TW201918709A - Board for inspection, and method for manufacturing board for inspection with electrically conductive protecting portion - Google Patents

Abstract

This board for inspection is board for inspection for electrically connecting, in a thickness direction, an inspecting device and an inspected device disposed respectively on one side and the other side thereof in the thickness direction. The board for inspection is provided with an insulating layer and a plurality of electrically connecting portions which penetrate through the insulating layer in the thickness direction and are disposed spaced apart from one another in a direction perpendicular to the thickness direction. The insulating layer covers one surface in the thickness direction of a peripheral edge portion of each of the plurality of electrically connecting portions. The insulating layer includes opposing portions which are disposed on said one side in the thickness direction of the peripheral edge portions and which oppose the peripheral edge portions, and connecting portions which are disposed between adjacent opposing portions to connect the adjacent opposing portions to one another in the perpendicular direction. A level difference D in the thickness direction between one surface in the thickness direction of the opposing portions and one surface in the thickness direction of the connecting portions is at most equal to 5 [mu]m.

Description

Method for manufacturing inspection board and inspection board with conductive protection part

The present invention relates to a method for manufacturing a substrate for inspection and a substrate for inspection with a conductive protection portion, and more particularly to a method for manufacturing an inspection substrate and a substrate for inspection with a conductive protection portion using the same.

The inspection substrate is an anisotropic conductive sheet having a plurality of conductive portions having conductivity in the thickness direction. Furthermore, it is known that the inspection substrate is used in such a manner that it is interposed between the electrical inspection device and the circuit board to be inspected, and the electrodes are brought into contact with the plurality of conductive portions from both sides in the thickness direction.

For example, there is proposed an anisotropic conductive sheet including an insulating sheet body formed with a plurality of through holes, a conductive element filled in the through hole, and a metal layer for contacts covering the surface of the conductive element ( For example, refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2000-243486

[Problems to be solved by the invention]

In recent years, from the viewpoint of the manufacturing method and the viewpoint of ensuring the strength of the conducting portion, there are cases where the upper side of the peripheral portion of the plurality of conducting portions is covered with an insulating sheet body. In this case, the insulating sheet body has undulations (concavo-convex) corresponding to the peripheral edge portion.

Furthermore, there is also a case where the conductive protective composition containing conductive particles is applied on the upper surface of the insulating sheet body and the circuit-conducting element instead of the metal layer for contact, and then the upper surface of the insulating sheet body The conductive protection composition is removed, and the conductive protection composition is formed from the conductive protection composition on the upper surface of the circuit-conducting element.

At this time, since the conductive protective composition coated on the upper surface of the insulating sheet body enters the concave portion, it is difficult to remove the conductive protective composition afterwards. Therefore, if the conductive protective composition remains, it may cause The circuit components are short-circuited to each other, and the reliability of the inspection is reduced.

The present invention provides an inspection for excellent reliability of inspection even if a conductive protection composition containing conductive particles is arranged on one side in the thickness direction, the conductive protection composition on one side can be reliably removed in the thickness direction of the insulating layer Manufacturing method of substrate and substrate for inspection with conductive protection part. [Technical means to solve the problem]

The present invention (1) includes a substrate for inspection, which is used to connect an inspection device and an inspection device arranged on one side and the other side in the thickness direction to the above-mentioned thickness direction, and includes: an insulating layer; and a plurality of A plurality of conductive portions that penetrate the thickness direction of the insulating layer and are spaced apart from each other in a direction orthogonal to the thickness direction; the insulating layer covers the peripheral portion of each of the plurality of conductive portions On one surface in the thickness direction, the insulating layer has: a facing portion, which is disposed on one side in the thickness direction with respect to the peripheral edge portion and faces the peripheral edge portion; and a connecting portion, which is disposed on the adjacent facing portion And the adjacent opposing portions are connected in the orthogonal direction; and the step difference D of the thickness direction surface of the opposing portion and the thickness direction surface of the connecting portion in the thickness direction is 5 Below μm.

In this inspection substrate, the step difference D in the thickness direction between the thickness direction surface of the facing portion and the thickness direction surface of the connecting portion is 5 μm or less. Therefore, even if the conductive protective composition containing conductive particles is disposed on the surface in the thickness direction of the inspection substrate, the conductive protective composition disposed on the surface in the thickness direction of the insulating layer can be reliably removed thereafter. Therefore, the inspection substrate of the inspection is excellent in reliability.

The present invention (2) includes the inspection substrate as described in (1), wherein the ratio (T2 / T1) of the thickness T2 of the opposed portion to the thickness T1 of the peripheral portion is 0.6 or more.

In this inspection substrate, since the ratio (T2 / T1) of the thickness T2 of the opposed portion to the thickness T1 of the peripheral portion is 0.6 or more, the step difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on one side of the insulating layer in the thickness direction can be more surely removed.

The invention (3) includes the inspection substrate as described in (1) or (2), wherein the thickness T1 of the peripheral portion is 10 μm or less.

In this inspection substrate, since the thickness T1 of the peripheral portion is 10 μm or less, the level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on one side of the insulating layer in the thickness direction can be more surely removed.

The present invention (4) includes the inspection substrate according to any one of (1) to (3), wherein the thickness T2 of the opposed portion is 7 μm or more.

In this inspection substrate, since the thickness T2 of the opposing portion is 7 μm or more, the level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on one side of the insulating layer in the thickness direction can be more surely removed.

The present invention (5) includes the inspection substrate according to any one of (1) to (4), wherein the interval I between the above-mentioned conductive portions exceeds 5 μm and does not reach 15 μm.

In this inspection substrate, since the interval I between adjacent conductive portions exceeds 5 μm and does not reach 15 μm, the above-mentioned level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on one side of the insulating layer in the thickness direction can be more surely removed.

The present invention (6) includes the inspection substrate as described in any one of (1) to (5), which further includes an elevation member embedded in the insulating layer between the plurality of conductive portions, The one surface of the connecting portion in the thickness direction is close to or arranged at the same level in the thickness direction relative to the surface of the facing portion in the thickness direction.

The inspection substrate is provided with a height member, which is buried in an insulating layer between a plurality of conductive portions, so that the thickness direction of the connecting portion is close to or arranged in the same direction as the thickness direction of the opposing portion in the thickness direction of the connecting portion Rank. Therefore, the above-mentioned level difference D can be surely set to 5 μm or less. The conductive protection composition disposed on one side in the thickness direction of the insulating layer can be removed more surely.

The present invention (7) includes the inspection substrate as described in (6), wherein the pad member is located at the same level as the peripheral portion of the conductive portion in the thickness direction.

In this inspection substrate, the pad member is located at the same level as the peripheral portion of the conductive portion in the thickness direction, so the structure is simple.

The present invention (8) includes a method for manufacturing a substrate for inspection with a conductive protection part, comprising the steps of: disposing a conductive protection composition containing conductive particles having an average particle diameter d equal to or greater than the above-mentioned step difference D in (1) To the thickness direction surface of the inspection substrate described in any one of (7); the conductive protection composition disposed on the thickness direction surface of the insulating layer is removed; and the thickness direction disposed on the conducting portion The above-mentioned conductive protection composition on one side forms a conductive protection portion.

Since the method for manufacturing a substrate for inspection with a conductive protection part arranges a conductive protection composition containing conductive particles having an average particle diameter d equal to or higher than the level difference D on one side in the thickness direction of the inspection substrate having the level difference D, The conductive protection composition disposed on one side in the thickness direction of the insulating layer can be surely removed.

Therefore, the conductive protection portion can be formed from the conductive protection composition disposed on one side in the thickness direction of the conductive portion, and as a result, a highly reliable inspection substrate with conductive protection portion can be manufactured.

The present invention (9) includes the method for manufacturing a substrate for inspection with a conductive protection part as described in (8), wherein the average particle diameter d of the conductive particles is less than 10 μm.

According to the manufacturing method of the substrate for inspection with a conductive protection part, since the average particle diameter d of the conductive particles is small, less than 10 μm, the conductive protection part containing the conductive particles can be reliably arranged in the thickness of the conductive part Direction side. [Effect of the invention]

The inspection substrate of the present invention is excellent in inspection reliability.

According to the method for manufacturing a substrate for inspection with a conductive protection part of the present invention, a substrate for inspection with a conductive protection part having high inspection reliability can be manufactured.

As shown in FIGS. 1 and 2, the inspection substrate 1 has a sheet shape with a specific thickness, which is arranged on the upper side (an example in the thickness direction) and the lower side (an example in the thickness direction) An anisotropic conductive sheet in which the inspection device 30 (refer to FIG. 4H) and the device under inspection 31 (refer to FIG. 4H) are conducted to electrically inspect the non-inspection device 31. The inspection substrate 1 has a substantially flat plate (sheet) shape extending in a plane direction orthogonal to the thickness direction. The inspection substrate 1 includes an insulating layer 2 and a plurality of conductive parts 3.

The insulating layer 2 has a certain thickness and has a sheet shape extending in the plane direction. The insulating layer 2 integrally includes a lower facing portion 4, an upper facing portion 5, and a connecting portion 6. The lower facing portion 4, the upper facing portion 5, and the connecting portion 6 will be described in detail below.

In addition, the insulating layer 2 has an opening 9 for filling each of the plurality of conductive portions 3. A plurality of openings 9 are provided corresponding to the plurality of conductive portions 3.

Examples of the material of the insulating layer 2 include resins such as polyimide. The size of the insulating layer 2 will be described in detail below.

The plurality of conductive portions 3 penetrate the thickness direction of the insulating layer 2 and are arranged at intervals in the plane direction. The plurality of conductive portions 3 are arranged in a dislocated manner in a plan view, for example. Each of the plurality of conductive portions 3 has a substantially circular shape in plan view. Each of the plurality of conducting portions 3 has a hat shape protruding downward when viewed in cross-section, specifically, a body portion 10 located at the opening 9 and a flange as an example of a peripheral portion located around it are integrally provided Department 11.

The body portion 10 is a conducting portion (conducting body portion) that ensures conduction in the thickness direction in the conducting portion 3. The body portion 10 integrally includes a central portion 12 and an inclined portion 13.

The central portion 12 has a substantially circular plate shape extending in the plane direction. The central portion 12 is the bottom located inside the opening 9. The central portion 12 has upper and lower surfaces parallel to each other. The plurality of central portions 12 are at the same level in the thickness direction.

The inclined portion 13 is a tapered portion having a shape inclined upward from the peripheral end edge of the central portion 12 toward the outside in the plane direction. The inclined portion 13 has a substantially circular shape in plan view. The inclined portion 13 has an upper surface (upper inclined surface) and a lower surface (lower inclined surface) parallel to each other.

The flange portion 11 is a supporting portion (or a hook portion with respect to the insulating layer 2) that is supported by the insulating layer 2 and held by the inspection substrate 1 in the conducting portion 3. The flange portion 11 has a substantially circular ring shape (flange shape) extending from the peripheral end edge of the inclined portion 13 toward the outside in the plane direction. The flange portion 11 is located on the upper stage with respect to the central portion 12.

The flange portion 11 has a flange lower surface 14 and a flange upper surface 15 parallel to each other, and a connecting surface 16 connecting these peripheral edges. In the adjacent conducting portion 3, the two connecting surfaces 16 corresponding to each other face each other in the plane direction, and are located at the same level in the thickness direction. Therefore, the plurality of flange portions 11 are also at the same level in the thickness direction.

The material of the conducting portion 3 may be a conductor such as copper.

The dimensions of the conducting portion 3 will be described in detail below.

Next, the lower facing portion 4, the upper facing portion 5, and the connecting portion 6 of the insulating layer 2 will be described in detail in order.

The lower facing portion 4 is disposed below the inclined portion 13 and the flange portion 11 of the conducting portion 3 and faces the lower surfaces. The lower facing portion 4 is the base of the flange portion 11. The lower side facing portion 4 has a substantially circular shape. The lower side facing portion 4 has an upper surface in contact with the flange lower surface 14 of the flange portion 11, a tapered surface 18 in contact with the lower surface of the inclined portion 13, and a lower surface facing the upper surface and the tapered surface 18 Face down the configuration. The tapered surface 18 connects the inner peripheral edges of the upper surface and the lower surface at the lower facing portion 4. The tapered surface 18 is parallel to the upper surface of the inclined portion 13. Moreover, the tapered surface 18 slopes inward toward the lower side. The lower surface of the lower facing portion 4 is exposed on the lower side. In addition, the lower surface of the lower facing portion 4 and the lower surface of the central portion 12 are on the same plane.

The upper facing portion 5 is arranged above the flange portion 11 and faces the upper sides. The upper facing portion 5 is a covering portion that covers the flange portion 11 from the upper side. The upper facing portion 5 has a substantially circular shape. In addition, the upper side facing portion 5 is arranged to face the upper side with respect to the lower side facing portion 4 at intervals of the arrangement flange portion 11. The upper facing portion 5 has a facing upward surface 7, a facing downward surface 39 disposed opposite to the lower face of the facing upward surface 7, and a facing inner surface connecting inner edges of the facing upward surface 7 and the facing downward surface 39 8.

The upward facing surface 7 has a flat shape along the surface direction. The opposed upper surface 7 is parallel to the flange upper surface 15 of the flange portion 11.

The downward surface 39 is a flat surface that contacts the flange upper surface 15 of the flange portion 11.

The opposed inner surface 8 has a shape extending in the thickness direction. The opposed inner surface 8 faces the upper surface of the body portion 10 of the guide portion 3.

The coupling portion 6 is arranged between the adjacent lower facing portions 4 and the adjacent upper facing portions 5 in a plan view. The connecting portion 6 extends in the plane direction, specifically, the adjacent lower side facing portion 4 is connected in the plane direction, and the adjacent upper side facing portion 5 is connected in the plane direction. The connecting portion 6 is formed in a pattern opposite to the conducting portion 3 (a region other than the conducting portion 3) in a plan view.

In addition, the connecting portion 6 is also filled (arranged) between adjacent connecting surfaces 16. The connecting portion 6 is in contact with the adjacent connecting surface 16. With this, the connecting portion 6 insulates the adjacent connecting surface 16.

The coupling portion 6 has a coupling lower surface 37 and a coupling upper surface 38 which are arranged to face each other with an interval in the thickness direction.

The coupling lower surface 37 has a flat shape. In addition, the connecting lower surface 37 is connected to the lower surface of the lower side facing portion 4 and is on the same plane. Thereby, the lower surface of the central portion 12, the lower surface of the lower facing portion 4, and the connecting lower surface 37 form a common surface (lower surface).

The connecting upper surface 38 connects the peripheral edge of the upper surface 7 facing the upper facing portion 5. The connection upper surface 38 includes a concave portion 17 recessed toward the lower side. The concave portion 17 is located, for example, in the substantially central portion between the adjacent pair of upper surfaces 7 in the connecting portion 6. The deepest part of the concave portion 17 forms a level difference D in the thickness direction with respect to the upper surface 7. That is, the deepest portion of the concave portion 17 is located at a lower level with respect to the upward facing surface 7, specifically, at a lower level by a difference D than the upward facing surface 7. The level difference D corresponds to the depth D of the concave portion 17.

In addition, the level difference D is inevitably generated due to the flange portion 11 and the like having the thickness T1, and it is not ideal to generate the level difference D originally. However, according to the present invention, even if it has the above-mentioned level difference D, it is set in a desired range, and thus it is possible to reliably achieve the object of the invention, that is, the removal of the conductive protection composition, thereby suppressing the short circuit between adjacent conductive portions 3.

Although not shown in FIG. 2, in addition to the concave portion 17, the connecting upper surface 38 has a plurality of second concave portions 47 as shown by the broken line in FIG. 1. The plurality of second concave portions 47 are located between the three conductive portions 3 close to each other. Specifically, it is located in a virtual region surrounded by three virtual line segments connecting the three conducting portions 3 (the center) to each other. The depth of the second concave portion 47 is the same as or deeper than the depth D of the concave portion 17. In addition, the second concave portion 47 is also an inevitable one as in the concave portion 17.

In addition, a boundary line is not clearly formed between the lower facing portion 4, the upper facing portion 5, and the connecting portion 6. In addition, the insulating layer 2 may be a single layer or a plurality of layers. In the case where the insulating layer 2 is a plurality of layers, the layers are sequentially arranged in the thickness direction, for example, and boundary lines may be clearly formed between the layers, or the boundary lines may not be formed.

The flange portion 11 is inserted (embedded) with respect to the insulating layer 2 in the plane direction. Thereby, the conduction part 3 is supported by the insulating layer 2 by the flange part 11.

Next, the dimensions and the like of the insulating layer 2 and the conducting portion 3 will be described.

The thickness of the insulating layer 2 is the distance between the lower surface of the lower facing portion 4 and the upper insulating surface 7 of the upper facing portion 5, for example, 5 μm or more, preferably 10 μm or more, and, for example, 50 μm or less, It is preferably 30 μm or less.

The thickness T2 of the upper facing portion 5 in the insulating layer 2 is, for example, 1 μm or more, preferably 5 μm or more, and more preferably 7 μm or more. If the thickness T2 of the upper facing portion 5 is equal to or greater than the above lower limit, the level difference D (described in detail below) can be surely set to 5 μm or less. Therefore, the conductive protective composition (conductive coating film 28) (described later) disposed on the connecting upper surface 38 of the connecting portion 6 can be removed more surely.

The thickness T2 of the upper facing portion 5 is, for example, 20 μm or less, preferably 15 μm or less.

The thickness of the lower facing portion 4 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 30 μm or less, preferably 18 μm or less.

The step difference D in the thickness direction of the deepest portion of the deepest portion of the concave portion 17 connecting the upper surface 7 of the upper facing portion 7 and the connecting portion 6 of the upper facing portion 5 is 5 μm or less, preferably 4 μm or less, more preferably 3 μm Below, further preferably 2.5 μm or less, particularly preferably 1.5 μm or less. Also, the level difference D is, for example, 0.001 μm or more, preferably 0.01 μm or more.

If the level difference D exceeds the upper limit, the conductive protection composition (described below) is disposed on the entire surface of the upper surface of the inspection substrate 1, and the upper surface of the insulating layer 2 (especially the concave portion 17) cannot be reliably removed Conductive protection composition. In other words, if the level difference D is lower than the above upper limit, even if the conductive protection composition is disposed on the entire surface of the upper surface of the inspection substrate 1, it is possible to surely remove Conductive protection composition.

The thickness of the conducting portion 3 is the same as the thickness of the body portion 10 and the thickness T1 of the flange portion 11, for example. Specifically, the thickness of the conducting portion 3 is, for example, 25 μm or less, preferably 18 μm or less, more preferably 10 μm or less, and further preferably 8 μm or less. If the thickness of the conducting portion 3 (thickness T1 of the flange portion 11) is equal to or less than the above upper limit, the level difference D can be surely set to 5 μm or less. Therefore, the conductive protection composition (conductive coating film 28) disposed on the connection upper surface 38 of the connection portion 6 can be removed more surely.

The thickness of the conducting portion 3 is, for example, 2 μm or more, preferably 3 μm or more.

The ratio (T2 / T1) of the thickness T2 of the upper facing portion 5 to the thickness T1 of the flange portion 11 is, for example, 0.3 or more, preferably 0.6 or more, more preferably 0.7 or more, and still more preferably 1 or more. If the ratio T2 / T1 is more than the above lower limit, the level difference D can be surely set to 5 μm or less. Therefore, the conductive protection composition (conductive coating film 28) disposed on the connection upper surface 38 of the connection portion 6 can be removed more surely.

In addition, the ratio T2 / T1 is, for example, 10 or less, preferably 5 or less.

The interval I between the adjacent conductive portions 3, that is, the opposed distance I between the adjacent connecting surfaces 16 is, for example, less than 15 μm, preferably 13 μm or less, and, for example, exceeds 5 μm, preferably 7 μm or more . If the interval I is equal to or less than the above upper limit, the level difference D can be surely set to 5 μm or less. Therefore, the conductive protection composition (conductive coating film 28) disposed on the connection upper surface 38 of the connection portion 6 can be removed more surely. If the interval I is equal to or greater than the above lower limit, short-circuiting of adjacent conduction parts 3 can be reliably prevented.

Next, the method of manufacturing the inspection substrate 1 will be described with reference to FIGS. 3A to 4H.

As shown in FIG. 3A, first, in this method, the support plate 21 is prepared, and then, the insulating lower portion 22 is provided on the upper surface of the support plate 21. The lower insulating portion 22 is, for example, a portion of the insulating layer 2 on the lower side. The material of the insulating lower portion 22 is the same as the material of the insulating layer 2. The lower insulating portion 22 includes a lower facing portion 4 and a lower portion of the connecting portion 6. The lower insulating portion 22 has a sheet shape including a plurality of openings 9. The insulating lower portion 22 has a lower surface in contact with the upper surface of the support plate 21, an upper surface parallel to the lower surface, and a tapered surface 18 that partitions the opening 9 and connects the inner periphery of the lower surface and the upper surface.

As shown in FIG. 3B, then, in this method, a plurality of conducting portions 3 are provided in a pattern having a body portion 10 and a flange portion 11. Specifically, the body portion 10 is formed in the opening 9, and the flange portion 11 is provided on the upper surface of the lower facing portion 4. For example, a plurality of conduction parts 3 are provided by an addition method, a subtraction method, or the like.

At this time, there is a step difference between the flange upper surface 15 of the flange portion 11 and the lower portion 35 of the connecting portion 6.

As shown in FIGS. 3C to 4E, then, an insulating upper portion 23 is provided. As shown in FIG. 4E, the upper insulating portion 23 is a portion connected to the upper side of the lower insulating portion 22, and together with the lower insulating portion 22 constitutes the insulating layer 2. The upper insulating portion 23 includes an upper facing portion 5 and an upper portion of the connecting portion 6. The upper surface of the insulating upper portion 23 has the above-mentioned level difference D.

When the insulating upper portion 23 is provided, for example, first, an insulating composition containing the same material as the insulating layer 2 is prepared. Furthermore, in the insulating composition, it is preferable to mix the photosensitive component in an appropriate ratio. Next, as shown in FIG. 3C, the insulating composition is applied to the upper surface of the conducting portion 3 (including the flange upper surface 15) and the upper surface of the lower portion 35 of the connecting portion 6, and thereafter, if necessary, dried ， Formation Insulating film 24.

The upper surface of the insulating film 24 contains the above-mentioned level difference D. In detail, based on the step difference between the upper surface 15 of the flange and the lower portion 35 of the connecting portion 6, between the portion facing the upper portion of the flange portion 11 and the adjacent flange portion 11 and the connecting portion 6 Between the parts facing the lower part 35, a level difference D, that is, a level difference occurs.

In addition, the upper surface of the insulating film 24 has a second level difference D2 in the thickness direction between a portion facing the central portion 12 and a portion facing the flange portion 11. The second level difference D2 is the depth of the second concave portion 36 formed on the upper surface of the insulating film 24 corresponding to the central portion 12.

Alternatively, instead of applying the insulating composition, an insulating sheet having a sheet shape and made of an insulating composition may be arranged on the upper surface of the conducting portion 3 and the upper surface of the lower portion 35 of the connecting portion 6.

Thereafter, as shown in FIG. 3D, in this method, a part of the insulating coating 24 is removed to form the upper insulating portion 23. Specifically, the portion of the insulating film 24 facing the main body 10 is removed.

When the insulating film 24 contains a photosensitive component, a part of the insulating film 24 is removed by optical processing. Or, a part of the insulating film 24 is removed by etching or the like. At this time, the second recess 36 is removed.

Alternatively, an insulating sheet previously formed as a pattern of the insulating upper portion 23 may be disposed on the upper surface of the flange upper surface 15 of the flange portion 11 and the lower portion 35 of the connecting portion 6.

With this, the insulating upper portion 23 is formed in a shape facing the upper side with respect to the flange portion 11 and filled between the adjacent flange portions 11. The insulating upper portion 23 exposes the upper surface of the body portion 10.

Thereby, the insulating layer 2 including the lower insulating portion 22 and the upper insulating portion 23 is formed. That is, the insulating layer 2 faces the upper side and sequentially includes two layers of the lower insulating portion 22 and the upper insulating portion 23.

Then, as shown in FIG. 4E, the support plate 21 is removed by peeling or the like, for example. As a result, the lower surface of the central portion 12, the lower surface of the lower facing portion 4, and the connecting lower surface 37 of the connecting portion 6 are exposed on the lower side. These planes form a common lower surface.

With this, the inspection substrate 1 including the insulating layer 2 and the plurality of conductive portions 3 is manufactured.

This inspection substrate 1 does not yet have a conductive protection portion 29 (see FIG. 4H), that is, it is not a substrate 25 for inspection with a conductive protection layer. However, the inspection substrate 1 is an industrially usable device that can be circulated separately.

Thereafter, as shown in FIGS. 4F to 4H, the conductive protection portion 29 is formed on the inspection substrate 1.

As shown in FIG. 4H, the conductive protection portion 29 has a shape that follows the upper surface of the body portion 10. That is, the conductive protection portion 29 has a shape that is curved upward as it goes outward from the center portion in the plane direction. The conductive protection portion 29 has a lower surface in contact with the upper surface of the body portion 10, an upper surface opened (exposed) toward the upper side, and an outer peripheral surface in contact with the opposed inner surface 8. On the other hand, the conductive protection portion 29 substantially does not have the facing upper surface 7 of the upper facing portion 5 and the connecting upper surface 38 of the connecting portion 6.

When the conductive protection portion 29 is provided, first, a conductive protection composition is prepared, and as shown in FIG. 4F, it is disposed on the entire upper surface of the inspection substrate 1.

The conductive protection composition contains, for example, conductive particles, a matrix component, and a solvent.

Examples of the conductive particles include metal particles containing metals such as iron, cobalt, nickel, gold, silver, copper, palladium, rhodium, and alloys of these metals; and, for example, non-conductive particles (polymers) having a core material Particles, glass beads, etc.), and core-shell particles or the like including a shell portion of the above metal on the surface of the core material. Preferably, a core-shell type particle which coats a polymer particle with metal is mentioned. The shape of the conductive particles is not particularly limited, and examples thereof include a spherical shape, a plate shape, a needle shape, and an irregular shape, and preferably a spherical shape.

The average particle diameter d of the conductive particles is equal to or higher than the above-mentioned level difference D. Regarding the average particle diameter d of the conductive particles, the ratio (d / D) of the average particle diameter d to the level difference D exceeds, for example, 1.0, preferably 1.25 or more, preferably 1.5 or more, more preferably 2.0 or more, and, For example, 100 or less.

If the ratio (d / D) is lower than the above lower limit, the conductive protection composition containing conductive particles disposed on the upper surface of the insulating layer 2 cannot be reliably removed. In other words, if the ratio (d / D) exceeds the lower limit, the conductive protection composition can be reliably removed.

As described above, the average particle diameter d of the conductive particles is set according to the level difference D, for example, 20 μm or less, preferably less than 10 μm, more preferably 5 μm or less, and, for example, 0.1 μm or more, more Preferably it is 1 μm or more. If the average particle diameter d of the conductive particles is equal to or less than the above upper limit, the conductive particles can be reliably provided on the upper surface of the main body 10.

The ratio of the conductive particles to 100 parts by mass of the matrix component is, for example, 150 parts by mass or more, preferably 200 parts by mass or more, and for example, 2000 parts by mass or less, preferably 1500 parts by mass or less.

Examples of the matrix component include resins such as acrylic resins, epoxy resins, and phenoxy resins.

Examples of the solvent include organic solvents such as esters, alcohols, and ketones; for example, water; and preferably organic solvents. Furthermore, the solvent can be used to change the concave shape of the conductive protection portion 29 in a timely manner.

In addition, a commercially available product can be used for the conductive protection composition.

When the conductive protective composition is placed on the upper surface of the inspection substrate 1, for example, a doctor blade, a gravure coater, a spray coater, a coater, a spin coater, a roll coater, etc. are used for coating Device.

If the conductive protective composition is applied to the entire upper surface of the inspection substrate 1, the upper surface 7 of the main body 10, the upper surface 7 of the upper facing portion 5, and the upper surface 38 of the connecting portion 6 are formed The conductive coating 28 of the conductive protection composition.

Next, as shown in FIG. 4G, the conductive coating film 28 applied to the upper surface 7 of the upper opposing portion 5 and the upper surface 38 of the connecting portion 6 is removed. The conductive coating film 28 is removed (washed) using, for example, a doctor blade (scraper) 26, a pressure-sensitive adhesive sheet (tape), or the like. Preferably, the conductive coating film 28 is scraped off by the doctor blade 26.

At this time, the upper portion of the conductive coating film 28 applied to the upper surface of the main body portion 10 (specifically, the portion located above the upper surface 7 from the upper facing portion 5) is removed, and the lower portion ( Specifically, the portion located on the lower side of the upper facing surface 7 from the upper facing portion 5 remains (retains), thereby forming the conductive protection portion 29 described below.

Furthermore, the concave portion 17 is also coated with a conductive coating film 28. Although the conductive coating film 28 is likely to remain in the concave portion 17, as described above, since the difference D (the depth of the concave portion 17) is lower than the upper limit, the concave portion 17 The conductive coating film 28 in the middle can be easily and surely removed without remaining.

As shown in FIG. 4H, then, in this method, the solvent in the conductive coating film 28 is removed by, for example, drying by heating. As a result, a conductive protection portion 29 containing conductive particles and matrix components is formed on the upper surface of the body portion 10.

Thereby, the substrate 25 for inspection with a conductive protective layer provided with the substrate for inspection 1 and the conductive protection portion 29 is manufactured.

Next, a method of electrically inspecting the non-inspection device 31 using the substrate 25 for inspection with a conductive protective layer will be described.

In this method, an inspection device 30 having a plurality of inspection electrodes 33 and an inspection device 31 having a plurality of electrodes 34 are prepared, as shown by an imaginary line in FIG. 4H, respectively above the substrate 25 for inspection with a conductive protective layer On the lower side, each of the inspection device 30 and the inspection device 31 is arranged.

Then, the inspection electrode 33 is brought into contact with the upper surface of the conductive protection portion 29, and the electrode 34 is brought into contact with the lower surface of the central portion 12.

As a result, the non-inspection device 31 is electrically inspected.

Further, in this inspection substrate 1, the level difference D in the thickness direction of the upper surface 7 of the upper facing portion 5 and the connecting upper surface 38 including the concave portion 17 of the connecting portion 6 in the thickness direction is 5 μm or less. Therefore, even if the conductive protection composition containing conductive particles is disposed on the entire upper surface of the inspection substrate 1, the conductive protection composition disposed on the upper surface of the insulating layer 2 (especially the concave portion 17) can be surely thereafter To remove.

On the other hand, as indicated by the dotted line in FIG. 4H, if the level difference D exceeds 5 μm, the conductive protective composition disposed in the concave portion 17, especially conductive particles, tend to remain. Therefore, there may be a case where adjacent conduction parts 3 are short-circuited with each other.

On the other hand, in the inspection substrate 1 of this embodiment, the level difference D is 5 μm or less, and the conductive protective composition containing conductive particles can be reliably removed, so that the adjacent conductive portions 3 can be suppressed from each other. Short circuit. As a result, the reliability of the inspection of the inspection substrate 1 is excellent.

In addition, in the inspection substrate 1, if the ratio (T2 / T1) of the thickness T2 of the upper facing portion 5 to the thickness T1 of the flange portion 11 is 0.6 or more, the step difference D can be surely set to Below 5 μm. Therefore, the conductive protective composition disposed on the upper surface of the insulating layer 2 can be more surely removed.

In addition, in the inspection substrate 1, if the thickness T1 of the flange portion 11 is 10 μm or less, the level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on the upper surface of the insulating layer 2 can be more surely removed.

In addition, in the inspection substrate 1, the thickness T2 of the upper facing portion 5 is 7 μm or more, so the level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on the upper surface of the insulating layer 2 can be more surely removed.

In addition, in this inspection substrate 1, if the interval I between adjacent conductive portions 3 exceeds 5 μm and does not reach 15 μm, the above-mentioned level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on the upper surface of the insulating layer 2 can be more surely removed.

In the manufacturing method of the substrate 25 for inspection with a conductive protective layer, a conductive protection composition containing conductive particles having an average particle diameter d equal to or higher than the level difference D is arranged on the upper surface of the inspection substrate 1 having the level difference D, Therefore, the conductive protective composition disposed on the upper surface of the insulating layer 2 can be reliably removed.

Therefore, the conductive protection portion 29 can be formed from the conductive protection composition disposed on the upper surface of the conductive portion 3, and as a result, the substrate 25 for inspection with a conductive protection layer having high reliability in inspection can be manufactured.

Furthermore, according to the manufacturing method of the substrate 25 for inspection with a conductive protective layer, if the average particle diameter d of the conductive particles is small, not exceeding 10 μm, the conductive protection portion including the conductive particles can be reliably arranged on the body The upper surface of the portion 10.

In one embodiment, as shown in FIG. 2, in general, the thickness T1 of the flange portion 11 is made thinner, and the thickness T2 of the upper facing portion 5 is made thicker, thereby reducing the above-mentioned level difference D.

For example, as shown in FIG. 5A, the case where the thickness T1 of the flange portion 11 is thin and the thickness T2 of the upper facing portion 5 is also thin is considered. In this case, although the step difference due to the flange portion 11 is small, since the connecting portion 6 (the insulating upper portion 23 in the connecting portion 6, which is the same below) connecting the upper facing portion 5 is thin, it has The ground follows the shape of the smaller step mentioned above. Therefore, a larger recess 17 is produced than the recess 17 shown in FIG. 2. That is, the level difference D of FIG. 5A is greater than the level difference D of FIG. 2.

On the other hand, as shown in FIG. 5B, the case where the thickness T1 of the flange portion 11 is thick and the thickness T2 of the upper facing portion 5 is also thick is considered. In this case, although the step difference due to the flange portion 11 is large, since the connecting portion 6 connecting the upper facing portion 5 is thick, the followability to the above large step difference is low. Therefore, as a result, a recess 17 larger than the recess 17 shown in FIG. 2 is produced. That is, the level difference D of FIG. 5B is greater than the level difference D of FIG. 2.

On the other hand, as shown in FIG. 5C, the case where the thickness T1 of the flange portion 11 is thick and the thickness T2 of the upper facing portion 5 is thin is examined. In this case, since the step difference generated by the flange portion 11 is large and the connecting portion 6 connecting the upper side facing portion 5 is thin, the followability to the above large step difference is high. Therefore, a concave portion 17 larger than the concave portion 17 shown in FIGS. 5B and 5C is generated. That is, a recess 17 that is significantly larger than the recess 17 shown in FIG. 5A is generated. That is, the level difference D of FIG. 5D is significantly larger than the level difference D of FIG. 2.

In this embodiment, by setting the ratio (T2 / T1) of the thickness T2 of the upper facing portion 5 to the thickness T1 of the flange portion 11 to be larger, or further setting the thickness T1 of the flange portion 11 It is below the desired upper limit, or the thickness T2 of the upper facing portion 5 is set above the desired lower limit, and the depth D of the concave portion 17 is set below the desired upper limit.

On the other hand, except for the thickness T1 of the flange portion 11 and the thickness T2 of the upper facing portion 5, as shown in FIG. 5D, when the interval I between the adjacent conducting portions 3 is large, the adjacent Inside the connecting surface 16, a concave portion 17 larger than the concave portion 17 shown in FIG. 2 is generated. That is, the level difference D of FIG. 5D is greater than the level difference D of FIG. 2.

On the other hand, as shown in FIG. 2, when the interval I between the adjacent conductive portions 3 is small, the connecting portion 6 connecting the upper facing portion 5 does not surely follow the step difference. Therefore, the concave portion 17 becomes smaller. That is, the level difference D of FIG. 2 is smaller than the level difference D of FIG. 5D.

Therefore, in this embodiment, the interval I between the adjacent conductive portions 3 is set to the above upper limit or lower, and the depth D of the recess 17 is set to or lower than the desired upper limit.

<Modifications> In the following modifications, the same components and steps as those in the above-mentioned embodiment are denoted by the same reference symbols, and detailed descriptions thereof are omitted. Moreover, each modification can be combined as appropriate. Furthermore, unless otherwise specified, each of the modified examples can produce the same effects as those of the first embodiment.

Although not shown in the inspection substrate 1 shown in FIG. 2, bumps and / or plating layers may be provided on the lower surface of the central portion 12 and / or the upper surface of the central portion 12 and the inclined portion 13.

In addition, the connection upper surface 38 of the connection portion 6 in the insulating layer 2 may not have the concave portion 17. The upward facing surface 7 and the connecting upper surface 38 are at the same level in the thickness direction, so the level difference D is zero. In this case, the second concave portion 47 having the depth D (level difference D) remains. That is, the inspection substrate 1 has at least one of the second concave portion 47 and the concave portion 17.

In the step shown in FIG. 4F, the conductive protective composition is applied to the entire surface of the upper surface of the inspection substrate 1 by coating, but it can also be placed on the body by printing such as screen printing or inkjet printing, for example Department 10. At this time, even if the conductive protective composition printed on the body portion 10 flows (moves) to the upper surface 7 of the upper opposing portion 5 and further to the upper surface 38 of the connection of the connection portion 6, it can be scraped off by the above ( After washing, etc., the conductive protection composition that has moved to the upper side of the recess 17 is surely removed.

In one embodiment, as shown in FIG. 1, the plurality of conducting portions 3 are arranged in a dislocated manner, but for example, as shown in FIG. 6, along the longitudinal direction and the lateral direction (both directions are along the surface direction and are mutually (Intersection) spaced apart from each other and arranged in a lattice.

In addition, as shown in FIGS. 7 and 8, the inspection substrate 1 may further include a height member 27.

The shim member 27 brings the connecting upper surface 38 of the connecting portion 6 closer to or in the same order as the upper surface 7 of the upper facing portion 5 in the thickness direction.

The pad member 27 is buried in the insulating layer 2 between the plurality of conductive portions 3. The shim member 27 is located between the three conducting parts 3 close to each other. Specifically, in the case where the plurality of conducting parts 3 are arranged in a dislocation shape, one pad is arranged in a virtual region surrounded by three virtual line segments connecting the three conducting parts 3 (the center) to each other高 员 27. Or, as shown in the imaginary line of FIG. 6, when a plurality of conducting parts 3 are arranged in the vertical and horizontal directions, surrounded by four imaginary line segments connecting the four conducting parts 3 (the center) to each other One pad member 27 is arranged in the virtual area.

As shown in FIG. 8, the shim member 27 is embedded in the central portion of the connecting portion 6 in the thickness direction. Each of the plurality of shim members 27 has a substantially circular plate shape extending in the plane direction. In addition, the shim member 27 is located at the same level as the flange portion 11 in the thickness direction. The thickness of the shim member 27 is the same as the thickness T1 of the conducting portion 3 (flange portion 11), for example. The distance (facing distance) L between the outer side surface of the shim member 27 and the connecting surface 16 of the flange portion 11 is in the same range as I described above. The material of the cushion member 27 is not particularly limited. Examples of the material of the shim member 27 include conductors and resins, and preferably the same materials as those of the conducting portion 3. If the material of the pad member 27 is the same material as the conductive portion 3, the pad member 27 can be formed as a dummy conductive portion 32 that does not have conduction in the thickness direction.

When forming the shim member 27, for example, in the step shown in FIG. 3B, the shim member 27 is provided on the upper side (upper surface) of the lower portion 35 simultaneously with, or before and after the formation of the conductive portion 3. If the pad member 27 is the dummy conducting portion 32, it is preferable to form the dummy conducting portion 32 simultaneously with the formation of the conducting portion 3.

Then, when the insulating upper portion 23 is provided, the upper surface (exposed surface) of the lower portion 35 of the connecting portion 6 is covered by the cushion member 27, that is, the upper surface of the cushion member 27 becomes the exposed surface, and the exposed surface is directed upward High. Therefore, since the influence of the step difference generated by the flange portion 11 is reduced, the connecting upper surface 38 of the connecting portion 6 can be approached or arranged at the same level in the thickness direction with respect to the facing upper surface 7 of the upper facing portion 5.

Furthermore, the inspection substrate 1 includes an elevation member 27 embedded in the insulating layer 2 between the plurality of conductive portions 3 so that the connection upper surface 38 of the connection portion 6 faces the upper side in the thickness direction The pair of parts 5 is close to or arranged on the same level as the upper surface 7. Therefore, the above-mentioned level difference D can be surely set to 5 μm or less. Therefore, the conductive protective composition disposed on the upper surface of the insulating layer 2 can be more surely removed.

Furthermore, the shim member 27 is located at the same level as the flange portion 11 in the thickness direction, so the structure is simple.

Furthermore, in FIG. 7, a plurality of shim members 27 are provided independently of each other, but for example, as shown in FIGS. 9 and 10, one shim member 27 may be continuously provided in the plane direction.

The cushion member 27 has a substantially honeycomb shape in plan view. Specifically, the cushion member 27 is continuously formed in the plane direction with a hexagonal shape having three sets of mutually parallel sides, and a plurality of conducting portions 3 are arranged in an area surrounded by each of the plurality of hexagons Of each.

In addition, as shown in FIG. 11, a plurality of cushion members 27 may be provided independently of each other so as to have a substantially Y-shape in plan view. In addition, the shape of the shim member 27 is not limited to this, and may be a polygonal shape such as a triangular shape, a rectangular shape, and a pentagonal shape. Specifically, in the modification shown in FIG. 11, the center portion of each side in the roughly honeycomb shape shown in FIG. 9 is cut. In detail, each of the plurality of shim members 27 has the shape of a projection wave canceling block (registered trademark), and in detail, has three straight lines extending in three directions from the center (center of gravity) of the above-mentioned virtual region unit. The angle formed by each of the three straight portions is, for example, 120 degrees.

In one embodiment, as shown in FIG. 2, the lower surface of the lower facing portion 4 and the connecting lower surface 37 of the connecting portion 6 are located at the same level as the lower surface of the central portion 12. However, as shown in FIG. 12, the lower surface of the lower facing portion 4 and the connecting lower surface 37 of the connecting portion 6 may be located at a lower level (lower side) with respect to the lower surface of the central portion 12.

The lower facing portion 4 has a second tapered surface 19 in addition to the tapered surface 18 of one embodiment. That is, in the modification shown in FIG. 12, the lower facing portion 4 has two tapered surfaces.

The second tapered surface 19 is continuous with the lower edge of the tapered surface 18. The second tapered surface 19 is inclined outward toward the lower side. The lower end edge of the second tapered surface 19 is continuous with the inner periphery of the lower surface of the lower side facing portion 4.

In one embodiment, the flange portion 11 is exemplified as an example of the peripheral portion covered by the insulating layer, but for example, the inclined portion 13 may be exemplified as shown in FIG. 13. The conducting portion 3 does not include the flange portion 11 but includes the body portion 10.

The inclined portion 13 in the conducting portion 3 is covered with the insulating layer 2. In addition to the above-mentioned upper surface and lower surface, the inclined portion 13 also has a connecting surface 16 connecting these peripheral edges.

On the other hand, the lower facing portion 4 in the insulating layer 2 is a base supporting the inclined portion 13 from the lower side, and is in contact with the lower surface of the inclined portion 13.

The upper facing portion 5 is a covering portion that covers the inclined portion 13 from the upper side, and is in contact with the upper side of the inclined portion 13.

In one embodiment, as shown in FIG. 4H, the conductive protection portion 29 has a curved shape. Although not shown, for example, it may have a flat shape that is continuous with the upper surface 7 facing the upper facing portion 5. [Example]

Examples and comparative examples are shown below to explain the present invention more specifically. Furthermore, the present invention is not limited to any examples and comparative examples. The specific values of the blending ratio (content ratio), physical property values, and parameters used in the following description can be described by the corresponding blending ratios (content ratio), physical property values, and parameters described in the above “embodiments” The upper limit (defined as "below" and "not reached" values) or the lower limit (defined as "above" and "exceeded" values) instead.

Example 1 to Example 11 and Comparative Examples 1 to 4 According to the steps shown in FIGS. 3A to 4E, the insulating layer 2 and the conducting portion 3 having the dimensions described in Table 1 and having the sizes shown in Table 1 are manufactured.之 更新 的 PCB 1. Furthermore, the material of the insulating layer 2 is polyimide. The material of the conducting part 3 is copper.

In addition, in Example 10 and Example 11, the inspection substrate 1 further includes the cushion member 27 described in FIGS. 7 and 8. The pad member 27 is a dummy conduction part 32 made of copper.

Manufacturing Examples 1 to 10 and Comparative Manufacturing Examples 1 to 5 According to the steps shown in FIGS. 4F to 4H, the conductive protection portion 29 is provided on the inspection substrate 1 of each embodiment and each comparative example.

The conductive protection part 29 has the average particle diameter d described in Table 1, and contains 70 parts by mass of conductive particles containing nickel-plated resin particles, and 21 parts by mass of epoxy resin (jER828, manufactured by Mitsubishi Chemical Corporation) (70 parts by mass in the matrix component) %), And 9 parts by mass of phenoxy resin (YP-50, manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.) (30% by mass in the matrix component). In addition, the partial removal of the conductive coating film 28 is performed by scraping off with the squeegee 26.

(Evaluation) (Occurrence Rate of Short Circuit in Adjacent Conducting Parts) Touch the probe of the resistance meter to each upper surface of the conductive protection part 29 corresponding to the adjacent (adjacent) conducting part 3, and measure the resistance value, thereby The occurrence rate of short circuit in the adjacent conduction part 3 was evaluated.

(The ratio of conductive particles in the inner surface of the insulation) The ratio of the conductive particles in the inner surface 8 was evaluated by an optical microscope.

(Comprehensive evaluation) ◎: The occurrence rate of short circuit is less than 0.2%, and the ratio of conductive particles is more than 90%. ○: The occurrence rate of short circuit is 0.2% or more and 1% or less, and the ratio of conductive particles is 90% or more. Δ: The occurrence rate of short circuit is 0.2% or more and 1% or less, and the ratio of conductive particles is less than 90% and 70% or more. ×: The occurrence rate of short circuit exceeds 1%.

[Table 1]

In addition, the above-mentioned invention is provided as an exemplary embodiment of the present invention, which is only an example and should not be interpreted in a limited manner. Variations of the invention that are obvious to those skilled in the art are included in the following patent application scope. [Industry availability]

The inspection substrate of the present invention is used for electrical inspection of non-inspection devices.

1‧‧‧ Inspection board

2‧‧‧Insulation

3‧‧‧Conducting Department

4‧‧‧Lower Opposite Department

5‧‧‧The upper part

6‧‧‧Link

7‧‧‧The first insulating upper surface

8‧‧‧Inward facing surface

9‧‧‧Opening

10‧‧‧Body

11‧‧‧Flange

12‧‧‧Central Department

13‧‧‧ Inclined part

14‧‧‧Flange lower surface

15‧‧‧Flange upper surface

16‧‧‧ Connection surface

17‧‧‧recess

18‧‧‧conical surface

19‧‧‧2nd conical surface

21‧‧‧Support board

22‧‧‧Insulation lower part

23‧‧‧Insulation upper part

24‧‧‧Insulation film

25‧‧‧Substrate for inspection with conductive protective layer

26‧‧‧Scraper

27‧‧‧Elevation member

28‧‧‧ conductive coating

29‧‧‧Conduction Protection Department

30‧‧‧ Inspection device

31‧‧‧ Checked device

32‧‧‧Dummy conduction department

33‧‧‧Check electrode

34‧‧‧electrode

35‧‧‧lower part

36‧‧‧Second recess

37‧‧‧Connect the lower surface

38‧‧‧Connect the upper surface

39‧‧‧ on the downward surface

47‧‧‧Second recess

D‧‧‧level difference

d‧‧‧The average particle size of conductive particles

D2‧‧‧ 2nd place difference

I‧‧‧Interval between adjacent conducting parts

L‧‧‧Interval (opposite distance)

T1‧‧‧Thickness of flange

T2‧‧‧ Thickness of the opposite side

FIG. 1 is a plan view showing an embodiment of the inspection substrate of the present invention. FIG. 2 is a cross-sectional view of the inspection substrate shown in FIG. 1 along line A-A. FIGS. 3A to 3D are steps of the manufacturing method of the inspection substrate shown in FIG. 2 and the manufacturing method of the inspection substrate with a conductive protective layer using the inspection substrate, FIG. 3A shows the step of providing the insulating lower part, and FIG. 3B shows the setting For the step of the conducting portion, FIG. 3C shows the step of providing an insulating coating, and FIG. 3D shows the step of providing the insulating upper portion. 4E to 4H are steps diagrams of the manufacturing method of the inspection substrate shown in FIG. 2 following FIG. 3D and the manufacturing method of the inspection substrate using the conductive protection layer with the inspection substrate, and FIG. 4E shows the step of removing the support plate 4F shows the step of providing a conductive coating film, FIG. 4G shows the step of removing a part of the conductive coating film, and FIG. 4H shows the formation of a conductive protection portion to manufacture a substrate with a conductive protective layer inspection, and then, by attaching a conductive protective layer inspection The step of inspecting the inspection device with the substrate. FIGS. 5A to 5D are explanatory diagrams for investigating the recessed portion due to the thickness T1 of the flange portion, the thickness T2 of the upper facing portion, and the interval I between the conductive portions, and FIG. 5A illustrates the thickness T1 of the flange portion It is thin and the thickness T2 of the upper facing portion 5 is thin. FIG. 5B illustrates the thickness T1 of the flange portion and the thickness T2 of the upper facing portion 5 is thick. FIG. 5C illustrates the flange portion. The thickness T1 is thicker and the thickness T2 of the upper facing portion 5 is thinner. FIG. 5D illustrates a state where the interval I between adjacent conductive portions is larger. FIG. 6 shows a plan view of a modified example of the inspection substrate shown in FIG. 1 (a state in which the conductive portions are arranged in a grid in the longitudinal and lateral directions). FIG. 7 is an enlarged plan view of a modified example of the inspection substrate shown in FIG. 8 is a cross-sectional view along the B-B bending line of the inspection substrate shown in FIG. 7. FIG. 9 shows an enlarged plan view of a modified example of the inspection substrate shown in FIG. 1 (a state in which one pad member is provided). FIG. 10 shows a cross-sectional view of the inspection substrate shown in FIG. 9 along line A-A. FIG. 11 shows a plan view of a modified example of the inspection substrate shown in FIG. 1 (the state in which the cushion member is substantially Y-shaped). FIG. 12 shows a plan view of a modified example of the inspection substrate shown in FIG. 1 (the state where the lower facing portion has two types of tapered surfaces). FIG. 13 shows a plan view of a modified example of the inspection substrate shown in FIG. 2 (a state where the body portion does not have a flange portion).

Claims (9)

An inspection substrate, characterized in that: it is used to make the inspection device and the inspection device arranged on one side and the other side of the thickness direction respectively conduct in the thickness direction, and is provided with: an insulating layer; and a plurality of conduction A portion that penetrates the thickness direction of the insulating layer and is spaced apart from each other in a direction orthogonal to the thickness direction; the insulating layer covers the thickness direction of the peripheral portion of each of the plurality of conductive portions On one side, the insulating layer includes: a facing portion, which is disposed on one side in the thickness direction with respect to the peripheral edge portion, and is opposed to the peripheral edge portion; and a connecting portion, which is disposed between adjacent facing portions , And the adjacent opposing portions are connected in the orthogonal direction; and the step difference D of the thickness direction surface of the opposing portion and the thickness direction surface of the connecting portion in the thickness direction is 5 μm or less . The inspection substrate according to claim 1, wherein the ratio (T2 / T1) of the thickness T2 of the opposed portion to the thickness T1 of the peripheral portion is 0.6 or more. The inspection substrate according to claim 1, wherein the thickness T1 of the peripheral portion is 10 μm or less. The substrate for inspection according to claim 1, wherein the thickness T2 of the opposed portion is 7 μm or more. The substrate for inspection as claimed in claim 1, wherein the interval I between the above-mentioned conductive portions exceeds 5 μm and does not reach 15 μm. The inspection substrate according to claim 1, further comprising a padding member, the padding member being buried in the insulating layer between the plurality of conductive portions so that the thickness direction of the connecting portion is opposite to the thickness direction in the thickness direction The thickness direction of the above-mentioned opposing portion is close to or arranged at the same level. The inspection substrate according to claim 6, wherein the pad member is located at the same level as the peripheral portion of the conductive portion in the thickness direction. A method for manufacturing a substrate for inspection with a conductive protection part, comprising the steps of: disposing a conductive protection composition containing conductive particles having an average particle diameter d equal to or greater than the above-mentioned step difference D for inspection as in claim 1 The surface in the thickness direction of the substrate; removing the conductive protection composition disposed on the surface in the thickness direction of the insulating layer; and forming the conductive protection portion from the conductive protection composition disposed on the surface in the thickness direction of the conductive portion. The method for manufacturing a substrate for inspection of a conductive protection part according to claim 8, wherein the average particle diameter d of the conductive particles is less than 10 μm.