TW202130770A - 黏接劑組成物、黏接片、疊層體、以及印刷配線板 - Google Patents

黏接劑組成物、黏接片、疊層體、以及印刷配線板 Download PDF

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Publication number
TW202130770A
TW202130770A TW109141235A TW109141235A TW202130770A TW 202130770 A TW202130770 A TW 202130770A TW 109141235 A TW109141235 A TW 109141235A TW 109141235 A TW109141235 A TW 109141235A TW 202130770 A TW202130770 A TW 202130770A
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TW
Taiwan
Prior art keywords
adhesive composition
mass
resin
parts
less
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TW109141235A
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English (en)
Chinese (zh)
Inventor
薗田遼
川楠哲生
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日商東洋紡股份有限公司
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Publication of TW202130770A publication Critical patent/TW202130770A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/46—Reaction with unsaturated dicarboxylic acids or anhydrides thereof, e.g. maleinisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/02—Condensation polymers of aldehydes or ketones only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/02—Condensation polymers of aldehydes or ketones only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW109141235A 2019-11-29 2020-11-25 黏接劑組成物、黏接片、疊層體、以及印刷配線板 TW202130770A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019216783 2019-11-29
JP2019-216783 2019-11-29

Publications (1)

Publication Number Publication Date
TW202130770A true TW202130770A (zh) 2021-08-16

Family

ID=76130512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109141235A TW202130770A (zh) 2019-11-29 2020-11-25 黏接劑組成物、黏接片、疊層體、以及印刷配線板

Country Status (5)

Country Link
JP (1) JP6919777B1 (ja)
KR (1) KR20220107147A (ja)
CN (1) CN114514300B (ja)
TW (1) TW202130770A (ja)
WO (1) WO2021106848A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022014531A1 (ja) * 2020-07-17 2022-01-20 東洋紡株式会社 接着剤組成物、接着シート、積層体およびプリント配線板
JP2022108927A (ja) * 2021-01-14 2022-07-27 味の素株式会社 樹脂組成物
JP2022108928A (ja) * 2021-01-14 2022-07-27 味の素株式会社 樹脂組成物
KR20240031943A (ko) 2021-07-09 2024-03-08 도요보 엠씨 가부시키가이샤 접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판

Family Cites Families (22)

* Cited by examiner, † Cited by third party
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JP2002053730A (ja) * 2000-08-10 2002-02-19 Kansai Paint Co Ltd ラミネート用樹脂組成物
JP4020632B2 (ja) * 2001-12-10 2007-12-12 京セラケミカル株式会社 エポキシ樹脂組成物および半導体装置
JP2004161828A (ja) * 2002-11-11 2004-06-10 Nippon Steel Chem Co Ltd フィルム形成用樹脂組成物及びフィルム状接着剤
JP3887358B2 (ja) * 2003-07-30 2007-02-28 日本油脂株式会社 架橋性樹脂組成物、架橋性樹脂成形品および難燃性架橋樹脂成形品
JP2007001291A (ja) * 2005-05-27 2007-01-11 Hitachi Chem Co Ltd 接着補助剤付金属箔、およびこれを用いたプリント配線板およびその製造方法
JP2007112848A (ja) * 2005-10-18 2007-05-10 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いたカバーレイフィルム、金属張積層板
KR101082448B1 (ko) * 2007-04-30 2011-11-11 주식회사 엘지화학 접착 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름
SG11201502157VA (en) * 2012-10-26 2015-05-28 Mitsubishi Gas Chemical Co Method for producing cyanogen halide, cyanateester compound and method for producing the same,and resin composition
JPWO2014147903A1 (ja) 2013-03-22 2017-02-16 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
US10017604B2 (en) * 2013-04-19 2018-07-10 Dic Corporation Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board
KR101899265B1 (ko) * 2014-06-11 2018-09-14 도요보 가부시키가이샤 폴리올레핀계 접착제 조성물
JP6645431B2 (ja) * 2014-08-27 2020-02-14 東洋紡株式会社 低誘電接着剤組成物
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JP6998739B2 (ja) * 2017-11-16 2022-02-10 群栄化学工業株式会社 アリル基含有カーボネート樹脂、その製造方法、樹脂ワニス、および積層板の製造方法
JP6947611B2 (ja) * 2017-11-16 2021-10-13 群栄化学工業株式会社 フェノールカーボネート樹脂、エポキシ樹脂硬化剤、フェノールカーボネート樹脂の製造方法、樹脂ワニス、および積層板の製造方法
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
CN108753220B (zh) * 2018-06-26 2021-01-05 长春峰泰汽车胶业有限公司 一种耐高温、耐溶剂的酚醛树脂胶片
CN110483714A (zh) * 2019-09-05 2019-11-22 河南工业大学 一种耐中温酚醛树脂胶黏剂的制备方法

Also Published As

Publication number Publication date
WO2021106848A1 (ja) 2021-06-03
CN114514300B (zh) 2023-11-14
KR20220107147A (ko) 2022-08-02
JPWO2021106848A1 (ja) 2021-12-02
JP6919777B1 (ja) 2021-08-18
CN114514300A (zh) 2022-05-17

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