CN108605412A - The manufacturing method of flexible circuit board and flexible circuit board - Google Patents
The manufacturing method of flexible circuit board and flexible circuit board Download PDFInfo
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- CN108605412A CN108605412A CN201780009400.0A CN201780009400A CN108605412A CN 108605412 A CN108605412 A CN 108605412A CN 201780009400 A CN201780009400 A CN 201780009400A CN 108605412 A CN108605412 A CN 108605412A
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- Prior art keywords
- flexible circuit
- hole
- circuit board
- conductive layer
- base material
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Even if the present invention provides a kind of short circuit using than that can be effectively prevent if previous more electroconductive binders between electrode, while can improve the flexible circuit board of fixed force between electronic unit and flexible circuit piece and the manufacturing method of flexible circuit board.Electronic unit 2 with electrode 3 is installed on flexible circuit piece 9 and forms flexible circuit board 1.Flexible circuit piece 9 has the base material 4 being made of resin film, is formed in the through hole 5 of base material 4 and covers through hole 5 from a surface side of base material 4 and constitute the conductive layer 7 of circuit pattern, the electrode 3 of electronic unit 2 is able to be mounted on conductive layer 7 from another surface side of base material 4 by through hole 5, while conductive adhesion portion 6 made of electroconductive binder hardening is formed in through hole 5.
Description
Technical field
The present invention relates to installing the flexible circuit that electronic unit is formed by the flexible circuit on piece of base material of resin film
The manufacturing method of substrate and flexible circuit board.
Background technology
Flexible circuit board has flexibility, can the power through very little and repeated deformation, have and also can in a deformed state
The property of its electrical characteristics, such flexible circuit board is maintained to be used in various electronic products.
Manufacturing such flexible electrical by way of installing electronic unit as the flexible circuit on piece of base material using resin film
Base board.
Such as installation of the electronic unit in flexible circuit piece is carried out by following manner shown in patent document 1：It will lead
Electric adhesive is coated in being formed at the line pattern of flexible circuit piece, then in coated portion crimping, installation electronic unit
Lead (electrode).
Fig. 8 is the sectional view of the major part for an example for showing such existing flexible circuit board 200.It is existing
Flexible circuit board 200 be formed by：It has flexible circuit piece 90, and the flexible circuit piece 90 includes conductive layer
70, which is formed in the line pattern on the base material 40 being made of resin film, meanwhile, it is hardened by electroconductive binder
The conductive adhesion portion 60 of formation and so that the electrode 30 of electronic unit is fixed on conductive layer 70.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 07-170048 bulletins
Invention content
Problems to be solved by the invention
However, in existing flexible circuit board 200, the protrusion of the line pattern formed by electroconductive binder can cause
It is short-circuit between the adjacent electrode 30 of electronic unit.Therefore, it is necessary to fix electricity with a small amount of electroconductive binder outstanding is not generated
Pole 30.
In turn, once the quantitative change of electroconductive binder is few, the adhesive strength of bond site is just insufficient, to which there are flexible circuits
The bending or impact of piece and the problem of cause electronic unit to be easily peeled off.
Therefore, even if proposing the present invention, and it is an object of the present invention to provide a kind of using than previous more conduction in view of the above problems
Adhesive also can effectively prevent the short circuit between electrode while can improve the fixation between electronic unit and flexible circuit piece
The flexible circuit board of power and the manufacturing method of flexible circuit board.
The method for solving problem
The flexible circuit board of the present invention, installs electronic unit with electrode in flexible circuit on piece and is formed
Flexible circuit board, it is characterised in that：Flexible circuit piece have be made of resin film base material, be formed in base material through hole,
Through hole is covered from a surface side of base material and constitutes the conductive layer of circuit pattern, and the electrode of electronic unit is from another surface side of base material
It is able to install on the electrically conductive by through hole, while being formed with conductive adhesion made of electroconductive binder hardening in through hole
Portion.
According to such present invention, electroconductive binder can be filled in through hole, can use and be led than in the past more
Electric adhesive.Thereby, it is possible to improve the fixed force between electronic unit and flexible circuit piece, when flexible circuit board deforms
It can prevent the stripping of electronic unit.Moreover, because electroconductive binder is deposited in through hole, therefore, also prevent conductive viscous
The protrusion of mixture, the short circuit that can be effectively prevent between electrode.
In addition, the present invention can be form below：With the first protective layer, in the first protective layer covering conductive layer
The surface with substrate side opposite side.
It can pass through protection according to such form, if even if having run through a part for conductive layer when forming through hole
Layer closes the through position.
In addition, the present invention can be form below：With the second protective layer, second protective layer covers conductive adhesion
Bond site between portion and electrode.
According to such form, the weatherability in conductive adhesion portion can be improved.
In addition, the present invention can be form below：The inner peripheral surface of through hole towards conductive layer side and diameter with becoming
Small mode tilts.
According to such form, it can be ensured that the bond area bigger with conductive adhesion portion in the inner peripheral surface of through hole,
Fixed force can be further increased.
In addition, the present invention can be form below：It is formed with protruding portion on the periphery of through hole.
According to such form, compared with the through hole of not protruding portion, the coating amount of electroconductive binder, energy can be increased
Enough stationary planes further expanded between electrode and base material, further increase fixed force.
In addition, the present invention can be form below：Conductive layer is able to by conducting particles is dispersed in adhesive
It is formed, the content of the conducting particles in conductive layer is 85 mass % or more, 96 mass % or less.
Through hole can be formed on base material according to such form, if even if reducing the thickness of conductive layer, while can
Retain conductive layer not through ground.Furthermore it is possible to ensure retentivity of the adhesive to conducting particles, prevent conductive layer from becoming fragile.
In addition, the present invention can be form below：The thickness of conductive layer is 2 μm or more, 50 μm or less.
According to such form, the material i.e. usage amount of conductive paste of conductive layer can be inhibited, while inhibiting cost
Increase, prevent laser processing when conductive layer removed together with base material.
In addition, the present invention can be form below：The thickness of base material is 10 μm or more, 200 μm or less.
According to such form, it can be ensured that as the enough intensity and durability of base material, while making laser processing
Well.
The manufacturing method of the flexible circuit board of the present invention is to install electronics production with electrode in flexible circuit on piece
Product and the manufacturing method of flexible circuit board formed, which is characterized in that have：In a surface side of the base material being made of resin film
The process of conductive layer is formed, laser is irradiated from another surface side of the base material and forms through hole in the base material and expose institute
State conductive layer process and by the through hole the conductive layer install electronic unit the electrode while
The process of filling hardening electroconductive binder in the through hole.
According to such present invention, it is capable of providing flexible circuit board, the flexible circuit board is solid on the electrically conductive
When determining electronic unit, using than previous more electroconductive binder, the fixed force between electronic unit and flexible circuit piece is improved,
The protrusion for preventing electroconductive binder simultaneously effectively prevents the flexible circuit board of the short circuit between electrode.In addition, by making
With laser, even if can easily manufacture the flexible electrical if in the case where through hole is complex-shaped or configuration is complicated
Base board.
Invention effect
According to aforementioned present invention, even if using than that can be effectively prevent between electrode if in the past more electroconductive binders
Short circuit, while the fixed force between electronic unit and flexible circuit piece can be improved.It is compared with the past thereby, it is possible to provide, electricity
The flexible circuit board of the stripping of subassembly less, secured and high reliability.
Description of the drawings
Fig. 1 is the vertical view for the flexible circuit board for showing first embodiment.
Fig. 2 is the Section A-A figure of Fig. 1.
Fig. 3 is the sectional view of the major part of the first step for the manufacturing method for showing flexible circuit board.
Fig. 4 is the sectional view of the major part of the second step for the manufacturing method for showing flexible circuit board.
Fig. 5 is the sectional view of the major part for the flexible circuit board for showing second embodiment.
Fig. 6 is the sectional view of the major part for the flexible circuit board for showing 3rd embodiment.
Fig. 7 is the sectional view of the major part for the flexible circuit board for showing fourth embodiment.
Fig. 8 is the sectional view for the major part for showing existing flexible circuit board.
Component represents symbol description
1,1', 10,100,200 flexible circuit boards
2 electronic units
3 leads (electrode)
4 base materials
5 through holes
6 conductive adhesion portions
7 conductive layers
8 first protective layers
The second protective layers of 8'
9 flexible circuit pieces
51 protruding portions
Specific implementation mode
Hereinafter, being illustrated to the flexible circuit board of the embodiment of the present invention with reference to attached drawing.
First embodiment (Fig. 1, Fig. 2)
The flexible circuit board 1 of first embodiment is to use conductive adhesion portion 6 by the ministry of electronics industry with the lead 3 as electrode
Part 2 is fixed on the mode of flexible circuit piece 9 and is formed.Conductive adhesion portion 6 refers to by the electroconductive binder institute shape after hardening
At lead 3 fixed position.
Flexible circuit piece 9 with base material 4, the through hole 5 that is formed in base material 4, from a surface side of base material 4 cover through hole
5 and constitute circuit pattern conductive layer 7 mode and formed.
Base material 4 is formed by resin film.As the material of the resin film, such as can be by polyethylene terephthalate
(PET) resin, polyethylene naphthalate (PEN) resin, makrolon (PC) resin, polyimides (PI) resin, poly- first
Base acrylic acid (PMMA) resin, polypropylene (PP) resin, polyurethane (PU) resin, polyamide (PA) resin, polyether sulfone (PES) tree
The formation such as fat, polyether-ether-ketone (PEEK) resin, tri acetyl cellulose (TAC) resin, cyclic olefin polymer (COP).Wherein, from
From the perspective of laser processing property, preferred polyethylene terephthalate (PET) resin.
Can use the prime coat of enhancing and adhesiveness between conductive layer or electroconductive binder, sealer or
Layer that is in external coating for the purpose of antistatic etc., being made of organic polymer and carrying out surface treatment is used as resin
Film.
The thickness of resin film is preferably 10~200 μm.If thickness reaches 200 μm, meet as flexible circuit piece
Intensity, but when more than 200 μm, it is more thick more be not necessarily to improve intensity, the shortcomings that tailing off instead there is also space on thickness direction.
In addition, if more than 200 μm, then compared with the thickness of aftermentioned conductive layer 7, the thickness of resin film becomes too much, therefore, makes
In the case of being processed with laser, it is difficult to adjust laser output come for leaving conductive layer 7, removal resin film.Another party
It face then can be insufficient as the durability of base material 4 if it is less than 10 μm.
Through hole 5 is formed as pattern corresponding with the configuration of lead 3 of electronic unit 2 to be mounted.Specifically, perforation
Hole 5 will form bigger than the shape of lead 3, and base material 4 has been retained between adjacent lead.This is because if adjacent draw
Through hole 5 between line 3 is connected, then electroconductive binder is flowed out by the connected component, and short circuit can occur between adjacent legs 3.
Through hole 5 is formed in such a way that inner circumferential surface is vertical with the surface of base material 4.In addition, through hole 5 is overlooked
Be formed as oblong under visual angle.
In addition, shape of the through hole 5 in the case where overlooking visual angle is not limited to oblong, shape can be arbitrary.However, perforation
Hole 5 is not by the way that for round, ellipse or oblong, to different from the through hole 5 of rectangle, inner peripheral portion forms corner, therefore,
Electroconductive binder does not diffuse into the corner and forms gap section, can prevent fixed force from reducing the generation of this problem.This
Outside, when forming through hole 5 with laser, rectangle is compared, oblong can be easier to process.
In turn, compared with overlooking rounded through hole 5 under visual angle, the through hole 5 of oblong can make between through hole 5
Spacing narrows, even if the lead 3 of electronic unit 2 can make that short circuit does not occur between adjacent lead 3 if with thin space setting.
Conductive paste made of dispersing conductive particles (electric conductivity coating liquid) hardens and forms conductive layer 7 in adhesive.
If using conductive paste, it will be able to circuit pattern is formed by printing, therefore, with the circuit pattern for etching copper foil and being formed
It compares, having the advantages that can be with the high flexible circuit piece of less process number, low cost manufacture circuit degree of freedom.
As conducting particles, particle made of metal can be used, can specifically enumerate silver, copper, aluminium, nickel or they
Alloy or with silver or gold coating metal obtained by particle.Wherein, it is preferable to use the high silver particles of electric conductivity.Aftermentioned
In laser treatment, in order to form through hole 5 in the case where not removing conductive layer 7 and on base material 4, preferably by such metal
The particle constituted.On the other hand, the conducting particles made of metal-coated resin is due to being easy by laser ablation, to difficult
To use.
As adhesive, organic polymer can be used.Acrylic acid, epoxy resin, polyester, poly- ammonia can specifically be enumerated
The various resins such as ester, phenolic resin, melmac, organosilicon, polyamide, polyimides, polyvinyl chloride.Wherein, preferably
Polyester.
Conducting particles is dispersed in adhesive, the quality of conducting particles account for conductive layer 7 conducting particles and adhesive it is total
The ratio of quality is bigger, when through hole 5 is arranged on base material 4 with laser, is more difficult to removal conductive layer 7.Therefore, conductive layer 7
In the ratio of conducting particles be preferably 85 mass % or more, more preferably 88 mass % or more.
If it is less than 85 mass %, then it is difficult to be manufactured by using the manufacturing method of laser.In addition, if being 85
Quality % or more, though through hole 5 can be formed if then the thickness of conductive layer 7 is as thin as 4~20 μm on base material 4, while can
Retain conductive layer 7 not through ground.If it is 88 mass % or more, the thickness regardless of base material 4 can be removed accurately
Base material 4, while not through conductive layer 7, part of it being made to retain.
The upper limit of the mass ratio of conducting particles in conductive layer 7 is about 96 mass %.When more than 96 mass %, have viscous
The problem of mixture cannot keep conducting particles, and conductive layer 7 becomes fragile.
The thickness of conductive layer 7 can be 2~50 μm.Furthermore it is preferred that being 4~20 μm.If it is less than 2 μm, then add in laser
Working hour, the problem of having with substrate 4 together by laser ablation, if it exceeds 50 μm, then the usage amount of conductive paste increase and
Cost is caused to increase.If thickness is 4 μm or more, the condition and range of laser output broadens, and manufacture becomes easy.In addition, such as
Fruit thickness is 20 μm hereinafter, then conductive layer 7 is formed by the change of the step difference between circuit pattern and the surface of surrounding base material 4
It is small, when being coated with layer protective layer on circuit pattern, being mixed into for bubble can be inhibited.
Conductive layer 7 can be formed by conductive paste is printed as desired circuit pattern shape.Conductive paste can
It uses：(1) by substance made of conducting particles and adhesive dissolving in a solvent, or (2) will be before conducting particles and adhesive
Body (host agent and curing agent) dissolving in a solvent made of substance, or (3) when the precursor of adhesive be liquid when, by conducting particles
Substance made of being dispersed in the precursor of adhesive.In addition, on the basis of mentioned component, it also can be suitably in conductive paste
Add dispersant, antifoaming agent, ultra-violet absorber, antioxidant etc..
By the way that the lead 3 of electronic unit 2 is mounted on conductive layer 7 by through hole 5, while being filled in through hole 5,
Electroconductive binder is hardened to carry out fixation of the electronic unit 2 on flexible circuit piece 9.
Electroconductive binder is the adhesive that conducting particles is dispersed in adhesive and is formed.
As the conducting particles included in electroconductive binder, particle made of metal can be used, can specifically arrange
Enumerate silver, copper, aluminium, nickel or their alloy or the particle obtained by silver or gold coating metal.It is wherein, it is preferable to use conductive
Property the high, silver particles with weatherability.
As the adhesive included in electroconductive binder, organic polymer can be used.Propylene can specifically be enumerated
Acid, epoxy resin, polyester, polyurethane, phenolic resin, melmac, organosilicon, polyamide, polyimides, polyvinyl chloride
Etc. various resins.Wherein, it is preferable to use epoxy resin.By using epoxy resin, can improve between base material 4 and lead 3
Adhesiveness.
The manufacturing method (Fig. 3, Fig. 4) of flexible circuit board
In the following, being illustrated to the manufacturing method of the flexible circuit board 1 of first embodiment.
First, as the first step, as shown in figure 3, coating conductive paste in a surface side of base material 4, conductive layer is formed
7。
As the painting method of conductive paste, silk-screen printing can be enumerated, coated with rod coaters, use distributor
Coating etc..Wherein, from the viewpoint of it can form finer and complicated circuit pattern with low cost, silk is particularly preferably used
Wire mark brush.
Secondly, as the second step, as shown in figure 4, from the surface side opposite with the surface for being formed with conductive layer 7 to base material
4 irradiation laser leave conductive layer 7 and form through hole 5 on base material 4.The shape that conductive layer 7 exposes from through hole 5 is formed as a result,
State.
As the laser used in the second step, preferably carbon dioxide laser.If swashed with YAG laser or optical fiber
The solid state laser of light device etc. is then easy to remove conductive layer 7 while removing base material 4, it is difficult to leave conductive layer 7 and only remove
Base material 4.In this regard, by carbon dioxide laser, it can easily carry out while impenetrating thickness big base material 4, leave thickness
Spend the processing of small conductive layer 7.
When irradiating above-mentioned carbon dioxide laser, the laser mark region different from color and luster around it is formed in conductive layer 7.
The different region of the color and luster is that conductive layer 7 is rotten, the changed region of color and luster, base material 4 by completely through when formed.Cause
This, is by checking the region, the quality examination that can be irradiated after carbon dioxide laser.
In addition, other than with laser, the formation of through hole 5 can also be carried out using cutting edge.Cutting edge has
When forming multiple through holes 5 on base material 4, the advantages of multiple through holes 5 can be formed simultaneously.But using cutting edge
In the case of, it is difficult to process the through hole 5 of shapes or configure complexity, however, if using laser, can easily into
The processing of the through hole 5 of row shapes or configure complexity.
Then, as the third step, the lead 3 of electronic unit 2 is installed by through hole 5 on conductive layer 7, while is passing through
The filling of through-hole 5, hardening electroconductive binder.In this way, forming conductive adhesion portion 6, as depicted in figs. 1 and 2, formation is completed in flexibility
The state of electronic unit 2 is fixed on circuit wafer 9.
In addition, in the third step, although by electroconductive binder to the lead 3 of the electronic unit 2 in insertion through hole 5
It is fixed with base material 4, but can first be inserted into the lead 3 of electronic unit in through hole 5, then filled around it conductive viscous
Mixture can also fill electroconductive binder in through hole 5, then the lead of electronic unit is inserted into through hole in advance.
Second embodiment (Fig. 5)
The flexible circuit board 1' of second embodiment in addition on the flexible circuit board 1 of first embodiment again provided with the
Other than one protective layer 8 and the second protective layer 8', there is structure identical with above-mentioned first embodiment.Therefore, in theory below
In bright, the first protective layer 8 and the second protective layer 8' that elaboration is different from the first embodiment.
The flexible circuit board 1' of the present embodiment, as shown in figure 5, in conductive layer 7, opposite with 4 side of base material side table
The first protective layer 8 is formed on face.In addition, forming the second guarantor in a manner of covering the stick portion in conductive adhesion portion 6 and lead 3
Sheath 8'.As the material of the first protective layer 8 and the second protective layer 8', it is poly- that polyesters, polyvinyl chloride-base or acrylic acid can be enumerated
The various resin materials of urethane class.
Before forming through hole 5, formation of first protective layer 8 on the surface of conductive layer 7 is carried out.As a result, with laser
When device forms through hole 5, even if if a part for perforation conductive layer 7 through position can be closed by the first protective layer 8.
In addition, covering the second protective layer 8' of the stick portion between conductive adhesion portion 6 and lead 3 by setting, conduction can be improved
The weatherability of bonding part 6.This point especially using argentiferous electroconductive binder in the case of, for prevent silver corrosion especially
Effectively.
3rd embodiment (Fig. 6)
The flexible circuit board 10 of 3rd embodiment is in addition to different from 1 shape of flexible circuit board of first embodiment
Through hole 5' other than, have structure identical with above-mentioned first embodiment.As a result, in the following description, pair with first
The different through hole 5' of embodiment is illustrated.
The through hole 5' of the flexible circuit board 10 of the present embodiment has the tapered shape in top, that is, be formed as inner peripheral surface with
With towards 7 side of conductive layer and the inclined state of gradually smaller mode.It can be easily by using carbon dioxide laser
Form the tapered shape in such top.
Compared with the uniform through hole of internal diameter shown in Fig. 25, such through hole 5' can ensure to further increase inner circumferential
Bond area in face, with conductive adhesion portion 6, can further increase fixed force.
In addition, not using carbon dioxide laser, and through hole 5' can be also formed using cutting edge.In such case
Under, cutting edge is first passed through in advance and forms through hole 5' on base material 4, then, forms conductive layer 7.
Fourth embodiment (Fig. 7)
The flexible circuit board 100 of fourth embodiment is different from the flexible circuit board 10 of above-mentioned 3rd embodiment, removes
It is formed other than protruding portion 51, is had as the flexible circuit board 10 of above-mentioned 3rd embodiment identical around through hole 5'
Structure.As a result, in the following description, the protruding portion 51 being different from the third embodiment is illustrated.
Protruding portion 51 is to cover the periphery of through hole 5' and be formed as cricoid ridge.With the through hole of no protruding portion 51
5' is compared, and by the way that protruding portion 51 is arranged, can be increased the loading of electroconductive binder, can further be expanded lead 3 and base material 4
Between stationary plane, further increase fixed force.By using carbon dioxide laser, such protruding portion can be easily formed
51。
In addition, the through hole 5 of first embodiment can also be identically formed protruding portion 51.It in this case, also can be same
Increase to sample the loading of electroconductive binder, can further expand the stationary plane between lead 3 and base material 4, further increase
Fixed force.
Variation
As the shape of electrode, be not limited in shown in first embodiment, so-called SOP (Small Outline
Package) the shape of the lead 3 of the electrode shape of type electronic component, such as can have flat as LED chip
The shape of electrode pad, ball-type electrode or needle-like electrode.
Even if using electroconductive binder can be filled if such structure in through hole, can use more than previous
Electroconductive binder.Thereby, it is possible to improve the fixed force between electronic unit and flexible circuit piece, deformed in flexible circuit board
When, it can also prevent the stripping of electronic unit.Further, since electroconductive binder is deposited in through hole, therefore, also prevent leading
The protrusion of electric adhesive, the short circuit that can be effectively prevent between electrode.
In addition, in lead, electrode pad, ball-type electrode or needle-like electrode shown in such as first embodiment, preferably
Use lead or the needle-like electricity for the contact area that can be deeply inserted into through hole and can expand adhesive and electrode surface
Pole.
Claims (9)
1. a kind of flexible circuit board is the flexible electrical installed electronic unit with electrode in flexible circuit on piece and formed
Base board, it is characterised in that：
The flexible circuit piece has
The base material that is made of resin film,
Be formed in the base material through hole,
The through hole is covered from a surface side of the base material and constitutes the conductive layer of circuit pattern,
The electrode of the electronic unit is able to be mounted on described from another surface side of the base material by the through hole
Conductive adhesion portion made of electroconductive binder hardening is formed on conductive layer, while in the through hole.
2. flexible circuit board according to claim 1, it is characterised in that：With cover in the conductive layer with it is described
First protective layer on the surface of substrate side opposite side.
3. flexible circuit board according to claim 1 or 2, it is characterised in that：With cover the conductive adhesion portion and
Second protective layer of the stick portion between the electrode.
4. flexible circuit board described in any one of claim 1 to 3, it is characterised in that：The inner circumferential of the through hole
Face tilts in a manner of with becoming smaller towards the conductive layer side.
5. flexible circuit board according to any one of claims 1 to 4, it is characterised in that：The periphery of the through hole
It is formed with protruding portion.
6. flexible circuit board according to any one of claims 1 to 5, it is characterised in that：The conductive layer is by making
Conducting particles is dispersed in adhesive and is formed, the content of the conducting particles in the conductive layer be 85 mass % with
Upper, 96 mass % or less.
7. according to flexible circuit board according to any one of claims 1 to 6, it is characterised in that：The thickness of the conductive layer
It is 2 μm or more, 50 μm or less.
8. flexible circuit board according to any one of claims 1 to 7, it is characterised in that：The thickness of the base material is
10 μm or more, 200 μm or less.
9. a kind of manufacturing method of flexible circuit board is by installing electronic unit with electrode in flexible circuit on piece
And the manufacturing method of the flexible circuit board formed, which is characterized in that have：
In the process that a surface side of the base material being made of resin film forms conductive layer,
Through hole is formed in the base material and expose the work of the conductive layer from another surface side of base material irradiation laser
Sequence,
By the through hole the conductive layer install electronic unit the electrode, while the through hole fill,
The process for hardening electroconductive binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210498913.5A CN114980553A (en) | 2016-03-29 | 2017-02-27 | Flexible circuit board and method for manufacturing flexible circuit board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-065009 | 2016-03-29 | ||
| JP2016065009 | 2016-03-29 | ||
| PCT/JP2017/007388 WO2017169421A1 (en) | 2016-03-29 | 2017-02-27 | Flexible circuit board and method for manufacturing flexible circuit board |
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| CN202210498913.5A Division CN114980553A (en) | 2016-03-29 | 2017-02-27 | Flexible circuit board and method for manufacturing flexible circuit board |
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| CN108605412A true CN108605412A (en) | 2018-09-28 |
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| CN202210498913.5A Pending CN114980553A (en) | 2016-03-29 | 2017-02-27 | Flexible circuit board and method for manufacturing flexible circuit board |
| CN201780009400.0A Pending CN108605412A (en) | 2016-03-29 | 2017-02-27 | The manufacturing method of flexible circuit board and flexible circuit board |
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| CN202210498913.5A Pending CN114980553A (en) | 2016-03-29 | 2017-02-27 | Flexible circuit board and method for manufacturing flexible circuit board |
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| Country | Link |
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| JP (1) | JP6953018B2 (en) |
| CN (2) | CN114980553A (en) |
| DE (1) | DE112017000497T5 (en) |
| WO (1) | WO2017169421A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112066868A (en) * | 2020-09-24 | 2020-12-11 | 西交利物浦大学 | Bending degree detection unit, device and method and wearable equipment |
| CN113711498A (en) * | 2019-04-18 | 2021-11-26 | 松下知识产权经营株式会社 | Circuit mounting article and apparatus |
| CN115430585A (en) * | 2022-08-23 | 2022-12-06 | 西安微电子技术研究所 | Automatic three proofings coating protection mold device of TSOP lead wire |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019186258A (en) * | 2018-04-02 | 2019-10-24 | 住江織物株式会社 | Series connection structure of fibrous photovoltaic elements and cloth type solar cell including fibrous photovoltaic elements connected in series connection structure |
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- 2017-02-27 CN CN202210498913.5A patent/CN114980553A/en active Pending
- 2017-02-27 CN CN201780009400.0A patent/CN108605412A/en active Pending
- 2017-02-27 DE DE112017000497.7T patent/DE112017000497T5/en active Pending
- 2017-02-27 JP JP2018508805A patent/JP6953018B2/en active Active
- 2017-02-27 WO PCT/JP2017/007388 patent/WO2017169421A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| CN114980553A (en) | 2022-08-30 |
| JP6953018B2 (en) | 2021-10-27 |
| DE112017000497T5 (en) | 2018-11-15 |
| WO2017169421A1 (en) | 2017-10-05 |
| JPWO2017169421A1 (en) | 2019-02-14 |
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Application publication date: 20180928 |