CN115430585A

CN115430585A - Automatic three proofings coating protection mold device of TSOP lead wire

Info

Publication number: CN115430585A
Application number: CN202211014723.8A
Authority: CN
Inventors: 张丁; 强灏; 顾毅欣; 余欢; 王超
Original assignee: Xian Microelectronics Technology Institute
Current assignee: Xian Microelectronics Technology Institute
Priority date: 2022-08-23
Filing date: 2022-08-23
Publication date: 2022-12-06

Abstract

The invention discloses an automatic three-proofing coating protection die device for a TSOP lead, which comprises a lead protection die and a matched die supporting plate thereof, wherein the lead protection die is arranged on a cubic die base, and the lead protection die supports and fixes a module and simultaneously clamps and covers the TSOP lead of a protection circuit module through clamping pieces and supporting block components arranged on two sides, so that the lead is not contaminated by three-proofing paint in the three-proofing coating process; the mold base can be matched with a mold supporting plate with a corresponding groove, so that a protective mold clamped with the circuit module can be inserted on the mold base, and other five surfaces except the bottom surface of the circuit module can be sequentially horizontally upward through inserting and pulling steering, so that automatic three-proofing coating is implemented, accumulation or flowing in the three-proofing paint drying or baking and curing process is avoided, and the coating uniformity is achieved.

Description

Automatic three proofings coating protection mold device of TSOP lead wire

Technical Field

The invention belongs to the technical field of three-proofing protection, and relates to an automatic three-proofing coating protection die device for a TSOP lead.

Background

The circuit module that has TSOP lead wire before the position that needs to use carries out the welding dress, if need accomplish the three proofings lacquer coating of circuit itself, must ensure that in-process TSOP lead wire does not stained by three proofings lacquer.

In automatic three proofings coating, three proofings lacquer is to going on in order to realize even coating, generally adopts the injection mode, and three proofings lacquer liquid drop will be certain area scattering this moment, because unable by artifical real-time detection in the mechanical operation moreover, if consequently not protecting circuit outer lead wire, hardly prevent three proofings lacquer adhesion at the lead wire surface. If the three-proofing paint is stained with the outer lead, particularly the welding area, the contact and infiltration between the soldering tin and the lead can be seriously hindered, and the hidden danger of welding quality is caused. In particular, most of the three-proofing paints are transparent and colorless, and have strong fluidity before curing, and are found to be difficult if adhered to a lead wire, and thus need to be avoided as much as possible. On the other hand, the TSOP lead is in a comb-shaped parallel structure, so that the strength is generally weak, and the flatness, parallelism and coplanarity of the lead have great influence on the assembly and welding quality because the lead needs to be welded with a bonding pad; the problem that the TSOP lead is easily polluted in the automatic three-proofing coating process, so that the welding quality is influenced exists.

Disclosure of Invention

Aiming at the problem that the TSOP lead is easily polluted in the automatic three-prevention coating process in the prior art so as to influence the welding quality, the invention provides the automatic three-prevention coating protection die device for the TSOP lead, so that the TSOP lead is effectively protected from being polluted in the three-prevention coating process, and the welding quality is improved.

The invention is realized by the following technical scheme:

an automatic three-proofing coating protection die device for a TSOP lead comprises a lead protection die, a die base and a die supporting plate, wherein one end of the die base is inserted on the die supporting plate, and the other end of the die base is connected with the lead protection die; the lead protection die comprises clamping pieces and supporting blocks, wherein the clamping pieces are arranged on two sides of the supporting blocks, and the clamping pieces are connected with the supporting blocks in a matched mode to realize fixed clamping on the TSOP lead; the supporting block is fixedly arranged on the mold base.

Preferably, the clip includes a first side and a second side.

Preferably, grooves are respectively formed in two sides of the surface of the supporting block, and the lead ends of the circuit are arranged in the grooves and fixedly clamped through the first side faces of the clamping pieces.

Preferably, the second side surface of the clamping piece is fixedly connected with the side surface of the supporting block through a bolt.

Preferably, the clamping piece is of an L-shaped structure.

Preferably, the supporting block is fixedly connected with the die base through a bolt.

Preferably, a plurality of open grooves are formed in the mold supporting plate, and the mold base is inserted into the open grooves.

Preferably, the material of the lead protection die is one of metal, plastic or bakelite.

Preferably, the mold base is of a cubic structure.

Preferably, a round hole is formed in the side face of the mold base.

Compared with the prior art, the invention has the following beneficial technical effects:

the invention designs a die device for protecting a TSOP lead of a circuit, and fixes the circuit and protects the TSOP lead in the process of automatically coating three-proofing paint by a lead protection die arranged on a die base. TSOP lead wire can not stained by three proofings lacquer at three proofings coating in-process to through the plug of mould below mould base on the mould layer board turn to, can make other five surfaces except that circuit module bottom surface in proper order towards directly over in order to wait to coat three proofings lacquer. The invention is suitable for a rectangular hexahedral electronic product with a typical TSOP lead wire. The technical scheme of the invention has the advantages of simple structure, strong applicability, good protection effect, convenient and quick operation of circuit replacement and coating surface, and wide application value in automatic three-prevention coating of electronic products needing three-prevention coating before welding at present with higher and higher automation requirements.

Furthermore, the lead protection die is fixed by matching a cubic die base under the lead protection die with a bolt.

Furthermore, the position of the lead protection die and the circuit is fixed by the processed die supporting plate, and the supporting plate can also be used for transmission and transportation of a transfer system such as a connecting table in automatic three-proofing coating.

Furthermore, the opening matched with the size of the cubic mold base is processed on the mold supporting plate, so that the mold base is fixed on the supporting plate, the circuit clamped by the mold above the base is fixed, and a positioning basis is provided for automatic three-proofing coating.

Furthermore, the invention can make a typical hexahedral circuit with TSOP structure lead wire fixed by mutually matching the mould base under the mould with the matched size opening on the mould supporting plate, and can fix any one surface of the other five surfaces of the circuit except the bottom and then keep the surface facing to the right upper side horizontally so as to make the surface bear the three-proofing paint spraying.

Further, the four sides of the base of the cubic die are provided with the round holes, so that picking convenience is provided for an operator.

Furthermore, the invention realizes the shielding protection of TSOP type leads on two sides of the circuit through two L-shaped clamping piece die components, the L-shaped clamping pieces are arranged on two sides of the supporting block die component by bolts, the L-shaped clamping pieces are arranged and dismounted by the bolts so as to place the circuit, and the leads are positioned in the undamaged shielded position.

Drawings

FIG. 1 is a diagram of a TSOP lead automatic three-proofing coating protection mold system of a circuit;

FIG. 2 is a view showing an installation structure of a lead protecting mold and a mold base;

FIG. 3 is an exploded top view of the lead protection die and die base;

fig. 4 is an exploded view of a lead protection die;

FIG. 5 is a block diagram of a mold base;

FIG. 6 is an exploded view of the wire protection die and TSOP wires for the circuit mounted in place;

FIG. 7 is a side view of the structure of TSOP leads, a lead protection die and a die base for a circuit;

FIG. 8 is a TSOP lead side view of the circuit along with part size indicia;

FIG. 9 is a side view of the components of the protective mold system and a dimensional indicia of the various parts;

in the figure: the circuit comprises a circuit 1, a lead protection die 2, a die base 3, a die supporting plate 4, an open slot 5, a round hole 6, a bolt 7, a clamping piece 21 and a supporting block 22.

Detailed Description

The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.

As shown in fig. 1 and 2, the present invention provides a mold system for providing shielding and mechanical protection to TSOP type leads of an electric circuit in a three-proofing automatic coating process, comprising a lead protection mold 2 and a mold pallet 4, wherein the lead protection mold 2 is mounted on the mold pallet 4; the lead protection die 2 comprises clamping pieces 21 and supporting blocks 22, the clamping pieces 21 are arranged on two sides of the supporting blocks 22, TSOP leads of the circuit 1 are arranged between the clamping pieces 21 and the supporting blocks 22, so that the three-proofing paint spraying shielding of TSOP type outer leads of the circuit module and the mechanical protection of the TSOP leads of the circuit 1 in the coating process can be effectively realized in the automatic three-proofing paint coating process. According to the method, the position of the lead protection die 2 and the circuit is fixed through the processed die supporting plate 4, and the supporting plate can also be used for transmission and transportation of a transmission system such as a connecting table in automatic three-proofing coating.

As shown in FIG. 4, the clamping piece 21 is of an L-shaped structure, and the method is used for installing and removing the L-shaped clamping piece 21 through the bolt 7 so as to place a circuit and enable a lead to be in an undamaged and shielded position. The clip 21 includes a first side and a second side. As shown in fig. 3, two sides of the surface of the supporting block 22 are respectively provided with a groove, and the TSOP leads of the circuit 1 are mounted in the grooves on the two sides of the surface of the supporting block 22 and are fixedly clamped by the first side surfaces of the clamping pieces 21. The second side surface of the clamping piece 21 is fixedly connected with the side surface of the supporting block 22 through a bolt 7. The method realizes shielding protection of TSOP type leads at two sides of a circuit through two L-shaped clamping pieces 21 die components, and the L-shaped clamping pieces 21 are arranged at two sides of a convex supporting block 22 die component by bolts 7. The method supports the bottom of the circuit through a boss in the center of the die assembly of the supporting block 22 in the shape of a Chinese character 'tu', and places TSOP type leads on two sides of the circuit through L-shaped structures on two sides of the structure in the shape of a Chinese character 'tu', as shown in FIG. 6.

The three-proofing coating protection die system further comprises a die base 3, and the lead protection die 2 is fixedly installed on the die base 3. The lead protection die 2 is fixedly connected with the die base 3 through a bolt 7. Screw holes are formed in one surfaces of the lead protection die 2 and the die base 3, and the bolt 7 is used for fixing the lead protection die 2 and the die base 3 through the screw holes;

the mould supporting plate 4 is provided with a plurality of open slots 5, and the mould base 3 is inserted in the open slots 5. The size of the open slot 5 is larger than that of the mold base 3. The mould base 3 is of a cubic structure. According to the method, the opening matched with the size of the cubic mold base is processed on the mold supporting plate 4, so that the mold base 3 is fixed on the supporting plate, the circuit clamped by the mold above the base is fixed, and a positioning basis is provided for automatic three-prevention coating. The method can ensure that when a typical hexahedral circuit with TSOP structure leads is fixed, any one surface of the other five surfaces of the circuit except the bottom can be fixed and kept horizontally and directly upwards so as to enable the surface to bear three-proofing paint spraying.

As shown in fig. 5, the side of the mold base 3 is provided with a round hole 6, and the method provides picking convenience for an operator by forming the round holes 6 on four sides of the cubic mold base 4.

The present invention will be described in detail with reference to examples. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The following detailed description is illustrative of the embodiments and is intended to provide further details of the invention. Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the invention.

Specific embodiments include the following, as shown in fig. 3, 7, 8 and 9:

1. when the mold supporting plate 4 is manufactured, an open slot 5 matched with the size of the cubic mold base 3 is processed on the surface of the mold supporting plate, in one preferred embodiment, if the size of the cubic mold base 3 is 32mm multiplied by 32mm, the size of the open slot 5 is 32.1 mm;

2. processing five faces of a cubic mold base with round holes 6 suitable for fingers to hold, wherein in one preferred embodiment, the size of the cubic mold base is 32mm multiplied by 32mm, and the diameter of the round holes 6 is 8.0 mm);

3. a threaded hole for installing and fixing the lead protection die 2 is formed above the cubic die base 4;

4. the lead protection die 2 can be processed by metal, plastic or bakelite and other materials, wherein the lead protection die comprises a left L-shaped clamping piece 21, a right L-shaped clamping piece 21, a die middle convex supporting block 22 component and a fixing bolt 7, and the horizontal part of the convex structure is I-shaped;

5. the middle part of the lead protection die 2 is provided with a convex supporting block 22 component, and D1 (the width of platforms at two sides of a boss) is more than D1 (the width of a circuit lead plane part);

6. the middle part of the lead protection die 2 is provided with a convex supporting block 22 component, and D2 (the width of a boss) is less than D2 (the span of a circuit lead);

7. a convex supporting block 22 component is arranged in the middle of the lead protection die 2, H1 (the length of a region where a lead can be placed in the convex supporting block component) is more than H1 (the distance between the outer edges of two ends of a circuit lead is the total length of a lead region);

8. a supporting block 22 component in the shape of a Chinese character 'tu' in the middle of the lead protection die 2, wherein H2 (the height of a boss) is less than H2 (the height of a circuit lead station);

9.H3 (the maximum total length of the circuit) is less than or equal to h3 (the total length of the lead protection die) and less than h4 (the side length of the cubic base);

10.H0 ("L" clip thickness) < H2 (circuit lead stand-up) — H1 (spacing between outer edges at both ends of a circuit lead, i.e., total lead area length);

11.H5 ("L" clip 21 length) < h1 ("convex" support block 22 assembly can place the lead region length);

d3 (circuit lead exposed module body width) < D3 (width of the 'L' -shaped clip 21 shielding lead portion) < D1 (circuit lead plane portion width) — H4 (circuit lead thickness);

the L-shaped clamping piece 21 is fixed on the lead protection die 2 by a bolt 7, and the opening position of the bolt 7 needs to ensure that the fixed position of the L-shaped clamping piece 21 is positioned between the lower part of the module body and the upper part of the lead and covers the part of the lead exposed out of the module body;

14. when the die system is used, the circuit lead protection die 2 is arranged on the cubic die base 3;

15. when the circuit is installed, the circuit is horizontally placed on the convex supporting block 22 component in the middle of the lead protection die 2;

16. when protecting the lead, the left and right L-shaped clamping pieces 21 are covered above the TSOP lead of the circuit 1, the clamping pieces 21 are fixed by the bolts 7, and the L-shaped cover plate above the clamping pieces 21 covers or lightly presses all parts of the TSOP lead of the circuit 1, which are exposed out of the module body;

17. inserting the cube mold base 3 with the circuit and the mold installed into an open slot 5 on a mold supporting plate 4 to realize position fixing;

18. the automatic three-proofing coating equipment can perform automatic coating action programming according to the position including the fixed height of the circuit surface, so that three-proofing coating is performed on the circuit surface which is vertically upward at the time, and the side surfaces of other circuits are programmed in the same way;

19. after the surface three-proofing paint is coated and cured, as shown in fig. 1, the cubic die base is manually pulled up from the tray opening, then is rotated 90 degrees leftwards or rightwards, forwards or backwards, and then is inserted into the original position tray opening, and at the moment, automatic three-proofing coating action can be carried out on the other circuit surface which is horizontally upward;

20. and after coating and curing all surfaces of the finished circuit which need to be coated with the three-proofing paint, removing the fixing bolts 7 and taking down the circuit.

The invention relates to a lead protection die 2 arranged on a cubic die base and a supporting die supporting plate 4 thereof, wherein the lead protection die 2 supports and fixes a module and simultaneously clamps and covers a TSOP lead of a circuit 1 of a protection circuit module through an L-shaped clamping piece 21 arranged on two sides and a convex supporting block 22 arranged below the L-shaped clamping piece, so that the lead is not contaminated by three-proofing paint in the three-proofing coating process; the cubic die base 3 can be matched with a die supporting plate with a corresponding groove, so that a protective die with a circuit module clamped thereon can be inserted on the cubic die base, and through plug-pull steering, other five surfaces except the bottom surface of the circuit module can be sequentially horizontally upwards so as to implement automatic three-proofing coating, so that the three-proofing paint cannot be accumulated or flow in the drying or baking and curing process, the coating uniformity is achieved, and the realization of shielding and mechanical protection of a circuit lead has important significance for the assembly work of electronic products.

The foregoing is a further detailed description of the invention and it will not be appreciated that specific embodiments of the invention are set forth herein by way of limitation, and it will be apparent to those skilled in the art that numerous modifications and variations are possible without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The automatic three-proofing coating protection die device for the TSOP lead is characterized by comprising a lead protection die (2), a die base (3) and a die supporting plate (4), wherein one end of the die base (3) is inserted on the die supporting plate (4), and the other end of the die base (3) is connected with the lead protection die (2); the lead protection die (2) comprises clamping pieces (21) and supporting blocks (22), the clamping pieces (21) are arranged on two sides of the supporting blocks (22), and the clamping pieces (21) are connected with the supporting blocks (22) in a matched mode to realize fixed clamping of TSOP leads of the circuit (1); the supporting block (22) is fixedly arranged on the die base (3).

2. A TSOP lead automatic tri-proof coating protection die set according to claim 1, wherein the clip (21) comprises a first side and a second side.

3. The TSOP automatic three-proofing coating protection die device is characterized in that two sides of the surface of the supporting block (22) are respectively provided with a groove, and the lead ends of the circuit (1) are arranged in the grooves and fixedly clamped by the first side surfaces of the clamping pieces (21).

4. A TSOP lead wire automatic three-proofing coating protection die device according to claim 2, wherein the second side of the clamping piece (21) is fixedly connected with the side of the supporting block (22) through a bolt (7).

5. A TSOP lead wire automatic three proofing coating protection die device according to claim 1, wherein said clip (21) is L-shaped structure.

6. The automatic three-proofing coating protection die device for the TSOP lead wire according to claim 1, wherein the supporting block (22) is fixedly connected with the die base (3) through a bolt (7).

7. A TSOP lead automatic three-proofing coating protection die device according to claim 1, wherein the die supporting plate (4) is provided with a plurality of open slots (5), and the die base (3) is inserted into the open slots (5).

8. A TSOP lead automatic three-proofing coating protection die device according to claim 1, wherein the lead protection die (2) is made of one of metal, plastic or bakelite.

9. A TSOP lead wire automatic three proofing coating protection die device according to claim 1, wherein the die base (3) is of a cubic structure.

10. A TSOP lead wire automatic three-proofing coating protection die device according to claim 1, wherein the side of the die base (3) is provided with a circular hole (6).