TW201933980A - 電磁波吸收體、附電磁波吸收體之物品、及電磁波吸收體的製造方法 - Google Patents

電磁波吸收體、附電磁波吸收體之物品、及電磁波吸收體的製造方法 Download PDF

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Publication number
TW201933980A
TW201933980A TW107147865A TW107147865A TW201933980A TW 201933980 A TW201933980 A TW 201933980A TW 107147865 A TW107147865 A TW 107147865A TW 107147865 A TW107147865 A TW 107147865A TW 201933980 A TW201933980 A TW 201933980A
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TW
Taiwan
Prior art keywords
electromagnetic wave
layer
wave absorber
slit
main surface
Prior art date
Application number
TW107147865A
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English (en)
Chinese (zh)
Inventor
山形一斗
待永廣宣
請井博一
宇井丈裕
Original Assignee
日商日東電工股份有限公司
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Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201933980A publication Critical patent/TW201933980A/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
TW107147865A 2017-12-28 2018-12-28 電磁波吸收體、附電磁波吸收體之物品、及電磁波吸收體的製造方法 TW201933980A (zh)

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Application Number Priority Date Filing Date Title
JP2017253475 2017-12-28
JP2017-253475 2017-12-28

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TW201933980A true TW201933980A (zh) 2019-08-16

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Country Status (7)

Country Link
US (1) US11266048B2 (ja)
EP (1) EP3735119A4 (ja)
JP (1) JPWO2019132027A1 (ja)
KR (1) KR20200102431A (ja)
CN (1) CN111557129A (ja)
TW (1) TW201933980A (ja)
WO (1) WO2019132027A1 (ja)

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EP3860326A4 (en) * 2018-09-25 2022-09-14 Sekisui Chemical Co., Ltd. ?/4 TYPE RADIO WAVE ABSORBER
JP2021044483A (ja) * 2019-09-13 2021-03-18 日東電工株式会社 インピーダンス整合膜及び電波吸収体
JP2021163792A (ja) * 2020-03-30 2021-10-11 株式会社ニフコ 電波吸収体の製造方法、電波吸収体およびレーダ機構
KR102391842B1 (ko) * 2021-01-20 2022-04-29 한국과학기술원 샌드위치 구조를 갖는 주파수 가변 전자기파 흡수체
EP4375696A1 (en) * 2021-07-21 2024-05-29 Nitto Denko Corporation Electromagnetic wave shield and radar cover

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US20210059085A1 (en) 2021-02-25
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US11266048B2 (en) 2022-03-01

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