TW201914737A - Processing device - Google Patents

Abstract

The disclosure reduces processing waste remaining on upper surfaces of a plurality of cover elements which form protective covers. The processing device of the disclosure includes a processing table for holding an object to be processed; a moving mechanism for linearly moving the processing table; the protective covers having the plurality of cover elements which cover the moving mechanism and overlap with one another, wherein the protective covers extend and contract along with the moving of the processing table; and a slide member moving relative to the plurality of protective covers along with the processing table and sliding on the upper surfaces of the plurality of cover elements.

Description

Processing device

The invention relates to a processing device.

Conventionally, when an electronic component such as a sealed substrate sealed with a resin is cut and singulated, a cutting device is used, and for example, a cutting device shown in Patent Document 1 is known. The cutting device includes a chuck table that holds an object to be processed, and a moving mechanism such as a ball screw that linearly moves the chuck table. In addition, the cutting device includes a protection plate for protecting the moving mechanism from cutting chips generated by cutting an object to be processed or machining fluid such as water supplied during cutting.

The protection plate is configured to be telescopic in accordance with the movement of the clip platform. Specifically, the protective plate includes a corrugated cover provided so as to surround the upper and lateral sides of the moving mechanism, and a plurality of plates constituting the protective plate provided on the upper surface of the corrugated cover. Each of the plates is configured to be sequentially overlapped, and slides with each other as the clip platform moves.

When an object to be processed is singulated by the cutting device, cutting chips such as a product portion and a scrap are generated. The product section is held by a clamping mechanism provided on the clamping platform.

However, since the cutting chips are not held by the chuck mechanism, they are scattered from the chuck platform or dropped to the outside after being cut from the product part. The flying chips may accumulate on the upper surface of each of the protective plates. If the clamp platform is moved in the state described above, in the process that the protective plate contracts with the movement of the clamp platform, cutting chips may invade between the plates that overlap each other. If machining debris penetrates between the plates, it will not only hinder the expansion and contraction of the protective plate, but also cause damage to the bellows due to contact with the bellows. If the corrugated cover is damaged, the processing fluid will leak to the moving mechanism, causing the moving mechanism to rust, causing malfunction or failure. As a result, the maintenance work or replacement work must be performed frequently, resulting in a decrease in the operation rate of the cutting device. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 6043648

[Problems to be Solved by the Invention] Accordingly, the present invention has been made in order to solve the problems described above, and a main object thereof is to reduce machining debris remaining on the upper surfaces of a plurality of cover elements constituting a protective cover. [Technical means to solve the problem]

That is, the processing device of the present invention includes a processing platform that holds a processing object, a moving mechanism that linearly moves the processing platform, and a protective cover having a plurality of cover elements that cover the moving mechanism and overlap each other. The processing platform moves and retracts; and a sliding member moves relative to the protective cover toward the processing platform along with the processing platform, and slides on the upper surfaces of the plurality of cover elements. [Effect of the invention]

According to the present invention configured as described above, it is possible to reduce machining debris remaining on the upper surfaces of the plurality of cover elements constituting the protective cover.

Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

The processing device of the present invention is as described above, and is characterized by comprising: a processing platform that holds a processing object; a moving mechanism that linearly moves the processing platform; and a protective cover having a plurality of covers that cover the moving mechanism and overlap each other. An element that expands and contracts with the movement of the processing platform; and a sliding member that relatively moves with respect to the protective cover toward the processing platform with the processing platform and moves on the upper surface of the plurality of cover elements slide. In the case of the processing device, when the processing platform is moved, the sliding member is relatively moved toward the processing platform relative to the plurality of protective covers to slide on the upper surfaces of the plurality of cover elements. The machining chips generated by the object remain on the upper surface of the protective cover, and the sliding members also remove the machining chips. Therefore, it is possible to prevent accumulation of machining chips on the upper surfaces of the plurality of cover elements constituting the protective cover. As a result, it is difficult for the machining chips to penetrate between the cover elements, and it is possible to reduce the causes of malfunction or failure of the protective cover or the moving mechanism. In addition, it is possible to suppress a decrease in the operation rate of the device and improve the productivity of the device.

In the processing device, in order to collect the processing chips generated by processing the object to be processed and discard them all at once, some further include a processing chip accommodating portion that stores the processing chips. In the above-mentioned structure, in order to enable the sliding member to reliably push the machining chips into the machining chip accommodating part along with the movement of the machining platform, it is desirable that the moving mechanism allows the machining platform to accommodate the machining chip. The person moving forward and backward moves the front end of the slide member on the chip receiving portion side to the upper surface of the cover element closest to the chip receiving portion by the advance and retreat of the processing platform. Or in a state where it is located on the side of the chip receiving portion. That is, it is desirable that the sliding member is located on the upper surface of the cover element closest to the machining chip accommodation portion in a state where the machining platform is moved to the machining chip accommodation portion side, or It is located on the side of the machining chip storage portion.

It is desirable that, among the cover elements adjacent to each other, the cover element located on the processing platform side is superposed on the cover element located on the opposite side from the processing platform. According to the above-mentioned structure, when the processing platform is moved and the protective cover is contracted, the machining chips pushed by the sliding member cannot enter between the cover elements. In the case of the opposite arrangement structure, when the processing platform moves and the protective cover contracts, it is feared that the machining chips pushed by the sliding member may be pushed between the cover elements.

Preferably, the sliding member is in the shape of a sheet covering the upper surface of the cover member. According to this structure, when the protective cover contracts with the movement of the processing platform, the machining chips can be pushed out by the sliding member, and the cover member and the gap between them can be covered by the sliding member. As a result, it is difficult for the machining chips to remain on the upper surface of the cover elements, and it is possible to further prevent the machining chips from entering between the cover elements.

In order to appropriately discharge the processing chips falling on both sides of the protective cover, it is desirable that the processing device further includes a processing chip discharge portion, which is provided along the moving direction of the processing platform on both sides of the protective cover, and is used for: Discharging the machining chips; and a fluid ejecting mechanism that ejects fluid toward the discharge side of the machining chip discharge section inside the machining chip discharge section. Here, as a specific embodiment of the machining chip discharge portion, a groove shape formed along the moving direction of the machining table is considered. When the groove shape includes a flat inner surface and a flat bottom surface, machining chips adhere to the flat inner surface and are difficult to discharge. In order to appropriately solve the problem, it is desirable that the bottom surface portion of the machining chip discharge portion having a groove shape has a curved inner surface. According to this structure, compared with a case of a flat inner surface, the contact area between the inner surface of the machining chip discharge portion and the machining chip can be reduced, and the machining chip becomes difficult to be attached. As a result, the machining can be easily discharged. Crumbs.

Further, some of the processing devices further include a fluid supply mechanism configured to supply a fluid toward the processing object held by the processing platform, and a receiving plate member provided between the processing platform and the protective cover. To receive machining chips generated during the processing of the object to be processed. Examples of the fluid supplied by the fluid supply mechanism include cutting water, cooling water, and washing water. Here, the receiving plate member has a discharge groove for discharging the machining chips together with the fluid in a predetermined direction. The supplied fluid may be a gas containing the gas. Gases and liquids are mixed and ejected, so that they can be ejected vigorously. In the structure, in order to increase the flow rate of the fluid flowing in the discharge groove of the receiving plate member and prevent the machining chips from being accumulated on the discharge side of the discharge groove, it is desirable that the inner surface of the discharge side of the discharge groove has An inclined surface or a curved surface whose groove width decreases from the opening side toward the bottom side.

In order to further prevent machining debris from being accumulated on the discharge side of the discharge groove of the receiving plate member, the receiving plate member is preferably inclined downward toward the discharge side.

<One embodiment of the present invention> Hereinafter, one embodiment of the processing apparatus of the present invention will be described with reference to the drawings. In addition, in all the drawings shown below, for ease of understanding, they are schematically omitted or exaggerated as appropriate. The same constituent elements are denoted by the same reference numerals, and descriptions thereof are appropriately omitted.

<Overall Structure of Processing Apparatus> As shown in FIG. 1, the processing apparatus 100 according to the present embodiment is a cutting apparatus that cuts a sealed substrate W as an object to be cut into a plurality of products P. The cutting device 100 includes, as each constituent element, a substrate supply module A, a substrate cutting module B, and an inspection module C. Each constituent element (each module A to C) is detachable and replaceable with respect to other constituent elements.

The substrate supply module A is provided with a substrate supply mechanism 1. The sealed substrate W corresponding to the object to be cut is carried out from the substrate supply mechanism 1 and is transferred to the substrate cutting module B by a transfer mechanism (not shown).

The cutting device 100 shown in FIG. 1 is a cutting device of a twin cut table type. Therefore, two cutting platforms (processing platforms) 2A, 2B are provided in the substrate cutting module B. A cutting jig 3A is attached to the cutting platform 2A. A cutting jig 3B is attached to the cutting platform 2B. The cutting platform 2A can be moved in the Y direction in FIG. 1 by the moving mechanism 4A, and can be rotated in the θ direction by the rotating mechanism 5A. The cutting platform 2B can be moved in the Y direction in FIG. 1 by the moving mechanism 4B, and can be rotated in the θ direction by the rotating mechanism 5B.

A positioning camera (not shown) is provided in the substrate cutting module B. The registration camera can move independently in the X direction. The substrate cutting module B is provided with two spindles 6A and 6B as a cutting mechanism. The cutting device 100 is a cutting device of a dual-spindle structure provided with two main shafts 6A and 6B. The main shafts 6A and 6B can move independently in the X direction and the Z direction.

An example of the operation of the substrate cutting module B is as follows. The cutting in the cutting platform 2A is performed by moving the cutting platform 2A and the two spindles 6A and 6B relative to each other to cut the sealed substrate W into a single piece. The cutting in the cutting platform 2B is performed by moving the cutting platform 2B relative to the two spindles 6A and 6B to cut the sealed substrate W into a single piece. The rotary blade 61A of the main shaft 6A and the rotary blade 61B of the main shaft 6B are rotated in a plane including the Y direction and the Z direction, thereby cutting the sealed substrate W held by each of the platforms 2A and 2B. The cutting process in the cutting platform 2A and the cutting process in the cutting platform 2B are performed alternately.

The inspection module C is provided with an inspection platform 7. An assembly including a plurality of products P obtained by cutting the sealed substrate W and singulating them is placed on the inspection platform 7. The plurality of products P are inspected by an inspection camera (not shown), and are classified into good products and defective products. Good products are contained in tray 8.

In this embodiment, a control unit CTL is provided in the substrate supply module A, and the control unit CTL performs the operation of the cutting device 100, the conveyance of the sealed substrate W, the cutting of the sealed substrate W, and the product P. Check all actions or controls. It is not limited to this, and the control section CTL may be provided in another module.

<Specific Structure of Substrate Cutting Module B> Next, the specific structure of the substrate cutting module B in the cutting apparatus 100 of this embodiment will be described below. The device structure on the cutting platform 2A side is substantially the same as the device structure on the cutting platform 2B side. Therefore, the structure on the cutting platform 2B side will be described in detail below. For convenience, the left-right direction in FIG. 2 will be described as the front-rear direction of the cutting device 100 (cutting module B). However, these directions are only for convenience of explanation and do not limit the scope of the present invention.

As shown in FIG. 2, the substrate cutting module B of the cutting device 100 includes: the cutting platform 2B, which holds the sealed substrate W; and the moving mechanism 4B, which moves the cutting platform 2B linearly in the Y direction. A protective cover 10 provided corresponding to the moving mechanism 4B to protect the moving mechanism 4B; and a machining chip accommodating portion 11 which stores machining chips S such as scraps generated by cutting of the sealed substrate W.

The moving mechanism 4B is provided below the cutting platform 2B, and the cutting platform 2B is linearly reciprocated by a ball screw mechanism 41 extending in the Y direction. Specifically, the moving mechanism 4B includes a ball screw mechanism 41, a drive source 42 such as a servo motor to drive the ball screw mechanism 41, and a slider 43 to support the cutting platform 2B, The ball screw mechanism 41 moves in the Y direction. Here, the ball screw mechanism 41 is housed and rotatably supported in the fixed table frame 44. The waste box serving as the machining chip storage unit 11 is provided outside the moving range of the cutting platform 2B in the moving mechanism 4B. As a result, the moving mechanism 4B moves the cutting platform 2B forward and backward with respect to the workpiece receiving portion 11.

The protective cover 10 is provided between the cutting platform 2B and the moving mechanism 4B, and expands and contracts while covering at least the upper portion of the moving mechanism 4B. This embodiment includes a first protective cover 10A provided on one side in the Y direction with respect to the cutting platform 2B (front side of the cutting platform 2B), and a second protective cover 10B provided with respect to the cutting platform. The platform 2B is provided on the other side in the Y direction (rear side of the cutting platform 2B).

The first protective cover 10A is provided between the front wall portion of the fixed table frame 44 that houses the moving mechanism 4B (specifically, the ball screw mechanism 41) and the front wall portion of the slide table 43 that supports the cutting platform 2B. Specifically, the first protective cover 10A covers the ball screw mechanism 41 located on the front side of the cutting platform 2B, and includes: a corrugated element 10A1 covering at least the upper portion of the ball screw mechanism 41; and a plurality of cover elements 10A2 provided in the housing. The upper surface of the corrugated element 10A1 covers the upper side of the ball screw mechanism 41. The plurality of cover elements 10A2 have a rectangular flat plate shape in a plan view. Of the two cover elements 10A2 adjacent to each other, the cover element 10A2 located on the cutting platform 2B side (rear side) overlaps with the cover element 10A2 located on the opposite side (front side) to the cutting platform 2B. These cover elements 10A2 slide on each other by moving the cutting platform 2B. The first protective cover 10A contracts when the cutting platform 2B moves toward the front side, and expands when the cutting platform 2B moves toward the rear side.

The second protective cover 10B is provided between the rear wall portion of the fixed table frame 44 that houses the moving mechanism 4B (specifically, the ball screw mechanism 41) and the rear wall portion of the slide table 43 that supports the cutting platform 2B. Specifically, the second protective cover 10B covers the ball screw mechanism 41 located on the rear side of the cutting platform 2B, and, similarly to the first protective cover 10A, includes a corrugated element 10B1 covering at least the upper portion of the ball screw mechanism 41; and A plurality of cover elements 10B2 are provided on the upper surface of the corrugated element 10B1 and cover the ball screw mechanism 41 above. The plurality of cover elements 10B2 have a rectangular flat plate shape in a plan view. Of the two cover elements 10B2 adjacent to each other, the cover element 10B2 located on the cutting platform 2B side (front side) overlaps with the cover element 10B2 located on the opposite side (rear side) to the cutting platform 2B. These cover elements 10B2 slide on each other by moving the cutting platform 2B. The second protective cover 10B contracts when the cutting platform 2B moves to the rear side, and extends when the cutting platform 2B moves to the front side.

<Stagnation Prevention of Processing Chips S in the Receiving Plate Member 13> The substrate cutting module B of this embodiment further includes a fluid supply mechanism 12 that supplies cutting water to the sealed substrate W held on the cutting platform 2B; and The receiving plate member 13 is provided between the cutting platform 2B and the protective cover 10, and receives cutting water and machining chips S.

The fluid supply mechanism 12 includes a cutting water nozzle 121 that injects cutting water in order to suppress frictional heat generated by the high-speed rotating blade 61B, and a supply pipe 122 that supplies cutting water to the cutting water nozzle 121. The cutting water nozzle 121 may be provided on the main shaft 6B or may be provided separately from the main shaft 6B.

On the upper surface of the receiving plate member 13, particularly as shown in FIG. 3, a discharge groove 13M for discharging machining chips S together with the cutting water in a predetermined direction is formed. The discharge groove 13M receives and discharges cutting water flowing from the cutting platform 2B, and has an upper opening including the cutting platform 2B in a plan view. The discharge groove 13M of the present embodiment is formed so as to be discharged toward the machining chip storage portion 11 side (the rear side of the cutting platform 2B).

In the receiving plate member 13, the discharge side of the discharge groove 13M has a structure in which the groove width becomes smaller as it goes from the upper opening side toward the bottom side. Specifically, the inner surface on the discharge side of the discharge groove 13M has an inclined surface or a curved surface whose groove width decreases as it goes from the upper opening side toward the bottom side.

In the present embodiment, the discharge-side side surfaces 13x of the receiving plate member 13 are inclined toward each other (inside), and the discharge groove 13M becomes narrower toward the discharge end portion 13a. In addition, in the narrowed portion, a curved surface (eg, a radius of curvature of about 100 mm to 200 mm) of the corner portion 13r of the bottom surface 13y and the side surface 13x is an R shape (partially circular shape). In addition, the curvature radius of the curved surface is not particularly limited, but by setting it to a range of, for example, about 100 mm to 200 mm, the processing of the receiving plate member 13 becomes easy. With this configuration, the cutting water flowing in the discharge groove 13M of the receiving plate member 13 has a faster flow velocity on the discharge side. The receiving plate member 13 is inclined downward toward the discharge side. Thereby, the flow velocity of water in the discharge tank 13M of the receiving plate member 13 can also be increased, especially the flow velocity of water on the discharge side.

<Prevention of Retention of Processing Chips S in the Protective Cover 10B> The substrate cutting module B has a mechanism for pushing the processing chips S remaining on the upper surface of the second protective cover 10B from the second protective cover 10B to the processing chip storage. The structure of the section 11.

Specifically, as shown in FIG. 2, FIG. 4, and FIG. 5, the substrate cutting module B is provided with a sliding member 14, which is accompanied by the movement of the cutting platform 2B. The upper surface of each cover element 10B2 slides.

The slide member 14 is provided on, for example, a slide table 43 that supports the cutting platform 2B, and moves together with the cutting platform 2B. That is, the moving amount of the sliding member 14 is the same as the moving amount of the cutting platform 2B. In addition, as the cutting platform 2B moves toward the cutting chip accommodation portion 11 side (rear side), the sliding member 14 relatively moves with respect to the second protective cover 10B in a direction (rear direction) in which the cutting platform 2B moves. Thereby, the sliding member 14 slides on the upper surface of the plurality of cover elements 10B2.

The sliding member 14 has a sheet shape covering the upper surface of the cover element 10B2. Specifically, the sliding member 14 has a substantially rectangular shape in a plan view, and one side portion thereof is fixed to the sliding table 43. The member fixed on the one side is not limited to the slide table 43 as long as the member moves together with the cutting platform 2B. The sliding member 14 covers the entire or substantially the entire width direction of the cover element 10B2. Here, the term "covering substantially the entirety" means covering at the both ends in the width direction of the upper surface of the cover element 10B2 with a space to the extent that machining chips S such as scraps are not left.

Further, in a state where the sliding member 14 is moved to the side (rear side) closest to the chip receiving portion 11 (see FIG. 5) in the cutting platform 2B, the slide member 14 is positioned to the side (rear side) closest to the chip receiving portion 11 (see FIG. 5). The upper surface of the cover element 10B2 is located on the machining chip accommodating portion 11 side. In addition, FIG. 5 shows an example in which the sliding member 14 is located on the machining chip accommodating portion 11 side than the second protective cover 10B. That is, the sliding member 14 covers the entire or substantially the entire upper surface of the second protective cover 10B in a state where the cutting platform 2B is moved to the side (rear side) closest to the machining chip accommodation portion 11.

The material of the sliding member 14 is, for example, a resin such as vinyl chloride, which is deformed by its own weight, and at least the front end portion 14 a of the free end portion is in contact with the upper surface of the cover element 10B2. The sliding member 14 has a strength such that the upper surface of the cover element 10B2 does not bend and deform due to the frictional force received by the sliding when sliding on the upper surface of the cover element 10B2, and can push the machining chips S toward the moving direction.

The front end portion 14 a of the sliding member 14 has a front end side parallel to a direction orthogonal to the moving direction of the cutting platform 2B in plan view in FIG. 4, but may have a front end extending from the moving direction toward the oblique direction. The side may have a triangular shape or a ladder shape with the central portion protruding outward.

Furthermore, in terms of the relationship with the receiving plate member 13, the sliding member 14 of this embodiment protrudes to the outside from the discharge end portion 13 a of the receiving plate member 13 in the moving direction (Y direction) of the cutting platform 2B. (Working chip storage section 11 side). In addition, as long as the cutting platform 2B is moved to the side closest to the workpiece receiving portion 11 (the state where the second protective cover 10B is most contracted), the slide member 14 is located at the cover element 10B2 closest to the workpiece receiving portion 11. The upper surface of the receiving plate member 13 may be projected to the outside from the discharge end portion 13 a of the receiving plate member 13 rather than being located on the chip receiving portion 11 side.

<Operation of Slider Member 14> Next, the operation of the slider member 14 accompanying the movement of the cutting platform 2B will be described with reference to FIGS. 6 (a) to 6 (c). As shown in FIG. 6 (a), in a state where the second protective cover 10B is extended, machining chips S remain on the upper surface of the cover element 10B2. The machining chips S are scattered by cutting and left on the upper surface of the cover element 10B2, or machining chips S flowing out of the discharge groove 13M together with the cutting fluid and left on the upper surface of the cover element 10B2.

As shown in FIG. 6 (b), when the cutting platform 2B is moved toward the cutting chip storage portion 11 side (rear side), the slide member 14 is moved toward the cutting chip storage portion 11 side together with the cutting platform 2B. At this time, the sliding member 14 relatively moves with respect to the cover element 10B2 in the direction in which the cutting platform 2B moves. Accordingly, the slide member 14 slides the upper surfaces of the plurality of cover elements 10B2 while pushing the machining chips S remaining on the upper surface of the cover element 10B2.

Next, as shown in FIG. 6 (c), in a state where the cutting platform 2B is moved to the side (rear side) closest to the machining chip accommodation portion 11, the front end portion 14 a of the sliding member 14 passes over the machining chip accommodation portion 11. The upper surface of the cover member 10B2 on the side is located on the side of the chip receiving portion 11. As a result, the machining chips S pushed by the sliding member 14 are pushed out from the upper surface of the cover element 10B2 into the machining chips accommodating section 11, and thereby are accommodated in the machining chips accommodating section 11.

These pushing-out operations are repeated every time the cutting platform 2B moves forward and backward with respect to the machining chip storage portion 11. In addition, the advancing and retracting movement with respect to the machining chip storage portion 11 may be performed with the cutting process of the sealed substrate W, or may be performed after the cutting process of the sealed substrate W is completed.

<Discharge of Work Chips S Falling on Both Sides of the Protective Cover 10B> Further, as shown in FIGS. 2 and 7, the substrate cutting module B of this embodiment further includes a work chip discharge unit 15 for removing the The machining chips S on both sides in the width direction (X direction) of the two protective covers 10B are discharged to the outside (the machining chip accommodating portion 11); and the fluid ejection mechanism 16 injects the machining chip discharge portion 15 toward the discharge side as Fluid of water.

The machining chip discharge portion 15 is provided along the moving direction (Y direction) of the cutting platform 2B on both sides in the width direction of the second protective cover 10B. The machining chip discharge portion 15 has a groove shape, and the groove shape has a linear shape along the moving direction of the cutting platform 2B. Further, as shown in FIG. 7, the machining chip discharge portion 15 has a curved inner surface on the bottom surface portion in the groove cross section. The machining chip discharge portion 15 may have a curved inner surface as a whole in the groove cross section. In this embodiment, the two cutting platform method is adopted. When two second protective covers 10B are provided in parallel, one machining chip discharge portion 15 is provided between the two second protective covers 10B for dual use.

The fluid ejection mechanism 16 is a mechanism that ejects water from the cutting platform 2B side (front side) of the machining chip discharge unit 15 toward the machining chip storage unit 11 side (rear side), and includes a jet provided inside the machining chip discharge unit 15. The nozzle 161 and a supply pipe 162 that supplies washing water to the spray nozzle 161. In addition, the machining chip discharge portion 15 may be provided not only on both sides of the second protective cover 10B but also on both sides of the first protective cover 10A. Here, the spraying of water by the spray nozzle 161 may be performed continuously, for example, during the cutting process of the sealed substrate W, or intermittently during the cutting process, or may be performed after the cutting process is completed.

<Effects of this Embodiment> According to the cutting device 100 of this embodiment, when the cutting platform 2B moves, the sliding member 14 relatively moves in the direction in which the cutting platform 2B moves relative to the second protective cover 10B. As a result, the upper surface of the plurality of cover elements 10B2 slides. Therefore, even if machining chips S generated from the sealed substrate W remain on the upper surface of the protective cover 10B, the slide member 14 pushes the machining chips S out. Therefore, it is possible to prevent the machining chips S from being accumulated on the upper surfaces of the plurality of cover elements 10B2 constituting the protective cover 10B. As a result, it is difficult for the machining chips S to penetrate between the cover elements 10B2, and it is possible to reduce the cause of malfunction or failure of the protective cover 10B or the moving mechanism 4B. In addition, it is possible to suppress a decrease in the operation rate of the cutting device 100 and improve the productivity of the device.

In the present embodiment, the moving mechanism 4B moves the cutting platform 2B forward and backward with respect to the machining chip storage portion 11, and the sliding member 14 moves the cutting platform 2B to a position closest to the machining chip storage portion 11. The upper surface of the cover element 10B2 located on the side closest to the chip receiving portion 11 or on the side of the chip receiving portion 11 allows the sliding member 14 to accompany cutting when compared with the case where the sliding member 14 is positioned on the inside. The cutting platform 2B is moved to reliably push the machining chips S into the machining chip accommodating section 11. In addition, the machining chips S generated by the cutting of the sealed substrate W can be collected in the machining chip accommodating portion 11 and discarded in one fell swoop.

In this embodiment, among the cover elements 10B2 adjacent to each other in the second protective cover 10B, the cover element 10B2 on the cutting platform 2B side overlaps with the cover element 10B2 on the opposite side to the cutting platform 2B. When the cutting platform 2B moves and the protective cover 10B contracts, the machining chips S pushed by the sliding member 14 can be prevented from entering between the cover elements 10B2.

In this embodiment, the sliding member 14 is in the shape of a sheet covering the upper surface of the cover element 10B2, and when the protective cover 10B contracts with the movement of the cutting platform 2B, the machining chip S can be pushed out by the sliding member 14 and can Since the cover members 10B2 and their gaps are covered by the sliding member 14, it is difficult for the machining chips S to remain on the upper surface of the cover members 10B2, and it is possible to appropriately prevent the machining chips S from entering between the cover members 10B2.

In the present embodiment, machining chip discharge sections 15 are provided on both sides of the protective cover 10B, and a fluid ejection mechanism 16 for ejecting a fluid toward the discharge side is provided inside the machining chip discharge section 15, so that it can be appropriately discharged. Work chips S on both sides of the protective cover 10B. Further, the machining chip discharge portion 15 has a groove shape, and the bottom surface portion has a curved inner surface. Therefore, compared with the case of a flat inner surface, the contact area between the inner surface of the machining chip discharge portion 15 and the machining chip S can be reduced. As a result, it becomes difficult to attach the machining chips S, and as a result, the machining chips S can be easily discharged.

In this embodiment, the inner surface on the discharge side of the discharge groove 13M of the receiving plate member 13 has an inclined surface or a curved surface whose groove width decreases as it goes from the opening side to the bottom side, so that the flow in the discharge groove 13M can be increased. The flow velocity of the fluid prevents the machining chips S from accumulating on the discharge side of the discharge groove 13M. In addition, when the inner surface on the discharge side of the discharge groove 13M has a curved surface, compared with the case of a flat inner surface, the contact area with the machining chips S can be reduced, and the machining chips S become difficult to attach, so that It is further prevented that the machining chips S accumulate on the discharge side of the discharge groove 13M. Furthermore, since the receiving plate member 13 inclines downward toward the discharge side, it is possible to further prevent the machining chips S from being accumulated on the discharge side of the discharge groove 13M of the receiving plate member 13.

<Other Variations> The present invention is not limited to the above-mentioned embodiments. For example, it is also possible to reduce the contact area with the cover element by forming an uneven shape on the back surface of the sliding member. In addition, as the concave-convex shape, it is conceivable to use ridge portions extending along the sliding direction of the sliding member or to distribute a plurality of ridge portions. With this configuration, the sliding of the sliding member can be made smooth.

In addition to the sheet-like member, the sliding member may include, for example, a rod-shaped sliding portion extending across both ends of the cover element in the width direction; and a support frame portion that is fixed to the processing platform side and supports the housing. Mentioned sliding portion. This structure can also reduce the contact area with the cover element, so that the sliding of the sliding member can be made smooth.

Further, the protective cover may be a telescopic cover having a plurality of cover members in addition to a structure in which a plurality of cover elements, that is, cover plates are overlapped with each other.

Furthermore, the inner surface of the bottom surface portion of the machining chip discharge portion may have a curved surface that reduces the contact area with the machining chip in addition to the curved shape.

Furthermore, in the above-mentioned embodiment, the cutting device of the double cutting platform method and the dual-spindle structure is described, but it is not limited thereto, and the cutting device of the single cutting table method and the single-spindle structure may also be used. Device, or a cutting device of single cutting platform type and dual spindle structure.

In addition, the processing device of the present invention may perform processing other than cutting, and may also perform other mechanical processing such as cutting or grinding.

In addition, the present invention is not limited to the embodiment described above, and various modifications can be made without departing from the scope of the invention.

1‧‧‧ substrate supply mechanism

2A, 2B ‧‧‧ cutting platform (processing platform)

3A, 3B‧‧‧ Cutting fixture

4A, 4B‧‧‧ Mobile agency

5A, 5B‧‧‧rotation mechanism

6A, 6B‧‧‧ Spindle

7‧‧‧ Inspection platform

8‧‧‧ tray

10‧‧‧ protective cover

10A‧‧‧First protective cover

10A1, 10B1‧‧‧ corrugated element

10A2, 10B2‧‧‧ cover element

10B‧‧‧Second protective cover

11‧‧‧Processing chip storage

12‧‧‧ fluid supply mechanism

13‧‧‧Accepting plate member

13a‧‧‧Discharge end

13M‧‧‧Exhaust trough

13r‧‧‧corner

13x‧‧‧ side

13y‧‧‧ Underside

14‧‧‧ sliding member

14a‧‧‧Front end

15‧‧‧Processing chip discharge section

16‧‧‧ fluid ejection mechanism

41‧‧‧ball screw mechanism

42‧‧‧Drive source

43‧‧‧Slide

44‧‧‧ fixed table frame

61A, 61B‧‧‧Rotary Knife

100‧‧‧ cutting device (processing device)

121‧‧‧ Nozzle for cutting water

122, 162‧‧‧ supply pipe

161‧‧‧jet nozzle

A‧‧‧ substrate supply module

B‧‧‧ substrate cutting module

C‧‧‧ Inspection Module

CTL‧‧‧Control Department

P‧‧‧ products

S‧‧‧Processing chips

W‧‧‧ Sealed substrate (object to be processed)

X, Y, Z, θ‧‧‧ directions

FIG. 1 is a diagram schematically showing a configuration of a cutting device according to this embodiment. FIG. 2 is a diagram schematically showing a configuration of a substrate cutting module according to the present embodiment. FIG. 3 (a) is a perspective view showing a structure on a discharge side of the receiving plate member according to the present embodiment, FIG. 3 (b) is a cross-sectional view, and FIG. 3 (c) is a side view. FIG. 4 is a partial plan view schematically showing a configuration of a substrate cutting module according to the present embodiment. FIG. 5 is a diagram schematically showing a configuration (a state where the second protective cover is contracted) of the substrate cutting module according to the present embodiment. 6 (a) to 6 (c) are partial plan views showing each state of the substrate cutting module according to the present embodiment. FIG. 7 is a cross-sectional view schematically showing a positional relationship between a machining chip discharge portion and a second protective cover according to the present embodiment.

Claims (7)

A processing device includes: a processing platform that holds a processing object; a moving mechanism that linearly moves the processing platform; a protective cover having a plurality of cover elements covering the moving mechanism and overlapping each other, accompanying the movement of the processing platform And telescopically; and a sliding member that moves relative to the protective cover toward the processing platform along with the processing platform, and slides on the upper surfaces of the plurality of cover elements. The processing device according to item 1 of the scope of patent application, further comprising: a processing chip storage section that stores processing chips generated by processing the processing object, and the moving mechanism makes the processing platform relatively to the processing platform. The chip receiving portion moves forward and backward, and the tip of the chip receiving portion side of the sliding member is moved to the cover element closest to the chip receiving portion by the advance and retreat of the processing platform. The upper surface, or the state where the cover element closest to the machining chip storage portion side is located on the machining chip storage portion side. The processing device according to claim 1 or claim 2, wherein the sliding member has a sheet shape covering an upper surface of the cover element. The processing device according to item 1 of the scope of patent application, further comprising: a processing chip discharge portion provided on both sides of the protective cover along the moving direction of the processing platform for discharging the processing object Machining chips generated by machining of objects; and a fluid ejection mechanism that ejects fluid toward the discharge side of the machining chip discharge section inside the machining chip discharge section. The processing device according to item 4 of the scope of patent application, wherein the processing chip discharge portion has a groove shape, and a bottom surface portion thereof has a curved inner surface. The processing device according to item 1 of the scope of patent application, further comprising: a fluid supply mechanism for supplying a fluid toward the processing object held on the processing platform; and a receiving plate member provided on the processing platform and The protective cover receives processing chips generated during processing of the object to be processed, and the receiving plate member has a discharge groove for discharging the processing chips in a predetermined direction. The inner surface of the discharge side has an inclined surface or a curved surface whose groove width decreases as it goes from the opening side toward the bottom side. The processing device according to claim 6 in which the receiving plate member is inclined downward toward the discharge side.