TW202045356A - 介質、及使用上述介質之積層陶瓷電容器之製造方法 - Google Patents

介質、及使用上述介質之積層陶瓷電容器之製造方法 Download PDF

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Publication number
TW202045356A
TW202045356A TW109102208A TW109102208A TW202045356A TW 202045356 A TW202045356 A TW 202045356A TW 109102208 A TW109102208 A TW 109102208A TW 109102208 A TW109102208 A TW 109102208A TW 202045356 A TW202045356 A TW 202045356A
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TW
Taiwan
Prior art keywords
medium
group
adhesive
compound
glass plate
Prior art date
Application number
TW109102208A
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English (en)
Chinese (zh)
Inventor
大和洋
岩谷真男
Original Assignee
日商大賽璐股份有限公司
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Publication date
Application filed by 日商大賽璐股份有限公司 filed Critical 日商大賽璐股份有限公司
Publication of TW202045356A publication Critical patent/TW202045356A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/10—Homopolymers or copolymers of unsaturated ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW109102208A 2019-01-25 2020-01-21 介質、及使用上述介質之積層陶瓷電容器之製造方法 TW202045356A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019010837A JP2020116864A (ja) 2019-01-25 2019-01-25 媒体、及び前記媒体を用いた積層セラミックコンデンサの製造方法
JPJP2019-010837 2019-01-25

Publications (1)

Publication Number Publication Date
TW202045356A true TW202045356A (zh) 2020-12-16

Family

ID=71736155

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102208A TW202045356A (zh) 2019-01-25 2020-01-21 介質、及使用上述介質之積層陶瓷電容器之製造方法

Country Status (3)

Country Link
JP (1) JP2020116864A (ja)
TW (1) TW202045356A (ja)
WO (1) WO2020153258A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240011801A (ko) * 2021-06-30 2024-01-26 코니카 미놀타 가부시키가이샤 편광판 및 액정 표시 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4250276B2 (ja) * 1999-10-20 2009-04-08 三菱樹脂株式会社 プラスチックフィルム・ガラスフィルム積層体及びその製造方法
CN101925456B (zh) * 2008-01-25 2013-10-16 旭硝子株式会社 玻璃树脂复合体的制造方法
TWI547369B (zh) * 2011-05-27 2016-09-01 康寧公司 玻璃塑膠積層之裝置、處理線、及方法
JP2013037207A (ja) * 2011-08-09 2013-02-21 Nitto Denko Corp 表示装置用保護基板
KR101688716B1 (ko) * 2012-05-23 2016-12-21 코니카 미놀타 가부시키가이샤 편광판, 편광판의 제조 방법 및 화상 표시 장치
JP2014065169A (ja) * 2012-09-25 2014-04-17 Nippon Electric Glass Co Ltd 展示物カバー用ガラスフィルム積層体
JP6400005B2 (ja) * 2013-07-09 2018-10-03 株式会社Adeka カチオン重合性組成物
JP6318836B2 (ja) * 2014-05-15 2018-05-09 三菱ケミカル株式会社 転写用基材及び転写シート
JP6728982B2 (ja) * 2016-05-27 2020-07-22 三菱ケミカル株式会社 ガラス積層体の製造方法
WO2019021557A1 (ja) * 2017-07-28 2019-01-31 株式会社ダイセル 積層体、及び前記積層体を備えたフレキシブルデバイス

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Publication number Publication date
WO2020153258A1 (ja) 2020-07-30
JP2020116864A (ja) 2020-08-06

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