TW201908357A - 反應性熱熔樹脂用剝離劑 - Google Patents

反應性熱熔樹脂用剝離劑

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TW201908357A
TW201908357A TW107124031A TW107124031A TW201908357A TW 201908357 A TW201908357 A TW 201908357A TW 107124031 A TW107124031 A TW 107124031A TW 107124031 A TW107124031 A TW 107124031A TW 201908357 A TW201908357 A TW 201908357A
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range
reactive hot
melt resin
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release agent
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TW107124031A
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TWI695851B (zh
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齊藤公惠
二宮淳
藤原豐邦
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日商迪愛生股份有限公司
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Abstract

本發明提供一種反應性熱熔樹脂用剝離劑，其特徵為：漢森溶解度參數中，分散項(δD)係在14.0~21.0MPa0.5之範圍，偶極間力項(δP)係在0~10.5MPa0.5之範圍，氫鍵項(δH)係在0~13.5MPa0.5之範圍。前述反應性熱熔樹脂用接著劑以選自包含苯甲酸酯、四氫糠醇、及(甲基)丙烯酸四氫糠酯之群組中的1種以上之溶劑為較佳。前述反應性熱熔樹脂以含有具異氰酸酯基之胺基甲酸酯預聚物為較佳，前述胺基甲酸酯預聚物之胺基甲酸酯鍵結的含量，以在0.1~3mol/kg之範圍為較佳。

Description

反應性熱熔樹脂用剝離劑
本發明係關於反應性熱熔樹脂所使用之剝離劑。
包含反應性熱熔樹脂之接著劑，由於無溶劑，所以迄今係作為環境對應型接著劑，以纖維黏合‧建材積層為中心進行各種研究，在產業界亦被廣泛利用。
又，近年，在光學零件之貼合中，對於光學零件之輕量化或薄膜化之需求提高，而正檢討以熱熔接著劑代替迄今為主流之丙烯酸系黏著劑。
就前述接著劑而言，例如，揭示一種使用耐濕熱性熱熔接著劑組成物之接著劑，該組成物之特徵為相對於(a)100重量份之開始流動溫度為55℃以上110℃以下的聚胺基甲酸酯樹脂，摻合(b)5~150重量份之Tg為0℃以上110℃以下、分子量10000~25000的飽和聚酯樹脂，(c)10~150重量份之軟化點為60℃以上140℃以下、分子量700~3000的環氧樹脂，及(d)10~200重量份之經偶合劑表面處理的無機填料(例如，參照專利文獻1)。
使用前述接著劑所得到之積層體，由於具有牢固的接著強度，從接著性之觀點而言，具有利之效 果。然而，相反地，由於其無法剝離，而有基材無法重工(rework)的問題。尤其，如今反應性熱熔樹脂多被使用於光學零件之貼合，由於多使用於液晶面板等的顯示部或殼體等高價被接著體(基材)，強烈需求藉由接著劑之剝離而使得基材之重工性提高。
先前技術文獻 專利文獻
專利文獻1 日本特開2003-27030號公報
本發明所欲解決之問題，為提供反應性熱熔樹脂與被接著體之剝離性優良的反應性熱熔樹脂用剝離劑。
本發明提供一種反應性熱熔樹脂用剝離劑，其特徵為漢森溶解度參數中，分散項(δD)係在14.0~21.0MPa0.5之範圍，極化項(δP)係在0~10.5MPa0.5之範圍，氫鍵項(δH)係在0~13.5MPa0.5之範圍。
本發明之反應性熱熔樹脂用剝離劑，可在使用反應性熱熔樹脂所得到之接著劑層與被接著體之間賦予優良之剝離性。又，藉此，可將藉由前述接著劑層接著之基材分離，故基材之重工性亦優良。
用於實施發明之態樣
本發明之反應性熱熔樹脂用剝離劑必須具有下列條件：漢森溶解度參數中，分散項(δD)係在14.0~21.0MPa0.5之範圍，極化項(δP)係在0~10.5MPa0.5之範圍，氫鍵項(δH)係在0~13.5MPa0.5之範圍。成為剝離對象的反應性熱熔樹脂具有於常溫係固體，且可藉由加熱而熔融的特徵，其漢森溶解度參數中，通常分散項(δD)係在14.0~21.0MPa0.5之範圍，極化項(δP)係在0~10.5MPa0.5之範圍，氫鍵項(δH)係在0~13.5MPa0.5之範圍。於是，藉由前述剝離劑之分散項(δD)係在14.0~21.0MPa0.5之範圍，極化項(δP)係在0~10.5MPa0.5之範圍，氫鍵項(δH)係在0~13.5MPa0.5之範圍，而具有與反應性熱熔樹脂之良好親和性，所以得到適度之膨潤性及溶解性，而可得到優良之剝離性。再者，本發明之反應性熱熔樹脂用剝離劑，即使未施行加熱等處理，亦能簡便地將反應性熱熔樹脂與基材剝離，又，由於不發生基材溶解‧浸蝕，所以為例如基材之重工性優良者。
再者，該漢森溶解度參數，意指將由希德布朗(Hildebrand)導入之溶解度參數分割為分散項(δD)、極化項(δP)、氫鍵項(δH)之3成分，表現於3次元空間者。分散項(δD)表示分散力所導致之效果、極化項(δP)表示偶極間力所導致之效果，氫鍵項(δH)表示氫鍵力所導致之效果。
再者，漢森溶解度參數之定義及計算，記載於Charles M.Hansen著「Hansen Solubility Parameters；A Users Handbook(CRC Press,2007)」中。又，藉由使用電腦軟體「Hansen Solubility Parameters in Practice(HSPiP)」，對於文獻上未記載參數值之有機溶劑，亦可從其化學構造估算漢森溶解度參數。在本發明中，關於文獻上有記載參數值之溶劑，使用其值，關於文獻上無記載參數值之有機溶劑，使用以HSPiP版本4.1.06所估算之參數值。
本發明之反應性熱熔樹脂用剝離劑，可使用1種溶劑，又，亦可將2種以上之溶劑併用。在併用2種以上之情況，可使各種溶劑之漢森溶解度參數的3個參數加權平均之值成為在上述範圍內而組合使用。
前述漢森溶解度參數中之前述分散項(δD)，從藉由相溶性而得到更優良之剝離性的觀點而言，以在16.5~19.0MPa0.5之範圍為更佳。又，前述極化項(δP)，從藉由濡濕性而得到更優良之剝離性的觀點而言，以在4.5~9.0MPa0.5之範圍為更佳。再者，就前述氫鍵項(δH)而言，從藉由溶解性而得到更優良之剝離性的觀點而言，以在3~13.0MPa0.5之範圍為更佳。
就作為前述反應性熱熔樹脂用剝離劑之具體例而言，苯甲酸甲酯(分散項(δD)：18.9、極化項(δP)：8.2、氫鍵項(δH)：4.7)、苯甲酸乙酯(分散項(δD)：17.9、極化項(δP)：6.2、氫鍵項(δH)：6.0)、苯甲酸丁酯(分散項(δD)：18.3、極化項(δP)：5.6、氫鍵項(δH)：5.5)、苯 甲酸己酯(分散項(δD)：17.2、極化項(δP)：4.9、氫鍵項(δH)：3.4)、苯甲酸二乙二醇酯(漢森溶解度參數：分散項(δD)：17.6、極化項(δP)：9.0、氫鍵項(δH)：4.8)、苯甲酸二丙二醇酯(分散項(δD)：17.5、極化項(δP)：8.0、氫鍵項(δH)：4.0)等苯甲酸酯；四氫糠醇(分散項(δD)：17.8、極化項(δP)8.2、氫鍵項(δH)：12.9)、丙烯酸四氫糠酯(分散項(δD)：16.9、極化項(δP)：5.9、氫鍵項(δH)：6.5)、甲基丙烯酸四氫糠酯(分散項(δD)：16.8、極化項(δP)：5.2、氫鍵項(δH)：5.7)
作為前述反應性熱熔樹脂用剝離劑，從保持反應性熱熔樹脂皮膜之強度，同時藉由相溶化使剝離變得更容易而言，前述者之中，以使用選自包含苯甲酸酯、四氫糠醇、及(甲基)丙烯酸四氫糠酯之群組中的1種以上之溶劑為較佳。
就前述反應性熱熔樹脂而言，例如，可使用聚酯樹脂、改質烯烴樹脂、含有具異氰酸酯基之胺基甲酸酯預聚物的濕氣硬化型熱熔樹脂等。若藉由本發明之剝離劑，可賦予此等反應性熱熔樹脂良好之剝離性。
就前述濕氣硬化型熱熔樹脂中所用的具異氰酸酯基之胺基甲酸酯預聚物而言，例如，可使用使多元醇與多元異氰酸酯反應所得到者。又，亦可使此等進一步與具有(甲基)丙烯醯基之化合物反應，而賦予活性能量射線硬化性。
就前述多元醇而言，可使用聚醚多元醇、聚酯多元醇、丙烯酸多元醇、聚碳酸酯多元醇、聚丁二烯多元醇、二聚體二醇等。
就前述多元醇之數平均分子量而言，從得到良好接著性、及機械強度之點，以500~50,000之範圍為較佳，以700~10,000之範圍為更佳。再者，前述聚醚多元醇之數平均分子量，係表示藉由凝膠滲透層析(GPC)法測定之值。
就前述多元異氰酸酯而言，例如，可使用：聚亞甲基聚苯基多異氰酸酯、二苯基甲烷二異氰酸酯、碳二亞胺改質二苯基甲烷二異氰酸酯、伸苯基二異氰酸酯、甲苯二異氰酸酯、萘二異氰酸酯等芳香族多元異氰酸酯、六亞甲基二異氰酸酯、離胺酸二異氰酸酯、環己烷二異氰酸酯、異佛爾酮二異氰酸酯、二環己基甲烷二異氰酸酯、苯二甲基二異氰酸酯、四甲基苯二甲基二異氰酸酯等脂肪族或脂環族多元異氰酸酯。此等之中，從反應性、及接著性之點而言，以使用二苯基甲烷二異氰酸酯為特佳。
前述胺基甲酸酯預聚物，為使前述多元醇與前述多元異氰酸酯反應所得到者，其為在聚合物末端或分子內，具有能與空氣中或塗布胺基甲酸酯預聚物之殼體或被接著體中所存在的水分反應，形成交聯構造之異氰酸酯基者。
就前述胺基甲酸酯預聚物之製造方法而言，例如，可使用藉由在加入有前述多元異氰酸酯之反應容器中，將前述多元醇之混合物滴入後加熱，於前述多元異氰酸酯所具有之異氰酸酯基相對於前述多元醇所具有之羥基為過剩的條件下反應而製造的方法。
在製造前述胺基甲酸酯預聚物時，前述多元異氰酸酯所具有之異氰酸酯基與前述多元醇所具有之羥基的當量比([異氰酸酯基/羥基])，從接著性及機械強度之點而言，以成為1.1~5之範圍為較佳，以1.5~3之範圍為更佳。
在製造前述胺基甲酸酯預聚物時，視需要，可使用胺基甲酸酯化觸媒。胺基甲酸酯化觸媒可在前述反應之任何階段適宜地添加。
前述胺基甲酸酯化觸媒，例如，可使用三乙基胺、三伸乙基二胺及N-甲基啉等含氮化合物；乙酸鉀、硬脂酸鋅及辛酸錫等金屬鹽；二丁基錫二月桂酸酯等有機金屬化合物等。
就藉由以上之方法所得到的胺基甲酸酯預聚物之胺基甲酸酯鍵結量而言，從具有與本發明之剝離劑的良好親和性，能夠得到更加優良之接著性、及剝離性之點，以0.1~3mol/kg之範圍為較佳，以0.2~2mol/kg之範圍為更佳。再者，前述胺基甲酸酯預聚物之胺基甲酸酯鍵結量，表示從前述胺基甲酸酯預聚物之原料之使用量算出的值。
又，就前述胺基甲酸酯預聚物之異氰酸酯基含有率(以下簡稱為「NCO%」)而言，從能得到更良好之接著性、及剝離性之觀點而言，以1.5~8質量%之範圍為較佳，以1.7~5質量%之範圍為更佳，以1.8~3質量%之範圍為特佳。再者，前述胺基甲酸酯預聚物之NCO%，表示根據JIS K1603-1：2007，藉由電位差滴定法測定之值。
就前述胺基甲酸酯預聚物之黏度而言，以於110℃之熔融黏度為1,000~50,000mPa‧s之範圍為較佳，以2,000~10,000mPa‧s之範圍為更佳。再者，前述於110℃之熔融黏度表示使用ICI錐板黏度計測定的值。
又，在對前述胺基甲酸酯預聚物賦予活性能量射線硬化性之情況中，就可與其反應的前述具有(甲基)丙烯醯基之化合物而言，例如，可使用：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、丙烯酸3-羥基丙酯、(甲基)丙烯酸3-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、丙烯酸6-羥基己酯、羥基乙基丙烯醯胺等具有羥基之(甲基)丙烯酸烷酯；三羥甲基丙烷二(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯等具有羥基之多官能(甲基)丙烯酸酯；聚乙二醇單丙烯酸酯、聚丙二醇單丙烯酸酯；2-(甲基)丙烯醯基氧基乙基異氰酸酯、2-(2-(甲基)丙烯醯基氧基乙基氧基)乙基異氰酸酯、1,1-雙((甲基)丙烯醯基氧基甲基)乙基異氰酸酯等具有異氰酸酯基之(甲基)丙烯酸化合物等。
含有前述具異氰酸酯基之胺基甲酸酯預聚物的濕氣硬化型熱熔樹脂，可只由前述胺基甲酸酯預聚物構成，然而視需要，亦可含有其他之添加劑。
就前述其他之添加劑而言，例如，可使用硬化觸媒、抗氧化劑、賦黏劑、塑化劑、安定劑、充填材料、染料、顏料、螢光增白劑、矽烷偶合劑、蠟等。
就前述反應性熱熔樹脂所使用之用途而言，例如，可適合使用作為纖維黏合、建材積層、光學零件之貼合等。
就使用於前述光學零件之貼合的態樣而言，例如，可列舉行動電話、個人電腦、遊戲機、電視、汽車導航、相機揚聲器、釣具之電動捲軸等之密封劑。
在進行前述貼合之情況，例如，可列舉將前述反應性熱熔樹脂於50~130℃之溫度範圍加熱熔融，將該組成物塗布於一面基材上，繼而在該樹脂層上貼合另一面基材，而得到積層體的方法。
就前述基材而言，例如，可使用：玻璃板、不鏽鋼(SUS)或鎂、鋁等金屬板、降冰片烯等環烯烴系樹脂、丙烯酸樹脂、胺基甲酸酯樹脂、聚矽氧樹脂、環氧樹脂、氟樹脂、聚苯乙烯樹脂、聚酯樹脂、聚碸樹脂、聚芳酯樹脂、聚氯乙烯樹脂、聚偏二氯乙烯、聚烯烴樹脂、聚醯亞胺樹脂、脂環式聚醯亞胺樹脂、聚醯胺樹脂、纖維素樹脂、聚碳酸酯(PC)、聚對苯二甲酸丁二酯(PBT)、聚苯醚(改質PPE)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸乙二酯(PET)、乳酸聚合物、丙烯腈-丁二烯-苯乙烯共聚合物(ABS)、丙烯腈-苯乙烯共聚合物(AS)等所得到者。又，前述基材視需要亦可進行電暈處理、電漿處理、或底漆處理等。
就將前述反應性熱熔樹脂塗布於前述基材之方法而言，例如，可使用滾筒塗布、噴霧塗布、T-模頭塗布、刀片塗布、逗點式塗布等。又，前述反應性熱熔樹脂，由於具有低黏度性或塗布後之保型性等，亦可藉由點膠機(dispenser)、噴墨印刷、網版印刷、膠版印刷等方式進行塗布。若依照此等塗布方式，由於可在前 述構件上欲塗布處塗布前述反應性熱熔樹脂，不會產生沖孔加工等損失，故為較佳。又，若依照此等塗布方式，可將前述反應性熱熔樹脂，於前述基材上連續地或斷續地形成點狀、線狀、三角狀、四角狀、圓狀、曲線等各種形狀。
就前述反應性熱熔樹脂之硬化物層的厚度而言，可依據所使用之用途而設定，然而例如亦能以較佳10μm~5mm之範圍設定。
就前述貼合後之熟成條件而言，例如，可在溫度20~80℃、相對濕度50~90%RH、0.5~5日之範圍內適宜地決定。
藉由以上之方法，可得到具有牢固地被接著之前述基材與前述反應性熱熔接著劑層之至少2層的積層體。就從該積層體將前述反應性熱熔接著劑層剝離而回收基材的方法而言，可列舉使積層體浸漬於本發明之反應性熱熔樹脂用剝離劑中的方法；使用棉花棒、紙或布等塗布或擦拭積層體之反應性熱熔接著劑層的方法等。
以上，本發明之反應性熱熔樹脂用剝離劑，可在使用反應性熱熔樹脂所得到之接著劑層與被接著體之間賦予優良的剝離性。又，因此，由於可將藉由前述接著劑層接著之基材分離，所以為基材之重工性優良者。
[實施例]
以下，藉由使用實施例，更詳細地說明本發明。
[合成例1] <胺基甲酸酯預聚物(1)之合成>
在具備溫度計、攪拌機、惰性氣體導入口及回流冷卻器之四口燒瓶中，添加15質量份之聚丙二醇(數平均分子量：1,000)、15質量份之聚丙二醇(數平均分子量：2,000)、10質量份之結晶性聚酯多元醇(使1,6-己二醇與己二酸反應者，數平均分子量：2,000)、10質量份之結晶性聚酯多元醇(使1,6-己二醇與1,12-十二烷二羧酸反應者，數平均分子量：3,500)、15質量份之非晶性聚酯多元醇(使雙酚A之6莫耳環氧丙烷加成物、癸二酸及間苯二甲酸反應者，數平均分子量：2,000)、2.5質量份之丙烯酸多元醇(使丙烯酸丁酯/甲基丙烯酸甲酯/丙烯酸乙酯/甲基丙烯酸2-羥基乙酯=69.65/25/5/0.35(質量比)反應者，數平均分子量：13,000，玻璃轉移溫度：-30.3℃)，於減壓條件下脫水至水分含有率成為0.05質量%以下為止。
繼而，將容器內溫度冷卻至70℃後，添加16.5質量份之4,4’-二苯基甲烷二異氰酸酯，並升溫至100℃，反應約3小時，至異氰酸酯基含有率成為恆定，得到具異氰酸酯基之胺基甲酸酯預聚物(1)。再者，所得到的胺基甲酸酯預聚物(1)之分散項(δD)：17.7、極化項(δP)：5.6、氫鍵項(δH)：5.3。又，胺基甲酸酯預聚物(1)之胺基甲酸酯鍵的含量為0.90mol/kg。
再者，合成例所用的多元醇之數平均分子量，表示藉由凝膠滲透層析(GPC)法，依照以下之條件所測定的值。
測定裝置：高速GPC裝置(東曹股份有限公司製「HLC-8220GPC」)
管柱：將東曹股份有限公司製之下述管柱直列地連接而使用。
「TSKgel G5000」(7.8mmI.D.×30cm)×1支
「TSKgel G4000」(7.8mmI.D.×30cm)×1支
「TSKgel G3000」(7.8mmI.D.×30cm)×1支
「TSKgel G2000」(7.8mmI.D.×30cm)×1支
檢測器：RI(示差折射計)
管柱溫度：40℃
溶離液：四氫呋喃(THF)
流速：1.0mL/分鐘
注入量：100μL(試料濃度0.4質量%之四氫呋喃溶液)
標準試料：使用下述之標準聚苯乙烯製成校正線。
(標準聚苯乙烯)
東曹股份有限公司製「TSKgel標準聚苯乙烯A-500」
東曹股份有限公司製「TSKgel標準聚苯乙烯A-1000」
東曹股份有限公司製「TSKgel標準聚苯乙烯A-2500」
東曹股份有限公司製「TSKgel標準聚苯乙烯A-5000」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-1」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-2」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-4」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-10」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-20」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-40」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-80」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-128」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-288」
東曹股份有限公司製「TSKgel標準聚苯乙烯F-550」
[積層體之製作]
藉由使前述胺基甲酸酯預聚物(1)於110℃加熱熔融，使用經加熱至110℃之具有直徑0.4mm內徑的點膠機針頭(武藏工程股份有限公司製點膠機「VALVE MASTER ME-5000VT」)，以噴出壓力：0.3MPa、加工速度50mm/秒，在PET(聚對苯二甲酸乙二酯)薄膜(13cm×15cm，厚度50μm)上，以厚度成為0.2mm的方式塗布1邊10cm之直線，在溫度23℃、相對濕度65%之恆溫恆濕槽中放置3日，而得到積層體。
[實施例1]
對於所得到之積層體之PET薄膜/接著劑層面，使用棉花棒塗布100質量%四氫糠醇之剝離劑，於23℃之氣體環境下放置5分鐘，用鑷子剝離直線之前端後，固定於普及型數位測力計(Imada股份有限公司製「DS2-200N」)，藉由測定剝離強度(N)，進行剝離性試驗。再者，亦一併進行塗布剝離劑前之積層體的剝離性試驗。
[實施例2~5、比較例1~2]
除將剝離劑之種類如表1~2所示地變更以外，以與實施例1同樣之方式，進行剝離性試驗。
可知本發明之反應性熱熔樹脂用剝離劑，係反應性熱熔接著劑層與基材之剝離性優良。
另一方面，比較例1使用漢森溶解度參數之氫鍵項(δH)超出本發明所規定範圍之剝離劑，結果剝離強度之降低少，剝離性不充分。
又，比較例2使用漢森溶解度參數之偶極間力項(δP)及氫鍵項(δH)超出本發明所規定範圍之剝離劑，結果剝離強度之降低少，剝離性不充分。

Claims (4)

  1. 一種反應性熱熔樹脂用剝離劑，其特徵為漢森溶解度參數中，分散項(δD)係在14.0~21.0MPa 0.5之範圍，偶極間力項(δP)係在0~10.5MPa 0.5之範圍，氫鍵項(δH)係在0~13.5MPa 0.5之範圍。
  2. 如請求項1之反應性熱熔樹脂用剝離劑，其為選自包含苯甲酸酯、四氫糠醇、及(甲基)丙烯酸四氫糠酯之群組中的1種以上之溶劑。
  3. 如請求項1或2之反應性熱熔樹脂用剝離劑，其中該反應性熱熔樹脂為含有具異氰酸酯基之胺基甲酸酯預聚物的濕氣硬化型熱熔樹脂。
  4. 如請求項3之反應性熱熔樹脂用剝離劑，其中該胺基甲酸酯預聚物中之胺基甲酸酯鍵的含量係在0.1~3mol/kg之範圍。
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