TW201816191A - 鎳鍍敷溶液 - Google Patents
鎳鍍敷溶液 Download PDFInfo
- Publication number
- TW201816191A TW201816191A TW106134778A TW106134778A TW201816191A TW 201816191 A TW201816191 A TW 201816191A TW 106134778 A TW106134778 A TW 106134778A TW 106134778 A TW106134778 A TW 106134778A TW 201816191 A TW201816191 A TW 201816191A
- Authority
- TW
- Taiwan
- Prior art keywords
- nickel
- electroplating composition
- composition
- ion
- semiconductor wafer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-208151 | 2016-10-24 | ||
JP2016208151A JP2018070907A (ja) | 2016-10-24 | 2016-10-24 | ニッケルめっき液 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201816191A true TW201816191A (zh) | 2018-05-01 |
Family
ID=60162034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106134778A TW201816191A (zh) | 2016-10-24 | 2017-10-11 | 鎳鍍敷溶液 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180112319A1 (fr) |
EP (1) | EP3312308A1 (fr) |
JP (1) | JP2018070907A (fr) |
KR (1) | KR20180044824A (fr) |
CN (1) | CN107974698A (fr) |
TW (1) | TW201816191A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111926352B (zh) * | 2018-06-12 | 2023-04-07 | 北京航空航天大学 | 一种镀镍溶液 |
KR102496247B1 (ko) * | 2021-01-06 | 2023-02-06 | 와이엠티 주식회사 | 전기 도금 용액 첨가제 및 이를 포함하는 고속 도금 가능한 고전류 전기 니켈 도금 용액 |
JP7197933B2 (ja) * | 2021-05-27 | 2022-12-28 | 石原ケミカル株式会社 | アンダーバリアメタルとソルダー層とを含む構造体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3261676B2 (ja) | 1999-12-16 | 2002-03-04 | 東京都 | 電気ニッケルめっき浴。 |
US20020135069A1 (en) * | 2000-11-03 | 2002-09-26 | Wood Robert L. | Electroplating methods for fabricating microelectronic interconnects |
GB2393037B (en) * | 2002-09-11 | 2007-05-23 | Tera View Ltd | Method of enhancing the photoconductive properties of a semiconductor and method of producing a seminconductor with enhanced photoconductive properties |
JP2004265253A (ja) | 2003-03-03 | 2004-09-24 | Matsushita Electric Works Ltd | 遠隔監視制御装置 |
JP2008285732A (ja) * | 2007-05-21 | 2008-11-27 | Meltex Inc | ニッケルめっき液及びそのニッケルめっき液を用いた電気めっき方法並びにその電気めっき方法でニッケルめっき皮膜を形成したチップ部品 |
JP4932872B2 (ja) | 2009-05-18 | 2012-05-16 | 株式会社アイアールエフ | 逆走防止装置 |
JP5452458B2 (ja) * | 2010-12-14 | 2014-03-26 | メルテックス株式会社 | ニッケルめっき液及びニッケルめっき方法 |
-
2016
- 2016-10-24 JP JP2016208151A patent/JP2018070907A/ja active Pending
-
2017
- 2017-08-31 US US15/692,521 patent/US20180112319A1/en not_active Abandoned
- 2017-10-11 TW TW106134778A patent/TW201816191A/zh unknown
- 2017-10-17 CN CN201710963553.0A patent/CN107974698A/zh active Pending
- 2017-10-23 EP EP17197736.6A patent/EP3312308A1/fr not_active Withdrawn
- 2017-10-23 KR KR1020170137321A patent/KR20180044824A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US20180112319A1 (en) | 2018-04-26 |
KR20180044824A (ko) | 2018-05-03 |
CN107974698A (zh) | 2018-05-01 |
JP2018070907A (ja) | 2018-05-10 |
EP3312308A1 (fr) | 2018-04-25 |
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