TW202201621A - 基板載置方法及基板載置機構 - Google Patents

基板載置方法及基板載置機構 Download PDF

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Publication number
TW202201621A
TW202201621A TW110115491A TW110115491A TW202201621A TW 202201621 A TW202201621 A TW 202201621A TW 110115491 A TW110115491 A TW 110115491A TW 110115491 A TW110115491 A TW 110115491A TW 202201621 A TW202201621 A TW 202201621A
Authority
TW
Taiwan
Prior art keywords
substrate
mounting
lift pin
lift pins
lift
Prior art date
Application number
TW110115491A
Other languages
English (en)
Chinese (zh)
Inventor
邊見篤
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202201621A publication Critical patent/TW202201621A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW110115491A 2020-05-11 2021-04-29 基板載置方法及基板載置機構 TW202201621A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020083483A JP7438018B2 (ja) 2020-05-11 2020-05-11 基板載置方法及び基板載置機構
JP2020-083483 2020-05-11

Publications (1)

Publication Number Publication Date
TW202201621A true TW202201621A (zh) 2022-01-01

Family

ID=78415768

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115491A TW202201621A (zh) 2020-05-11 2021-04-29 基板載置方法及基板載置機構

Country Status (4)

Country Link
JP (1) JP7438018B2 (ja)
KR (1) KR102550838B1 (ja)
CN (1) CN113644021B (ja)
TW (1) TW202201621A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023165539A (ja) 2022-05-06 2023-11-16 東京エレクトロン株式会社 基板処理装置及び基板処理装置の製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
JP2000277587A (ja) 1999-03-29 2000-10-06 Kokusai Electric Co Ltd 基板搬送システム
KR20050001621A (ko) * 2003-06-26 2005-01-07 주성엔지니어링(주) 기판 지지핀 배치 방법
JP4080401B2 (ja) 2003-09-05 2008-04-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US20060005770A1 (en) 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
JP2008041969A (ja) * 2006-08-08 2008-02-21 Matsushita Electric Ind Co Ltd 基板の脱離方法
JP4795899B2 (ja) * 2006-08-31 2011-10-19 東京エレクトロン株式会社 基板載置機構および基板受け渡し方法
JP5561664B2 (ja) 2006-09-08 2014-07-30 株式会社 エスアンドデイ リフトピン機構
JP2008087890A (ja) 2006-09-29 2008-04-17 Fujifilm Corp 基板搬送方法及び基板搬送装置
JP4783762B2 (ja) * 2007-08-31 2011-09-28 東京エレクトロン株式会社 基板載置台および基板処理装置
TW201135372A (en) * 2009-10-20 2011-10-16 Nikon Corp Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method
JP5141707B2 (ja) 2010-03-24 2013-02-13 株式会社安川電機 被処理体の支持機構、支持方法およびそれを備えた搬送システム
WO2012147600A1 (ja) 2011-04-26 2012-11-01 シャープ株式会社 基板保持装置
JP5907681B2 (ja) 2011-08-02 2016-04-26 東京エレクトロン株式会社 基板受け渡し方法
JP2013258270A (ja) * 2012-06-12 2013-12-26 Tokyo Electron Ltd 基板載置台及び基板処理装置
JP2014120740A (ja) 2012-12-19 2014-06-30 Tokyo Electron Ltd 基板処理装置、及び基板の張り付け又は剥離方法
JP6487244B2 (ja) 2015-03-25 2019-03-20 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
TW201732997A (zh) 2016-01-18 2017-09-16 Ｈｏｙａ股份有限公司 基板保持裝置、描繪裝置、光罩檢查裝置、及光罩之製造方法
US10522385B2 (en) 2017-09-26 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer table with dynamic support pins
WO2019198537A1 (ja) 2018-04-11 2019-10-17 株式会社アルバック 基板保持装置、基板保持方法及び成膜装置
JP7115942B2 (ja) * 2018-09-06 2022-08-09 東京エレクトロン株式会社 載置台、基板処理装置、エッジリング及びエッジリングの搬送方法

Also Published As

Publication number Publication date
CN113644021B (zh) 2024-04-09
KR102550838B1 (ko) 2023-07-03
CN113644021A (zh) 2021-11-12
KR20210137908A (ko) 2021-11-18
JP7438018B2 (ja) 2024-02-26
JP2021180214A (ja) 2021-11-18

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