inspection socket in the conventional IC handler. For this reason, according to the present invention, it is possible to provide an IC handler with a shorter tact time than a conventional IC handler.

  According to invention of Claim 2 or Claim 3, when the electronic component is adsorbed or placed on the tray on the tray supporting device, a tray that is not the object of the operation is taken in and out of the stocker. can do. For this reason, since it is not necessary to stop the operation | movement which adsorb | sucks and mounts an electronic component in order to replace | exchange trays, tact time can be shortened further.

  According to the fourth aspect of the present invention, since the next electronic component can be prepared by the other component moving device while the electronic component is being inspected, the tact time can be further reduced.

  According to the fifth aspect of the present invention, by mounting a plurality of inspection sockets so as to correspond to the suction nozzles, it is possible to load a plurality of electronic components in a plurality of inspection sockets at a time. Therefore, according to the present invention, the inspection efficiency can be improved and the tact time can be further reduced as compared with the IC handler configured to load the electronic components one by one in the inspection socket.

  According to the sixth aspect of the present invention, when the electronic component is being sucked or placed on the tray on the tray support device, a tray that is not the object of the operation can be taken in and out of the stocker. . For this reason, since it is not necessary to stop the operation | movement which adsorb | sucks and mounts an electronic component in order to replace | exchange trays, tact time can be shortened further.

Hereinafter, an embodiment of an IC handler according to the present invention will be described in detail with reference to FIGS.
FIG. 1 is a plan view of an IC handler according to the present invention. In the figure, the tray support device and the stocker are drawn with no tray placed thereon. 2 is a cross-sectional view taken along the line II-II in FIG. 1, FIG. 3 is a perspective view for explaining the configuration of the component moving device, FIG. 4 is a perspective view of the head unit, and FIG. This figure shows only two unit units. FIG. 6 is a side view of the unit unit. In FIG. This fracture position is indicated by the line VI-VI in FIG.

  7A and 7B are diagrams showing the configuration of the tray support device, where FIG. 7A is a side view and FIG. 7B is a front view. FIG. 8 is a plan view for explaining the operation of the tray transfer device and the tray support device, FIGS. 9 to 12 are front views for explaining the operation of the tray transfer device and the stocker, and FIG. 13 is an outline of the IC handler. It is a perspective view which shows a structure.

In these drawings, the reference numeral 1 indicates an IC handler according to this embodiment.
As shown in FIGS. 1 and 2, the IC handler 1 includes an inspection area A located at the rear end of the base 2 (the upper end in FIG. 1 and the right end in FIG. 2). The electronic component 5 (see FIG. 2 and FIG. 6) is moved by the component moving devices 3 and 4 to be described later between the component region B and the component region B located in the substantially central portion of the base 2 in the front-rear direction. In the present specification, the vertical direction in FIG. 1 is referred to as the Y direction as the longitudinal direction of the apparatus, the horizontal direction in FIG. 1 is referred to as the X direction as the lateral direction of the apparatus, and the direction orthogonal to the paper surface is simply the Z direction. That's it.

  An opening 2a is provided in the inspection area A of the base 2, and a test head 8 provided with a plurality of inspection sockets 6 on which the electronic components 5 to be inspected are placed is located below the opening 2a. The base 2 is detachably fixed. The inspection socket 6 is inspected on the inspection apparatus main body 7 (see FIG. 2) placed on the floor independently of the IC handler 1 in the base 2 via the test head 8 or directly. Are connected via a current cable. In addition, the inspection socket 6 has a configuration in which an electronic component 5 (see FIGS. 2 and 6) is loaded from above, and is disposed at a substantially central portion of the base 2 in the X direction. In this embodiment, four inspection sockets 6 are provided. These inspection sockets 6 are provided such that two sets of inspection sockets 6 and 6 arranged in the X direction are arranged in the Y direction. The inspection of the electronic component 5 is performed by inputting / outputting an inspection current between the electronic component 5 and the inspection apparatus body 7 in a state where the electronic component 5 is placed on the inspection socket 6. A detachable connector is disposed at one end or middle of the inspection current cable.

  On the base 2 are a plurality of stockers 11, 11... Positioned at the front end of the base 2, and a tray support device 12 positioned between the stockers 11 and the inspection socket 6. The tray transfer device 13 for moving a later-described tray T (see FIG. 2) between the stocker 11 and the tray support device 12 and the fixed rails 14 positioned at both ends in the X direction of the base 2 are supported. A plurality of base-side imaging devices 15 for imaging the first component moving device 3 and the second component moving device 4 and the electronic component 5 that is attracted and moved by these component moving devices 3 and 4 from below. And are provided. These base-side imaging devices 15 are arranged in the X direction at positions between the inspection socket 6 and the tray support device 12 so as to be distributed to the left side and the right side with respect to the center of the base 2 in the X direction. Two are provided in a state. Hereinafter, each device on the base 2 will be described in detail.

  As shown in FIG. 2, the stocker 11 has a structure that accommodates a plurality of trays T stacked in the vertical direction. As shown in FIG. 1, a plurality of stockers 11 are arranged in the X direction. As shown in FIG. 8, the tray T is formed in a rectangular dish shape that is long in the Y direction in a plan view by plastic. Although not shown in the figure, a large number of recesses for accommodating the electronic components 5 are formed in the tray T so as to open upward.

  As shown in FIGS. 1, 2, and 13, the stocker 11 has a rectangular frame 21 in a plan view located at the lowermost portion, and an L-shaped cross-section erected at the rear end of the frame 21. A rear support 22, a front support 23 having an L-shaped cross-section standing at the front end of the frame 21, and a tray support hook 24 provided on the frame 21 (see FIGS. 9 to 12). ) Etc. In FIG. 13, only the stockers located at both ends in the X direction are depicted among the plurality of stockers.

  As shown in FIG. 2, the stocker 11 is mounted on a stocker frame 25 provided on the front end of the base 2. The stocker frame 25 is not shown in FIG. A tray loading / unloading port 26 (see FIG. 2) is formed in a portion of the stocker frame 25 that is below the frame body 21 of the stocker 11.

The frame body 21 of the stocker 11 is formed so that the horizontal tray T can be loaded in the vertical direction in the opening portion inside.
The rear column 22 and the front column 23 are positioned so as to hold the four corners of the rectangular tray T in a fitted state. As shown in FIG. 2, the front column 23 is formed to be lower than the rear column 22.

The hook 24 is for supporting the tray T in the stocker 11, and in the plan view, the forward position where the tip portion faces the opening portion of the frame body 21, and the retreat position where the tip portion comes out of the opening portion. Is supported by the frame body 21 so as to be able to reciprocate between. In this embodiment, the hook 24 constitutes a tray holding means in the invention described in claim 3. In this embodiment, the forward position is the holding position as defined in claim 3, and the retracted position is the entry / exit position as defined in claim 3.
Each hook 24 is connected to an actuator (not shown) that moves the hook 24 to either the forward position or the backward position.

  Although not shown in the drawing, the tip end portion of the hook 24 is formed so as to engage with a recessed portion formed so as to open sideways on the side portion of the tray T. The hook 24 shown in FIGS. 9 to 12 has a structure in which the lower end of the tray T is supported by the tip portion so that the state in which the tray T is supported and the state in which the tray T is released can be easily discriminated. It is drawn as. In addition to the structure that translates as described above, the hook 24 has a horizontal state in which the tip end faces the opening in a plan view, and the entire hook is approximately 90 ° so that the tip is directed downward. It is also possible to adopt a structure that rotates and rotates between the vertical state where the tip end portion is out of the opening portion.

  The tray support device 12 constitutes the component region B in the present invention, and as shown in FIG. 1, three tray support devices 12 are provided so as to be arranged in a line in the X direction. That is, a plurality of component regions B are provided side by side in a direction (X direction) orthogonal to a direction (Y direction) away from the inspection region A in plan view. As shown in FIG. 8, these tray support devices 12 are for a component supply tray T1 in which uninspected electronic components 5 are stored, and non-defective products for storing electronic components 5 determined to be non-defective after inspection. A tray T2 and a defective product tray T3 for storing the electronic component 5 determined to be defective after the inspection are supported.

These tray support devices 12 move in the X direction while being supported by a component area moving device 31 described later. The number of tray support devices 12 is not limited to three, and can be increased or decreased as necessary.
1, 2, 7, and 8, each tray support device 12 includes a tray lifting cylinder 33 provided on a plate-like support base 32 of a component area moving device 31 described later, and X A pair of vertical plates 34 erected on the plate-like support base 32 so as to face each other at intervals in the direction, a belt conveyor 35 provided inside each of the vertical plates 34, and the 2 A front side pressure plate 36 and a rear side pressure plate 37 that are installed between the upper ends of the vertical plates 34, 34, and a pair of side guides that are provided in the middle of the vertical plate 34 in the Y direction. The members 38, 38 and a tray stopper 39 {see FIG. 7A) provided at an end portion on the rear side of the apparatus are configured.

The tray lifting / lowering cylinder 33 is fixed on the plate-like support base 32 so that the piston rod 33a moves in the vertical direction, and the tray lifting / lowering plate 40 described later is moved up and down by the piston rod 33a. In FIG. 7, the member that supports the cylinder 33 is omitted.
The tray elevating plate 40 is for supporting the lower surface of the tray T, and is formed in a rectangular shape that is long in the Y direction in plan view. The plate elevating plate 41 can be raised and lowered by the elevating guide 41. It is supported. The tray lifting / lowering plate 40 is inserted between the pair of belt conveyors 35 and 35 so as not to contact the belt conveyors 35.

The tray lifting / lowering plate 40 formed in this way is in a standby position (see FIG. 2) that is lower than the conveying surface of the belt conveyor 35 by driving the cylinder 33, and at a higher position than the conveying surface. T ascends and descends between raised positions where T is pressed against a front pressure plate 36 and a rear pressure plate 37 which will be described later.
The said vertical board 34 is formed in the length which surrounds the belt conveyor 35 from a side from a front end part to a rear end part.
The belt conveyor 35 conveys the tray T in the Y direction while supporting both sides of the tray T, and carries the tray T into the tray support device 12 and unloads the tray T from the tray support device 12. belongs to. The drive shaft 42 of the belt conveyor 35 is formed so as to penetrate the three tray support devices 12 in the X direction, and drives all the belt conveyors 35 of these tray support devices 12 simultaneously.

  The front pressure plate 36 and the rear pressure plate 37 are for determining the vertical position of the tray T and correcting the distortion of the tray T. The lower surfaces of the front pressure plate 36 and the rear pressure plate 37 are formed flat so that the upper surface of the tray T lifted by the cylinder 33 and the tray lifting / lowering plate 40 abuts from below. As shown in FIG. 7A, the front pressure plate 36 is provided with an optical sensor 43 for detecting the end of the tray T carried in by the belt conveyor 35.

  The side guide member 38 is for determining the position of the tray T in the X direction, and is formed so as to extend from the upper end of the vertical plate 34 to above the belt conveyor 35 in a plan view as shown in FIG. ing. Although not shown, the lower surface of the extending portion of the side guide member 38 is gradually inclined toward the tip of the side guide member 38 as it goes upward. That is, the tray T carried into the tray support device 12 by the belt conveyor 35 is raised by the cylinder 33 and the tray lifting / lowering plate 40, so that the tray T is placed on both sides of the lower surface of the side guide member 38. The parts contact from below and are positioned in the X direction by the pair of side guide members 38.

  The tray stopper 39 is for determining the position in the transport direction of the tray T transported into the tray support device 12 by the belt conveyor 35. As shown in FIG. A vertical surface is formed on which the end surface on the front side in the traveling direction of the tray T carried into the tray support device 12 abuts. The tray stopper 39 is supported on the plate-like support base 32 or the vertical plate 34 via a bracket (not shown).

  As shown in FIGS. 1, 2, and 7 (b), the component area moving device 31 moves in the X direction to a pair of fixed rails 44 extending in the X direction on the base 2. A slider 45 supported freely, the plate-like support base 32 supported by the slider 45, and a ball screw type driving device 46 (FIG. 5) for moving the plate-like support base 32 and the slider 45 in the X direction. 8). As shown in FIGS. 1 and 2, the ball screw type driving device 46 rotates a ball screw shaft 47 extending in the X direction between the fixed rails 44, 44, and is screwed onto the ball screw shaft 47. At the same time, the nut member 48 provided integrally with the plate-like support base 32 is moved.

  As shown in FIGS. 1, 2, and 8 to 12, the tray transfer device 13 is supported on a fixed rail 51 that extends in the X direction on the base 2, and is supported by the fixed rail 51 so as to be movable in the X direction. Provided on the slider 52, a ball screw type driving device 53 for moving the slider 52 by a predetermined amount in the X direction, a support plate 54 fixed on the slider 52, and the support plate 54. Further, it is constituted by two sets of transfer device main bodies 55, 55, a relay conveyor 56 positioned between the fixed rail 51 and the tray support device 12 described above.

The two sets of transfer device main bodies 55 are used for carrying the tray T into the stocker 11 from above or carrying the tray T out from the lower end of the stocker 11, and have the same pitch as the parallel arrangement of the plurality of stockers 11. Are arranged in the X direction so as to have a pitch of.
The transfer device main body 55 includes a first cylinder 61 and a second cylinder 62 fixed in a state of being arranged in the Y direction on the support plate 54, and on both sides of the cylinders 61 and 62 in the X direction. A pair of vertical plates 63, 63 erected on the support plate 54, and a pair of belt conveyors 64, 64 provided inside the vertical plates 63, respectively.

  The first and second cylinders 61 and 62 are fixed to the support plate 54 so that the piston rods 61a and 62a move in the vertical direction, and a later-described tray support member 65 is moved up and down by the piston rods 61a and 62a. The movement stroke of the piston rod 61a of the first cylinder 61 located on the rear side of the device (the right side in FIG. 2) of the first and second cylinders 61 and 62 is the piston rod 62a of the second cylinder 62. It is formed so as to be longer than the moving stroke. Equipped with two types of cylinders 61 and 62 having different movement strokes as described above is that the rising position of the tray support member 65 is divided into two stages, a relatively high position and a relatively low position, as will be described later. This is for switching.

  The tray support member 65 is for supporting the lower surface of the tray T, and is formed in a rectangular shape that is long in the Y direction in plan view. The elevating guide provided on the support plate 54 or the vertical plate 63 ( (Not shown) so as to be movable up and down. Further, as shown in FIGS. 9 to 12, the tray support member 65 is inserted between a pair of belt conveyors 64 described later so as not to contact the belt conveyors 64. . 9 to 12, the tray support member 65 is schematically drawn so that the operation of the tray transfer device 13 can be easily understood.

Further, the size of the tray support member 65 in a plan view is such that the tray support member 65 is raised in a state where the transfer device main body 55 is positioned directly below the stocker 11 as shown in FIG. 9B, for example. By doing so, the tray support member 65 is formed in such a size that it can enter the tray loading / unloading opening 26 of the stocker frame 25.
The tray support member 65 formed in this way has a standby position (see FIG. 2) that becomes lower than the conveying surface of the belt conveyor 64 by driving the first cylinder 61 and the second cylinder 62, and the conveying surface. It moves up and down between a higher position, which will be described later, in the vicinity of the lower end of the stocker 11.

  The raised position of the tray support member 65 when the tray support member 65 is lifted by the first cylinder 61 is, for example, as shown in FIG. 12A, where the lowermost tray T in the stocker 11 is the tray support. The position is set such that the member 65 is pushed up above the hook 24. On the other hand, when the tray support member 65 is raised by the second cylinder 62, the raised position of the tray support member 65 is the lowest in the stocker 11 supported by the hook 24, as shown in FIG. The position is set such that the tray T placed on the tray support member 65 is overlapped with the tray T positioned from above.

  The belt conveyor 64 of the tray transfer device 13 is for transporting the tray T in the Y direction while supporting both sides of the tray T. As shown in FIG. Mounted on the plate 63. The height of the conveying surface is positioned at substantially the same height as the conveying surface of the belt conveyor 35 of the tray support device 12 described above.

  As shown in FIGS. 1 and 2, the relay conveyor 56 includes a belt conveyor 66 that conveys the tray T in the Y direction while supporting both sides of the tray T, and the belt conveyor 35 of the tray support device 12 described above. The tray T is delivered to and from the belt conveyor 64 of the tray transfer device 13. Further, the belt conveyor 66 of the relay conveyor 56 operates so that the conveying direction of the tray T coincides with the belt conveyor 35 of the tray support device 12 and the belt conveyor 64 of the tray transfer device 13.

  The first component moving device 3 and the second component moving device 4 are formed so as to be line symmetric with respect to a center line extending in the Y direction of the base 2. Therefore, here, the first component moving device 3 located on the left side in FIG. 1 will be described, and the second component moving device 4 is denoted by the same reference numerals as those of the first component moving device 3 in detail. The detailed explanation is omitted.

  As shown in FIGS. 1 to 6, the first component moving device 3 includes a pair of fixed rails 14, 14 extending in the Y direction on the X-direction end of the base 2, and the fixed rails 14 have Y A Y-direction moving member 71 movably supported in the direction, a ball screw type first Y-direction driving device 72 for moving the Y-direction moving member 71 in the Y direction, and the Y-direction moving member 71 in the X direction. A support member 73 (refer to FIG. 3) supported movably in the first direction, and a ball screw type first X direction drive device 74 (see FIG. 3) for moving the support member 73 in the X direction with respect to the Y direction movement member 71. 3) and a head unit 75 provided on the support member 73. The operations of the driving devices 72 and 74 of the first component moving device 3 and the second component moving device 4 and the respective devices in the head unit 75 to be described later are control means (not shown) of the IC handler 1. Controlled by.

As shown in FIG. 1, the fixed rail 14 is located at the same position in the X direction as the outermost stocker 11 among the plurality of stockers 11 provided on the base 2 and located at the outermost side. It is arranged at a position away from the stocker 11 to the rear of the apparatus.
As shown in FIG. 3, the Y-direction moving member 71 includes a base 71a connected to the fixed rails 14 and 14 via a slide member (not shown), and a side (see FIG. 3) from the upper end of the base 71b. 3 is provided with a pair of arm portions 71b protruding rightward). These arm portions 71b are provided so as to be arranged at intervals in the Y direction, and support the support member 73 movably in the X direction via a guide member 71c. The guide member 71c has a structure that supports a rail 73a provided on the support member 73 from above.

  As shown in FIG. 1, a first Y-direction drive device 72 that drives the Y-direction moving member 71 in the Y direction is a ball screw that is rotatably supported with respect to the fixed rail 14 while extending in the Y direction. A shaft 76, a nut member (not shown) screwed in the middle of the ball screw shaft 76 and fixed to the Y-direction moving member 71, and a motor connected to the end of the ball screw shaft 76 on the rear side of the device 79 or the like.

As shown in FIG. 3, the support member 73 is formed in a rectangular plate shape having an opening 73b in a plan view, and both ends in the Y direction are supported by the Y direction moving member 71 via the rail 73a. ing.
As shown in FIG. 3, the first X-direction drive device 74 that drives the support member 73 in the X direction includes a motor block 81 provided on an upper portion of the Y-direction moving member 71, and the motor block 81 is rotatable. , A nut member 82a screwed onto the ball screw shaft 82 and fixed to the support member 73, one end of the ball screw shaft 82 (on the left side in the first component moving device 3) The motor 83 is connected to the end of the motor. The nut member 82a is attached to an end portion of the support member 73 opposite to the frame-shaped portion 84 having the opening 73b.

As shown in FIGS. 1 and 4, the head unit 75 includes four unit units 85 attached to the X-direction extending portion 84 a of the frame-like portion 84.
As shown in FIG. 1, these four unit units 85 are arranged in the X direction and the Y direction in the same manner as the four inspection sockets 6 in a plan view. The head unit 75 according to this embodiment is provided with head-side imaging devices 86 and 87 for imaging the inspection socket 6 from above. The head side imaging device 86 is used for imaging the inspection socket 6, and the head side imaging device 87 is used for imaging the tray T conveyed to the tray support device 12. From the position of a predetermined recessed portion or fiducial mark of the tray T imaged at a predetermined timing, the correction amount of the conveyance error of the belt conveyor 35 and the driving amount of the ball screw type driving device 46 is calculated. In consideration of these correction amounts, each tray T on the component area moving device 31 is arranged at a correct position when the electronic component 5 is sucked and placed.
These imaging devices 86 and 87 are provided at both ends of the frame-shaped portion 84 in the Y direction.

  As shown in FIG. 6, each unit unit 85 includes an X-direction support member 91 attached to the X-direction extending portion 84 a of the frame-shaped portion 84, and a lower portion of the X-direction support member 91 in the X direction. An X-direction slider 92 that is movably mounted, a second ball screw type X-direction drive device 93 that drives the X-direction slider 92 in the X-direction, and a lower portion of the X-direction slider 92 are integrally formed. A Y-direction support member 94, a Y-direction slider 95 attached to the lower portion of the Y-direction support member 94 so as to be movable in the Y-direction, and a second Y of the ball screw type that drives the Y-direction slider 95 in the Y-direction A direction driving device 96, a Z-direction support member 98 attached to a lower portion of the Y-direction slider 95 via a bracket 97, and a suction head 99 supported by the Z-direction support member 98 so as to be movable in the Z-direction. It is constituted by the Z-direction driving device 100 for vertically moving the suction head 99. The unit unit 85 constitutes the suction nozzle moving device referred to in the present invention.

  A linear motion guide member 101 such as a so-called cross roller guide is interposed between the X direction support member 91 and the X direction slider 92 and between the Y direction support member 94 and the Y direction slider 95. Yes. The second X-direction drive device 93 includes a ball screw shaft 102 that is rotatably supported by the X-direction support member 91 in a state extending in the X direction, and a motor 103 connected to one end of the ball screw shaft 102 ( 4 to 6) and a nut member 104 screwed in the middle of the ball screw shaft 102 and fixed to the X-direction slider 92. As shown in FIG. 4, the motor 103 of the second X-direction drive device 93 is equipped along the X-direction extending portion 84 a of the frame-shaped portion 84.

  As shown in FIG. 6, the second Y-direction drive device 96 includes a ball screw shaft 110 that is rotatably supported by the Y-direction support member 73 in a state extending in the Y direction, and one end of the ball screw shaft 110. And a nut member 112 screwed in the middle of the ball screw shaft 110 and fixed to the Y-direction slider 95. As shown in FIG. 4, the motor 111 of the second Y-direction drive device 96 is provided so as to protrude from the frame-shaped portion 84 to both sides in the Y direction.

  The second Y-direction drive device 96 and the second X-direction drive device 93 are configured to move the nut members 104 and 112 as compared with the first Y-direction drive device 72 and the first X-direction drive device 74 described above. The amount is reduced, and the resolution when determining the position of the nut members 104 and 112 (position of the driven member) is increased.

As shown in FIG. 6, the Z direction support member 98 is formed in a cylindrical shape extending in the Z direction, and moves up and down a ball screw shaft 113 of a Z direction drive device 100 described later and a suction head 99 described later. A guide member (not shown) that is freely supported is accommodated.
As shown in FIG. 6, the Z-direction drive device 100 is supported by the ball screw shaft 113 that is rotatably supported by the Z-direction support member 98 in a state extending in the Z direction, and the upper end portion of the Z-direction support member 98. The motor 114 is connected to the upper end of the ball screw shaft 113, and the nut member 115 is screwed in the middle of the ball screw shaft 113 and coupled to a suction head 99 described later.

  As shown in FIG. 6, the suction head 99 is fitted to the guide member of the Z-direction support member 98 and is coupled to the nut member 115 of the Z-direction drive device 100, and extends in the Z direction. A shaft 122 rotatably supported inside the housing 121, a rotation driving device 124 having a motor 123 for rotating the shaft 122, and a suction nozzle 125 detachably attached to the lower end portion of the shaft 122. I have. The shaft 122 is formed in a hollow shape and is connected to an air suction device (not shown).

The suction nozzle 125 has a suction surface at the lower end, and is configured so that both the shaft 122 and the housing 121 can be rotated around an axis in the Z direction.
That is, as shown in FIG. 5, the unit unit 85 moves the suction nozzle 125 in the X direction, the Y direction, and the Z direction with respect to the support member 73, and the suction nozzle 125 around the Z-direction axis. Rotate.

  A control means (not shown) for controlling the operation of the IC handler 1 including the suction nozzle 125 is connected to a control device in the inspection apparatus body 7 by a link cable (not shown), and is connected to a plurality of inspection sockets 6. The information about the mounting of each electronic component 5 by each suction nozzle 125 is transmitted to the control device in the inspection apparatus main body 7, and the control device in the inspection apparatus main body 7 informs that the inspection is completed and the inspection result. To the control means.

  Further, the control means of the IC handler 1 receives information on the completion of the inspection and the inspection result, and when the inspected electronic component 5 is a non-defective product, it is transferred to the non-defective product tray T2. The head unit 75 is controlled so that the electronic component 5 is transferred to the defective product tray T3.

  Next, the operation of the IC handler 1 configured as described above will be described. In order to load the electronic component 5 into the inspection socket 6 by the IC handler 1, first, the component supply tray T1 is conveyed from the stocker 11 to the tray support device 12 by the tray transfer device 13, and the first or first The electronic component 5 on the tray T1 is moved to the inspection socket 6 by the two component moving devices 3 and 4.

  In order to transport the component supply tray T1 from the stocker 11 to the tray support device 12 by the tray transfer device 13, first, as shown in FIG. 9A, the transfer device main body 55 is placed below the desired stocker 11. And the tray support member 65 is raised to the raised position by the first cylinder 61, and the second cylinder 62 is brought into the extended state. At this time, the tray support member 65 contacts the lowermost tray T1 in the stocker 11. Next, as shown in FIG. 5B, the hook 24 of the stocker 11 is retracted, and as shown in FIG. 5C, the piston rod 61a of the first cylinder 61 is lowered.

  As the piston rod 61 a is lowered, the tray support member 65 and the multiple trays T in the stocker 11 are lowered and are supported by the piston rod 62 a of the second cylinder 62. Thereafter, as shown in FIG. 10A, the hook 24 is moved forward, and as shown in FIG. 10B, the piston rod 62a of the second cylinder 62 is lowered. As the piston rod 62a is lowered in this way, the tray support member 65 and the tray T1 are lowered, and the tray T1 is supported on the belt conveyor 64.

  Next, the belt conveyor 65, the belt conveyor 66 of the relay conveyor 56, and the belt conveyor 35 of the tray support device 12 are operated in the same direction. By operating these belt conveyors, the tray T1 is conveyed into the tray support device 12 from below the stocker 11 through the relay conveyor 56. At this time, the tray lifting plate 40 of the tray support device 12 is positioned at the standby position.

  The non-defective product tray T2 and the defective product tray T3 are conveyed to the other two tray support devices 12 among the three tray support devices 12 by the same operation as described above. At this time, the tray support device 12 is moved in the X direction by the component area moving device 31, and the tray support device 12 that carries the non-defective product tray T <b> 2 or the defective product tray T <b> 3 is positioned downstream in the transport direction of the relay conveyor 56.

  When the tray T1 is carried into the tray support device 12 and the end of the tray T1 in the transport direction is detected by the sensor 43, the belt conveyor is stopped. At this time, the tray T1 is positioned in the transport direction (Y direction) by the end of the tray T1 on the front side in the transport direction coming into contact with the stopper 39. After the belt conveyor 35 is thus stopped, the tray T1 is raised together with the tray lifting plate 40 by the cylinder 33 of the tray support device 12.

  When the tray T1 is lifted in this way, the tray T1 is positioned in the X direction by the pair of side guide members 38, 38, and is clamped by the front pressure plate 36, the rear pressure plate 37, and the tray lifting plate 40. By doing so, the distortion is corrected. For this reason, the tray T1 is held in a state where the tray T1 is positioned in the X direction and the Y direction.

  After the tray T1 is held by the tray support device 12, the first X-direction driving device 74 and the first Y-direction driving device 72 of the first component moving device 3 or the second component moving device 4 are driven. The head unit 75 moves above the tray T1. Thereafter, each suction head 99 is lowered by driving the Z-direction driving device 100 and the four electronic components 5 on the tray T1 are sucked by the four suction nozzles 125. At this time, the head unit 75 has the second position so that the position of the suction nozzle 125 (the pitch in the X direction and the Y direction) matches the position (the pitch in the X direction and the Y direction) of the component storage concave portion of the tray T1. The X direction driving device 93 and the second Y direction moving device 96 are operated. Then, the first Y-axis direction driving device 72 and the first driving device 72 are arranged so that any of the suction nozzles 125 serving as a reference is located directly above the reference component storage recess corresponding to the suction nozzle 125. The X-axis direction driving device 74 is operated to control the movement of the head unit 75.

After the suction nozzle 125 sucks the electronic component 5, the head unit 75 passes over the base-side imaging device 15 by driving the first X-direction drive device 74 and the first Y-direction drive device 72. It moves above the inspection socket 6.
When the head unit 75 passes above the base side imaging device 15, the electronic component 5 is imaged from below by the base side imaging device 15, and the suction nozzle is picked up by a control device (not shown) of the IC handler 1. The position of the electronic component 5 with respect to 125 is detected.

  The head unit 75 uses the second X-direction drive device 93 and the second Y-direction drive device 96 so that the position of the electronic component 5 coincides with the position of the inspection socket 6 based on the detection result. Are moved in the X and Y directions. At this time, the head unit 75 adjusts the angle of the electronic component 5 around the axis line in the Z direction so as to coincide with the angle of the inspection socket 6 by the rotation driving device 124.

  The correction of the position of the suction nozzle 125 is performed until the head unit 75 moves above the inspection socket 6. The position of the inspection socket 6 is detected by imaging the inspection socket 6 with the head side imaging device 86 provided in the head unit 75. The imaging and the position detection of the inspection socket 6 are performed, for example, when the inspection socket 6 is replaced.

  Thereafter, the head unit 75 lowers the suction head 99 and simultaneously loads the four electronic components 5 into the inspection socket 6. When the electronic component 5 is loaded in the inspection socket 6 in this manner, the component inspection apparatus 7 performs a predetermined inspection on the electronic component 5. During the inspection, the other component moving device 4 sucks the electronic component 5 on the tray T1 in the same manner as described above, moves to the vicinity of the inspection socket 6, and waits until the inspection is completed.

  After completion of the inspection, the head unit 75 raises the electronic component 5 from the inspection socket 6 and above the tray support device 12 where the non-defective product tray T2 or the defective product tray T3 is located among the three tray support devices 12. The electronic component 5 is transferred to these trays T2 and T3. At the time of transfer, when the position of the concave portion for storing the component of the tray T2 or the tray T3 and the current position of the electronic component 5 do not match, the head unit 75 performs the second X direction so as to match. The drive device 93, the second Y-direction drive device 96, and the rotary drive device 124 are operated to correct the position of the electronic component 5. Then, the first Y-axis direction driving device 72 and the first driving device 72 are arranged so that any of the suction nozzles 125 serving as a reference is located directly above the reference component storage recess corresponding to the suction nozzle 125. The X-axis direction driving device 74 is operated to control the movement of the head unit 75.

  All the electronic components 5 on the component supply tray T1 held by the tray support device 12 are taken out and the tray T1 becomes empty, or the non-defective product tray T2 or the defective product tray T3 is the electronic component 5 after the inspection. When it is satisfied, as shown in FIG. 8A, these return trays T4 are transferred from the tray support device 12 to one of the two sets of transfer device main bodies 55 via the relay conveyor 56 one by one. Move.

  Next, as shown in FIG. 4B, the tray transfer device 13 is operated to move the two sets of transfer device main bodies 55 in the X direction, and the other transfer device main body 55 is opposed to the relay conveyor 56. Let Then, as shown in FIG. 3C, a new tray T5 previously placed on the other transfer device main body 55 is conveyed to the tray support device 12 via the relay conveyor 56. Thus, after the new tray T5 is carried out from the other transfer device main body 55, the one transfer device main body 55 is moved below the predetermined stocker 11, and the return tray T4 is moved to the stocker. 11 is housed.

  The return tray T4 is stored in the stocker 11 as shown in FIGS. That is, first, as shown in FIGS. 11 (a) and 11 (b), the return tray T 4 is lowered to the other tray T located at the lowermost end of the stocker 11 by the second cylinder 62 of the tray transfer device 13. The hook 24 of the stocker 11 is moved backward. Thereafter, as shown in FIG. 6C, the first cylinder 61 pushes up all the trays T in the stocker 11 including the other tray T together with the return tray T4 by one tray. 12 (a), the hook 24 is advanced. Thus, after the hook 24 moves forward, the piston rods 61a and 62a of the first and second cylinders 61 and 62 are lowered.

  The IC handler 1 configured as described above is provided in a state where a plurality of tray support devices 12 as the component region B are arranged in the X direction, and is separated from these tray support devices 12 in the Y direction. An inspection socket 6 is provided. For this reason, the IC handler 1 according to this embodiment has a distance equivalent to that of the tray closest to the inspection socket in the conventional IC handler in which the component areas are arranged in a direction away from the inspection socket. All the trays T can be disposed at such positions.

  Accordingly, in the IC handler 1 according to this embodiment, when the electronic component 5 is moved between the tray support device 12 and the inspection socket 6, the first or second component moving device 3, 4 is used by the tray support device 12. The tact time for performing a series of inspection operations of suction, movement, inspection, and placement of the electronic component 5 is shortened as compared with the conventional IC handler without moving beyond the socket 6 for inspection. I was able to.

  The IC handler 1 according to this embodiment includes a plurality of stockers 11 arranged in a direction parallel to the direction in which the tray support device 12 is arranged on the side opposite to the inspection socket 6 with respect to the tray support device 12. The tray transfer device 13 for moving the tray T between the stocker 11 and the tray support device 12 is provided. For this reason, in the IC handler 1, when the electronic component 5 is sucked or placed on the tray T on the tray support device 12, the tray T that is not the target of the operation is placed on the stocker 11. Can be put in and out. For this reason, it is not necessary to stop the operation of sucking and placing the electronic component 5 in order to replace the tray T.

  The IC handler 1 according to this embodiment includes a first component moving device 3 and a second component moving device 4, and these first and second component moving devices 3 and 4 include electronic components 5. The inspection sockets 6 are arranged symmetrically so as to be alternately loaded. Therefore, according to the IC handler 1 according to this embodiment, while the electronic component 5 is loaded and held in the inspection socket 6 by one component moving device (during the inspection), the other component moving device performs the next operation. The electronic component 5 can be prepared.

  In the IC handler 1 according to this embodiment, the first component moving device 3 and the second component moving device 4 support a plurality of suction heads 99 that raise and lower the suction nozzle 125 and rotate the suction nozzles 125. A head unit 75 and a moving device for the head unit 75 (a first X-direction driving device 74, a first Y-direction driving device 72, etc.) for moving the head unit 75 in the horizontal direction are provided. For this reason, in the IC handler 1 according to this embodiment, since a plurality of electronic components 5 can be loaded into the plurality of inspection sockets 6 at a time, the electronic components are loaded one by one into the inspection socket. The inspection efficiency is higher than that of the IC handler.

  The IC handler according to the present invention can be configured as shown in FIGS. 14 is a plan view showing another embodiment of the IC handler, FIG. 15 is a sectional view taken along line XV-XV in FIG. 14, and FIGS. 16 to 20 are plan views showing other embodiments of the IC handler. In these drawings, members that are the same as or equivalent to those described with reference to FIGS. 1 to 13 are given the same reference numerals, and detailed descriptions thereof are omitted as appropriate.

  The IC handler 1 shown in FIGS. 14 and 15 has the same configuration as that of the IC handler 1 shown in FIGS. 1 to 13 except that the configuration of the imaging device 15 on the base side is different. The IC handler 1 shown in FIGS. 14 and 15 includes only one base side imaging device 15. The base side imaging device 15 is configured to move in the X direction by a ball screw type driving device 201.

  By adopting this configuration, the base-side imaging device 15 can be moved so as to approach the head unit 75. Therefore, the head unit 75 can be moved in a straight line toward the inspection socket 6 after the components are attracted. it can. For this reason, according to the IC handler 1, the tact time can be further shortened.

The IC handler 1 shown in FIGS. 16 to 19 includes only one component moving device. A component moving device 202 shown in FIG. 16 has the same structure as the first component moving device 3 used in the IC handler 1 shown in FIGS.
In the component moving device 203 shown in FIG. 17, fixed rails 204 are provided at both ends in the X direction of the base 2, and support members 205 are provided so as to be horizontally mounted on these fixed rails 204. The support member 205 is supported by the fixed rail 204 so as to be movable in the Y direction, and is moved in the Y direction by a ball screw type first Y direction driving device 206. The support member 205 includes a rail 207 extending in the X direction, and the rail 207 supports the head unit 75 so as to be movable in the X direction.

  The head unit 75 is moved in the X direction by a ball screw type first X direction driving device 208 provided on the support member 205. The head unit 75 according to this embodiment is supported by a moving member 209 that is supported by the rail 207 so as to be movable in the X direction and extends from the supporting member 205 to the front of the apparatus. The movement in the Y direction moves in the Y direction, and the movement of the moving member 209 in the X direction moves on the support member 205 in the X direction. For this reason, in this embodiment, the support member 73 used when taking the form shown in FIGS. 1 to 17 is not used, and the unit unit 85 is directly attached to the moving member 209.

  The IC handler 1 shown in FIGS. 18 and 19 is configured such that the tray T moves directly between the tray transfer device 13 and the tray support device 12. In the component moving device 210 of the IC handler 1 shown in FIG. 18, a fixed rail 211 is provided between the stocker 11 and the tray support device 12 and at the rear end portion of the base 2, and a support member 212 is provided on the fixed rail 211. Is supported so as to be movable in the X direction. The support member 212 is moved in the X direction by a ball screw type first X direction driving device 213.

  The support member 212 includes a rail 214 extending in the Y direction, and the rail 214 supports the head unit 75 so as to be movable in the Y direction. The head unit 75 is moved in the Y direction by the first Y direction driving device 215 provided on the support member 212. The head unit 75 according to this embodiment is supported by a moving member 216 that is supported by a rail 214 so as to be movable in the Y direction and extends from the support member 212 to the left side of the apparatus. The movement in the X direction moves in the X direction, and the movement of the moving member 216 in the Y direction moves on the support member 212 in the Y direction. For this reason, in this embodiment, the support member 73 used when taking the form shown in FIGS. 1 to 17 is not used, and the unit unit 85 is directly attached to the moving member 216.

  The component moving device 220 of the IC handler 1 shown in FIG. 19 has the same configuration as the component moving device 203 shown in FIG. 17 except that the extending direction of the head unit 75 is different. For this reason, the same code | symbol is attached | subjected here and detailed description is abbreviate | omitted. The head unit 75 shown in FIG. 19 is formed so as to extend from the support member 205 to the front of the apparatus.

An IC handler 1 shown in FIG. 20 shows an embodiment of an IC handler described in claim 6, and a component region B is constituted by a plurality of stockers 11. In other words, the IC handler 1 is not provided with the tray support device 12 in the IC handler 1 shown in FIGS.
The stocker 11 according to this embodiment has a structure equivalent to the stocker described in Japanese Patent Application Laid-Open No. 2002-303649 already filed by the applicant of the present application. That is, the stocker 11 according to this embodiment has a structure that accommodates a plurality of trays stacked in the vertical direction, and includes a lifting device 230 that lifts and lowers the trays.

The lifting device 230 is of a ball screw type and is fitted to a motor 231 located at the bottom of the stocker 11 and a ball nut (not shown) that is a rotational drive shaft of the motor 231 and is regulated in the vertical direction. However, the ball screw shaft (not shown) that is penetrated and whose rotation is restricted, and the upper end portion of the ball screw shaft are fixed, and a table 232 that supports the tray T is configured.
In the uppermost part of the stocker 11, an opening is provided which becomes a transfer part 233 from which the electronic component 5 and the tray T are taken out or returned from above.

Also in this embodiment, a plurality of stockers 11 are provided so as to be arranged in a direction (X direction) orthogonal to a direction (Y direction) away from the inspection socket 6.
The IC handler 1 according to this embodiment is equipped with a component moving device 240 having the same structure as the component moving device 220 shown in FIG. 19, and the component moving device 240 allows the tray T and the inspection socket on the stocker 11 to be inspected. A configuration is adopted in which the electronic component 5 is moved to and from 6 without being released. The description of each member of the component moving device 240 will be omitted with reference numerals shown in FIG.

Further, the IC handler 1 shown in FIG. 20 is a suction-type tray for carrying out an empty tray after all the electronic components 5 to be inspected have been taken out or a tray filled with the electronic components 5 after the inspection. A transfer device 241 is provided. The tray transfer device 241 includes an adsorption member 242 that adsorbs the tray from above, and an X-direction moving device 243 that moves the adsorption member 242 up and down and moves it in the X direction.
The IC handler 1 shown in FIG. 20 has the same effect as the IC handler 1 shown in FIGS. In particular, the IC handler 1 shown in FIG. 20 is not provided with the tray support device 12 referred to in the IC handler 1 shown in FIGS. 1 to 19, and therefore can be formed more compactly than these IC handlers. .

  In each of the above embodiments, the IC handler has the test head 8 fixed to the base 2 in a removable manner. For this reason, when the test head 8 is mounted on the base 2 and the parts are inspected, the vibration of the external environment is separated from the IC handler where the test head is placed on the floor on which the base is placed. Even if it is transmitted to the floor, the suction nozzle 125 can be accurately aligned with the inspection socket 6.

  The control device in the IC handler 1 and the inspection device body 7 are connected by a signal line (not shown), and the IC handler 1 operates in conjunction with the inspection device body 7 when the electronic component 5 is inspected. The main body 7 may be a part of the IC handler 1. In this case, it is effective to configure a single operation program or combine control devices into one. Further, the inspection apparatus body 7 may be placed on a lower structural member (not shown) of the base 2 instead of being placed on the floor. Thereby, the operation inspection as the component inspection apparatus can be performed by improving the production of the IC handler 1. It can also be transported as a unit.

  The test head 8 is detachably fixed to the base 2, and a test cable (not shown) connecting the test socket 6 and the test apparatus main body 7 is provided with a connector (not shown) at either one end or an intermediate part. Corresponding to the change of the electronic component 5 to be inspected, the component inspection is performed by simply replacing the test head 8 without affecting the replacement inspection apparatus body 7 except for the change of the inspection program. be able to. The control device in the IC handler 1 and the control device of the inspection apparatus main body 7 exchange information by a signal line (not shown), and the parts transfer program and the parts inspection program may be executed in parallel while being linked. Although it is good, both the component transfer control and the component inspection control may be performed by the control device in the IC handler 1.

It is a top view of the IC handler concerning the present invention. It is the II-II sectional view taken on the line in FIG. It is a perspective view for demonstrating the structure of a components moving apparatus. It is a perspective view of a head unit. It is a perspective view for demonstrating the operation direction of a unit unit. It is a side view of a unit unit. It is a figure which shows the structure of a tray support apparatus. It is a top view for demonstrating operation | movement of a tray transfer apparatus and a tray support apparatus. It is a front view for demonstrating operation | movement of a tray transfer apparatus and a stocker. It is a front view for demonstrating operation | movement of a tray transfer apparatus and a stocker. It is a front view for demonstrating operation | movement of a tray transfer apparatus and a stocker. It is a front view for demonstrating operation | movement of a tray transfer apparatus and a stocker. It is a perspective view which shows schematic structure of an IC handler. It is a top view which shows the other form of IC handler. It is the XV-XV sectional view taken on the line in FIG. It is a top view which shows the other form of IC handler. It is a top view which shows the other form of IC handler. It is a top view which shows the other form of IC handler. It is a top view which shows the other form of IC handler. It is a top view which shows the other form of IC handler.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... IC handler, 3 ... 1st component moving apparatus, 4 ... 2nd component moving apparatus, 5 ... Electronic component, 6 ... Inspection socket, 12 ... Tray support apparatus, 11 ... Stocker, 13 ... Tray transfer apparatus 75 ... Head unit, 99 ... Suction head, 125 ... Suction nozzle, 202, 203, 210, 220, 240 ... Part moving device, 241 ... Elevating device, A ... Inspection area, B ... Part area, T, T1-T5 …tray.

Claims (6)

A component area in which a tray in which a large number of electronic components are stored is positioned, an inspection area having an inspection socket in which the electronic component is loaded, and a component movement for moving the electronic component between the inspection area and the component area In an IC handler equipped with a device,
A plurality of the component regions are provided side by side in a direction orthogonal to a direction away from the inspection region in plan view,
2. The IC handler according to claim 1, wherein the component moving device includes a suction nozzle that moves while sucking without releasing an electronic component between the tray in the component region and the inspection socket. The IC handler according to claim 1,
The component area is configured by a plurality of tray support devices that hold the tray so that movement is restricted,
A stocker that is provided in a state in which the tray support device is arranged in a direction parallel to the direction in which the tray support device is arranged on the side opposite to the inspection region with respect to the tray support device, and stores a plurality of trays in a stacked state in the vertical direction;
An IC handler, comprising: a tray transfer device that moves a tray between the stocker and the tray support device. The IC handler according to claim 1,
The component area is configured by a plurality of tray support devices that hold the tray so that movement is restricted,
A stocker that is provided in a state in which the tray support device is arranged in a direction parallel to the direction in which the tray support device is arranged on the side opposite to the inspection region with respect to the tray support device, and stores a plurality of trays in a stacked state in the vertical direction;
A tray transfer device for moving the tray between the stocker and the tray support device;
The stocker includes a tray loading / unloading port at the bottom, a holding position for holding the tray in the vicinity of the tray loading / unloading port, and a tray holding means that can move between a loading / unloading position that allows the tray to move downward,
The tray transfer device includes an elevating device that raises and lowers a tray in the stocker, and a conveyor that supports the tray below the stocker. In the IC handler according to any one of claims 1 to 3,
A plurality of component moving devices,
These component moving devices are arranged in a pair on both sides of the base, and an IC handler is characterized in that electronic components are alternately loaded in a socket for inspection. In the IC handler according to any one of claims 1 to 3,
The component moving device includes a suction head that moves the suction nozzle up and down and rotates it,
An IC handler comprising: a head unit that supports a plurality of the suction heads; and a moving device for the head unit that moves the head unit in a horizontal direction. The IC handler according to claim 1,
The component area is composed of a plurality of stockers that accommodate a plurality of trays stacked in the vertical direction,
This stocker is provided with an elevating device for raising and lowering the tray, an opening is provided at the uppermost portion, and an IC is provided with a tray transfer device for taking out the tray from this opening and transferring it to another stocker. Handler.

Images