TW201918709A - 檢查用基板及附導電保護部檢查用基板之製造方法 - Google Patents

檢查用基板及附導電保護部檢查用基板之製造方法 Download PDF

Info

Publication number
TW201918709A
TW201918709A TW107126523A TW107126523A TW201918709A TW 201918709 A TW201918709 A TW 201918709A TW 107126523 A TW107126523 A TW 107126523A TW 107126523 A TW107126523 A TW 107126523A TW 201918709 A TW201918709 A TW 201918709A
Authority
TW
Taiwan
Prior art keywords
thickness direction
inspection
conductive
insulating layer
thickness
Prior art date
Application number
TW107126523A
Other languages
English (en)
Chinese (zh)
Inventor
柴田周作
高倉隼人
髙野誉大
若木秀一
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201918709A publication Critical patent/TW201918709A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
TW107126523A 2017-07-31 2018-07-31 檢查用基板及附導電保護部檢查用基板之製造方法 TW201918709A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-147785 2017-07-31
JP2017147785A JP2019027932A (ja) 2017-07-31 2017-07-31 検査用基板および導電保護部付検査用基板の製造方法

Publications (1)

Publication Number Publication Date
TW201918709A true TW201918709A (zh) 2019-05-16

Family

ID=65232759

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107126523A TW201918709A (zh) 2017-07-31 2018-07-31 檢查用基板及附導電保護部檢查用基板之製造方法

Country Status (4)

Country Link
JP (1) JP2019027932A (ko)
KR (1) KR20200036859A (ko)
TW (1) TW201918709A (ko)
WO (1) WO2019026880A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116774013B (zh) * 2023-08-17 2023-11-21 山东圆坤电子科技股份有限公司 一种控制器电路板测试设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229714A (ja) * 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JPS62229713A (ja) * 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JP2000243486A (ja) 1999-02-17 2000-09-08 Jsr Corp 異方導電性シート
JP2004134183A (ja) * 2002-10-09 2004-04-30 Sharp Corp 電極シートおよびその製造方法
TW200624817A (en) * 2004-11-11 2006-07-16 Jsr Corp Sheet-form probe, probe card, and wafer inspection method
WO2006051878A1 (ja) * 2004-11-11 2006-05-18 Jsr Corporation シート状プローブおよびプローブカードならびにウエハの検査方法
KR101573450B1 (ko) * 2014-07-17 2015-12-11 주식회사 아이에스시 테스트용 소켓
JP6951897B2 (ja) * 2016-10-06 2021-10-20 日東電工株式会社 異方導電性シート
WO2018066540A1 (ja) * 2016-10-06 2018-04-12 日東電工株式会社 異方導電性シート
WO2018066541A1 (ja) * 2016-10-06 2018-04-12 日東電工株式会社 異方導電性シート

Also Published As

Publication number Publication date
KR20200036859A (ko) 2020-04-07
WO2019026880A1 (ja) 2019-02-07
JP2019027932A (ja) 2019-02-21

Similar Documents

Publication Publication Date Title
JP7440789B2 (ja) 異方性導電フィルム並びに接続構造体及びその製造方法
TWI783971B (zh) 電氣特性之檢查治具
JP5684349B1 (ja) 半導体装置および半導体装置の検査方法
TWI686999B (zh) 異向性導電膜、其製造方法及連接構造體
TWM459517U (zh) 封裝基板
KR20160148097A (ko) Ｐｃｒ 디바이스 및 그 제조 방법
TW201918709A (zh) 檢查用基板及附導電保護部檢查用基板之製造方法
US20210251111A1 (en) Electromagnetic-wave shielding sheet and electronic component-mounted substrate
CN108605412A (zh) 柔性电路基板以及柔性电路基板的制造方法
JP2013206707A (ja) 実装用アダプタ、プリント基板及びその製造方法
TW201826626A (zh) 各向異性導電性片材
JP5580954B1 (ja) 導電性微粒子、異方性導電材料、及び、導電接続構造体
KR102469857B1 (ko) 이방 도전성 시트
TWI421992B (zh) 封裝基板及其製法
TWI542086B (zh) 異方性導電連接器及其製造方法
KR101853002B1 (ko) 반도체 패키지 테스트 소켓
KR101153167B1 (ko) 테스트소켓 용 칩 가이드 유닛
US10925172B1 (en) Carrier structure and manufacturing method thereof
CN103681366B (zh) 半导体封装件及其制法
JP5933047B2 (ja) 半導体装置の製造方法、半導体装置の検査方法、および半導体装置
TWI439199B (zh) 封裝基板線路之製法
JP2011142114A (ja) 半導体デバイスとその製造方法及び検査方法
JP2017130599A (ja) 配線基板
JP2013131626A (ja) 配線基板