TW201934209A - 清洗裝置、清洗方法及電腦記錄媒體 - Google Patents
清洗裝置、清洗方法及電腦記錄媒體 Download PDFInfo
- Publication number
- TW201934209A TW201934209A TW108100149A TW108100149A TW201934209A TW 201934209 A TW201934209 A TW 201934209A TW 108100149 A TW108100149 A TW 108100149A TW 108100149 A TW108100149 A TW 108100149A TW 201934209 A TW201934209 A TW 201934209A
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- rotating body
- wafer
- processed
- substrate
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 279
- 238000000034 method Methods 0.000 title claims description 24
- 238000003860 storage Methods 0.000 title description 4
- 239000007788 liquid Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 36
- 230000001681 protective effect Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 54
- 235000012431 wafers Nutrition 0.000 description 153
- 230000007246 mechanism Effects 0.000 description 51
- 238000005498 polishing Methods 0.000 description 31
- 239000004575 stone Substances 0.000 description 18
- 238000012805 post-processing Methods 0.000 description 15
- 229910052902 vermiculite Inorganic materials 0.000 description 15
- 235000019354 vermiculite Nutrition 0.000 description 15
- 239000010455 vermiculite Substances 0.000 description 15
- 238000000227 grinding Methods 0.000 description 14
- 238000001035 drying Methods 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-000981 | 2018-01-09 | ||
| JP2018000981 | 2018-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201934209A true TW201934209A (zh) | 2019-09-01 |
Family
ID=67219041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108100149A TW201934209A (zh) | 2018-01-09 | 2019-01-03 | 清洗裝置、清洗方法及電腦記錄媒體 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6990720B2 (ja) |
| KR (1) | KR102629528B1 (ja) |
| CN (1) | CN111566784B (ja) |
| TW (1) | TW201934209A (ja) |
| WO (1) | WO2019138881A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7481198B2 (ja) | 2020-08-20 | 2024-05-10 | 株式会社ディスコ | ウェーハ清掃装置、及び保持面清掃装置 |
| JP2022152042A (ja) * | 2021-03-29 | 2022-10-12 | 株式会社ディスコ | 研磨装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2654314B2 (ja) * | 1992-06-04 | 1997-09-17 | 東京応化工業株式会社 | 裏面洗浄装置 |
| US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| DE19950068B4 (de) * | 1999-10-16 | 2006-03-02 | Schmid Technology Systems Gmbh | Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben |
| JP2002343756A (ja) | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
| JP3776779B2 (ja) * | 2001-09-28 | 2006-05-17 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4996157B2 (ja) * | 2006-07-21 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | スクリュー搬送機構およびこれを用いるディスク洗浄装置 |
| JP2008183659A (ja) * | 2007-01-30 | 2008-08-14 | Disco Abrasive Syst Ltd | 研削装置 |
| JP5241317B2 (ja) * | 2008-05-15 | 2013-07-17 | 株式会社東京精密 | クリーニング装置 |
| JP2010147262A (ja) * | 2008-12-19 | 2010-07-01 | Tokyo Electron Ltd | 洗浄装置、基板処理システム、洗浄方法、プログラム及びコンピュータ記憶媒体 |
| JP2011066198A (ja) | 2009-09-17 | 2011-03-31 | Disco Abrasive Syst Ltd | 研削加工装置 |
| DE102010045098A1 (de) * | 2010-09-13 | 2012-03-15 | Rena Gmbh | Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten |
| JP5746532B2 (ja) * | 2011-03-24 | 2015-07-08 | 三鈴工機株式会社 | ベルト洗浄装置 |
| JP6158721B2 (ja) * | 2014-02-19 | 2017-07-05 | インテル コーポレーションＩｎｔｅｌ Ｃｏｒｐｏｒａｔｉｏｎ | 洗浄装置、剥離システム、洗浄方法、プログラム及びコンピュータ記憶媒体 |
| JP6366544B2 (ja) * | 2014-07-04 | 2018-08-01 | 株式会社荏原製作所 | 洗浄装置及びロール洗浄部材 |
| CN107221491B (zh) * | 2016-03-22 | 2021-10-22 | 东京毅力科创株式会社 | 基板清洗装置 |
| JP6665042B2 (ja) * | 2016-06-21 | 2020-03-13 | 東京エレクトロン株式会社 | 基板処理装置、基板処理装置の洗浄方法及び記憶媒体 |
-
2018
- 2018-12-26 JP JP2019564624A patent/JP6990720B2/ja active Active
- 2018-12-26 WO PCT/JP2018/047860 patent/WO2019138881A1/ja active Application Filing
- 2018-12-26 CN CN201880085394.1A patent/CN111566784B/zh active Active
- 2018-12-26 KR KR1020207021993A patent/KR102629528B1/ko active IP Right Grant
-
2019
- 2019-01-03 TW TW108100149A patent/TW201934209A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN111566784B (zh) | 2024-03-26 |
| WO2019138881A1 (ja) | 2019-07-18 |
| CN111566784A (zh) | 2020-08-21 |
| KR102629528B1 (ko) | 2024-01-25 |
| JPWO2019138881A1 (ja) | 2020-12-17 |
| KR20200101977A (ko) | 2020-08-28 |
| JP6990720B2 (ja) | 2022-01-12 |
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