TW202024765A - 鏡頭模組及其組裝方法 - Google Patents

鏡頭模組及其組裝方法 Download PDF

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TW202024765A
TW202024765A TW108100103A TW108100103A TW202024765A TW 202024765 A TW202024765 A TW 202024765A TW 108100103 A TW108100103 A TW 108100103A TW 108100103 A TW108100103 A TW 108100103A TW 202024765 A TW202024765 A TW 202024765A
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circuit board
lens
mounting bracket
photosensitive chip
lens module
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陳信文
張龍飛
樊珂華
李堃
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大陸商三贏科技（深圳）有限公司
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Abstract

本發明提出一種鏡頭模組及其組裝方法，該鏡頭模組的組裝方法包括：於電路板上開設第一通孔並將感光晶片裝設於第一通孔內；於電路板的一側安裝複數圍繞感光晶片的金手指，於感光晶片的邊緣設置多根金屬導線，並將金屬導線與金手指對應連接；於金屬導線外包裹膠體，並固化膠體使多根金屬導線之間互不接觸；將一安裝支架固定於電路板上，並將安裝支架與感光晶片相對設置；將一濾光片固定於安裝支架遠離電路板的一側，並將濾光片與感光晶片相對設置；將鏡頭裝設於鏡座中；以及將鏡座固定於安裝支架遠離電路板的一側，並將鏡頭與感光晶片相對設置。本發明能夠防止金屬導線斷裂與互相接觸，並提高成像畫面的品質。

Description

鏡頭模組及其組裝方法
本發明涉及攝像領域，尤其涉及一種鏡頭模組及其組裝方法。
人們對手機拍照性能的要求越來越高，鏡頭成像品質成為衡量手機性能的重要指標之一。目前市場上大多數的手機鏡頭模組一般包括一鏡頭、一鏡座、一安裝支架、一濾光片、一感光晶片以及一電路板。組裝時，感光晶片設有多根金屬導線，每根金屬導線分別與電路板連接。然而，金屬導線較長時，可能發生斷開或互相接觸的現象，導致模組電性不良。並且，當鏡頭於特定角度和強光之下拍攝時，強光會穿過濾光片照到金屬導線上，進而反射到感光晶片上，從而形成雜光，影響了成像畫面的品質，降低了清晰度。
鑒於上述狀況，實有必要提供一種鏡頭模組及其組裝方法，以解決上述問題。
本發明提供一種鏡頭模組的組裝方法，包括以下步驟：提供一電路板及一感光晶片，於所述電路板上開設第一通孔並將所述感光晶片裝設於所述第一通孔內；於所述電路板的一側安裝複數圍繞所述感光晶片的金手指，於所述感光晶片的邊緣設置多根金屬導線，並將所述金屬導線與所述金手指對應連接；於所述金屬導線外包裹膠體，並固化所述膠體使多根所述金屬導線之間互不接觸；將一安裝支架固定於所述電路板上，並將所述安裝支架與所述感光晶片相對設置；將一濾光片固定於所述安裝支架遠離所述電路板的一側，並將所述濾光片與所述感光晶片相對設置；提供一鏡頭以及一鏡座，將所述鏡頭裝設於所述鏡座中；以及將所述鏡座固定於所述安裝支架遠離所述電路板的一側，並將所述鏡頭與所述感光晶片相對設置，從而得到所述鏡頭模組。
本發明還提供一種鏡頭模組，包括一電路板、一感光晶片、一安裝支架、一濾光片、一鏡座及一鏡頭，所述電路板開設有第一通孔，所述感光晶片裝設於所述第一通孔內；所述電路板的一側安裝有複數圍繞所述感光晶片設置的金手指，所述感光晶片的邊緣設置多根金屬導線，且每根所述金屬導線與對應的所述金手指連接；所述金屬導線外包裹有膠體以使多根所述金屬導線之間互不接觸；所述安裝支架固定於所述電路板上，所述濾光片固定於所述安裝支架遠離所述電路板的一側並與所述感光晶片相對設置；所述鏡座固定於所述安裝支架遠離所述電路板的一側，所述鏡頭安裝於所述鏡座中並與所述感光晶片相對設置。
相較於先前技術，本發明提供的鏡頭模組及其組裝方法於金屬導線上包裹一層膠體，有利於防止金屬導線斷裂與互相接觸，並能避免因強光照到金屬導線上，進而反射到感光晶片上形成雜光，提高了穩定性與成像畫面的品質。
以下將結合圖示之具體實施方式對本創作進行詳細描述。但該等實施方式並不限制本創作，本領域之普通技術人員根據該等實施方式所做出的結構、方法、或功能上之變換均包含於本創作之保護範圍內。
請參見圖1，本發明的實施例提供一種鏡頭模組的組裝方法，包括如下步驟：
步驟S101：提供一電路板及一感光晶片，於電路板上開設第一通孔，並將感光晶片裝設於第一通孔內。
其中，電路板可為陶瓷基板、軟板、硬板或軟硬結合板。於本實施例中，電路板為軟板。感光晶片可為互補金屬氧化物半導體（CMOS）晶片或電荷耦合元件（CCD）晶片。
步驟S102：於電路板的一側安裝複數圍繞感光晶片的金手指，於感光晶片的邊緣設置多根金屬導線，並將金屬導線與金手指對應連接。
具體地，可採用電導率較高的金屬製備金屬導線，例如金。
步驟S103：於電路板設有金手指的一側上安裝複數電子元件。
步驟S104：於電路板背離金手指的一側設置一補強板，並將感光晶片固定於補強板上。
步驟S105：於金屬導線外包裹膠體，並固化膠體使多根金屬導線之間互不接觸。
其中，包裹膠體時，可為於每根金屬導線外分別塗一膠體，也可為於多根金屬導線外塗一膠體，只要控制膠體固化後，多根金屬導線被包裹且互不接觸。步驟S105用於防止金屬導線斷裂與互相接觸，並能避免強光照到金屬導線上，進而反射到感光晶片上，形成雜光，影響成像畫面的品質。
步驟S106：將一安裝支架固定於電路板上，並將安裝支架與感光晶片相對設置。
具體地，安裝支架大致為方形，於安裝支架上開設一第二通孔，並使第二通孔的內壁向第二通孔的中心軸方向延伸形成一凸緣。
步驟S107：將一濾光片固定於安裝支架遠離電路板的一側，並將濾光片與感光晶片相對設置。
具體地，將濾光片固定於凸緣遠離感光晶片的一面上，並使濾光片遠離電路板的表面與安裝支架遠離電路板的表面大致齊平。
步驟S108：提供一中空的鏡座以及一鏡頭，將鏡頭裝設於鏡座中。
於本實施例中，鏡頭的材料為樹脂，鏡座為一音圈馬達。
步驟S109：將鏡座固定於安裝支架遠離電路板的一側，並將鏡頭與感光晶片相對設置，從而得到鏡頭模組。
其中，鏡座大致為中空方形，且鏡座的形狀與尺寸與安裝支架匹配。
根據不同需求，上述組裝方法的步驟順序可改變，某些步驟可省略或合併，例如，步驟S104於電路板不為軟板時，可省略。
請參見圖2至圖4，本發明還提供一種鏡頭模組100，其應用於一電子裝置（圖未示）中。電子裝置可為一智慧手機或一平板電腦等。鏡頭模組100包括一電路板10、一感光晶片20、一補強板30、一中空的安裝支架40、一濾光片50、一中空的鏡座60及一鏡頭70。
電路板10上開設第一通孔11，感光晶片20設於第一通孔11內。電路板10的一側安裝有複數金手指12及複數電子元件13，且複數金手指12圍繞感光晶片20設置。電子元件13可為電阻、電容、二極體、三極管、繼電器、帶電可擦可程式設計唯讀記憶體（EEPROM）等被動元件。
感光晶片20的邊緣設置多根金屬導線21，且每根金屬導線21與對應的金手指12連接。每根金屬導線21上分別包裹一膠體22，或者多根金屬導線21上包裹一膠體22但控制金屬導線21不互相接觸，以防止金屬導線21斷裂與互相接觸，並能避免強光照到金屬導線21上，進而反射到感光晶片20上，形成雜光，影響成像畫面的品質。
補強板30位於電路板10背離金手指12的一側，且感光晶片20固定於補強板30上。於本實施例中，補強板的材料為不銹鋼。
安裝支架40大致為方形並固定於電路板10上。安裝支架40開設有一第二通孔41。第二通孔41的內壁向第二通孔41的中心軸方向延伸而形成一凸緣42。
濾光片50固定於凸緣42遠離感光晶片20的一面上，並與感光晶片20相對設置。濾光片50遠離電路板10的表面與安裝支架40遠離電路板10的表面大致齊平。於本實施例中，濾光片50為一紅外截止濾光片，紅外截止濾光片為利用精密光學鍍膜技術於光學基片上交替鍍上高折射率的光學膜，實現可見光區(400-630nm)、近紅外(700-1100nm)截止的光學濾光片。 鏡頭70安裝於鏡座60中。鏡座60固定於安裝支架40遠離電路板10的一側，以使鏡頭70與感光晶片20相對設置。
使用時，濾光片50用於將經鏡頭70投射至其表面的光信號中的紅外線濾除。感光晶片20用於將投射至其表面的濾除紅外線之後的光信號轉換為電信號，並將該電信號通過金屬導線21輸出至電路板10，從而，電路板10可對該電信號進行處理以獲得所需影像。
相較於先前技術，本發明提供的鏡頭模組及其組裝方法於金屬導線21上包裹一層膠體22，有利於防止金屬導線21斷裂與互相接觸，並能避免因強光照到金屬導線21上，進而反射到感光晶片20上形成雜光，提高了穩定性與成像畫面的品質。
應當理解，雖然本說明書按照實施方式加以描述，但並非每個實施方式僅包含一個獨立之技術方案，說明書之該等敘述方式僅係為清楚起見，本領域技術人員應當將說明書作為一個整體，各實施方式中之技術方案也可經適當組合，形成本領域技術人員可理解之其他實施方式。上文所列出之一系列之詳細說明僅係針對本創作之可行性實施方式之具體說明，它們並非用以限制本創作之保護範圍，凡未脫離本創作技藝精神所作之等效實施方式或變更均應包含於本創作之保護範圍之內。
100:鏡頭模組 10:電路板 11:第一通孔 12:金手指 13:電子元件 20:感光晶片 21:金屬導線 22:膠體 30:補強板 40:安裝支架 41:第二通孔 50:濾光片 60:鏡座 70:鏡頭
圖1為本發明一實施例提供的鏡頭模組的組裝方法的流程圖。
圖2為本發明一實施例提供的鏡頭模組的立體示意圖。
圖3為圖2提供的鏡頭模組的分解示意圖。
圖4為圖2提供的鏡頭模組沿IV-IV線的剖視圖。
無
10:電路板
20:感光晶片
22:膠體
30:補強板
40:安裝支架
50:濾光片
60:鏡座
70:鏡頭

Claims (10)

  1. 一種鏡頭模組的組裝方法，其改良在於：包括以下步驟：提供一電路板及一感光晶片，於所述電路板上開設第一通孔並將所述感光晶片裝設於所述第一通孔內；於所述電路板的一側安裝複數圍繞所述感光晶片的金手指，於所述感光晶片的邊緣設置多根金屬導線，並將所述金屬導線與所述金手指對應連接；於所述金屬導線外包裹膠體，並固化所述膠體使多根所述金屬導線之間互不接觸；將一安裝支架固定於所述電路板上，並將所述安裝支架與所述感光晶片相對設置；將一濾光片固定於所述安裝支架遠離所述電路板的一側，並將所述濾光片與所述感光晶片相對設置；提供一鏡頭以及一鏡座，將所述鏡頭裝設於所述鏡座中；以及將所述鏡座固定於所述安裝支架遠離所述電路板的一側，並將所述鏡頭與所述感光晶片相對設置，從而得到所述鏡頭模組。
  2. 如申請專利範圍第1項所述之鏡頭模組的組裝方法，其中：採用金製備所述金屬導線。
  3. 如申請專利範圍第1項所述之鏡頭模組的組裝方法，其中：所述鏡頭模組的組裝方法還包括以下步驟：將一補強板設置於所述電路板背離所述金手指的一側，並將所述感光晶片固定於所述補強板上。
  4. 如申請專利範圍第1項所述之鏡頭模組的組裝方法，其中：所述鏡頭模組的組裝方法還包括以下步驟：將複數電子元件安裝於所述電路板設有所述金手指的一側。
  5. 如申請專利範圍第1項所述之鏡頭模組的組裝方法，其中：所述鏡頭模組的組裝方法還包括以下步驟：於所述安裝支架上開設一第二通孔，並使所述第二通孔的內壁沿所述第二通孔的中心軸方向延伸形成一凸緣。
  6. 如申請專利範圍第5項所述之鏡頭模組的組裝方法，其中：將所述濾光片固定於所述凸緣上並使所述濾光片與所述安裝支架的表面齊平。
  7. 一種鏡頭模組，包括一電路板、一感光晶片、一安裝支架、一濾光片、一鏡座及一鏡頭，其改良在於：所述電路板開設有第一通孔，所述感光晶片裝設於所述第一通孔內；所述電路板的一側安裝有複數圍繞所述感光晶片設置的金手指，所述感光晶片的邊緣設置多根金屬導線，且每根所述金屬導線與對應的所述金手指連接；所述金屬導線外包裹有膠體以使多根所述金屬導線之間互不接觸；所述安裝支架固定於所述電路板上，所述濾光片固定於所述安裝支架遠離所述電路板的一側並與所述感光晶片相對設置；所述鏡座固定於所述安裝支架遠離所述電路板的一側，所述鏡頭安裝於所述鏡座中並與所述感光晶片相對設置。
  8. 如申請專利範圍第7項所述之鏡頭模組，其中：所述金屬導線由金製成。
  9. 如申請專利範圍第7項所述之鏡頭模組，其中：所述電路板為軟板。
  10. 如申請專利範圍第9項所述之鏡頭模組，其中：所述電路板背離所述金手指的一側設有一補強板，所述感光晶片固定於所述補強板上。
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