TW201704282A - 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板 - Google Patents
樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板 Download PDFInfo
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- TW201704282A TW201704282A TW105112202A TW105112202A TW201704282A TW 201704282 A TW201704282 A TW 201704282A TW 105112202 A TW105112202 A TW 105112202A TW 105112202 A TW105112202 A TW 105112202A TW 201704282 A TW201704282 A TW 201704282A
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- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
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- 239000003504 photosensitizing agent Substances 0.000 description 1
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- 238000006116 polymerization reaction Methods 0.000 description 1
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- 239000011148 porous material Substances 0.000 description 1
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- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
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- 239000002351 wastewater Substances 0.000 description 1
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- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
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Abstract
一種樹脂組成物,含有:氰酸酯化合物(A)、及具有下式(1)表示之結構單元及下式(2)表示之結構單元之環氧樹脂(B)。 【化1】□
Description
本發明關於樹脂組成物、使用該樹脂組成物之預浸體、使用該預浸體之覆金屬箔疊層板、樹脂片、及印刷電路板。
近年,廣泛使用於電子設備或通訊設備、個人電腦等之半導體的高整合化、微細化越發加速。與此相伴,針對用於印刷電路板之半導體封裝用疊層板所要求的各種特性變得越發嚴格。就所要求的特性而言,例如,可列舉低吸水性、吸濕耐熱性、阻燃性、低介電常數、低介電正切、低熱膨脹率、耐熱性、耐化學性、高鍍敷剝離強度等特性。但,到目前為止,該等要求特性未必都令人滿意。
自以往,就耐熱性、電特性優異之印刷電路板用樹脂而言,氰酸酯化合物係為人們所知,於氰酸酯化合物倂用環氧樹脂等而成的樹脂組成物近年廣泛使用在半導體塑膠封裝用等高機能的印刷電路板用材料等。又,由於多層印刷電路板的小型化、高密度化,將多層印刷電路板所使用之疊層板薄膜化的研究正積極進行中,但由於會發生多層印刷電路板之翹曲擴大的問題,故對於成為絕緣層之材料的樹脂組成物要求具有高玻璃轉移溫度。 [先前技術文獻] [專利文獻]
[專利文獻1]國際公開第2013/065694號小冊 [專利文獻2]國際公開第2014/203866號小冊
[發明所欲解決之課題] 有人提出了密合性、低吸水性、吸濕耐熱性、絕緣可靠性等特性優異的由氰酸酯化合物與環氧樹脂構成之樹脂組成物(例如參照專利文獻1、2),但關於玻璃轉移溫度的特性改善仍不充分,故要求進一步改善玻璃轉移溫度。
本發明係鑒於上述問題而進行,旨在提供具有高玻璃轉移溫度之樹脂組成物、使用該樹脂組成物之預浸體、使用該預浸體之覆金屬箔疊層板、樹脂片、及印刷電路板等。 [解決課題之手段]
本案發明人們針對上述課題進行深入研究的結果,發現藉由倂用氰酸酯化合物(A)與指定之環氧樹脂(B),可解決上述課題,並達成了本發明。
亦即,本發明如下。 [1]一種樹脂組成物,含有: 氰酸酯化合物(A);及 具有下式(1)表示之結構單元及下式(2)表示之結構單元之環氧樹脂(B)。 【化1】[2]如[1]之樹脂組成物,其中,該環氧樹脂(B)之含量相對於該樹脂組成物中之樹脂固體成分100質量份為1~90質量份。 [3]如[1]或[2]之樹脂組成物,更含有填充材(C)。 [4]如[1]~[3]中任一項之樹脂組成物,更含有選自於由該環氧樹脂(B)以外之環氧樹脂、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并
化合物、及具有可聚合之不飽和基之化合物構成之群組中之任1種以上。 [5]如[3]或[4]之樹脂組成物,其中,該填充材(C)之含量相對於該樹脂組成物中之樹脂固體成分100質量份為50~1600質量份。 [6]一種預浸體,具有: 基材;及 含浸或塗佈於該基材之如[1]~[5]中任一項之樹脂組成物。 [7]一種覆金屬箔疊層板,具有: 至少重疊了1片以上之如[6]之預浸體;與 配置在該預浸體之單面或兩面之金屬箔。 [8]一種樹脂片,具有: 支持體;與 塗佈在該支持體表面並進行了乾燥的如[1]~[5]中任一項之樹脂組成物。 [9]一種印刷電路板,包含: 絕緣層;與 形成在該絕緣層表面之導體層; 該絕緣層含有如[1]~[5]中任一項之樹脂組成物。 [發明之效果]
根據本發明,可提供具有高玻璃轉移溫度之樹脂組成物、使用該樹脂組成物之預浸體、使用該預浸體之覆金屬箔疊層板、樹脂片、及印刷電路板等,其工業實用性為極高。
以下,針對實施本發明之形態(以下稱為「本實施形態」)進行詳細說明,但本發明並不限定於此,在不超出其要旨的範圍內可進行各種的變形。
[樹脂組成物] 本實施形態之樹脂組成物含有氰酸酯化合物(A)、及具有下式(1)表示之結構單元及下式(2)表示之結構單元之環氧樹脂(B)。 【化2】
[氰酸酯化合物(A)] 本實施形態中所使用之氰酸酯化合物(A),只要是於分子內具有經至少1個氰氧基(氰酸酯基)取代之芳香族部分的樹脂即可,並無特別限定。該等氰酸酯化合物(A),例如,可列舉下列通式(3)表示者。此外,氰酸酯化合物(A)可1種單獨使用,亦可將2種以上組合使用。 【化3】(式中,Ar1
各自獨立地表示亦可具有取代基之伸苯基、亦可具有取代基之伸萘基或亦可具有取代基之伸聯苯基。Ra各自獨立地選自於氫原子、亦可具有取代基之碳數1~6之烷基、亦可具有取代基之碳數6~12之芳基、亦可具有取代基之碳數1~4之烷氧基、碳數1~6之烷基與碳數6~12之芳基鍵結而得的亦可具有取代基之芳烷基、或碳數1~6之烷基與碳數6~12之芳基鍵結而得的亦可具有取代基之烷芳基中之任一種。p表示鍵結於Ar1
之氰氧基的數目,為1~3之整數。q表示鍵結於Ar1
之Ra的數目,Ar1
為伸苯基時為4-p,伸萘基時為6-p,伸聯苯基時為8-p。t表示平均重複數,為0~50之整數,可為t不同之化合物的混合物。X各自獨立地選自於單鍵、碳數1~50之2價有機基(氫原子也可取代為雜原子)、氮數1~10之2價有機基(-N-R-N-等)、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(carbonyl dioxide)(-OC(=O)O-)、磺醯基(-SO2
-)、或2價硫原子或2價氧原子中之任一種。)
通式(3)之Ra之烷基可具有鏈狀結構、環狀結構(環烷基等)中之任一者。
又,通式(3)之Ra之烷基及芳基中的氫原子亦可取代為氟、氯等鹵素原子;甲氧基、苯氧基等烷氧基;氰基等。
通式(3)之Ra之烷基的具體例,可列舉甲基、乙基、丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、1-乙基丙基、2,2-二甲基丙基、環戊基、己基、環己基、三氟甲基等。
通式(3)之Ra之芳基的具體例,可列舉苯基、二甲苯基、三甲苯基、萘基、苯氧基苯基、乙基苯基、鄰、間或對氟苯基、二氯苯基、二氰基苯基、三氟苯基、甲氧基苯基、鄰、間或對甲苯基等。進一步就烷氧基而言,可列舉甲氧基、乙氧基、丙氧基、異丙氧基、正丁氧基、異丁氧基、三級丁氧基等。
通式(3)之X之2價有機基的具體例,可列舉亞甲基、伸乙基、三亞甲基、伸環戊基、伸環己基、三甲基伸環己基、聯苯基亞甲基、二甲基亞甲基-伸苯基-二甲基亞甲基、茀二基、鄰苯二甲內酯二基(phthalidiyl)等。X表示之2價有機基中的氫原子亦可取代為氟、氯等鹵素原子;甲氧基、苯氧基等烷氧基;氰基等。
通式(3)之X之氮數1~10之2價有機基,可列舉亞胺基、聚醯亞胺基等。
又,就通式(3)中之X而言,可列舉具有下列通式(4)或下列通式(5)表示之結構的基。 【化4】(式中,Ar2
各自獨立地表示選自於伸苯基、伸萘基及伸聯苯基中之任一種。Rb、Rc、Rf、Rg各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、三氟甲基及經至少1個苯酚性羥基取代之芳基中之任一種。Rd、Re各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基及羥基中之任一種。u表示0~5之整數,可為u不同之化合物的混合物。) 【化5】(式中,Ar3
各自獨立地選自於伸苯基、伸萘基或伸聯苯基中之任一種。Ri、Rj各自獨立地選自於氫原子、碳數1~6之烷基、碳數6~12之芳基、苄基、碳數1~4之烷氧基、羥基、三氟甲基及經至少1個氰氧基取代之芳基中之任一種。v表示0~5之整數,可為v不同之化合物的混合物。)
進一步,就通式(3)中之X而言,可列舉下式表示之2價基。 【化6】(式中,z表示4~7之整數。Rk各自獨立地表示氫原子或碳數1~6之烷基。)
通式(4)之Ar2
及通式(5)之Ar3
的具體例,可列舉1,4-伸苯基、1,3-伸苯基、4,4’-伸聯苯基、2,4’-伸聯苯基、2,2’-伸聯苯基、2,3’-伸聯苯基、3,3’-伸聯苯基、3,4’-伸聯苯基、2,6-伸萘基、1,5-伸萘基、1,6-伸萘基、1,8-伸萘基、1,3-伸萘基、1,4-伸萘基等。
通式(4)之Rb~Rf及通式(5)之Ri、Rj之烷基及芳基與通式(3)所記載的內容相同。
就通式(3)表示之氰氧基取代之芳香族化合物的具體例而言,可列舉氰氧基苯;1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲基苯;1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲氧基苯;1-氰氧基-2,3-、1-氰氧基-2,4-、1-氰氧基-2,5-、1-氰氧基-2,6-、1-氰氧基-3,4-或1-氰氧基-3,5-二甲基苯;氰氧基乙基苯、氰氧基丁基苯、氰氧基辛基苯、氰氧基壬基苯、2-(4-氰氧基苯基)-2-苯基丙烷(4-α-異丙苯基苯酚之氰酸酯))、1-氰氧基-4-環己基苯、1-氰氧基-4-乙烯基苯、1-氰氧基-2-或1-氰氧基-3-氯苯、1-氰氧基-2,6-二氯苯、1-氰氧基-2-甲基-3-氯苯、氰氧基硝基苯、1-氰氧基-4-硝基-2-乙基苯、1-氰氧基-2-甲氧基-4-烯丙基苯(丁香酚之氰酸酯))、甲基(4-氰氧基苯基)硫醚、1-氰氧基-3-三氟甲基苯、4-氰氧基聯苯、1-氰氧基-2-或1-氰氧基-4-乙醯基苯、4-氰氧基苯甲醛、4-氰氧基苯甲酸甲酯、4-氰氧基苯甲酸苯酯、1-氰氧基-4-乙醯基胺基苯、4-氰氧基二苯基酮、1-氰氧基-2,6-二-三級丁基苯、1,2-二氰氧基苯、1,3-二氰氧基苯、1,4-二氰氧基苯、1,4-二氰氧基-2-三級丁基苯、1,4-二氰氧基-2,4-二甲基苯、1,4-二氰氧基-2,3,4-三甲基苯、1,3-二氰氧基-2,4,6-三甲基苯、1,3-二氰氧基-5-甲基苯、1-氰氧基或2-氰氧基萘、1-氰氧基4-甲氧基萘、2-氰氧基-6-甲基萘、2-氰氧基-7-甲氧基萘、2,2’-二氰氧基-1,1’-聯萘;1,3-、1,4-、1,5-、1,6-、1,7-、2,3-、2,6-或2,7-二氰氧基萘;2,2’-或4,4’-二氰氧基聯苯、4,4’-二氰氧基八氟聯苯、2,4’-或4,4’-二氰氧基二苯基甲烷、雙(4-氰氧基-3,5-二甲基苯基)甲烷、1,1-雙(4-氰氧基苯基)乙烷、1,1-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基-3-甲基苯基)丙烷、2,2-雙(2-氰氧基-5-聯苯基)丙烷、2,2-雙(4-氰氧基苯基)六氟丙烷、2,2-雙(4-氰氧基-3,5-二甲基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)-2,2-二甲基丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)戊烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-3-甲基丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)庚烷、3,3-雙(4-氰氧基苯基)辛烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、3,3-雙(4-氰氧基苯基)-2-甲基己烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基戊烷、4,4-雙(4-氰氧基苯基)-3-甲基庚烷、3,3-雙(4-氰氧基苯基)-2-甲基庚烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,4-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,2,4-三甲基戊烷、2,2-雙(4-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)苯基甲烷、1,1-雙(4-氰氧基苯基)-1-苯基乙烷、雙(4-氰氧基苯基)聯苯甲烷、1,1-雙(4-氰氧基苯基)環戊烷、1,1-雙(4-氰氧基苯基)環己烷、2,2-雙(4-氰氧基-3-異丙基苯基)丙烷、1,1-雙(3-環己基-4-氰氧基苯基)環己烷、雙(4-氰氧基苯基)二苯基甲烷、雙(4-氰氧基苯基)-2,2-二氯乙烯、1,3-雙[2-(4-氰氧基苯基)-2-丙基]苯、1,4-雙[2-(4-氰氧基苯基)-2-丙基]苯、1,1-雙(4-氰氧基苯基)-3,3,5-三甲基環己烷、4-[雙(4-氰氧基苯基)甲基]聯苯、4,4-二氰氧基二苯基酮、1,3-雙(4-氰氧基苯基)-2-丙烯-1-酮、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)碸、4-氰氧基苯甲酸-4-氰氧基苯酯(4-氰氧基苯基-4-氰氧基苯甲酸酯)、雙-(4-氰氧基苯基)碳酸酯、1,3-雙(4-氰氧基苯基)金剛烷、1,3-雙(4-氰氧基苯基)-5,7-二甲基金剛烷、3,3-雙(4-氰氧基苯基)異苯并呋喃-1(3H)-酮(酚酞之氰酸酯))、3,3-雙(4-氰氧基-3-甲基苯基)異苯并呋喃-1(3H)-酮(鄰甲酚酞之氰酸酯))、9,9’-雙(4-氰氧基苯基)茀、9,9-雙(4-氰氧基-3-甲基苯基)茀、9,9-雙(2-氰氧基-5-聯苯基)茀、參(4-氰氧基苯基)甲烷、1,1,1-參(4-氰氧基苯基)乙烷、1,1,3-參(4-氰氧基苯基)丙烷、α,α,α’-參(4-氰氧基苯基)-1-乙基-4-異丙基苯、1,1,2,2-肆(4-氰氧基苯基)乙烷、肆(4-氰氧基苯基)甲烷、2,4,6-參(N-甲基-4-氰氧基苯胺基)-1,3,5-三、2,4-雙(N-甲基-4-氰氧基苯胺基)-6-(N-甲基苯胺基)-1,3,5-三、雙(N-4-氰氧基-2-甲基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-3-氰氧基-4-甲基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-4-氰氧基苯基)-4,4’-氧基二鄰苯二甲醯亞胺、雙(N-4-氰氧基-2-甲基苯基)-4,4’-(六氟異亞丙基)二鄰苯二甲醯亞胺、參(3,5-二甲基-4-氰氧基苄基)異氰尿酸酯、2-苯基-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-(4-甲基苯基)-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-苯基-3,3-雙(4-氰氧基-3-甲基苯基)苄甲內醯胺、1-甲基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、2-苯基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、苯酚酚醛清漆型氰酸酯化合物、甲酚酚醛清漆型氰酸酯化合物、參苯酚酚醛清漆型氰酸酯化合物、茀酚醛清漆型氰酸酯化合物、苯酚芳烷基型氰酸酯化合物、甲酚芳烷基型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、苯酚改性二甲苯甲醛型氰酸酯化合物、改性萘甲醛型氰酸酯化合物、苯酚改性二環戊二烯型氰酸酯化合物、具有聚伸萘基醚結構之苯酚樹脂之氰酸酯化合物等,並無特別限制。該等氰酸酯化合物可使用1種或將2種以上混合使用。
此外,就苯酚酚醛清漆型氰酸酯化合物、甲酚酚醛清漆型氰酸酯化合物而言,可列舉藉由公知的方法將苯酚酚醛清漆樹脂、甲酚酚醛清漆樹脂予以氰酸酯化而得者。作為苯酚酚醛清漆樹脂、甲酚酚醛清漆樹脂,可列舉藉由公知的方法使苯酚、烷基取代之苯酚或鹵素取代之苯酚,與福馬林或多聚甲醛等甲醛化合物於酸性溶液中反應而得者。
就參苯酚酚醛清漆型氰酸酯化合物而言,可列舉藉由公知的方法將參苯酚酚醛清漆樹脂予以氰酸酯化而得者。作為參苯酚酚醛清漆樹脂,可列舉使羥基苯甲醛與苯酚於酸性觸媒的存在下反應而得者。
就茀酚醛清漆型氰酸酯化合物而言,可列舉藉由公知的方法將茀酚醛清漆樹脂予以氰酸酯化而得者。作為茀酚醛清漆樹脂,可列舉使茀酮化合物與9,9-雙(羥基芳基)茀類於酸性觸媒的存在下反應而得者。
就苯酚芳烷基型氰酸酯化合物、甲酚芳烷基型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物而言,可列舉藉由公知的方法將苯酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂或聯苯芳烷基樹脂予以氰酸酯化而得者。作為苯酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂或聯苯芳烷基樹脂,可列舉藉由公知的方法使如Ar2
-(CH2
Y)2
表示之雙鹵代甲基化合物與苯酚化合物於酸性觸媒或無觸媒下反應而得者;使如Ar2
-(CH2
OR)2
表示之雙(烷氧基甲基)化合物、如Ar2
-(CH2
OH)2
表示之雙(羥基甲基)化合物與苯酚化合物於酸性觸媒的存在下反應而得者;或將芳香族醛化合物、芳烷基化合物、苯酚化合物縮聚合而得者。
就苯酚改性二甲苯甲醛型氰酸酯化合物而言,可列舉藉由公知的方法將苯酚改性二甲苯甲醛樹脂予以氰酸酯化而得者。作為苯酚改性二甲苯甲醛樹脂,可列舉藉由公知的方法使二甲苯甲醛樹脂與苯酚化合物於酸性觸媒的存在下反應而得者。
就改性萘甲醛型氰酸酯化合物而言,可列舉藉由公知的方法將改性萘甲醛樹脂予以氰酸酯化而得者。作為改性萘甲醛樹脂,可列舉藉由公知的方法使萘甲醛樹脂與羥基取代之芳香族化合物於酸性觸媒的存在下反應而得者。
就苯酚改性二環戊二烯型氰酸酯化合物、具有聚伸萘基醚結構之苯酚樹脂之氰酸酯化合物而言,可列舉藉由公知的方法將苯酚改性二環戊二烯樹脂、具有聚伸萘基醚結構之苯酚樹脂予以氰酸酯化而得者。作為苯酚改性二環戊二烯樹脂、具有聚伸萘基醚結構之苯酚樹脂,可列舉藉由公知的方法使於1分子中具有2個以上之苯酚性羥基的多價羥基萘化合物,於鹼性觸媒的存在下脫水縮合而得者。
其中,苯酚酚醛清漆型氰酸酯化合物、萘酚芳烷基型氰酸酯化合物、聯苯芳烷基型氰酸酯化合物、伸萘基醚型氰酸酯化合物、二甲苯樹脂型氰酸酯化合物、金剛烷骨架型氰酸酯化合物為較佳,萘酚芳烷基型氰酸酯化合物特佳。使用該等氰酸酯化合物的樹脂硬化物有具高玻璃轉移溫度、低熱膨脹性、優異鍍敷密合性等特性的傾向。
氰酸酯化合物(A)之含量可因應所期望之特性進行適宜設定,並無特別限定,相對於樹脂組成物中之樹脂固體成分100質量份宜為1~90質量份較佳,20~75質量份更佳,40~60質量份尤佳。藉由氰酸酯化合物(A)之含量為上述範圍內,有玻璃轉移溫度進一步提高的傾向。此外,本實施形態中,「樹脂組成物中之樹脂固體成分」,若無特別指明,係指樹脂組成物中之不包括溶劑、及填充材(C)的成分,「樹脂固體成分100質量份」係指樹脂組成物中之不包括溶劑、及填充材(C)的成分的合計為100質量份。
[環氧樹脂(B)] 本實施形態中所使用之環氧樹脂(B),具有下式(1)表示之結構單元及下式(2)表示之結構單元。藉由使用同時具有下式(1)表示之結構單元及下式(2)表示之結構單元的環氧樹脂(B),玻璃轉移溫度進一步提高。此外,環氧樹脂(B)可1種單獨使用,亦可將2種以上組合使用。 【化7】
式(2)表示之結構單元相對於式(1)表示之結構單元10莫耳的莫耳比宜為0.1~5較佳,0.5~4更佳,1~3尤佳。藉由式(2)表示之結構單元相對於式(1)表示之結構單元10莫耳的莫耳比為上述範圍內,有玻璃轉移溫度進一步提高的傾向。
上述環氧樹脂(B)可使用市售品,例如可適當使用日本化藥(股)公司製NC-3500。
環氧樹脂(B)之含量可因應所期望之特性進行適宜設定,並無特別限定,相對於樹脂組成物中之樹脂固體成分100質量份宜為1~90質量份較佳,20~75質量份更佳,40~60質量份尤佳。藉由環氧樹脂(B)之含量為上述範圍內,有可獲得玻璃轉移溫度優異之樹脂組成物的傾向。
[填充材(C)] 本實施形態之樹脂組成物可進一步含有填充材(C)。就填充材(C)而言,可適當使用公知的物質,其種類並無特別限定,可適當使用該領域中通常使用之無機填充材或有機填充材。
無機填充材並無特別限定,例如,可列舉天然二氧化矽、熔融二氧化矽、合成二氧化矽、非晶態二氧化矽、AEROSIL、白碳、中空二氧化矽等二氧化矽類;鈦白、氧化鋁、氧化鋅、氧化鎂、水鋁石、氧化鋯等氧化物;氮化硼、凝聚氮化硼、氮化矽、氮化鋁等氮化物;硫酸鋇等硫酸鹽;氫氧化鋁、經加熱處理之氫氧化鋁(將氫氧化鋁進行加熱處理,以減少部分結晶水而得者)、氫氧化鎂等氫氧化物;氧化鉬、鉬酸鋅等鉬化合物;硼酸鋅等硼酸鹽;錫酸鋅等錫酸鹽;黏土、高嶺土、滑石、煅燒黏土、煅燒高嶺土、煅燒滑石、雲母、E-玻璃、A-玻璃、NE-玻璃、C-玻璃、L-玻璃、D-玻璃、S-玻璃、M-玻璃G20、玻璃短纖維(含有E玻璃、T玻璃、D玻璃、S玻璃、Q玻璃等玻璃微粉末類。)、中空玻璃、球狀玻璃等矽酸鹽。
又,有機填充材並無特別限定,例如,可列舉苯乙烯型、丁二烯型、丙烯酸型等的橡膠粉末;核-殼型橡膠粉末、矽酮樹脂粉末、矽酮橡膠粉末、矽酮複合粉末等。該等填充材可1種單獨使用,亦可將2種以上組合使用。
藉由使用該等填充材(C),有樹脂組成物之熱膨脹特性、尺寸穩定性、阻燃性等特性改善的傾向。
填充材(C)之含量可因應所期望之特性進行適宜設定,並無特別限定,相對於樹脂組成物中之樹脂固體成分100質量份宜為50~1600質量份較佳,50~1000質量份更佳,50~500質量份尤佳,50~250質量份特佳。藉由填充材(C)之含量為上述範圍內,有樹脂組成物之成形性進一步提高的傾向。
此處當使用填充材(C)時,宜倂用矽烷偶聯劑、濕潤分散劑較佳。就矽烷偶聯劑而言,可適當使用一般用於無機物之表面處理者,其種類並無特別限定。具體而言,可列舉γ-胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷等胺基矽烷系化合物;γ-環氧丙氧丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等環氧矽烷系化合物;γ-甲基丙烯醯氧丙基三甲氧基矽烷、乙烯基-三(β-甲氧基乙氧基)矽烷等乙烯基矽烷系化合物;N-β-(N-乙烯基苄基胺基乙基)-γ-胺基丙基三甲氧基矽烷鹽酸鹽等陽離子矽烷系化合物;苯基矽烷系化合物等。矽烷偶聯劑可1種單獨使用,亦可將2種以上組合使用。
又,濕潤分散劑可適當使用一般用於塗料用者,其種類並無特別限定。宜使用共聚物系之濕潤分散劑較佳,其具體例可列舉BYK Japan(股)公司製的Disperbyk-110、111、161、180、BYK-W996、BYK-W9010、BYK-W903、BYK-W940等。濕潤分散劑可1種單獨使用,亦可將2種以上組合使用。
[其他成分] 進一步,本實施形態之樹脂組成物必要時亦可含有其他成分。其他成分並無特別限定,例如,可列舉選自於由上述環氧樹脂(B)以外之環氧樹脂(以下稱為「其他環氧樹脂」。)、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并
化合物、及具有可聚合之不飽和基之化合物構成之群組中之任1種以上。藉由使用該等其他成分,可改善將樹脂組成物硬化後得到之硬化物的阻燃性、低介電性等所期望之特性。
就其他環氧樹脂而言,只要是不具有式(1)及式(2)表示之結構單元,並於1分子中具有2個以上之環氧基的環氧樹脂即可,可適當使用公知的物質,其種類並無特別限定。具體而言,可列舉雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、縮水甘油酯型環氧樹脂、芳烷基酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂、蔥型環氧樹脂、萘骨架改性酚醛清漆型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯型環氧樹脂、聯苯型環氧樹脂、脂環式環氧樹脂、多元醇型環氧樹脂、含磷之環氧樹脂;將縮水甘油胺、縮水甘油酯、丁二烯等之雙鍵環氧化而得之化合物;藉由含羥基之矽酮樹脂類與表氯醇反應而得之化合物等。該等環氧樹脂中,聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂為較佳。藉由使用該等其他環氧樹脂,有阻燃性及耐熱性進一步提高的傾向。該等環氧樹脂可1種單獨使用,亦可將2種以上組合使用。
就馬來醯亞胺化合物而言,只要是於1分子中具有1個以上之馬來醯亞胺基的化合物即可,可使用一般公知的物質,其種類並無特別限定。具體而言,可列舉4,4-二苯基甲烷雙馬來醯亞胺、苯基甲烷馬來醯亞胺、間伸苯基雙馬來醯亞胺、2,2-雙(4-(4-馬來醯亞胺苯氧基)-苯基)丙烷、3,3-二甲基-5,5-二乙基-4,4-二苯基甲烷雙馬來醯亞胺、4-甲基-1,3-伸苯基雙馬來醯亞胺、1,6-雙馬來醯亞胺-(2,2,4-三甲基)己烷、4,4-二苯醚雙馬來醯亞胺、4,4-二苯碸雙馬來醯亞胺、1,3-雙(3-馬來醯亞胺苯氧基)苯、1,3-雙(4-馬來醯亞胺苯氧基)苯、聚苯基甲烷馬來醯亞胺、酚醛清漆型馬來醯亞胺、聯苯芳烷基型馬來醯亞胺、及該等馬來醯亞胺化合物的預聚物、或馬來醯亞胺化合物與胺化合物的預聚物等,並無特別限制。該等馬來醯亞胺化合物可使用1種,亦可將2種以上混合使用。其中,酚醛清漆型馬來醯亞胺化合物、聯苯芳烷基型馬來醯亞胺化合物為特佳。
就苯酚樹脂而言,只要是於1分子中具有2個以上之羥基的苯酚樹脂即可,可使用一般公知的物質,其種類並無特別限定。具體而言,可列舉雙酚A型苯酚樹脂、雙酚E型苯酚樹脂、雙酚F型苯酚樹脂、雙酚S型苯酚樹脂、苯酚酚醛清漆樹脂、雙酚A酚醛清漆型苯酚樹脂、縮水甘油酯型苯酚樹脂、芳烷基酚醛清漆型苯酚樹脂、聯苯芳烷基型苯酚樹脂、甲酚酚醛清漆型苯酚樹脂、多官能苯酚樹脂、萘酚樹脂、萘酚酚醛清漆樹脂、多官能萘酚樹脂、蔥型苯酚樹脂、萘骨架改性酚醛清漆型苯酚樹脂、苯酚芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、二環戊二烯型苯酚樹脂、聯苯型苯酚樹脂、脂環式苯酚樹脂、多元醇型苯酚樹脂、含磷之苯酚樹脂、含羥基之矽酮樹脂類等,並無特別限制。該等苯酚樹脂中,聯苯芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、含磷之苯酚樹脂、含羥基之矽酮樹脂在阻燃性的方面為較佳。該等苯酚樹脂可1種單獨使用,亦可將2種以上組合使用。
就氧雜環丁烷樹脂而言,可使用一般公知的物質,其種類並無特別限定。具體而言,可列舉氧雜環丁烷、2-甲基氧雜環丁烷、2,2-二甲基氧雜環丁烷、3-甲基氧雜環丁烷、3,3-二甲基氧雜環丁烷等烷基氧雜環丁烷;3-甲基-3-甲氧基甲基氧雜環丁烷、3,3-二(三氟甲基)全氟氧雜環丁烷、2-氯甲基氧雜環丁烷、3,3-雙(氯甲基)氧雜環丁烷、聯苯型氧雜環丁烷、OXT-101(東亞合成製商品名)、OXT-121(東亞合成製商品名)等,並無特別限制。該等氧雜環丁烷樹脂可使用1種,亦可將2種以上混合使用。
就苯并
化合物而言,只要是於1分子中具有2個以上之二氫苯并
環的化合物即可,可使用一般公知的物質,其種類並無特別限定。具體而言,可列舉雙酚A型苯并
BA-BXZ(小西化學製商品名)、雙酚F型苯并
BF-BXZ(小西化學製商品名)、雙酚S型苯并
BS-BXZ(小西化學製商品名)等,並無特別限制。該等苯并
化合物可使用1種,亦可將2種以上混合使用。
就具有可聚合之不飽和基之化合物而言,可使用一般公知的物質,其種類並無特別限定。具體而言,可列舉乙烯、丙烯、苯乙烯、二乙烯基苯、二乙烯基聯苯等乙烯基化合物;(甲基)丙烯酸甲酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、聚丙二醇二(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四(甲基)丙烯酸新戊四醇酯、六(甲基)丙烯酸二新戊四醇酯等1元或多元醇的(甲基)丙烯酸酯類;雙酚A型環氧(甲基)丙烯酸酯、雙酚F型環氧(甲基)丙烯酸酯等環氧(甲基)丙烯酸酯類;苯并環丁烯樹脂、(雙)馬來醯亞胺樹脂等,並無特別限制。該等具有不飽和基之化合物可使用1種,亦可將2種以上混合使用。
[硬化促進劑] 又,本實施形態之樹脂組成物,必要時亦可含有用以適當調節硬化速度的硬化促進劑。就該硬化促進劑而言,可適當使用一般用作氰酸酯化合物、環氧樹脂等之硬化促進劑者,其種類並無特別限定。其具體例可列舉辛酸鋅、環烷酸鋅、環烷酸鈷、環烷酸銅、乙醯基丙酮鐵、辛酸鎳、辛酸錳等有機金屬鹽類;苯酚、二甲酚、甲酚、間苯二酚、兒茶酚、辛基酚、壬基酚等苯酚化合物;1-丁醇、2-乙基己醇等醇類;2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等咪唑類及該等咪唑類之羧酸或其酸酐類的加成物等衍生物;二氰二醯胺、苄基二甲胺;4-甲基-N,N-二甲基苄胺等胺類;膦系化合物、氧化膦系化合物、鏻鹽系化合物、二膦系化合物等磷化合物;環氧-咪唑加成物系化合物;過氧化苯甲醯、過氧化對氯苯甲醯、二-三級丁基過氧化物、過氧化碳酸二異丙酯、過氧化碳酸二-2-乙基己酯等過氧化物;或偶氮雙異丁腈等偶氮化合物等。硬化促進劑可1種單獨使用,亦可將2種以上組合使用。
此外,硬化促進劑之含量可考慮樹脂的硬化度、樹脂組成物的黏度等而進行適宜調整,並無特別限定,通常相對於樹脂組成物中之樹脂固體成分100質量份宜為0.005~10質量份較佳。
進一步,本實施形態之樹脂組成物,必要時可倂用其他熱硬化性樹脂、熱塑性樹脂及其他低聚物、彈性體類等各種高分子化合物、阻燃性化合物、各種添加劑等。該等只要是一般使用者即可,並無特別限定。例如,就阻燃性化合物而言,可列舉4,4’-二溴聯苯等溴化合物、磷酸酯、磷酸三聚氰胺、含磷之環氧樹脂、三聚氰胺或苯胍胺等氮化合物、含
環之化合物、矽酮系化合物等。又,就各種添加劑而言,可列舉紫外線吸收劑、抗氧化劑、光聚合引發劑、螢光增白劑、光增感劑、染料、顏料、增黏劑、流動調整劑、潤滑劑、消泡劑、分散劑、調平劑、光澤劑、聚合抑制劑等。該等可因應所望而單獨使用1種,亦可將2種以上組合使用。
此外,本實施形態之樹脂組成物,必要時可使用有機溶劑。此種情況下,本實施形態之樹脂組成物可以上述各種樹脂成分之至少一部分,較佳為全部溶解於或與有機溶劑互溶之態樣(溶液或清漆)使用。有機溶劑只要是可將上述各種樹脂成分之至少一部分,較佳為全部予以溶解或能互溶者即可,可適當使用公知的物質,其種類並無特別限定。具體而言,可列舉丙酮、甲乙酮、甲基異丁基酮等酮類;丙二醇單甲醚、丙二醇單甲醚乙酸酯等賽珞蘇系溶劑;乳酸乙酯、乙酸甲酯、乙酸乙酯、乙酸丁酯、乙酸異戊酯、甲氧基丙酸甲酯、羥基異丁酸甲酯等酯系溶劑;二甲基乙醯胺、二甲基甲醯胺等醯胺類等極性溶劑類;甲苯、二甲苯等芳香族烴等無極性溶劑等。該等可1種單獨使用,亦可將2種以上組合使用。
[樹脂組成物的製造方法] 本實施形態之樹脂組成物可依常法進行製備,只要是可獲得均勻地含有氰酸酯化合物(A)及環氧樹脂(B)、上述其他任意成分之樹脂組成物的方法即可,其製備方法並無特別限定。例如,藉由將氰酸酯化合物(A)及環氧樹脂(B)依序摻合至溶劑中,並充分攪拌,可輕易地製備本實施形態之樹脂組成物。
此外,製備樹脂組成物時,可進行用以使各成分均勻地溶解或分散之公知的處理(攪拌、混合、混練處理等)。例如,當均勻分散填充材(C)時,藉由使用設置有具適當攪拌能力之攪拌機的攪拌槽進行攪拌分散處理,對於樹脂組成物的分散性提高。上述攪拌、混合、混練處理,例如可使用球磨機、珠粒研磨機等以混合為目的之裝置、或公轉•自轉型混合裝置等公知的裝置而適當進行。
[用途] 本實施形態之樹脂組成物可作為預浸體、覆金屬箔疊層板、樹脂片、印刷電路板之絕緣層、半導體封裝用材料使用。以下,針對該等用途進行說明。
[預浸體] 本實施形態之預浸體具有基材、含浸或塗佈於該基材之上述樹脂組成物。預浸體的製造方法只要是組合本實施形態之樹脂組成物與基材而製造預浸體的方法即可,並無特別限定。具體而言,使本實施形態之樹脂組成物含浸或塗佈於基材後,利用在120~220℃乾燥2~15分鐘左右的方法等使其半硬化,藉此製造本實施形態之預浸體。此時,樹脂組成物相對於基材之附著量,亦即樹脂組成物的量(包括填充材(C)。)相對於半硬化後之預浸體之總量宜為20~99質量%之範圍較佳。
製造本實施形態之預浸體時所使用之基材,可使用用於各種印刷電路板材料之公知的物質。例如,可列舉E玻璃、D玻璃、L玻璃、S玻璃、T玻璃、Q玻璃、UN玻璃、NE玻璃、球狀玻璃等玻璃纖維;石英等玻璃以外的無機纖維;聚醯亞胺、聚醯胺、聚酯等有機纖維;液晶聚酯等織布,但並不限定於該等。基材的形狀已知有織布、不織布、粗紗、切股氈、表面氈等,均可使用。基材可1種單獨使用,亦可將2種以上組合使用。又,基材的厚度並無特別限定,若為疊層板用途,宜為0.01~0.2mm之範圍較佳,特別是已施加超開纖處理、孔目堵塞處理之織布,以尺寸穩定性的觀點觀之為較理想。進一步,經環氧矽烷處理、胺基矽烷處理等矽烷偶聯劑等進行表面處理之玻璃織布,以吸濕耐熱性的觀點觀之為較佳。又,液晶聚酯織布,在電特性的方面為較佳。
[覆金屬箔疊層板] 又,本實施形態之覆金屬箔疊層板具有至少重疊了1片以上之上述預浸體、與配置在該預浸體之單面或兩面之金屬箔。覆金屬箔疊層板的製造方法,可列舉藉由將一片或多片前述預浸體重疊,並在其單面或兩面配置銅、鋁等金屬箔,進行疊層成形而製作的方法。
此處所使用之金屬箔只要是用於印刷電路板材料者即可,並無特別限定,壓延銅箔、電解銅箔等銅箔較佳。又,金屬箔的厚度並無特別限定,宜為2~70μm較佳,3~35μm更佳。
成形條件可適用通常之印刷電路板用疊層板及多層板的方法。例如,可藉由使用多段壓製機、多段真空壓製機、連續成形機、高壓釜成形機等,以溫度180~350℃、加熱時間100~300分鐘、面壓20~100kg/cm2
進行疊層成形,而製成本實施形態之覆金屬箔疊層板。又,亦可藉由將上述預浸體、與另外製作的內層用配線板組合並疊層成形,而製成多層板。多層板的製造方法,例如,可在1片上述預浸體之兩面配置35μm之銅箔,以上述條件進行疊層形成後,形成內層電路,對該電路實施黑化處理而形成內層電路板,之後,將該內層電路板與上述預浸體交替地各1片逐一配置,進一步於最外層配置銅箔,依上述條件,較佳為真空下進行疊層成形,而製成多層板。再者,本實施形態之覆金屬箔疊層板可適當用作印刷電路板。
[印刷電路板] 本實施形態之印刷電路板包含絕緣層、與形成在該絕緣層表面之導體層,該絕緣層含有上述樹脂組成物。印刷電路板可依常法製造,其製造方法並無特別限定。以下,顯示印刷電路板之製造方法之一例。首先,準備上述覆銅疊層板等覆金屬箔疊層板。然後,對於覆金屬箔疊層板之表面實施蝕刻處理而形成內層電路,製作內層基板。對於該內層基板之內層電路表面視需要實施用以提高黏著強度之表面處理,然後在該內層電路表面重疊所需片數的上述預浸體,進一步於其外側疊層外層電路用之金屬箔,加熱加壓並一體成形。以此方式製成在內層電路與外層電路用之金屬箔之間形成有基材及由熱硬化性樹脂組成物之硬化物構成之絕緣層的多層疊層板。然後,對該多層的疊層板施以通孔(through hole)、介層孔(via hole)用之穿孔加工後,在該孔之壁面形成用以使內層電路與外層電路用之金屬箔導通的鍍敷金屬皮膜,進一步對外層電路用之金屬箔實施蝕刻處理而形成外層電路,藉此製成印刷電路板。
上述製造例所獲得之印刷電路板具有絕緣層、及形成在該絕緣層表面之導體層,絕緣層含有上述本實施形態之樹脂組成物而構成。亦即,上述本實施形態之預浸體(基材及含浸或塗佈於該基材之本實施形態之樹脂組成物)、上述本實施形態之覆金屬箔疊層板之樹脂組成物之層(由本實施形態之樹脂組成物構成之層),係由含有本實施形態之樹脂組成物的絕緣層構成。
[樹脂片] 本實施形態之樹脂片具有支持體、與塗佈在該支持體表面並進行了乾燥的上述樹脂組成物。樹脂片可藉由將使上述本實施形態之樹脂組成物溶解於溶劑而得之溶液塗佈於支持體並乾燥而獲得。樹脂片可作為堆積(build-up)用薄膜或乾薄膜阻焊劑使用。
此處所使用之支持體,例如,可列舉聚乙烯薄膜、聚丙烯薄膜、聚碳酸酯薄膜、聚對苯二甲酸乙二酯薄膜、乙烯四氟乙烯共聚物薄膜、及在該等薄膜表面塗佈脫模劑而成之脫模薄膜、聚醯亞胺薄膜等有機系薄膜基材;銅箔、鋁箔等導體箔;玻璃板、SUS板、FRP等板狀品,但不特別限定。
樹脂組成物之塗佈方法,例如,可列舉將使本實施形態之樹脂組成物溶解於溶劑而得之溶液利用桿塗機、模塗機、刮刀塗佈機、貝克塗抹機等塗佈在支持體上的方法。又,乾燥後從疊層片將支持體予以剝離或蝕刻,藉此可製成單層片(樹脂片)。此外,亦可藉由將使上述本實施形態之樹脂組成物溶解於溶劑而得之溶液供給具片狀空腔之模具內,並乾燥等而成形為片狀,獲得不使用支持體之單層片(樹脂片)。
此外,製作本實施形態之單層或疊層片時,去除溶劑時的乾燥條件並無特別限定,考量為低溫的話樹脂組成物中易有溶劑殘留,為高溫的話樹脂組成物的硬化會進行的方面,宜於20℃~200℃之溫度進行1~90分鐘較佳。又,本實施形態之單層或疊層片之樹脂層的厚度,可利用本實施形態之樹脂組成物的溶液濃度與塗佈厚度調整,並無特別限定,考量一般而言,塗佈厚度變厚的話乾燥時溶劑容易殘留的方面,宜為0.1~500μm較佳。又,樹脂組成物能以只將溶劑乾燥後之未硬化的狀態使用,視需要亦可使其成為半硬化(B階段化)的狀態而使用。 [實施例]
以下,舉合成例、實施例及比較例對本發明進行更詳細地說明,但本發明並不限定於該等。
(合成例1)氰酸酯化合物的合成 使1-萘酚芳烷基樹脂(新日鐵住金化學(股)公司製)300g(換算為OH基1.28mol)及三乙基胺194.6g(1.92mol)(相對於羥基1mol為1.5mol)溶解於二氯甲烷1800g,將其作為溶液1。
另一方面,將氯化氰125.9g(2.05mol)(相對於羥基1mol為1.6mol)、二氯甲烷293.8g、36%鹽酸194.5g(1.92mol)(相對於羥基1mol為1.5mol)、水1205.9g混合,以作為溶液2。將溶液2於攪拌下保持在液溫-2~-0.5℃,同時歷時30分鐘將溶液1注入溶液2。溶液1注入結束後,於同溫度攪拌30分鐘後,將使三乙基胺65g(0.64mol)(相對於羥基1mol為0.5mol)溶解於二氯甲烷65g而得之溶液(溶液3)歷時10分鐘注入溶液2。溶液3注入結束後,於同溫度攪拌30分鐘使反應結束。
之後,將反應液靜置使有機相與水相分離。利用水1300g將獲得之有機相清洗5次。第5次水洗的廢水的導電度為5μS/cm,確認藉由以水清洗,可充分去除待去除之離子性化合物。
將水洗後之有機相在減壓下濃縮,最後於90℃濃縮乾燥1小時而得到係目標之萘酚芳烷基型氰酸酯化合物(SNCN)(橙色黏性物)331g。所獲得之SNCN的質量平均分子量Mw為600。又,SNCN的IR光譜顯示2250cm-1
(氰酸酯基)的吸收,且並未顯示羥基的吸收。
(實施例1) 將合成例1所獲得之SNCN50質量份、至少具有1個以上之下式(1)及下式(2)表示之結構單元之環氧樹脂(NC-3500、日本化藥(股)公司製)50質量份、熔融二氧化矽(SC2050MB、Admatechs製)100質量份、辛酸鋅(日本化學產業(股)公司製)0.15質量份混合而得到清漆。將該清漆以甲乙酮進行稀釋,並含浸塗覆於厚度0.1mm之E玻璃織布,在150℃加熱乾燥5分鐘,得到樹脂含量50質量%的預浸體。此外,式(2)表示之結構單元相對於式(1)表示之結構單元10莫耳的莫耳比為1~3左右。
【化8】
將獲得之預浸體8片重疊並在上下配置12μm厚之電解銅箔(3EC-M3-VLP、三井金屬(股)公司)製),於壓力30kgf/cm2
、溫度220℃進行120分鐘的疊層成形,得到絕緣層厚度0.8mm之覆金屬箔疊層板。使用獲得之覆金屬箔疊層板,進行玻璃轉移溫度(Tg)的評價。結果顯示於表1中。
(比較例1) 使用僅具有式(2)表示之結構單元之聯苯芳烷基型環氧樹脂(NC-3000-FH、日本化藥(股)公司製)50質量份替換使用至少具有1個以上之式(1)及式(2)表示之結構單元之環氧樹脂50質量份,且辛酸鋅的使用量設定為0.12質量份,除此以外,與實施例1同樣進行而得到厚度0.8mm之覆金屬箔疊層板。獲得之覆金屬箔疊層板的評價結果顯示於表1中。
(測定方法及評價方法) 玻璃轉移溫度:將實施例1、比較例1所獲得之覆金屬箔疊層板切出40mm×20mm之大小,依照JIS C6481利用動態黏彈性測定裝置(TA Instruments製)進行測定。
【表1】<TABLE border="1" borderColor="#000000" width="85%"><TBODY><tr><td> </td><td> 實施例1 </td><td> 比較例1 </td></tr><tr><td> 玻璃轉移溫度 </td><td> (℃) </td><td> 276 </td><td> 250 </td></tr><tr height="0"><td></td><td></td><td></td><td></td></tr></TBODY></TABLE>
由表1可知,藉由使用本發明之樹脂組成物,確認可達成玻璃轉移溫度優異的預浸體及印刷電路板等。
本申請案係基於2015年4月21日向日本專利局提申的日本專利申請案(日本特願2015-086409),其內容在此納入作為參考。 [產業上利用性]
如以上之説明,本發明之樹脂組成物於電氣・電子材料、工作機械材料、航空材料等各種用途,可廣泛且有效地用作例如:電絕緣材料、半導體塑膠封裝體、密封材料、黏著劑、疊層材料、阻劑、堆積疊層板材料等,尤其特別可有效地用作因應近年來資訊終端機設備、通訊設備等高整合・高密度化的印刷電路板材料。又,本發明之疊層板及覆金屬箔疊層板等具有玻璃轉移溫度優異的性能,故其工業上的實用性極高。
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Claims (9)
- 一種樹脂組成物,含有: 氰酸酯化合物(A),及 具有下式(1)表示之結構單元及下式(2)表示之結構單元之環氧樹脂(B); 【化1】
- 如申請專利範圍第1項之樹脂組成物,其中,該環氧樹脂(B)之含量相對於該樹脂組成物中之樹脂固體成分100質量份為1~90質量份。
- 如申請專利範圍第1項之樹脂組成物,更含有填充材(C)。
- 如申請專利範圍第1項之樹脂組成物,更含有選自於由該環氧樹脂(B)以外之環氧樹脂、馬來醯亞胺化合物、苯酚樹脂、氧雜環丁烷樹脂、苯并 化合物、及具有可聚合之不飽和基之化合物構成之群組中之任1種以上。
- 如申請專利範圍第3項之樹脂組成物,其中,該填充材(C)之含量相對於該樹脂組成物中之樹脂固體成分100質量份為50~1600質量份。
- 一種預浸體,具有: 基材;及 含浸或塗佈於該基材之如申請專利範圍第1項之樹脂組成物。
- 一種覆金屬箔疊層板,具有: 至少重疊了1片以上之如申請專利範圍第6項之預浸體;與 配置在該預浸體之單面或兩面之金屬箔。
- 一種樹脂片,具有: 支持體;與 塗佈在該支持體表面並進行了乾燥的如申請專利範圍第1項之樹脂組成物。
- 一種印刷電路板,包含: 絕緣層;與 形成在該絕緣層表面之導體層; 該絕緣層含有如申請專利範圍第1項之樹脂組成物。
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EP (1) | EP3287479B1 (zh) |
JP (1) | JP6792204B2 (zh) |
KR (1) | KR102513654B1 (zh) |
CN (1) | CN107531881A (zh) |
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JP7211744B2 (ja) * | 2018-09-19 | 2023-01-24 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物およびその硬化物 |
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TWI415911B (zh) | 2005-07-13 | 2013-11-21 | Ube Industries | 伸聯苯交聯酚醛清漆樹脂及其用途 |
US8481066B2 (en) * | 2009-07-16 | 2013-07-09 | The Curators Of The University Of Missouri | Scaffold for tissue regeneration in mammals |
JP5754731B2 (ja) * | 2011-08-25 | 2015-07-29 | 明和化成株式会社 | エポキシ樹脂、エポキシ樹脂の製造方法、及びその使用 |
EP2774938B1 (en) * | 2011-11-02 | 2016-02-03 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, and laminated sheet |
CN104093764B (zh) * | 2012-01-31 | 2018-06-08 | 三菱瓦斯化学株式会社 | 印刷电路板材料用树脂组合物、以及使用了其的预浸料、树脂片、覆金属箔层叠板和印刷电路板 |
CN103897143B (zh) * | 2012-12-28 | 2018-05-01 | 明和化成株式会社 | 环氧树脂、环氧树脂的制造方法及其使用 |
JP2014205755A (ja) * | 2013-04-11 | 2014-10-30 | 住友ベークライト株式会社 | プライマー層形成用樹脂組成物 |
WO2014203866A1 (ja) * | 2013-06-18 | 2014-12-24 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、樹脂シート及び金属箔張り積層板 |
JP6428153B2 (ja) * | 2014-10-27 | 2018-11-28 | 味の素株式会社 | 樹脂組成物 |
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- 2016-04-15 EP EP16783106.4A patent/EP3287479B1/en active Active
- 2016-04-15 CN CN201680022712.0A patent/CN107531881A/zh active Pending
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EP3287479A1 (en) | 2018-02-28 |
CN107531881A (zh) | 2018-01-02 |
EP3287479B1 (en) | 2019-11-27 |
WO2016171085A1 (ja) | 2016-10-27 |
TWI735441B (zh) | 2021-08-11 |
KR20170139032A (ko) | 2017-12-18 |
US20180051168A1 (en) | 2018-02-22 |
EP3287479A4 (en) | 2018-11-07 |
JP6792204B2 (ja) | 2020-11-25 |
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