TW201714240A - Device and method for bonding of substrates - Google Patents

Device and method for bonding of substrates

Info

Publication number
TW201714240A
TW201714240A TW106101547A TW106101547A TW201714240A TW 201714240 A TW201714240 A TW 201714240A TW 106101547 A TW106101547 A TW 106101547A TW 106101547 A TW106101547 A TW 106101547A TW 201714240 A TW201714240 A TW 201714240A
Authority
TW
Taiwan
Prior art keywords
substrate
bonding
mounting
outer ring
deformation
Prior art date
Application number
TW106101547A
Other languages
English (en)
Other versions
TWI708307B (zh
Inventor
Thomas Wagenleitner
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of TW201714240A publication Critical patent/TW201714240A/zh
Application granted granted Critical
Publication of TWI708307B publication Critical patent/TWI708307B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Combinations Of Printed Boards (AREA)
TW106101547A 2011-08-12 2012-07-09 接合基板之設備及方法 TWI708307B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
WOPCT/EP2011/063968 2011-08-12
EP2011063968 2011-08-12
PCT/EP2011/064353 WO2013023708A1 (de) 2011-08-12 2011-08-22 Vorrichtung und verfahren zum bonden von substraten
WOPCT/EP2011/064353 2011-08-22

Publications (2)

Publication Number Publication Date
TW201714240A true TW201714240A (en) 2017-04-16
TWI708307B TWI708307B (zh) 2020-10-21

Family

ID=44719857

Family Applications (6)

Application Number Title Priority Date Filing Date
TW101124662A TWI602252B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW110133657A TWI809495B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW106101547A TWI708307B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW111130297A TWI820860B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW108116259A TWI732215B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW109125168A TWI777200B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW101124662A TWI602252B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW110133657A TWI809495B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW111130297A TWI820860B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW108116259A TWI732215B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法
TW109125168A TWI777200B (zh) 2011-08-12 2012-07-09 接合基板之設備及方法

Country Status (7)

Country Link
US (1) US9613840B2 (zh)
JP (6) JP5977826B2 (zh)
KR (5) KR102151902B1 (zh)
CN (1) CN106941084B (zh)
SG (1) SG2014009369A (zh)
TW (6) TWI602252B (zh)
WO (1) WO2013023708A1 (zh)

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* Cited by examiner, † Cited by third party
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TWI814872B (zh) * 2018-07-26 2023-09-11 日商日本碍子股份有限公司 暫時固定基板、暫時固定方法及電子構件的製造方法

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KR102249004B1 (ko) * 2014-04-22 2021-05-07 에베 그룹 에. 탈너 게엠베하 나노구조를 엠보싱하기 위한 방법 및 장치
SG11201603148VA (en) * 2014-12-18 2016-07-28 Ev Group E Thallner Gmbh Method for bonding substrates
KR102311942B1 (ko) * 2014-12-23 2021-10-13 에베 그룹 에. 탈너 게엠베하 기판들을 예비고정하기 위한 방법 및 장치
KR20170137050A (ko) 2015-04-10 2017-12-12 에베 그룹 에. 탈너 게엠베하 2개의 기판을 결합하기 위한 기판 홀더 및 방법.
CN108028180B (zh) 2016-02-16 2022-01-28 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法
SG11201806511XA (en) 2016-03-22 2018-08-30 Ev Group E Thallner Gmbh Device and method for bonding substrates
CN110383446A (zh) 2017-03-16 2019-10-25 Ev 集团 E·索尔纳有限责任公司 用于接合至少三个衬底的方法
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JP6818076B2 (ja) * 2019-04-17 2021-01-20 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板を接合する装置および方法
JP6801061B2 (ja) * 2019-08-05 2020-12-16 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板を仮固定するための方法と装置
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JP2023533653A (ja) 2020-06-29 2023-08-04 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板同士を接合するための方法および装置
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CN112038220B (zh) * 2020-08-31 2023-02-03 上海华力集成电路制造有限公司 晶圆键合工艺中改善晶圆边缘形变的方法
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WO2023078567A1 (de) 2021-11-08 2023-05-11 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum bonden von substraten

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814872B (zh) * 2018-07-26 2023-09-11 日商日本碍子股份有限公司 暫時固定基板、暫時固定方法及電子構件的製造方法

Also Published As

Publication number Publication date
JP2016213491A (ja) 2016-12-15
JP2014529885A (ja) 2014-11-13
TW201937635A (zh) 2019-09-16
TW201308495A (zh) 2013-02-16
KR20140050644A (ko) 2014-04-29
JP2019186560A (ja) 2019-10-24
JP6848012B2 (ja) 2021-03-24
KR20200104431A (ko) 2020-09-03
JP5977826B2 (ja) 2016-08-24
TWI732215B (zh) 2021-07-01
WO2013023708A1 (de) 2013-02-21
US9613840B2 (en) 2017-04-04
JP2018041971A (ja) 2018-03-15
CN106941084A (zh) 2017-07-11
CN103718282A (zh) 2014-04-09
JP7146002B2 (ja) 2022-10-03
CN106941084B (zh) 2020-05-19
JP6543316B2 (ja) 2019-07-10
TW202218015A (zh) 2022-05-01
TWI820860B (zh) 2023-11-01
KR20190094255A (ko) 2019-08-12
TWI809495B (zh) 2023-07-21
SG2014009369A (en) 2014-09-26
KR102151902B1 (ko) 2020-09-03
JP6231625B2 (ja) 2017-11-15
KR20230106735A (ko) 2023-07-13
KR20220008392A (ko) 2022-01-20
TWI708307B (zh) 2020-10-21
KR102350216B1 (ko) 2022-01-11
TWI777200B (zh) 2022-09-11
US20140209230A1 (en) 2014-07-31
JP2021093547A (ja) 2021-06-17
KR102009053B1 (ko) 2019-10-21
TW202247328A (zh) 2022-12-01
TWI602252B (zh) 2017-10-11
JP2022174267A (ja) 2022-11-22
TW202042332A (zh) 2020-11-16
JP7345613B2 (ja) 2023-09-15

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