TW201835167A - 硬化性樹脂組成物、硬化物及半導體裝置 - Google Patents

硬化性樹脂組成物、硬化物及半導體裝置 Download PDF

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Publication number
TW201835167A
TW201835167A TW106122212A TW106122212A TW201835167A TW 201835167 A TW201835167 A TW 201835167A TW 106122212 A TW106122212 A TW 106122212A TW 106122212 A TW106122212 A TW 106122212A TW 201835167 A TW201835167 A TW 201835167A
Authority
TW
Taiwan
Prior art keywords
group
resin composition
curable resin
polyorganosiloxane
formula
Prior art date
Application number
TW106122212A
Other languages
English (en)
Chinese (zh)
Inventor
中川泰伸
Original Assignee
大賽璐股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大賽璐股份有限公司 filed Critical 大賽璐股份有限公司
Publication of TW201835167A publication Critical patent/TW201835167A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Sealing Material Composition (AREA)
TW106122212A 2016-11-02 2017-07-03 硬化性樹脂組成物、硬化物及半導體裝置 TW201835167A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-214739 2016-11-02
JP2016214739A JP6228284B1 (ja) 2016-11-02 2016-11-02 硬化性樹脂組成物、硬化物、及び半導体装置

Publications (1)

Publication Number Publication Date
TW201835167A true TW201835167A (zh) 2018-10-01

Family

ID=60265850

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106122212A TW201835167A (zh) 2016-11-02 2017-07-03 硬化性樹脂組成物、硬化物及半導體裝置

Country Status (3)

Country Link
JP (1) JP6228284B1 (ja)
TW (1) TW201835167A (ja)
WO (1) WO2018083832A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735015B (zh) * 2019-07-30 2021-08-01 長興材料工業股份有限公司 聚矽氧烷樹脂、含彼之塗料組合物及其應用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109735203B (zh) * 2018-12-25 2021-01-29 陕西科技大学 一种半封闭笼状三官能环氧醚基poss组合料、涂料及制备方法
KR20240044414A (ko) * 2021-08-11 2024-04-04 제이엔씨 주식회사 실록산 폴리머 조성물, 경화물, 전자 부품, 광학 부품 및 복합 부재

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5211881A (en) * 1975-07-18 1977-01-29 Toshiba Corp Semiconductor integrated circuit device
JPS62256863A (ja) * 1986-04-30 1987-11-09 Toshiba Silicone Co Ltd ロール用液状シリコーンゴム組成物
EP2752459B1 (en) * 2011-12-08 2017-11-15 Momentive Performance Materials Japan LLC Hydrosilylation-curable silicone rubber composition
JP6496193B2 (ja) * 2015-06-02 2019-04-03 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物、並びに光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735015B (zh) * 2019-07-30 2021-08-01 長興材料工業股份有限公司 聚矽氧烷樹脂、含彼之塗料組合物及其應用

Also Published As

Publication number Publication date
WO2018083832A1 (ja) 2018-05-11
JP2018070824A (ja) 2018-05-10
JP6228284B1 (ja) 2017-11-08

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