TW201903043A - 樹脂組成物、預浸體、覆金屬積層板、印刷配線板及覆金屬積層板之製造方法 - Google Patents
樹脂組成物、預浸體、覆金屬積層板、印刷配線板及覆金屬積層板之製造方法 Download PDFInfo
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- TW201903043A TW201903043A TW107119452A TW107119452A TW201903043A TW 201903043 A TW201903043 A TW 201903043A TW 107119452 A TW107119452 A TW 107119452A TW 107119452 A TW107119452 A TW 107119452A TW 201903043 A TW201903043 A TW 201903043A
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- Prior art keywords
- resin composition
- metal
- insulating layer
- resin
- hardened
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- 230000009477 glass transition Effects 0.000 claims abstract description 29
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 54
- 229910052751 metal Inorganic materials 0.000 claims description 38
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- GSKNLOOGBYYDHV-UHFFFAOYSA-N 2-methylphenol;naphthalen-1-ol Chemical compound CC1=CC=CC=C1O.C1=CC=C2C(O)=CC=CC2=C1 GSKNLOOGBYYDHV-UHFFFAOYSA-N 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
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- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
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- 238000007598 dipping method Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
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- VSWALKINGSNVAR-UHFFFAOYSA-N naphthalen-1-ol;phenol Chemical compound OC1=CC=CC=C1.C1=CC=C2C(O)=CC=CC2=C1 VSWALKINGSNVAR-UHFFFAOYSA-N 0.000 description 1
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Classifications
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Abstract
本發明提供一種樹脂組成物，其含有環氧樹脂，且可藉由硬化成為具耐熱性之硬化物。樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖
Description
本發明涉及樹脂組成物、預浸體、覆金屬積層板、印刷配線板及覆金屬積層板之製造方法，詳細來說係涉及含有環氧樹脂之樹脂組成物、具備樹脂組成物之乾燥物或半硬化物的預浸體、具備含有樹脂組成物之硬化物的絕緣層的覆金屬積層板及印刷配線板、以及使用樹脂組成物的覆金屬積層板之製造方法。
發明背景 作為覆金屬積層板及印刷配線板中之絕緣層材料之一，有含有環氧樹脂、硬化劑、硬化促進劑等之樹脂組成物(參照專利文獻1)。
近年，針對車載用途等之印刷配線板力求高度的耐熱性。
先前技術文獻 專利文獻 專利文獻1：國際公開WO2010/035452
發明概要 本發明課題在於提供一種含有環氧樹脂且可藉由硬化成為具有耐熱性之硬化物的樹脂組成物、具備樹脂組成物之乾燥物或半硬化物的預浸體、具備含有樹脂組成物之硬化物的絕緣層的覆金屬積層板及印刷配線板、以及使用樹脂組成物的覆金屬積層板之製造方法。
本發明一態樣之樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)。前述樹脂組成物之硬化物具有260℃以上之玻璃轉移溫度。
本發明一態樣之預浸體具備纖維基材與浸潤至前述纖維基材中之前述樹脂組成物的乾燥物或半硬化物。
本發明一態樣之覆金屬積層板具備絕緣層及與前述絕緣層疊合之金屬層。前述絕緣層含有前述樹脂組成物之硬化物。
本發明一態樣之印刷配線板具備絕緣層及與前述絕緣層疊合之導體配線，並且，前述絕緣層含有前述樹脂組成物之硬化物。
本發明一態樣之覆金屬積層板之製造方法包含以下步驟：於具備纖維基材與浸潤至前述纖維基材中之樹脂組成物的乾燥物或半硬化物的預浸體上，疊合金屬箔並熱壓，藉此製作含有前述纖維基材與前述樹脂組成物之硬化物的絕緣層、及由前述金屬箔所構成之金屬層。前述樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)。前述熱壓時之最高加熱溫度為280℃以上。
用以實施發明之形態 以下說明本發明一實施形態之樹脂組成物、預浸體、硬化物、覆金屬積層板、印刷配線板及覆金屬積層板之製造方法。
樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)。樹脂組成物之硬化物具有260℃以上之玻璃轉移溫度。另，硬化物之玻璃轉移溫度的測定方法如下述實施例中說明。
本實施形態具有一優點，即，可提供可藉由硬化成為具有耐熱性之硬化物的樹脂組成物、具有耐熱性之硬化物、具備樹脂組成物之乾燥物或半硬化物的預浸體、具備含有樹脂組成物之硬化物的絕緣層的覆金屬積層板及印刷配線板、以及使用樹脂組成物的覆金屬積層板之製造方法。
硬化物可藉由加熱樹脂組成物、樹脂組成物之乾燥物或樹脂組成物之半硬化物來製造。加熱條件係樹脂組成物可充分硬化之條件。樹脂組成物只要可在至少一種條件下被加熱而成為具有260℃之玻璃轉移溫度的硬化物即可。樹脂組成物、樹脂組成物之乾燥物或樹脂組成物之半硬化物的加熱條件，譬如最高加熱溫度在260~400℃之範圍內，從開始加熱時起至達到最高加熱溫度時為止之升溫速度在2~8℃/sec之範圍內，且加熱時間在1.5~6分鐘之範圍內。利用熱壓加熱時，加壓壓力譬如在0.5~5MPa之範圍內。在該等範圍內之任一條件下將樹脂組成物加熱而製得之硬化物宜具有260℃以上之玻璃轉移溫度。
從樹脂組成物可製作覆金屬積層板及印刷配線板中之絕緣層，此時，樹脂組成物可提升絕緣層之耐熱性。
另，具三吖骨架之咪唑化合物為公知，譬如國際公開WO2010/035452中亦有記載2,4-二胺基-6-[2'-十一基咪唑基-(1')]乙基-s-三吖等作為咪唑硬化促進劑一例。
但，實際上並不存在用以製作覆金屬積層板等之絕緣層的環氧樹脂組成物中摻混有具三吖骨架之咪唑化合物的例子。其理由是因為咪唑化合物雖具有促進環氧樹脂硬化之作用，但具三吖骨架之咪唑化合物其作用薄弱，故一般認為不合實用。所以，很難會想到實際要利用含有具三吖骨架之咪唑化合物的樹脂組成物。
發明人在這等情況下，為了製作覆金屬積層板及印刷配線板中之絕緣層，突破性想到利用含有具三吖骨架之咪唑化合物的樹脂組成物。此外，發明人發現這種樹脂組成物之硬化物可具有高玻璃轉移溫度，藉由利用這種樹脂組成物可製作耐熱性高的絕緣層的顯著優點，進而達至完成本發明。
環氧樹脂(A)可含有譬如選自於由萘型環氧樹脂、甲酚酚醛型環氧樹脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛型環氧樹脂、烷基苯酚酚醛型環氧樹脂、芳烷基型環氧樹脂、聯酚型環氧樹脂、二環戊二烯型環氧樹脂、酚類與具酚性羥基之芳香族醛的縮合物之環氧化物、三聚異氰酸三環氧丙酯及脂環式環氧樹脂所構成群組中之至少一種化合物。
環氧樹脂(A)尤宜含有苯酚酚醛型環氧樹脂。樹脂組成物若含有具三吖骨架之咪唑化合物(C)並含有苯酚酚醛型環氧樹脂，則樹脂組成物之硬化物即可具有特別高的玻璃轉移溫度。
環氧樹脂(A)之環氧當量宜為200以上。此時，硬化物可具有特別優異的熱穩定性。
酚化合物(B)為環氧樹脂(A)之硬化劑。酚化合物(B)可含有譬如選自於由肆酚樹脂、酚醛型酚樹脂、萘型酚樹脂、甲酚酚醛樹脂、芳香族烴甲醛樹脂改質酚樹脂、二環戊二烯酚加成型樹脂、酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂、聯苯改質酚芳烷基樹脂、酚三羥甲甲烷樹脂、四羥苯基乙烷(tetraphenylolethane)樹脂、萘酚酚醛樹脂、萘酚-酚共縮酚醛樹脂、萘酚-甲酚共縮酚醛樹脂、聯苯改質酚樹脂、胺基三吖改質酚樹脂、聯酚、乙二醛四酚樹脂、雙酚A酚醛樹脂及雙酚F酚醛樹脂所構成群組中之至少一種化合物。
酚化合物(B)由宜含有肆酚樹脂。樹脂組成物若含有具三吖骨架之咪唑化合物(C)並含有含肆酚樹脂之酚化合物(B)，則樹脂組成物之硬化物即可具有特別高的玻璃轉移溫度。環氧樹脂(A)含有苯酚酚醛型環氧樹脂且酚化合物(B)含有肆酚樹脂尤佳。
酚化合物(B)之羥基當量宜為150以上。此時，硬化物可具有特別優異的熱穩定性。
環氧樹脂(A)與酚化合物(B)之當量比宜在0.8：1.2~1.2：0.8之範圍內。
如上述，樹脂組成物含有具三吖骨架之咪唑化合物(C)。因此，樹脂組成物之硬化物可具有高玻璃轉移溫度，亦可具有260℃以上之玻璃轉移溫度。所以，含有樹脂組成物之硬化物的絕緣層可具有高度的耐熱性。並且，含有樹脂組成物之硬化物的絕緣層可具有與金屬層高度的密著性。
咪唑化合物(C)譬如可包含2,4-二胺基-6-[2'-乙基-4'-甲基咪唑基-(1')]乙基-s-三吖。咪唑化合物(C)尤宜包含2,4-二胺基-6-[2'-乙基-4'-甲基咪唑基-(1')]乙基-s-三吖。此時，樹脂組成物之硬化物可具有特別高的玻璃轉移溫度，且含有該硬化物之絕緣層可具有特別高的耐熱性。
樹脂組成物中，相對於環氧樹脂(A)與酚化合物(B)之合計，咪唑化合物(C)之比率宜在0.02~1質量%之範圍內。該比率若為0.02質量%以上，硬化物即可具有特別高的玻璃轉移溫度。又，該比率若為1質量%以下，即使在含有溶劑之情況下保存樹脂組成物，樹脂組成物之成分也不容易產生凝聚，亦即樹脂組成物可具有良好的清漆保存穩定性，且絕緣層可具有良好的焊接耐熱性。另，清漆保存穩定性可以下述實施例中所示方法評估。
樹脂組成物亦可含有無機充填材。無機充填材可含有譬如選自於由二氧化矽、硫酸鋇、氧化矽粉、碎二氧化矽、煆燒滑石、鈦酸鋇、氧化鈦、黏土、氧化鋁、雲母、軟水鋁石、硼酸鋅、錫酸鋅以及前述以外之各種金屬氧化物及金屬水合物所構成群組中之至少一種成分。
樹脂組成物若含有無機充填材，可使含有樹脂組成物之硬化物的絕緣層達到低線膨脹係數化。因此，可抑制具備絕緣層之積層板及印刷配線板翹曲等變形。無機充填材含量宜相對於樹脂組成物總量為80質量%以下，且在10~80質量%之範圍內尤佳。
樹脂組成物亦可含有溶劑。溶劑可含有譬如選自於由丙酮、甲基乙基酮、環己酮等酮系溶劑、甲苯、二甲苯等芳香族系溶劑及二甲基甲醯胺等含氮溶劑所構成群組中之至少一種成分。
樹脂組成物亦可含有上述以外之成分。譬如，樹脂組成物亦可含有光穩定劑、黏度調整劑、阻燃劑等。
再來說明預浸體。
預浸體具備纖維基材與浸潤至纖維基材中之樹脂組成物的乾燥物或半硬化物。
纖維基材譬如為玻璃等無機質纖維之織布、無機質纖維之不織布、芳醯胺布、聚酯布或紙。纖維基材宜為玻璃織布，即玻璃布。
製造預浸體時，譬如首先將樹脂組成物以浸漬法、塗佈法等公知方法浸潤至纖維基材中。
接著將樹脂組成物加熱使其乾燥或半硬化。加熱條件譬如加熱溫度在120~190℃之範圍內且加熱時間在3~15分鐘之範圍內，惟不受此限。藉此可製造預浸體。
接著說明覆金屬積層板。
覆金屬積層板具備絕緣層及與絕緣層疊合之金屬層。絕緣層含有上述說明之樹脂組成物之硬化物。
覆金屬積層板可具備二層金屬層，且該二金屬層分別疊合在絕緣層中之一面及其相反側之面。覆金屬積層板亦可僅具備一層金屬層，且該一金屬層疊合在絕緣層中之一面。
樹脂組成物之硬化物可具有高玻璃轉移溫度，因此覆金屬積層板可具有高耐熱性。此外，覆金屬積層板亦可達成金屬層對絕緣層的高度剝離強度。
硬化物譬如可藉由加熱樹脂組成物、樹脂組成物之乾燥物或樹脂組成物之半硬化物來製造。
加熱樹脂組成物時的最高加熱溫度宜為260℃以上。此時，可達成特別高的玻璃轉移溫度及特別高的剝離強度。該最高加熱溫度在260~400℃之範圍內較佳，在280~320℃之範圍內更佳。
加熱樹脂組成物時，從開始加熱時起至達到最高加熱溫度時為止的升溫速度宜為2℃/sec以上。此時，硬化物可具有特別高的玻璃轉移溫度。該升溫速度在2~8℃/sec之範圍內較佳，在3~5℃/sec之範圍內更佳。
再來說明覆金屬積層板之製造方法之一例。
將金屬箔疊合至上述說明之預浸體或是預浸體多片積層而成的積層物來製作積層體。覆金屬積層板具備二層金屬層時，將二層金屬箔分別疊合至預浸體或積層物之一面及其相反側之面來製作積層體。覆金屬積層板僅具備一層金屬層時，將金屬箔疊合至預浸體或積層物之一面來製作積層體。藉由熱壓積層體，可製作含有纖維基材與樹脂組成物之硬化物的絕緣層、及由金屬箔所構成之金屬層。藉此，可製作覆金屬積層板。
該覆金屬積層板中之絕緣層中所含硬化物可具有高玻璃轉移溫度，亦可具有260℃以上之玻璃轉移溫度。因此，覆金屬積層板可具有高耐熱性。
該覆金屬積層板既可達成金屬層對絕緣層的高剝離強度，亦可達成4N/cm以上之剝離強度。剝離強度之測定方法如下述實施例中說明。
熱壓積層體之條件包含譬如最高加熱溫度、加壓壓力及加熱時間。 最高加熱溫度與上述同樣宜為260℃以上，且在260~400℃之範圍內較佳，在280~320℃之範圍內更佳。熱壓時，從開始加熱時起至達到最高加熱溫度時為止的升溫速度與上述同樣宜為2℃/sec以上，且在2~8℃/sec之範圍內較佳，在3~5℃/sec之範圍內更佳。
加壓壓力譬如在0.5~5MPa之範圍內。此時，可達成特別高的玻璃轉移溫度及特別高的剝離強度。加壓壓力在0.5~5MPa之範圍內即佳，在2~4MPa之範圍內較佳。
加熱時間譬如在1.5~6分鐘之範圍內，且在2.4~4分鐘之範圍內為宜。加熱時間少於1.5分鐘時，可能會因為硬化反應未結束而造成硬化物特性下降，尤其很難獲得玻璃轉移點為260℃之硬化物。又，當在加熱溫度為260℃下進行處理超過6分鐘的情況下，恐因分解反應的進行造成硬化物之特性下降。
另，熱壓積層體之條件會影響絕緣層之玻璃轉移溫度及金屬層對絕緣層的剝離強度。因此，在本實施形態中，熱壓積層體之條件將特定出積層板的結構或特性。但，發明人對在不同條件下將積層體熱壓所做成的絕緣層進行分析也並未發現具意義的差異。因此，絕緣層雖具有源自熱壓積層體之條件得來的結構或特性，但無法如言詞上特定其結構或特性。
接著說明印刷配線板。
印刷配線板具備絕緣層及與絕緣層疊合之導體配線。絕緣層含有上述說明之樹脂組成物之硬化物。
印刷配線板亦可具備二個導體配線，且該等分別疊合在絕緣層中之一面及其相反側之面。印刷配線板亦可僅具備一個導體配線，且其疊合在絕緣層中之一面。
樹脂組成物之硬化物可具有高玻璃轉移溫度，因此印刷配線板可具有高耐熱性。
此外，印刷配線板亦可達成導體配線對絕緣層的高度剝離強度。
印刷配線板譬如可以光刻法將上述所說明之覆金屬積層板中之金屬層圖案化來製作導體配線而製得。
印刷配線板亦可為具備多層絕緣層及多個導體配線的多層印刷配線板。此時，多層絕緣層中之至少一絕緣層含有上述所說明之樹脂組成物之硬化物即可。 實施例
1.調製樹脂組成物及製造覆金屬積層板 將表1之「組成」一欄中所示成分混合，而調製出樹脂組成物。
使該樹脂組成物浸潤至玻璃布(厚95μm，日東紡績股份有限公司製型號2116)中以後，在130℃且3分鐘之條件下加熱，製出預浸體。
於該預浸體之一面及其相反側之面分別疊合銅箔(厚18μm，三井金屬礦業股份有限公司製型號3EC-VLP)，製作出積層體。將該積層體熱壓而製得覆金屬積層板。將積層體熱壓時，從開始加熱時起至達到最高溫度時為止的升溫速度、最高加熱溫度、加壓壓力及加熱時間如表1之「熱壓條件」一欄所示。
另，表1所示成分詳細如下。 ・苯酚酚醛型環氧樹脂：日本化藥股份有限公司製EPPN-502H。 ・雙酚A型環氧樹脂：日本化藥股份有限公司製RE-310S。 ・酚樹脂1：聯苯芳烷基型酚樹脂，明和化成股份有限公司製MEH7851-4H。 ・酚樹脂2：肆酚樹脂，明和化成股份有限公司製MEH7600-4H。 ・1-氰乙基-2-甲基咪唑：四國化成工業股份有限公司製2MZ-CN。 ・2-乙基-4-甲基咪唑：四國化成工業股份有限公司製2E4MZ。 ・2,4-二胺基-6-[2'-乙基-4'-甲基咪唑基-(1')]-乙基-s-三吖：四國化成工業股份有限公司製2E4MZ-A。 ・球狀二氧化矽：(股)Admatechs製SC-2050MTX。 ・溶劑：甲基乙基酮。
2.評估試驗 針對覆金屬積層板進行下述評估試驗。其結果列於表1。
(1)剝離強度 測定覆金屬積層板中之金屬箔(銅箔)對絕緣層的剝離強度。測定係按照JIS C6481進行。
(2)玻璃轉移溫度 利用動態黏彈性測定測出覆金屬積層板之絕緣層中所含硬化物之玻璃轉移溫度。測定裝置係使用SEIKO INSTRUMENTS INC.製黏彈性分光計(DMS100)，以彎曲模組在頻率10Hz、升溫速度5℃/分鐘、溫度範圍室溫~340℃之條件下測定tanδ，並以tanδ顯示極大值之溫度作為玻璃轉移溫度。
(3)清漆保存穩定性 將樹脂組成物在室溫下放置30日後，以肉眼確認樹脂組成物之透明性。若可確認樹脂組成物為透明即評估為「A」；確認樹脂組成物上有混濁則評估為「B」。
[表1]
[表2]如從上述實施形態明示可知，第1態樣之樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)，且樹脂組成物之硬化物具有260℃以上之玻璃轉移溫度。在第1態樣中，可製得可藉由硬化成為具有耐熱性之硬化物的樹脂組成物。 就第2態樣之樹脂組成物而言，在第1態樣中，相對於環氧樹脂(A)與酚化合物(B)之合計，咪唑化合物(C)之比率在0.02~1質量%之範圍內。在第2態樣中，硬化物可具有特別高的玻璃轉移溫度，且樹脂組成物可具有良好的清漆保存穩定性。又，絕緣層含有硬化物時，絕緣層可具有良好的焊接耐熱性。 第3態樣之硬化物係將含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)的樹脂組成物硬化而製得，且具有260℃以上之玻璃轉移溫度。在第3態樣中，可製得具有耐熱性之硬化物。 第4態樣之預浸體具備纖維基材及浸潤至纖維基材中之第1或第2態樣之樹脂組成物的乾燥物或半硬化物。在第4態樣中，可製得可成為具有耐熱性之絕緣層的預浸體。 第5態樣之覆金屬積層板具備絕緣層及與絕緣層疊合之金屬層，且絕緣層含有第1或第2態樣之樹脂組成物之硬化物或第3態樣之硬化物。在第5態樣中，覆金屬積層板中之絕緣層可具有耐熱性及與金屬層之密著性。 就第6態樣之覆金屬積層板而言，在第5態樣中，硬化物係依下述方式製得：在最高加熱溫度為260℃以上之溫度下，將第1或第2態樣之樹脂組成物、其乾燥物或其半硬化物加熱而製得。在第6態樣中，絕緣層尤可具有耐熱性及與金屬層特別高的密著性。 就第7態樣之覆金屬積層板而言，在第6態樣中，加熱樹脂組成物、乾燥物或半硬化物時，從開始加熱時起至達到最高加熱溫度時為止的升溫速度為2℃/sec以上。在第7態樣中，絕緣層可具有特別高的耐熱性。 就第8態樣之覆金屬積層板而言，在第5至第7中之任一態樣中，金屬層對絕緣層之剝離強度為4N/cm以上。在第8態樣中，絕緣層可與金屬層具有特別高的密著性。 第9態樣之印刷配線板具備絕緣層及與絕緣層疊合之導體配線，且絕緣層含有第1或第2態樣之樹脂組成物之硬化物或第3態樣之硬化物。在第9態樣中，印刷配線板中之絕緣層可具有耐熱性及與導體配線之密著性。 第10態樣之覆金屬積層板之製造方法包含以下步驟：於具備纖維基材與浸潤至纖維基材中之樹脂組成物之乾燥物或半硬化物的預浸體上，疊合金屬箔製作出積層體後，將積層體熱壓，藉此製作含有纖維基材與樹脂組成物之硬化物的絕緣層、及由金屬箔所構成之金屬層。樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)。熱壓積層體時之最高加熱溫度為280℃以上。在第10態樣中，覆金屬積層板中之絕緣層可具有耐熱性及與金屬層之密著性。 就第11態樣之覆金屬積層板之製造方法而言，將積層體熱壓時，從開始加熱時起至達到最高加熱溫度時為止的升溫速度為2℃/sec以上。在第11態樣中，絕緣層可具有特別高的耐熱性。
Claims (10)
- 一種樹脂組成物，含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)，且 其硬化物具有260℃以上之玻璃轉移溫度。
- 如請求項1之樹脂組成物，其中相對於前述環氧樹脂(A)與前述酚化合物(B)之合計，前述咪唑化合物(C)之比率在0.02~1質量%之範圍內。
- 一種預浸體，具備纖維基材與浸潤至前述纖維基材中之如請求項1或2之樹脂組成物的乾燥物或半硬化物。
- 一種覆金屬積層板，具備絕緣層及與前述絕緣層疊合之金屬層，並且 前述絕緣層含有如請求項1或2之樹脂組成物之硬化物。
- 如請求項4之覆金屬積層板，其中前述硬化物係依下述方式製得：在最高加熱溫度為260℃以上之溫度下，將如請求項1或2之樹脂組成物、其乾燥物或其半硬化物加熱而製得。
- 如請求項5之覆金屬積層板，其中在加熱前述樹脂組成物、前述乾燥物或前述半硬化物時，從開始加熱時起至達到最高加熱溫度時為止的升溫速度為2℃/sec以上。
- 如請求項4之覆金屬積層板，其中前述金屬層對前述絕緣層的剝離強度為4N/cm以上。
- 一種印刷配線板，具備絕緣層及與前述絕緣層疊合之導體配線，並且 前述絕緣層含有如請求項1或2之樹脂組成物之硬化物。
- 一種覆金屬積層板之製造方法，包含以下步驟：於具備纖維基材與浸潤至前述纖維基材中之樹脂組成物的乾燥物或半硬化物的預浸體上，疊合金屬箔製作出積層體後，熱壓前述積層體，藉此製作含有前述纖維基材與前述樹脂組成物之硬化物的絕緣層、及由前述金屬箔所構成之金屬層； 前述樹脂組成物含有環氧樹脂(A)、酚化合物(B)及具三吖骨架之咪唑化合物(C)，且 將前述積層體熱壓時的最高加熱溫度為280℃以上。
- 如請求項9之覆金屬積層板之製造方法，其將前述積層體熱壓時，從開始加熱時起至達到最高加熱溫度時為止的升溫速度為2℃/sec以上。
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| JP2017-113826 | 2017-06-08 | ||
| JP2017113826A JP6934637B2 (ja) | 2017-06-08 | 2017-06-08 | 樹脂組成物、プリプレグ、金属張積層板、プリント配線板、及び金属張積層板の製造方法 |
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| TWI696660B TWI696660B (zh) | 2020-06-21 |
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| US (1) | US20200157300A1 (zh) |
| JP (1) | JP6934637B2 (zh) |
| KR (1) | KR102286704B1 (zh) |
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| JPS61272243A (ja) * | 1985-05-28 | 1986-12-02 | Hitachi Chem Co Ltd | 印刷配線板用プリプレグの製造方法 |
| JPH0776282B2 (ja) * | 1989-10-06 | 1995-08-16 | 日立化成工業株式会社 | 印刷配線板用プリプレグの製造方法 |
| JPH04300974A (ja) * | 1991-03-28 | 1992-10-23 | Somar Corp | エポキシ樹脂粉体塗料 |
| JPH0867745A (ja) * | 1994-08-30 | 1996-03-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPH11323200A (ja) * | 1998-05-12 | 1999-11-26 | Nippon Kayaku Co Ltd | 粉体塗料用組成物 |
| JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
| JP3821728B2 (ja) | 2002-03-06 | 2006-09-13 | 住友ベークライト株式会社 | プリプレグ |
| JP2004307654A (ja) * | 2003-04-08 | 2004-11-04 | Mitsui Chemicals Inc | 接着性樹脂組成物およびその用途 |
| JP4590883B2 (ja) * | 2004-03-02 | 2010-12-01 | 住友ベークライト株式会社 | 樹脂組成物及び樹脂組成物を使用して作製した半導体装置 |
| JP2006273900A (ja) * | 2005-03-28 | 2006-10-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂粉体塗料 |
| TWI413220B (zh) * | 2006-12-05 | 2013-10-21 | Sumitomo Bakelite Co | 半導體封裝體、核心層材料、增層材料及密封樹脂組成物 |
| US20110244183A1 (en) | 2008-09-24 | 2011-10-06 | Sekisui Chemical Co., Ltd. | Resin composition, cured body and multilayer body |
| CN102365310B (zh) * | 2009-03-27 | 2013-11-20 | 日立化成工业株式会社 | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 |
| JP5185218B2 (ja) * | 2009-06-30 | 2013-04-17 | エムテックスマツムラ株式会社 | 半導体装置用中空パッケージおよび半導体部品装置 |
| JP2012001592A (ja) * | 2010-06-15 | 2012-01-05 | Nitto Denko Corp | モジュール封止用エポキシ樹脂組成物の製造方法 |
| US20120328811A1 (en) * | 2011-06-24 | 2012-12-27 | Air Products And Chemicals, Inc. | Epoxy Resin Compositions |
| JP2013216884A (ja) * | 2012-03-14 | 2013-10-24 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP2015193687A (ja) * | 2014-03-31 | 2015-11-05 | ナミックス株式会社 | 樹脂組成物、接着フィルム、および半導体装置 |
| KR20150115523A (ko) * | 2014-04-04 | 2015-10-14 | 삼성전기주식회사 | 인쇄회로기판용 절연 수지 조성물 및 이를 이용한 제품 |
| JP2017160427A (ja) * | 2016-03-04 | 2017-09-14 | 京セラ株式会社 | 封止用樹脂組成物及び半導体装置 |
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| US20200157300A1 (en) | 2020-05-21 |
| KR102286704B1 (ko) | 2021-08-05 |
| KR20190137943A (ko) | 2019-12-11 |
| WO2018225665A1 (ja) | 2018-12-13 |
| JP6934637B2 (ja) | 2021-09-15 |
| TWI696660B (zh) | 2020-06-21 |
| JP2018203955A (ja) | 2018-12-27 |
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