TW201735989A - 中空絲膜模組及其製造方法 - Google Patents
中空絲膜模組及其製造方法 Download PDFInfo
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Abstract
本發明之中空絲膜模組係如下之中空絲膜模組,其具備:筒狀容器(2),其一端部及另一端部開口;中空絲膜之束(3),其裝填於該筒狀容器(2)內;灌封部(4),其將中空絲膜之束(3)於筒狀容器(2)之兩端部包埋固定;及集管(5),其設置於筒狀容器(2)之兩端部,且具有成為流體之出入口之噴嘴。於該中空絲膜模組中,集管(5)與筒狀容器(2)係至少於1次熔接部(71)及2次熔接部(72)之2部位之區域熔接,2次熔接部(72)係配置於在1次熔接部(71)之熔接開始後或與熔接開始同時地開始熔接之位置。
Description
本發明係關於一種利用裝填於本體容器之中空絲膜將血液淨化之中空絲膜模組之構造及其製造方法。
先前,中空絲膜型血液淨化器(於本說明書中稱為「中空絲膜模組」)係根據血液透析、血液過濾、血漿分離、血漿成分區分等體外循環式之血液淨化療法而開發有各種,且利用於利用膜分離技術之多種血液淨化療法等。中空絲膜模組一般而言包括以如下方式構成之模組,即,於在側部設置有埠之圓筒狀之本體容器裝填中空絲膜之束,藉由胺基甲酸酯等灌封材而將中空絲膜束接著固定於本體容器之後,於本體容器之兩端安裝集管。血液透析係使用該中空絲膜模組藉由如下方式而進行,即,藉由使透析液流入至入口側之埠,並自出口埠流出而使透析液於本體容器內流通,又,使血液自血液入口側集管向中空絲膜流入,並向血液出口側集管流通。於進行此種血液透析時,必須以液體不自集管與本體容器之接合部分漏出之方式液密地密封,例如,利用將集管與本體容器超音波熔接而接合之方法。其係藉由一面使集管之被熔接部分與本體容器之被熔接部分抵接一面賦予超音波振動而發熱、熔融來接合之方法,且作為用以獲得液密性、氣密性之較佳之一方法而利用(例如參照專利文獻1)。[先前技術文獻][專利文獻][專利文獻1]國際公開第2013/146663號
[發明所欲解決之問題]然而,血液淨化器中之集管與本體容器之接合強度未必始終充分,若接合強度不足則因輸送時之衝擊而會產生接合部脫離。又,若起因於接合強度不充分而耐壓強度不足,則於施行血液淨化療法時會產生接合部脫離而產生漏液。本發明係為了解決上述不良情況而完成者,其目的在於提供一種提高集管與本體容器之接合強度,解決接合強度不足、耐壓強度不足、漏液之問題之中空絲膜模組。[解決問題之技術手段]為了解決該問題,本發明係一種中空絲膜模組,其具備:筒狀容器,其一端部及另一端部開口;中空絲膜之束,其裝填於該筒狀容器;灌封部,其將上述中空絲膜之束於上述筒狀容器之兩端部包埋固定;及集管,其設置於上述筒狀容器之兩端部,且具有成為流體之出入口之噴嘴;且該中空絲膜模組之特徵在於,上述集管與上述筒狀容器係至少於1次熔接部及2次熔接部之2部位之區域熔接,上述2次熔接部配置於在上述1次熔接部之熔接開始後或與熔接開始同時地開始熔接之位置。集管與筒狀容器先前係僅於1個部位熔接,相對於此,於本案之中空絲膜模組中於2部位以上之區域熔接,故而接合強度增加,中空絲膜模組之接合強度、耐壓強度提高。因此,耐壓強度難以不足,不易產生漏液。於中空絲膜模組中,較佳為,上述1次熔接部之熔融部分之沿著上述筒狀容器之中心軸的長度即熔融長度,較上述2次熔接部之熔融部分之熔接長度更長或成為與此相同之長度。亦可於上述筒狀容器形成有上述集管之一部分嵌合之凹部。上述凹部亦可由如下形狀之凸緣部形成,該凸緣部自上述筒狀容器之外側面向外側突出,且向上述集管彎曲。較佳為,上述1次熔接部配置於較上述2次熔接部等其他熔接部更接近上述集管之與熔接焊頭之接合面之側。於中空絲膜模組中,亦可於上述1次熔接部與上述2次熔接部之一者或兩者中,使用共用接頭作為熔接上述集管與上述筒狀容器之接頭設計。又,本發明係一種中空絲膜模組之製造方法,該中空絲膜模組具備:筒狀容器,其一端部及另一端部開口;中空絲膜之束,其裝填於該筒狀容器;灌封部,其將上述中空絲膜之束於上述筒狀容器之兩端部包埋固定;及集管,其設置於上述筒狀容器之兩端部,且具有成為流體之出入口之噴嘴;且該中空絲膜模組之製造方法之特徵在於,將上述集管與上述筒狀容器至少於1次熔接部及2次熔接部之2部位之區域熔接,並且將上述2次熔接部之熔接於上述1次熔接部之熔接開始後或與熔接開始同時開始。於中空絲膜模組之製造方法中,較佳為,使上述1次熔接部之沿著上述筒狀容器之中心軸的熔接長度,較上述2次熔接部之熔接長度更長或與此相同。[發明之效果]根據本發明,可提高中空絲膜模組中之集管與本體容器之接合強度,解決接合強度不足、耐壓強度不足、漏液之問題。
以下,參照圖式對本發明之較佳之實施形態進行說明。再者,對相同之要件標註相同之符號,並省略重複之說明。又,上下左右等之位置關係只要未特別說明,設為基於圖式所示之位置關係者。進而,圖式之尺寸比率並不限定於圖示之比率。又,以下之實施形態係用以說明本發明之例示,本發明並不限定於該實施形態。 <中空絲膜模組之構成>首先,對本實施形態之中空絲膜模組之構成進行說明。圖1係表示中空絲膜模組1之構成之一例之剖面模式圖(其中僅圖示剖面者)。 中空絲膜模組1具備筒狀容器2、中空絲膜束3、灌封部4、及集管5等。 筒狀容器2係形成為圓筒狀,且長度方向(圓筒之中心軸P方向)之兩端部2a開口。於筒狀容器2之內部收容有中空絲膜束3。於筒狀容器2之側面,形成有成為流體之出入口之例如2個埠10。 中空絲膜束3係將多條中空絲膜集中而成之束,且沿著長度方向收容於筒狀容器2內。中空絲膜束3作為分離膜而發揮功能,可於各中空絲膜之內側區域與外側區域之間將作為分離對象之流體之成分分離。 灌封部4係藉由灌封樹脂而構成,且於筒狀容器2之兩端部2a之內側包埋中空絲膜束3之兩端部3a,並且將中空絲膜束3固定於筒狀容器2之兩端部2a。灌封部4係外周部成為僅藉由灌封樹脂而構成之部分4a,其內側成為灌封樹脂進入至中空絲膜束3之中空絲膜彼此之間隙之部分4b。作為灌封樹脂,例如可列舉聚胺基甲酸酯樹脂、環氧樹脂、矽樹脂等,但並不特別限定於該等。 集管5於筒狀容器2之兩端部2a之開口作為該等兩端部2a之蓋材而設置。集管5具有:管狀之噴嘴部20,其於中心軸P成為流體之出入口;板狀之頂板部21,其自噴嘴部20向徑向擴展;及作為側壁部之集管突出部22,其自頂板部21之外周緣向筒狀容器2側突出。 噴嘴部20具有用以連接外部管之螺紋構造。頂板部21具有與中空絲膜束3之端部3a對向,且自噴嘴部20朝向筒狀容器2之端部2a而直徑逐漸變大之內表面21a(參照圖4)。於集管5之內表面21a與中空絲膜束3之端部3a之間,形成有自噴嘴部20流入之流體或自噴嘴部20流出之流體通過之空間23。 集管突出部22具有以中心軸P為軸心之圓筒形狀。集管突出部22例如如圖4所示,自頂板部21朝向筒狀容器2側依序具備基部30、中段部31及前端部32。基部30、中段部31及前端部32係徑向之厚度互不相同,基部30之厚度最大,中段部31之厚度第二大,前端部32之厚度最小。 基部30係自頂板部21連續之部分,例如具有第1內周面30a,該第1內周面30a具有固定之內徑R1。第1內周面30a之內徑R1大於頂板部21之內表面21a之下端(最大徑部)之內徑R0。於頂板部21之內表面21a與基部30之第1內周面30a之間,形成有相對於中心軸P垂直之環狀之平坦面(階部)40。 中段部31具有第2內周面31a,該第2內周面31a具有大於內徑R1之固定之內徑R2。前端部32具有:第3內周面32a,其具有與第2內周面31a相同之內徑R2;及外周面32b,其具有外徑較中段部31之外周面31b小之固定之外徑R3。於中段部31之外周面31b與前端部32之外周面32b之間,形成有相對於中心軸P垂直之環狀之平坦面(階部)42。 筒狀容器2之端部2a具有所謂兩股構造。端部2a具有向集管5側雙層地圓筒狀地突出之內側突出部50與外側突出部51。內側突出部50與外側突出部51分別具有以中心軸P為軸心之圓筒形狀,且配置為同心圓狀。內側突出部50較外側突出部51長,且向集管5側(中心軸P方向外側)突出。內側突出部50之內周面50a構成筒狀容器2之內周面。 外側突出部51由自筒狀容器2之外側面向徑向外側突出,進而自其外緣向端部2a側(最近之集管5側)彎曲之形狀之凸緣部形成。又,於該等內側突出部50與外側突出部51之間,形成有以供集管5之一部分(前端部32)嵌合之形狀構成耦合構造之環狀之凹部52(參照圖4)。內側突出部50之內周面50a具有大於內徑R0且小於內徑R1之內徑R4。內側突出部50之外周面50b具有大於內徑R1且小於內徑R2之外徑R5。<集管與筒狀容器之接合構造> 於將集管突出部22插入至筒狀容器2之內側突出部50與外側突出部51之間的狀態下,集管5與筒狀容器2藉由超音波熔接而熔接。內側突出部50與集管突出部22之中段部31及前端部32對向,外側突出部51與前端部32對向。 集管5與筒狀容器2係利用熔接部70熔接,該熔接部70包括內側突出部50之前端部附近與集管突出部22之中段部31之間的1次熔接部71、及內側突出部50與前端部32之間之2次熔接部72。如此,藉由將熔接部設置於至少2部位進行雙層熔接,可進而提高漏液抑制效果與耐壓強度。1次熔接部71係遍及例如內側突出部50之端面(圖4中之上端面)與外周面50b而形成。再者,於圖4中,為了方便起見,以虛線表示1次熔接部71,且明確地圖示其分界線,但於接觸部分熔融而接著之熔接中,其分界模糊,且實際上於每一熔接發生變動。2次熔接部72係形成於例如集管突出部22之前端部32之前端附近(前端部32之較長度方向之中央更靠前端之位置)(參照圖4等)。2次熔接部72係自1次熔接部71遠離,於2次熔接部72與1次熔接部71之間,形成有集管突出部22與內側突出部50不接觸之空間(於圖4中以符號75表示)。為了於1次熔接部71及2次熔接部72之位置熔接,而於成為1次熔接部71、2次熔接部72之部分之集管突出部22、或內側突出部50之至少任一者,預先設置有熔接裕量(過盈部)。又,1次熔接部71與2次熔接部72中至少一者係遍及集管突出部22之周向之全周而連續性地形成,另一者係例如斷續性地形成。進而較佳為,1次熔接部71與2次熔接部72之兩方係遍及全周而連續性地形成。又,於本實施形態之中空絲膜模組1中,2次熔接部72配置於在1次熔接部71之熔接開始後或與熔接開始同時地開始熔接之位置(參照圖2)。一般而言,根據於超音波熔接時集管5進入至筒狀容器2(之凹部52)之方向,而有1次熔接、2次熔接均無法確保充分之熔融體積,從而無法獲得充分之接合強度、耐壓強度之情形,尤其,如本實施形態之2次熔接部72般,於使集管5之前端部32進入至凹部52之構造(耦合構造)之熔接部中,耦合構造之進入方向容易偏移,因此對1次熔接部71之熔接帶來影響,會產生無法確保充分之熔融體積之情況。又,若使2次熔接部72(成為2次熔接部72之部分)先接觸,則集管5之前端部32於外側打開之後1次熔接部71(成為1次熔接部71之部分)熔接,故而會產生1次熔接部71、2次熔接部72均熔接體積變小之情況(認為相對於若使2次熔接部72先接觸則前端部32於外側打開,而1次熔接部71未先打開之理由在於,因2次熔接部72遠離超音波焊頭90故而未充分地傳遞振動)。相對於此,如本實施形態般,藉由設為於1次熔接部71之熔接開始後或與熔接開始同時開始2次熔接部72之熔接之構造,而1次熔接部71、2次熔接部72均容易確保熔融體積。於該情形時,於自超音波焊頭90振盪超音波之狀態下,構成2次熔接部72之前端部32側之熔接裕量(過盈部)與內側突出部50側之熔接裕量(過盈部)接觸而被加壓熔接。由於越接近超音波焊頭90則越充分地傳遞振動,故而自接近超音波焊頭90之方(1次熔接部71)依次熔接,藉此可穩定地熔接。又,於本實施形態之中空絲膜模組1中,1次熔接部71之熔融部分之沿著中心軸P方向的熔接長度L1,為2次熔接部72之熔融部分之熔接長度L2以上的長度(參照圖4)。進而,1次熔接部71配置於較其他熔接部(於本實施形態之情形時,為2次熔接部72)接近集管5之與超音波焊頭(熔接焊頭)90之接合面之側(參照圖2)。所謂集管5之與超音波焊頭90之接合面係指集管5之頂板部21,且係指於超音波接合時超音波焊頭90所接觸之面(參照圖2)。又,1次熔接部71與其他熔接部(於本實施形態之情形時,為2次熔接部72)亦可分別配置於至中心軸P之距離不同之位置。進而,1次熔接部71與其他熔接部(於本實施形態之情形時,為2次熔接部72)相比,亦可配置於接近中心軸P之位置。再者,於本實施形態中,採用共用接頭作為將集管5與筒狀容器2熔接之1次熔接部71及2次熔接部72之接頭設計(參照圖4等),但其只不過為較佳之一例。作為共用接頭之優點,可列舉如下方面:相對於超音波焊頭90之縱向振動,而各構件(集管5與筒狀容器2)之接觸面與振動方向接近於相同方向,故而熔接面不易產生氣泡,液密性優異。又,亦有如下優點:由於施加如摩擦邊緣部分與錐形部(參照以圖2之橢圓包圍之部分,1次熔接部71、2次熔接部72之邊緣狀地有稜角之部分與成為錐形狀之部分之情況)之振動,故而發熱效果良好,獲得較高之熔接強度。雖未特別圖示,但此外亦可採用對接接頭作為1次熔接部71與2次熔接部72之接頭設計。於結晶性樹脂之超音波熔接中,若工件尺寸較小則即便使用對接接頭亦可實現液密性較高之熔接。然而,若工件尺寸變大則亦存在超音波焊頭90與熔接面之距離變長,因超音波衰減而熔接性降低之情況。因此,於僅在1次熔接部71與2次熔接部72之任一者採用對接接頭之情形時,較佳為採用於較2次熔接部72更接近超音波焊頭90之1次熔接部71。<灌封部之配置>如圖4所示,於灌封部4之端面,形成有將灌封部之兩端部於徑向切斷而形成之灌封部切斷面4S。灌封部4向較筒狀容器2之內側突出部50更靠中心軸P方向之外側(集管5側)突出。灌封部切斷面4S相對於集管5之內表面之平坦面40以被賦予有特定壓力之狀態抵接。藉此,可抑制流體容易地進入至集管突出部22與筒狀容器2之端部2a之間隙,從而可提高集管5與筒狀容器2之間之密封力。 筒狀容器2及集管5之原材料並不特別限定,可自各種熱塑性樹脂選擇。例如,於結晶性樹脂中可列舉乙烯與α-烯烴之共聚物或低密度聚乙烯、高密度聚乙烯之聚乙烯系樹脂或丙烯單體之聚合物、丙烯與乙烯之共聚物或者丙烯與乙烯與其他之α-烯烴之共聚物之聚丙烯系樹脂。另一方面,於非晶性樹脂中,可列舉聚酯、聚碳酸酯、聚苯乙烯、苯乙烯-丁二烯共聚物(SBS)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)等樹脂,該等既可以單體使用或者亦可作為混合物利用。本實施形態中之較佳之樹脂係上述中之聚丙烯系樹脂,其中丙烯與乙烯之無規共聚物自剛性與耐熱性之觀點而言較佳,且乙烯含量調整為1~8質量%之丙烯與乙烯之無規共聚物更佳。 <中空絲膜模組之製造方法> 首先,準備較最終需要之長度更長之中空絲膜束3,收容於筒狀容器2內。其次,於筒狀容器2內形成灌封部4。該灌封部4係將中空絲膜束3之兩端部3a包埋並且將中空絲膜束3固定於筒狀容器2之內周面50a。其次,將灌封部4(中空絲膜束3之兩端部3a)之多餘部分於相對於中心軸P垂直之斷面切斷而形成灌封部切斷面4S。 其次,將集管5熔接於筒狀容器2。例如,如圖3所示,將集管5之集管突出部22插入至筒狀容器2之內側突出部50與外側突出部51之間,而且將灌封部切斷面4S抵接於集管5之內表面之平坦面40。於該狀態下,將超音波焊頭90自外側接觸於集管5之頂板部21。而且,若超音波焊頭90一面將集管5自中心軸P方向之外側向筒狀容器2側按壓,一面朝向集管5振盪超音波振動,則藉由超音波熔接(藉由將電能轉換為機械性振動能量,並同時施加加壓而於熔接之2個部分之接合面產生強力之熱,使塑膠熔融、接合之技術),而將1次熔接部71、2次熔接部72熔接。此時,於本實施形態之中空絲膜模組1中,2次熔接部72之熔接係於1次熔接部71之熔接開始後開始(參照圖2)。再者,於本實施形態中表示了如此依次熔接之例,但此外,可採用使1次熔接部71與2次熔接部72同時接觸而誘發觸發之熔接方法。或者,可於藉由超音波焊頭90而產生超音波熔接之狀態下使熔接開始。如上所述般完成集管5與筒狀容器2於至少2部位熔接之中空絲膜模組1 (參照圖1)。根據本實施形態,集管5與筒狀容器2係於1次熔接部71、2次熔接部72之2部位之區域熔接,故而接合強度增加,中空絲膜模組1之接合強度、耐壓強度提高。因此,耐壓強度難以不足,不易產生漏液。例如,於使用中空絲膜模組1時,血液等流體自噴嘴部20流入至集管5內,並通過中空絲膜束3之各中空絲膜,自相反之集管5之噴嘴部20排出,此時流體之特定成分通過中空絲膜之側壁而分離至外部。而且,因持續性使用中空絲膜模組1而使得中空絲膜越來越堵塞,中空絲膜模組1之內壓上升。若集管5內之流體之壓力上升某程度以上,則存在流體自灌封部4與集管5之內表面之間進入至外側之可能性。於該情形時,流體之壓力附加至處於集管突出部22與內側突出部50之間的1次熔接部71。藉此,對集管突出部22賦予向筒狀容器2側(圖4之下方向)之剪斷力,將集管5向筒狀容器2側壓抵,其結果,集管5自筒狀容器2脫離之情況得到抑制。而且,即便於集管5內之流體之壓力進而上升,1次熔接部71之一部分破損之情形時,其壓力亦附加至處於集管突出部22與內側突出部50之間的2次熔接部72。藉此,對集管突出部22繼續賦予向筒狀容器2側之剪斷力,其結果,集管5自筒狀容器2脫離之情況得到抑制。以上之結果,集管5不易自筒狀容器2脫離,從而可提高中空絲膜模組1之耐壓強度。此處,若對中空絲膜模組1之耐壓強度進行研究,則作為熔接部之強度而言,1次熔接部71較2次熔接部72強,故而難以考慮按照1次熔接部71、2次熔接部72之順序破壞,實際上,於如上所述內壓上升之情形時,可產生於1次熔接部71破壞之後2次熔接部72亦破壞之現象。再者,即便自根據模擬之結果判明對1次熔接部71作用較2次熔接部72更強之壓力而言,認為亦更佳為使1次熔接部71之強度變強。又,實際上,相較於使1個部位之熔接部之強度提高,而使1次熔接部71、2次熔接部72之2部位之熔接部之兩者熔接則強度更大,作為其理由,可列舉藉由於1次熔接部71、2次熔接部72之兩部位(譬如2部位之支點)支撐而耐壓強度變大。再者,該情形時之強度與1次熔接部71、2次熔接部72之各熔接長度L1、L2相關。為了使熔接長度L1、L2變長必須2階段熔接。附帶而言,使熔接長度L1變長則作為整體之耐壓強度變大,故而較佳。認為熔接長度L1之影響度較大係因為處於易受壓力之影響之位置。再者,上述實施形態為本發明之較佳之實施之一例,但並不限定於此,可於不脫離本發明之主旨之範圍內實施各種變化。例如,於上述實施形態中,表示了集管5與筒狀容器2係於1次熔接部71及2次熔接部72之2部位之區域熔接之例,但當然亦較佳為於較其更多之部位即3部位以上之區域將該等集管5與筒狀容器2熔接。若例示1次熔接部71及2次熔接部72以外之熔接部,雖未進行詳細之說明,但可列舉於前端部32與外側突出部51之間之區域熔接而形成3次熔接部者(省略圖示)。又,上述實施形態中所示之中空絲膜模組1之構造只不過為較佳之一例,例如集管5之集管突出部22之構造、筒狀容器2之內側突出部50與外側突出部51之構造等並不限定於上述者。又,筒狀容器2、集管5之整體構造亦並不限定於上述者。又,中空絲膜模組1之用途並不限定於血液等液體處理,亦可為氣體處理。[產業上之可利用性]本發明係於提高中空絲膜模組之耐壓強度時有用。
1‧‧‧中空絲膜模組
2‧‧‧筒狀容器
2a‧‧‧端部
3‧‧‧中空絲膜束
3a‧‧‧兩端部
4‧‧‧灌封部
4a‧‧‧部分
4b‧‧‧部分
4S‧‧‧灌封部切斷面
5‧‧‧集管
10‧‧‧埠
20‧‧‧噴嘴部
21‧‧‧頂板部
21a‧‧‧內表面
22‧‧‧集管突出部
23‧‧‧空間
30‧‧‧基部
30a‧‧‧第1內周面
31‧‧‧中段部
31a‧‧‧第2內周面
32‧‧‧前端部
32a‧‧‧第3內周面
32b‧‧‧外周面
42‧‧‧平坦面(階部)
50‧‧‧內側突出部
50a‧‧‧內周面
50b‧‧‧外周面
51‧‧‧外側突出部
52‧‧‧凹部
70‧‧‧熔接部
71‧‧‧1次熔接部
72‧‧‧2次熔接部
75‧‧‧空間
90‧‧‧超音波焊頭(熔接焊頭)
L1‧‧‧熔接長度
L2‧‧‧熔接長度
P‧‧‧中心軸
R0‧‧‧內徑
R1‧‧‧內徑
R2‧‧‧內徑
R3‧‧‧外徑
R4‧‧‧內徑
R5‧‧‧外徑
圖1係表示中空絲膜模組之構成之一例之縱剖面的模式圖。圖2係表示利用超音波焊頭之集管與筒狀容器之熔接開始時間點之接合部分及其周邊的放大剖視圖。圖3係表示將集管與筒狀容器超音波熔接時之情況之剖視圖。圖4係表示將集管與筒狀容器熔接之狀態之接合部分及其周邊之放大剖視圖。
無
Claims (8)
- 一種中空絲膜模組,其具備:筒狀容器,其一端部及另一端部開口;中空絲膜之束,其裝填於該筒狀容器;灌封部,其將上述中空絲膜之束於上述筒狀容器之兩端部包埋固定;及集管,其設置於上述筒狀容器之兩端部,且具有成為流體之出入口之噴嘴;且其特徵在於:上述集管與上述筒狀容器係至少於1次熔接部及2次熔接部之2部位之區域熔接,上述2次熔接部配置於在上述1次熔接部之熔接開始後或與熔接開始同時地開始熔接之位置。
- 如請求項1之中空絲膜模組,其中上述1次熔接部之熔融部分之沿著上述筒狀容器之中心軸的長度即熔融長度,較上述2次熔接部之熔融部分之熔接長度更長或成為相同之長度。
- 如請求項1或2之中空絲膜模組,其中於上述筒狀容器形成有上述集管之一部分嵌合之凹部。
- 如請求項3之中空絲膜模組,其中上述凹部由如下形狀之凸緣部形成,該凸緣部自上述筒狀容器之外側面向外側突出,且向上述集管彎曲。
- 如請求項1至4中任一項之中空絲膜模組,其中上述1次熔接部配置於較上述2次熔接部等其他熔接部更接近上述集管之與熔接焊頭之接合面之側。
- 如請求項1至5中任一項之中空絲膜模組,其中於上述1次熔接部與上述2次熔接部之一者或兩者,使用共用接頭作為熔接上述集管與上述筒狀容器之接頭設計。
- 一種中空絲膜模組之製造方法,該中空絲膜模組具備:筒狀容器,其一端部及另一端部開口;中空絲膜之束,其裝填於該筒狀容器;灌封部,其將上述中空絲膜之束於上述筒狀容器之兩端部包埋固定;及集管,其設置於上述筒狀容器之兩端部,且具有成為流體之出入口之噴嘴;且該中空絲膜模組之製造方法之特徵在於:將上述集管與上述筒狀容器至少於1次熔接部及2次熔接部之2部位之區域熔接,並且使上述2次熔接部之熔接於上述1次熔接部之熔接開始後或與熔接開始同時地開始。
- 如請求項7之中空絲膜模組之製造方法,其中使上述1次熔接部之沿著上述筒狀容器之中心軸的熔接長度,較上述2次熔接部之熔接長度更長或與其相同。
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JP7436144B2 (ja) * | 2018-12-25 | 2024-02-21 | 旭化成メディカル株式会社 | 被除去成分の吸着・除去機能と透析機能を併せ持つ一体化された血液浄化器 |
JP7221780B2 (ja) * | 2019-04-26 | 2023-02-14 | 旭化成メディカル株式会社 | 中空糸膜モジュールとその製造方法 |
CN110237331A (zh) * | 2019-06-13 | 2019-09-17 | 武汉华诚创福医疗科技有限公司 | 一种pp透析器外壳和端盖的连接方法 |
DE102021108842A1 (de) * | 2021-04-09 | 2022-10-13 | Fresenius Medical Care Deutschland Gmbh | Dialysator |
CN113546231B (zh) * | 2021-06-11 | 2023-08-15 | 中聚科技股份有限公司 | 一种高耐久的超声结构焊接及血液净化器 |
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JPH0252668A (ja) * | 1988-08-16 | 1990-02-22 | Terumo Corp | 医療用液体処理器及びその製造方法 |
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JPWO2017170971A1 (ja) | 2018-10-18 |
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