TW202201621A - Substrate mounting method and substrate mounting mechanism capable of suppressing deformation of the substrate - Google Patents

Abstract

Provided are a substrate mounting method and a substrate mounting mechanism that can suppress deformation of the substrate. The substrate mounting mechanism is provided with a first lifting pin arranged at the corner of the mounting area, a second lifting pin arranged at the central portion of the short side of the mounting area, a third lifting pin arranged at the central portion of the long side of the mounting area, and a fourth lifting pin arranged at the central portion of the surface of the mounting area. The substrate mounting method includes a step of supporting the substrate by the first to fourth lifting pins at least in a state where the fourth lifting pin is higher than the third lifting pin and the second lifting pin is higher than the fourth lifting pin; after the step of supporting the substrate, a step of accommodating the first to the fourth lifting pins on the mounting table to mount the substrate on the mounting area. The step of mounting the substrate on the mounting area is to mount the central portion of the long side of the substrate on the mounting surface, then mount the central portion of the surface of the substrate on the mounting surface, and then mount the central portion of the short side of the substrate on the mounting surface.

Description

Substrate mounting method and substrate mounting mechanism

The present disclosure relates to a substrate mounting method and a substrate mounting mechanism.

Patent Document 1 discloses a substrate transfer method, which comprises transferring a substrate to a mounting table, the mounting table being arranged in a processing chamber for performing plasma processing on the flexible substrate, and having a method of electrostatic adsorption. an electrostatic chuck for sucking the substrate; the mounting table is provided with: a substrate mounting surface, on which the substrate is mounted; a first lift pin, which is capable of appearing and retracting relative to the substrate mounting surface, and supports the peripheral portion of the substrate; and a second lift pin, which is capable of appearing and retracting relative to the substrate placement surface, and supports the central portion of the substrate; the substrate receiving and delivering method includes: causing the first lift pin to be moved by the first lift pin and positioned farther from the first lift pin A substrate placement process in which the substrate supported above the substrate placement surface is lowered by the second lift pin at the lower position, and the substrate is placed on the substrate placement surface from the center of the substrate; A process of adsorbing the substrate placed on the substrate placement surface by the electrostatic chuck and performing plasma treatment on the substrate; and releasing the adsorption by the electrostatic chuck after the plasma treatment is completed, and making the A substrate detachment step in which the first lift pins and the second lift pins are positioned at the same height to support the substrate so as to release the substrate from the substrate placement surface.

Patent Document 1: Japanese Patent Laid-Open No. 2013-33847

In one aspect, the present disclosure provides a substrate placement method and a substrate placement mechanism for suppressing deformation of a substrate when a flexible substrate is placed on a placement table.

In order to solve the above-mentioned problems, according to one aspect, a substrate mounting method is provided, wherein the substrate is mounted on a mounting table, the mounting table having a mounting surface on which the flexible and rectangular substrate is mounted; The mounting surface has a mounting area corresponding to the substrate; the mounting table is provided with: a first lift pin, which is provided in a corner of the mounting region so as to be in and out; and a second lift pin, which is provided in a retractable manner In the center of the short side of the placement area; a third lift pin is provided in the central part of the long side of the placement area so as to be in and out; and the fourth lift pin is provided in the surface of the placement area in a retractable manner a central part; the substrate mounting method comprises: at least in a state where the fourth lift pin is higher than the third lift pin and the second lift pin is higher than the fourth lift pin, by the first to a step of supporting the substrate by a fourth lift pin; and a step of accommodating the first to fourth lift pins in the mounting table to mount the substrate on the mounting area after the step of supporting the substrate; The step of placing the substrate on the placing area is to first place at least the central portion of the long side of the substrate on the placing surface, then place the central portion of the surface of the substrate on the placing surface, and then place the central portion of the substrate on the placing surface. The short-side central portion is placed on the placement surface.

According to one aspect, it is possible to provide a substrate mounting method and a substrate mounting mechanism for suppressing deformation of the substrate when the flexible substrate is mounted on the mounting table.

G: substrate

1: Substrate processing device

2: Chamber

4: Pedestal (mounting table)

4a: Substrate

4b: Insulating member

4c: Substrate mounting surface (mounting surface)

4d: Placement area

4e, 4f: Centerline

7,7a~7d: through hole

8: Lifting pin

8a: Lift pin (1st lift pin)

8b: Lift pin (2nd lift pin)

8c: Lift pin (3rd lift pin)

8d: Lift pin (4th lift pin)

9a~9d: Drive section

31: Controller

40: Electrostatic chuck

FIG. 1 is an example of a schematic cross-sectional view of a substrate processing apparatus.

FIG. 2 is an example of a schematic cross-sectional view in the plane direction of the substrate processing apparatus.

FIG. 3 is an example of a block diagram showing the configuration of a drive mechanism that drives the lift pins.

4 is a flowchart illustrating an example of a substrate receiving and receiving operation of the substrate processing apparatus.

5 is a timing chart showing an example of the movement of the lift pins during the substrate receiving and receiving operation of the substrate processing apparatus.

FIG. 6 is an example of a cross-sectional conceptual diagram of the substrate when it is received and transferred to the lift pins.

FIG. 7 is a diagram illustrating an example of substrate deflection.

Hereinafter, a form for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals may be assigned to the same components to omit overlapping descriptions.

<Substrate processing apparatus>

The substrate processing apparatus 1 of the present embodiment will be described with reference to FIGS. 1 to 3 . FIG. 1 is an example of a schematic cross-sectional view of a substrate processing apparatus 1 . The substrate processing apparatus 1 is an apparatus which places the substrate G on a mounting table and performs desired processing (eg, etching processing, etc.) on the substrate G. As shown in FIG. In addition, the mounting table is configured so that the temperature of the mounted substrate G can be adjusted (for example, cooled). The horizontal direction is referred to as the X direction, the horizontal direction orthogonal to the X direction is referred to as the Y direction, and the height direction is referred to as the Z direction.

In addition, the substrate G to be processed in the substrate processing apparatus 1 , in other words, the substrate G to be placed on the stage is a rectangular and flexible substrate in plan view. The substrate G may be, for example, a flexible rectangular glass substrate. In addition, the substrate G may be, for example, a thin-film glass substrate having a thickness of about 0.2 mm to several mm. In addition, the plane size of the substrate G may include at least a size of about 1500 mm×1800 mm for the sixth generation to a size of about 3000 mm×3400 mm for the 10.5th generation, for example.

The substrate processing apparatus 1 includes a chamber 2 that accommodates the substrate G as a processing container. The chamber 2 is made of, for example, aluminum whose surface has been anodized (anodized), and is formed in a rectangular cylindrical shape in accordance with the shape of the substrate G.

The bottom wall in the chamber 2 is provided with a susceptor 4 on which the substrate G is placed as a placing table. The susceptor 4 is formed in a square plate shape or a columnar shape according to the shape of the substrate G. The susceptor 4 has a base material 4 a made of a conductive material such as metal, and an insulating member 4 b provided between the bottom of the base material 4 a and the bottom surface of the chamber 2 . Substrate 4a A power supply line 23 for supplying high-frequency power is connected to the system. The power supply line 23 is connected to the high-frequency power supply 25 through the matching device 24 . The high-frequency power supply 25 applies, for example, a high-frequency power of 13.56 MHz to the base 4 . The matching unit 24 matches the output impedance of the high-frequency power supply 25 with the input impedance on the load side. Thereby, the structure of the base 4 has the function of the lower electrode.

In addition, the base 4 is provided with an electrostatic chuck 40 for attracting the mounted substrate G by electrostatic attraction. The electrostatic chuck 40 is provided on the upper portion of the substrate 4a. The electrostatic chuck 40 has a dielectric body 41 and an internal electrode 42 provided inside the dielectric body 41 . The inner electrode 42 is connected with a power supply line 43 for applying a voltage. The power supply line 43 is connected to the power source 45 through the switch 44 . The power supply 45 applies voltage to the inner electrodes 42 . Switch 44 turns the application of voltage on/off.

In addition, the upper surface of the susceptor 4 (the electrostatic chuck 40 ) becomes the substrate placement surface 4c on which the substrate G is placed. Moreover, the board|substrate mounting surface 4c has the outer edge part (not shown) which contact|connects the outer peripheral part of the inner surface of the board|substrate G, and the recessed part (not shown) formed inside the outer edge part. Moreover, the recessed part is comprised so that the heat transfer gas, such as He gas, may be supplied. The substrate G is electrostatically adsorbed by the electrostatic chuck 40, and the outer peripheral portion of the inner surface of the substrate G and the outer edge portion of the substrate placement surface 4c are airtightly adsorbed. In addition, by supplying He gas to the space formed as a gap between the inner surface of the substrate G and the recessed portion of the substrate mounting surface 4c, the substrate G mounted on the susceptor 4 can be cooled (adjusted in temperature). . In addition, a plurality of minute convex portions may be provided in the concave portion, and the substrate G may be supported by the outer edge portion and the convex portion.

The upper part or the upper wall of the chamber 2 is provided with the shower head 11 which supplies the process gas into the chamber 2 and has the function of the upper electrode so as to face the susceptor 4 . In the shower head 11 , a gas diffusion space 12 for diffusing the processing gas is formed therein, and a plurality of injection holes 13 for discharging the processing gas are formed on the lower surface or on the surface opposite to the susceptor 4 . The shower head 11 is grounded and forms a pair of parallel plate electrodes together with the base 4 . In addition, although this embodiment illustrates that the present disclosure is applicable to The present disclosure can also be applied to a substrate processing apparatus that generates plasma by inductive coupling, and of course, the present disclosure can also be applied to generating plasma by other methods. substrate processing equipment.

The upper surface of the shower head 11 is provided with a gas inlet 14 , and the gas inlet 14 is connected with a processing gas supply pipe 15 , and the processing gas supply pipe 15 is connected with the processing gas supply through the valve member 16 and the mass flow controller 17 . Source 18. For example, a process gas for etching is supplied from the process gas supply source 18 . As the processing gas system, halogen-based gas, O ₂ gas, Ar gas and other gases generally used in this field can be used.

An exhaust pipe 19 is connected to the bottom wall of the chamber 2 , and an exhaust device 20 is connected to the exhaust pipe 19 . The exhaust device 20 is provided with a vacuum pump such as a turbomolecular pump, and can thereby be configured to be able to evacuate the inside of the chamber 2 to a predetermined reduced pressure atmosphere. The side wall of the chamber 2 is formed with an unloading inlet 21 for carrying in and out of the substrate G, and a gate valve 22 for opening and closing the loading and unloading inlet 21 is provided. 2 ), which will be described later, is transported between transport chambers not shown that are adjacent to the permeation inlet 21 and the gate valve 22 in a state of being supported from below.

In the bottom wall of the chamber 2 and the susceptor 4, the outer peripheral portion and the central portion of the susceptor 4 are respectively formed with through holes penetrating through them. 7. In the insertion holes 7 , lift pins 8 that support and lift the substrate G from below are inserted into and out of the substrate placement surface 4 c of the base 4 , respectively. The lift pins 8 are respectively provided so as to contact the outer peripheral portion and the central portion of the substrate G when protruding, and are inserted into the insertion holes in a state of being positioned in the radial direction or the width direction by a positioning sleeve (not shown) within 7.

The lower part of the lift pin 8 protrudes outside the chamber 2 . The lower part of the lift pin 8 is formed with a flange 26, and the flange 26 is connected to one end (lower end) of a bellows 27 which is arranged to be retractable around the lift pin 8, and the other end (upper end) of the bellows 27 is Connected to the bottom wall of chamber 2. Alternatively, the bellows 27 can also be The other end (upper end) is connected to the bottom wall of the base 4 . Thereby, the bellows 27 expands and contracts following the lifting and lowering of the lift pins 8 , and seals the gap between the insertion holes 7 and the lift pins 8 .

Here, the arrangement of the insertion holes 7 and the lift pins 8 will be further described with reference to FIG. 2 . FIG. 2 is an example of a schematic cross-sectional view of the substrate processing apparatus 1 in the plane direction. In addition, in FIG. 2, the position of the conveyance arm 50 and the board|substrate G when the board|substrate G hold|maintained by the conveyance arm 50 is arrange|positioned above the mounting area 4d is shown by the two-dotted chain line.

As shown in FIG. 2, the board|substrate G and the board|substrate mounting surface 4c of the susceptor 4 on which the board|substrate G is mounted have the rectangular shape which has a short side (Y direction) and a long side (X direction) in planar view. Moreover, the board|substrate mounting surface 4c has the mounting area|region 4d corresponding to the board|substrate G (indicated by the dotted line in FIG. 2). When the substrate G is placed on the susceptor 4, the substrate G is placed on the placement region 4d. In addition, in FIG. 2, the center line 4e (the line connecting the midpoint of one long side and the midpoint of the other long side) and the center line 4f (connecting the short side on one side) of the placement area 4d are indicated by a one-dot chain line. The line between the midpoint of the side and the midpoint of the short side on the other side). In addition, in FIG. 2 , although the dotted line indicating the placement area 4d is drawn on the inside of the two-dot chain line indicating the substrate G for convenience, it does not mean that the placement area 4d is limited to the inner side than the outer periphery of the substrate G. , but it is desirable that the placement region 4d will have the same shape and the same area as the substrate G. In addition, the mounting region 4d may be a region having a shape and an area that encloses the substrate G.

The base 4 has insertion holes 7 a to 7 d as the insertion holes 7 . The insertion holes 7a-7c are provided in the outer peripheral part of the mounting area 4d. The insertion hole 7d is provided in the surface center part of the mounting area 4d surrounded by the outer peripheral part of the mounting area 4d. The insertion holes 7 a to 7 d are provided with lift pins 8 a to 8 d as lift pins 8 .

The corners of the rectangular mounting region 4d are provided with penetration holes 7a. In the example shown in FIG. 2 , four insertion holes 7a are provided in the placement region 4d with the center line 4e and the center line 4f as axes of symmetry. Lift pins 8a are arranged in the respective insertion holes 7a, respectively. Hereinafter, the four lift pins 8a will be referred to as the first group Gr.1.

The insertion hole 7b is provided in the center part of the short sides of the rectangular mounting area 4d (between two corners on the left and right (Y direction) with the center line 4f as the axis of symmetry). In the example shown in FIG. 2, two insertion holes 7b are provided in the central part of one short side with the center line 4f as the axis of symmetry. Similarly, the center part of the other short side is provided with two insertion holes 7b with the center line 4f as the axis of symmetry. Four insertion holes 7b are provided in the placement area 4d. Lift pins 8b are arranged in each of the insertion holes 7b, respectively. Hereinafter, the four lift pins 8b will be referred to as the second group Gr.2.

The insertion hole 7c is provided in the center part of the long sides of the rectangular mounting area 4d (between the front and rear (X direction) two corners with the center line 4e as the axis of symmetry). In the example shown in FIG. 2 , a through hole 7c is formed on the center line 4e of the center portion of one long side. Similarly, an insertion hole 7c is provided in the center portion of the other long side tied to the center line 4e. Two insertion holes 7c are provided in the mounting area 4d. Lift pins 8c are arranged in the respective insertion holes 7c, respectively. Hereinafter, the two lift pins 8c will be referred to as the third group Gr.3.

A penetration hole 7d is provided in the center part of the surface in the vicinity of the center of the rectangular-shaped mounting area 4d. In the example shown in FIG. 2 , two through holes 7d are provided on the center line 4e, and the center line 4f is used as the axis of symmetry. The lift pins 8d are arranged in each of the insertion holes 7d, respectively. Hereinafter, the two lift pins 8d are referred to as the fourth group Gr.4.

FIG. 3 is an example of a block diagram showing the configuration of a drive mechanism that drives the lift pins 8a to 8d.

The lift pins 8a to 8d are connected to the drive parts 9a to 9d, respectively. The lift pins 8 a to 8 d are configured to be raised and lowered by the driving of the drive units 9 a to 9 d, and to protrude and sink with respect to the substrate placement surface 4 c of the base 4 . The drive units 9a to 9d are each configured using, for example, a stepping motor. In addition, as shown in FIG. 3 , although the lift pins 8a to 8d have been described as being configured to be individually drivable, the present invention is not limited to this, and may be configured so that each group (the first group Gr. 1 ~4th group Gr.4) are driven separately. According to this configuration, the number of drive units (stepping motors) can be reduced.

The drive systems of the drive units 9a to 9d are individually controlled by the controller 31 provided with a microprocessor (computer), whereby the lift pins 8a to 8d are configured to be able to move up and down independently of each other. controller 31 is connected to a user interface 32 and a memory unit 33, and the user interface 32 is a keyboard for performing command input operations, etc., so that the process manager can manage the driving of the driving units 9a to 9d, or to control the driving of the driving units 9a to 9d. The memory unit 33 is composed of a display or the like that visualizes and displays the driving conditions, and the memory unit 33 stores a database in which a control program or driving condition data and the like that realize the driving of the driving units 9a to 9d under the control of the controller 31 are recorded. In addition, by calling an arbitrary database from the memory unit 33 and executing it by the controller 31 by an instruction or the like from the user interface 32 as required, the drive units 9a to 9d can be controlled under the control of the controller 31. Drive and stop. The database can be used, for example, by using the state stored in a computer-readable storage medium such as CD-ROM, hard disk, and flash memory, or by being transmitted from other devices at any time through a dedicated line, for example.

The controller 31, the user interface 32 and the memory unit 33 constitute a control unit that controls the lifting and lowering of the lift pins 8a-8d caused by the drive units 9a-9d. The base 4, the lift pins 8a-8d, and the drive units 9a-9d and the control unit constitute a substrate placement mechanism.

Next, the board|substrate transfer method (mounting method) which transfers the board|substrate G in the board|substrate processing apparatus 1 to the base 4 is demonstrated using FIG.4 and FIG.5.

FIG. 4 is a flowchart illustrating an example of the substrate receiving and receiving operation of the substrate processing apparatus 1 . FIG. 5 is a timing chart showing an example of the operation of the lift pins 8 during the substrate receiving and receiving operation of the substrate processing apparatus 1 .

In step S101, the substrate G held by the transfer arm 50 is transferred to the lift pins 8a-8d. Specifically, the controller 31 causes the gate valve 22 to open. Next, the controller 31 controls the transfer arm 50 to insert the transfer arm 50 holding the substrate G into the chamber 2 from the unloading inlet 21 to transfer the substrate G above the susceptor 4 . Next, the controller 31 controls the drive units 9 a to 9 d so that the lift pins 8 a to 8 d protrude higher than the conveyance arm 50 . Thereby, the board|substrate G is conveyed from the conveyance arm 50 to the lift pins 8a-8d. In addition, as shown in Figure 2, the lift The pins 8 a to 8 d are arranged so as not to come into contact with the transfer arm 51 . Next, the controller 31 controls the transfer arm 50 to withdraw the transfer arm 50 from the carry-out entrance 21 . Next, the controller 31 closes the gate valve 22 .

Here, as shown in FIG. 5 , the heights of the lift pins 8a to 8d supporting the substrate G are defined as “the height of the lift pins 8c of the third group Gr.3<the height of the lift pins 8d of the fourth group Gr.4 <The height of the lift pin 8b of the second group Gr.2 <the height of the lift pin 8a of the first group Gr.1" is offset.

In addition, the lift pins 8a to 8d may be moved upward in a batch after forming an offset relationship between the lift pins 8a to 8d on the lower side of the conveying arm 50 . Therefore, the lift pins 8a of the first group Gr.1, the lift pins 8b of the second group Gr.2, the lift pins 8d of the fourth group Gr.4, and the lift pins 8d of the third group Gr.3 The lift pins 8c come into contact with the substrate G in sequence.

Alternatively, the lift pins 8a to 8d may be raised at the same time, and the offset relationship between the lift pins 8a to 8d may be formed by stopping at predetermined heights, respectively, and then the substrate G may be transferred from the transfer arm 50 to the lift pins 8a to 8d. . Thereby, the lift pins 8a of the first group Gr.1, the lift pins 8b of the second group Gr.2, the lift pins 8c of the third group Gr.3, and the lift pins 8d of the fourth group Gr.4 It will contact with the substrate G at the same time, and then rise again. Then, the lift pins 8c of the third group Gr.3, the lift pins 8d of the fourth group Gr.4, the lift pins 8b of the second group Gr.2, and the lift pins of the first group Gr.1 will be raised and lowered. sequence of pins 8a to stop.

Here, the shape of the board|substrate G when it is conveyed to the lift pins 8a-8d is demonstrated using FIG. 6. FIG. FIG. 6 is an example of a conceptual cross-sectional view of the substrate G when it is received and received to the lift pins 8a to 8d. FIG.6(A) is the figure which looked at the board|substrate G from the short side, and FIG.6(B) is the figure which looked at the board|substrate G from the long side. In addition, in FIG. 6, the deflection of the board|substrate G is shown exaggeratedly.

The cross-sectional conceptual diagram 201 of FIG. 6(A) is a schematic diagram of the A-A cross-section of the substrate G (refer to FIG. 2 ). In the AA section, the substrate G is supported so that the center of the long side of the substrate G supported by the lift pins 8c of the third group Gr.3 is higher than the substrate G supported by the lift pins 8d of the fourth group Gr.4 The central part of the face should be lower. In other words That is to say, the substrate G is formed in such a shape that the central portion of the surface is higher than the central portion of the longer side on the line connecting the central portion of the long side of the long side of the substrate G and the central portion of the long side of the long side of the substrate G. are supported on lift pins 8 .

The cross-sectional conceptual diagram 202 of FIG. 6(A) is a schematic diagram of the B-B cross-section of the substrate G (refer to FIG. 2 ). In the BB section, the board G is supported so that the short-side central portion of the board G supported by the lift pins 8b of the second group Gr.2 is higher than the board G supported by the lift pins 8a of the first group Gr.1 The corners should be lower. In other words, the substrate G is supported by the lift pins 8 in such a shape that the short side of the outer peripheral side of the substrate G becomes higher from the center portion of the short side toward the corner portion.

The cross-sectional conceptual diagram 203 of FIG. 6(B) is a schematic diagram of the C-C cross-section of the substrate G (refer to FIG. 2 ). In the CC section, the board G is supported so that the center of the long side of the board G supported by the lift pins 8c of the third group Gr.3 is higher than the board G supported by the lift pins 8a of the first group Gr.1 The corners should be lower. In other words, the substrate G is supported by the lift pins 8 in such a shape that the long sides on the outer peripheral side of the substrate G become higher from the center of the long sides toward the corners.

The cross-sectional conceptual diagram 204 of FIG. 6(B) is a schematic diagram of the D-D cross-section of the substrate G (refer to FIG. 2 ). In the DD section, the substrate G is supported so that the center portion of the surface of the substrate G supported by the lift pins 8d of the fourth group Gr.4 is higher than the substrate G supported by the lift pins 8b of the second group Gr.2. The center of the short side should be lower. In other words, the substrate G is on a line connecting the short-side central portion of the short side of the substrate G and the short-side central portion of the other short side of the substrate G, and the height from the surface central portion toward the short-side central portion is increased. The shape comes to be supported on the lift pins 8.

Returning to FIG. 4 , in step S102, the controller 31 controls the drive units 9a to 9d to lower the lift pins 8a to 8d. Here, as shown in FIG. 6 , the controller 31 lowers the lift pins 8a to 8d while maintaining the height deviation of the lift pins 8a to 8d. Next, in step S103, according to the height deviation of the lift pins 8a-8d The lift pins 8c of the third group Gr.3 are accommodated in the insertion holes 7c according to the difference in displacement. Thereby, the center part of the long side of the board|substrate G is mounted on the board|substrate mounting surface 4c of the base 4 first.

In step S104, the controller 31 controls the drive unit 9d to lower the lift pins 8d. At this time, the lift pins 8a and the lift pins 8b stop at the height of step S103. In addition, the lift pin 8c is accommodated in the insertion hole 7c, and stops at the height at the time of step S103. Next, in step S105, the lift pins 8d of the fourth group Gr. 4 are accommodated in the insertion holes 7d. Thereby, the center part of the surface of the board|substrate G is mounted on the board|substrate mounting surface 4c of the base 4 in the second order.

In step S106, the controller 31 controls the drive parts 9a, 9b to lower the lift pins 8a, 8b. Here, as shown in FIG. 6, the controller 31 lowers the lift pins 8a, 8b while maintaining the height deviation of the lift pins 8a, 8b. In addition, the lift pins 8c, 8d are accommodated in the insertion holes 7c, 7d, respectively, and stop at the height at the time of step S105. Next, in step S107, the lift pins 8b of the second group Gr. 2 are accommodated in the insertion holes 7b according to the difference in height offset of the lift pins 8a, 8b. Thereby, the short-side central portion of the substrate G is placed on the substrate placement surface 4c of the base 4 in the third order.

In step S108, the controller 31 controls the drive unit 9a to lower the lift pins 8a. In addition, the lift pins 8b to 8d are accommodated in the insertion holes 7b to 7d, respectively, and stop at the height in step S107. Next, in step S109, the lift pins 8a of the first group Gr.1 are accommodated in the insertion holes 7a. Thereby, the corner portion of the substrate G is finally placed on the substrate placement surface 4c of the base 4 .

FIG. 7 is a diagram illustrating an example of the deflection of the substrate G. FIG. The upper part in FIG. 7 shows the deflection of the substrate G in a quarter area divided by the center line 4e and the center line 4f by the contour lines and the shades between the contour lines. Here, the lower left is the center (Center) of the board G. That is, the upper right corresponds to the corner of the substrate G, the upper left corresponds to the center of the short side of the substrate G, the lower right corresponds to the center of the long side of the substrate G, and the lower left corresponds to the center of the surface of the substrate G. In addition, the deflection of the board G is determined by the height of the lift pins 8a As a reference (0), the deflection becomes denser (the dots are denser) as it goes downward, and the deflection becomes weaker (the dots are sparser) as it goes up. In addition, the lower stage in FIG. 7 schematically shows the state of the substrate G in each state in the A-A cross section.

In addition, FIG. 7(A) shows the state in which the board|substrate G is conveyed to the lift pins 8 (refer to step S101). FIG.7(B) shows the state which the center part of the long side of the board|substrate G is mounted on the board|substrate mounting surface 4c (refer step S103). FIG.7(C) shows the state which the surface center part of the board|substrate G is mounted on the board|substrate mounting surface 4c (refer step S105).

In step S101, the value of "the height of the lift pin 8c of the third group Gr.3 < the height of the lift pin 8d of the fourth group Gr.4 < the height of the lift pin 8b of the second group Gr.2 < the height of the lift pin 8b of the second group Gr.2 The substrate G is supported by offsetting the height of the lift pins 8a of the 1 group Gr.1". As a result, as shown in FIG. 7(A), the substrate G is held in the position of "the height of the central portion of the long side of the substrate G < the height of the central portion of the surface of the substrate G < the height of the central portion of the short side of the substrate G < the substrate The height of the corner of G" is in a state of flexing.

In step S103, the center portion 301 of the long side of the substrate G is placed first. In this state, as shown in FIG.7(B), the center part of the surface of the board|substrate G floats.

In step S104, the lift pins 8d of the fourth group Gr.4 are lowered while the lift pins 8a of the first group Gr.1 and the lift pins 8b of the second group Gr.2 are stopped. Thereby, as shown in FIG.7(C), the floating of the surface center part 302 of the board|substrate G can be cancelled|released, and the surface center part 302 of the board|substrate G can be mounted. Thereby, the board|substrate G can be mounted on the base 4 along the center line 4e (refer FIG. 2) which passes the center of the long side of the board|substrate G.

After that, by placing the substrate G on the base 4 in the order of the center portion of the short side and the corner portion of the substrate G, it is possible to prevent the substrate G from being placed in a convexly deformed shape.

As described above, according to the substrate processing apparatus 1 having the substrate placing mechanism according to the present embodiment, when placing the substrate G on the susceptor 4, the center of the long side of the substrate G, which is likely to be deformed in a convex shape, passes through the center of the long side. By placing the part on the base 4, the convex deformation of the central part of the long side of the substrate G can be suppressed. Moreover, by providing the short-side center part of the board|substrate G rather than the corner part of the board|substrate G, the convex deformation of the short-side center part of the board|substrate G can be suppressed. Thereby, the outer peripheral part of the inner surface of the board|substrate G and the outer edge part of the board|substrate mounting surface 4c of the susceptor 4 are sucked airtightly. Thereby, when the He gas is supplied between the inner surface of the substrate G and the concave portion of the substrate mounting surface 4c, it is possible to prevent the generation of leakage of the He gas.

In addition, when the center part of the surface of the substrate G is placed on the base 4, the lift pins 8a of the first group Gr.1 and the lift pins 8b of the second group Gr. The lift pin 8d of the group Gr.4 descends. Thereby, the board|substrate G can be mounted on the base 4, suppressing the convex shape deformation of the surface center part of the board|substrate G. Thereby, the space volume between the inner surface of the board|substrate G and the recessed part of the board|substrate mounting surface 4c can be prevented from increasing.

Although the substrate processing apparatus 1 has been described above, the present disclosure is not limited to the above-described embodiments and the like, and various modifications and improvements can be made within the scope of the gist of the present disclosure described in the scope of claims.

S101: Transfer the substrate to the lift pins, and configure the pins (Gr.3<Gr.4<Gr.2<Gr.1)

S102: Gr.1~Gr.4 drop

S103: Gr.3 storage completed (placed in the center of the long side)

S104: Only Gr.4 drops

S105: Gr.4 storage completed (central part of the mounting surface)

S106: Gr.1, Gr.2 drop

S107: Gr.2 completed storage (placed at the center of the short side)

S108: Gr.1 drop

S109: Gr.1 completed storage (placement corner)

Claims (5)

A substrate mounting method, comprising mounting a substrate on a mounting table, the mounting table having a mounting surface for mounting the flexible and rectangular substrate; the placement surface has a placement area corresponding to the substrate; The stage is equipped with: The first lift pin is provided at the corner of the placement area so as to be infestable; The second lift pin is provided in the central part of the short side of the placing area so as to be able to appear and fall; A third lift pin is provided at the center of the long side of the mounting area so as to be able to appear and fall; and The fourth lift pin is provided in the central part of the surface of the placing area so as to be able to appear and fall; The substrate mounting method includes: A step of supporting the substrate by the first to fourth lift pins at least in a state where the fourth lift pin is higher than the third lift pin and the second lift pin is higher than the fourth lift pin; as well as After the step of supporting the substrate, the step of accommodating the first to fourth lift pins on the mounting table to mount the substrate on the mounting area; The step of placing the substrate on the placing area is to place at least the central portion of the long side of the substrate on the placing surface, then place the central portion of the surface of the substrate on the placing surface, and then place the central portion of the substrate on the placing surface. The short-side central portion of the substrate is placed on the placement surface. The substrate mounting method of claim 1, wherein the step of supporting the substrate is to support the substrate in a state where the first lift pins are higher than the second lift pins; In the step of placing the substrate on the placing area, after the center portion of the short side of the substrate is placed on the placing surface, the corner portion of the substrate is placed on the placing surface. According to the substrate mounting method of claim 1 or 2, wherein the step of mounting the substrate on the mounting area is after the center portion of the long side of the substrate is mounted on the mounting surface, and then the substrate is mounted on the mounting surface. When the center portion of the surface of the substrate is placed on the placement surface, the fourth lift pin is lowered and the first lift pin and the second lift pin are stopped. The substrate mounting method according to any one of the claims 1 to 3, wherein the first lift pin, the second lift pin, the third lift pin, and the fourth lift pin are installed independently of each other drive. A substrate placement mechanism is provided with: a mounting table having a mounting surface on which a flexible rectangular substrate can be mounted, and lift pins provided so as to be able to protrude from the mounting surface; a driving part for driving the lift pin; and a control part, which controls the driving part; the placement surface has a placement area corresponding to the substrate; The lift pin is provided with a first lift pin that can be retracted at the corner of the mounting area, a second lift pin that can be mounted at the center of the short side of the mounting area, and a A third lift pin at the center of the long side of the placement area, and a fourth lift pin that can be installed in the center of the surface of the placement area; The control unit will control the drive unit to perform the following processes: A step of supporting the substrate by the first to fourth lift pins at least in a state where the fourth lift pin is higher than the third lift pin and the second lift pin is higher than the fourth lift pin; as well as After the step of supporting the substrate, the step of accommodating the first to fourth lift pins on the mounting table to mount the substrate on the mounting area; The step of placing the substrate on the placing area is to place at least the central portion of the long side of the substrate on the placing surface, then place the central portion of the surface of the substrate on the placing surface, and then place the central portion of the substrate on the placing surface. The short-side central portion of the substrate is placed on the placement surface.

Images