JP6788807B2 - 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 - Google Patents
樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 Download PDFInfo
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- JP6788807B2 JP6788807B2 JP2017515505A JP2017515505A JP6788807B2 JP 6788807 B2 JP6788807 B2 JP 6788807B2 JP 2017515505 A JP2017515505 A JP 2017515505A JP 2017515505 A JP2017515505 A JP 2017515505A JP 6788807 B2 JP6788807 B2 JP 6788807B2
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- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-L oxido carbonate Chemical compound [O-]OC([O-])=O MMCOUVMKNAHQOY-UHFFFAOYSA-L 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- NOHFYJWXIIYRIP-UHFFFAOYSA-N phenyl 4-cyanatobenzoate Chemical compound C=1C=C(OC#N)C=CC=1C(=O)OC1=CC=CC=C1 NOHFYJWXIIYRIP-UHFFFAOYSA-N 0.000 description 1
- CWHFDTWZHFRTAB-UHFFFAOYSA-N phenyl cyanate Chemical compound N#COC1=CC=CC=C1 CWHFDTWZHFRTAB-UHFFFAOYSA-N 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 125000004360 trifluorophenyl group Chemical group 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Description
シアン酸エステル化合物(A)及び下記一般式(1)で表されるエポキシ樹脂(B)を含有する、樹脂組成物。
[2]
前記一般式(1)で表されるエポキシ樹脂(B)の含有量が、前記樹脂組成物中の樹脂固形分の総量(100質量部)に対して、1〜90質量部である、[1]に記載の樹脂組成物。
[3]
充填材(C)をさらに含有する、[1]又は[2]に記載の樹脂組成物。
[4]
前記一般式(1)で表されるエポキシ樹脂(B)以外のエポキシ樹脂、マレイミド化合物、フェノール樹脂、オキセタン樹脂、ベンゾオキサジン化合物、及び重合可能な不飽和基を有する化合物からなる群より選択される1種又は2種以上を、さらに含有する、[1]〜[3]のいずれかに記載の樹脂組成物。
[5]
前記充填材(C)の含有量が、前記樹脂組成物中の樹脂固形分の総量(100質量部)に対して、50〜1600質量部である、[3]又は[4]に記載の樹脂組成物。
[6]
基材と、該基材に含浸又は塗布された、[1]〜[5]のいずれかに記載の樹脂組成物と、を有する、プリプレグ。
[7]
1枚の又は2枚以上を積層した、[6]に記載のプリプレグと、該プリプレグの片面又は両面に積層成形された金属箔と、を有する、金属箔張積層板。
[8]
シート基材と、該シート基材の片面又は両面に塗工及び乾燥された、[1]〜[5]のいずれかに記載の樹脂組成物と、を有する、樹脂シート。
[9]
[1]〜[5]のいずれかに記載の樹脂組成物を含む絶縁層と、該絶縁層の片面又は両面に形成された導体層と、を有する、プリント配線板。
本実施形態の樹脂組成物は、シアン酸エステル化合物(A)及び下記一般式(1)で表されるエポキシ樹脂(B)(以下、単に「エポキシ樹脂(B)」ともいう。)を含有する。
本実施形態のシアン酸エステル化合物(A)は、シアナト基(シアン酸エステル基)が少なくとも1個置換された芳香族部分を分子内に有する樹脂であれば特に限定されない。本実施形態のシアン酸エステル化合物(A)を含有することにより、耐熱性に優れたプリント配線板を実現する樹脂組成物を得ることができる。この要因は、シアン酸エステル化合物(A)を含有することにより、樹脂組成物全体のガラス転移温度が高くなることに起因して、耐熱性により優れたプリント配線板が得られると推察される(ただし、要因はこれに限定されない。)。
本実施形態のエポキシ樹脂(B)は、下記一般式(1)で表される。
本実施形態の樹脂組成物は、充填材(C)をさらに含有することが好ましい。充填材(C)を含有することで、本発明の作用効果をより確実に奏することができ、優れためっきピール強度が得られる傾向にある。また、本実施形態のシアン酸エステル化合物(A)の作用効果をより確実に奏することができ、優れた耐熱性が得られる傾向にもある。
さらに、本実施形態の樹脂組成物は、必要に応じてその他の成分を含有していてもよい。その他の成分としては、特に限定されないが、例えば、上記エポキシ樹脂(B)以外のエポキシ樹脂(以下、「他のエポキシ樹脂」という。)、マレイミド化合物、フェノール樹脂、オキセタン樹脂、ベンゾオキサジン化合物、及び重合可能な不飽和基を有する化合物からなる群より選ばれるいずれか1種類以上が挙げられる。このようなその他の成分を用いることにより、樹脂組成物を硬化した硬化物の難燃性、低誘電性など所望する特性を向上させることができる。
本実施形態の樹脂組成物は、常法にしたがって製造することができ、シアン酸エステル化合物(A)及び一般式(1)で表されるエポキシ樹脂(B)、並びに上述したその他の任意成分を均一に含有する樹脂組成物が得られる方法であれば、その調製方法は特に限定されない。例えば、シアン酸エステル化合物(A)及び一般式(1)で表されるエポキシ樹脂(B)を順次溶剤に配合し、十分に撹拌することで本実施形態の樹脂組成物を容易に調整することができる。
以下、本実施形態のプリプレグについて詳述する。本実施形態のプリプレグは、基材と、該基材に含浸又は塗布された、上述した本実施形態の樹脂組成物とを有する。プリプレグの製造方法は、本実施形態の樹脂組成物と基材とを組み合わせてプリプレグを製造する方法であれば、特に限定されず、本実施形態の樹脂組成物を基材に含浸又は塗布させて得られる。より具体的には、本実施形態の樹脂組成物を基材に含浸又は塗布させた後、120〜220℃で2〜15分程度乾燥させる方法等によって半硬化させることで、本実施形態のプリプレグを製造することができる。このとき、基材に対する樹脂組成物の付着量、すなわち半硬化後のプリプレグの総量(100質量部)に対する樹脂組成物量(充填材(C)を含む。)は、20〜99質量部の範囲であることが好ましい。
本実施形態の金属箔張積層板は、1枚の又は2枚以上を積層した、上述したプリプレグと、該プリプレグのの片面又は両面に積層成形された金属箔と、を有する。具体的には、上述したプリプレグを一枚あるいは複数枚重ね、その片面又は両面に銅やアルミニウム等の金属箔を配置して、積層成形することにより製造することができる。ここで使用する金属箔は、プリント配線板材料に用いられているものであれば、特に限定されないが、圧延銅箔や電解銅箔等の銅箔が好ましい。また、金属箔の厚さは、特に限定されないが、2〜70μmであることが好ましく、3〜35μmであることがより好ましい。成形条件としては、通常のプリント配線板用積層板及び多層板の手法が適用できる。例えば、多段プレス機、多段真空プレス機、連続成形機、オートクレーブ成形機等を使用し、温度180〜350℃、加熱時間100〜300分、面圧20〜100kg/cm2で積層成形することにより本実施形態の金属箔張積層板を製造することができる。また、上記のプリプレグと、別途作製した内層用の配線板とを組み合わせて積層成形することにより、多層板とすることもできる。多層板の製造方法としては、例えば、上述したプリプレグ1枚の両面に35μmの銅箔を配置し、上記条件にて積層形成した後、内層回路を形成し、この回路に黒化処理を実施して内層回路板を形成し、その後、この内層回路板と上記のプリプレグとを交互に1枚ずつ配置し、さらに最外層に銅箔を配置して、上記条件にて好ましくは真空下で積層成形することにより、多層板を作製することができる。
本実施形態のプリント配線板は、上述した本実施形態の樹脂組成物を含む絶縁層と、該絶縁層の片面又は両面に形成された導体層とを有する。すなわち、上述した本実施形態のプリプレグ(基材及びこれに含浸又は塗布された本実施形態の樹脂組成物)、上述した本実施形態の金属箔張積層板の樹脂組成物の層(本実施形態の樹脂組成物からなる層)が、本実施形態の樹脂組成物を含む絶縁層から構成されることになる。
本実施形態の樹脂シートは、シート基材と、該シート基材の片面又は両面に塗工及び乾燥された、上述した本実施形態の樹脂組成物とを有する。樹脂シートは、溶剤に溶解させた溶液(樹脂組成物)をシート基材に塗布(塗工)し、乾燥することで得ることができる。ここで用いるシート基材としては、例えば、ポリエチレンフィルム、ポリプロピレンフィルム、ポリカーボネートフィルム、ポリエチレンテレフタレートフィルム、エチレンテトラフルオロエチレン共重合体フィルム、並びにこれらのフィルムの表面に離型剤を塗布した離型フィルム、ポリイミドフィルム等の有機系のフィルム基材、銅箔、アルミ箔等の導体箔、ガラス板、SUS板、FRP等の板状のものが挙げられるが、特に限定されるものではない。塗布方法としては、例えば、本実施形態の樹脂組成物を溶剤に溶解させた溶液を、バーコーター、ダイコーター、ドクターブレード、ベーカーアプリケーター等で支持体上に塗布する方法が挙げられる。また、乾燥後に、積層シートから支持体を剥離又はエッチングすることで、単層シート(樹脂シート)とすることもできる。なお、上記の本実施形態の樹脂組成物を溶剤に溶解させた溶液を、シート状のキャビティを有する金型内に供給し乾燥する等してシート状に成形することで、支持体を用いることなく単層シート(樹脂シート)を得ることもできる。
1−ナフトールアラルキル樹脂(新日鉄住金化学株式会社製)300g(OH基換算1.28mol)及びトリエチルアミン194.6g(1.92mol)(ヒドロキシ基1molに対して1.5mol)をジクロロメタン1800gに溶解させ、これを溶液1とした。
合成例1により得られたSNCN50質量部、下記一般式(1)で表されるエポキシ樹脂(EP−4000S、粘度:1800mPa・s/25℃、(株)ADEKA製)50質量部、溶融シリカ(SC2050MB、アドマテックス製)100質量部、オクチル酸亜鉛(日本化学産業(株)製)0.15質量部を混合してワニスを得た。このワニスをメチルエチルケトンで希釈し、厚さ0.1mmのEガラス織布に含浸塗工し、150℃で5分間加熱乾燥して、樹脂含有量50質量%のプリプレグを得た。
実施例1において、一般式(1)で表されるエポキシ樹脂を50質量部用いる代わりに、ビフェニルアラルキル型エポキシ樹脂(NC−3000−FH、日本化薬(株)製)50質量部、オクチル酸亜鉛を0.12質量部用いた以外は、実施例1と同様にして厚さ0.8mmの金属箔張積層板を得た。得られた金属箔張積層板の各評価結果を表1に示す。
めっきピール強度:実施例1及び比較例1で得られた絶縁層厚さ0.8mmの金属箔張積層板を、上村工業製の無電解銅めっきプロセス(使用薬液名:MCD−PL、MDP−2、MAT−SP、MAB−4−C、MEL−3−APEA ver.2)にて、約0.8μmの無電解銅めっきを施し、130℃で1時間の乾燥を行った。続いて、電解銅めっきをめっき銅の厚みが18μmになるように施し、180℃で1時間の乾燥を行った。こうして、絶縁層上に厚さ18μmの導体層(めっき銅)が形成されたサンプルを作製し評価した。めっき銅の接着力は、JIS C6481に準じて3回測定し、その平均値を求めた。
Claims (8)
- 下記一般式(2)で表されるナフトールアラルキル型シアン酸エステル化合物(A)、及び下記一般式(1)で表されるエポキシ樹脂(B)を含有し、
前記一般式(2)で表されるナフトールアラルキル型シアン酸エステル化合物(A)の含有量が、前記樹脂組成物中の樹脂固形分の総量(100質量部)に対して、40〜60質量部であり、
前記一般式(1)で表されるエポキシ樹脂(B)の含有量が、前記樹脂組成物中の樹脂固形分の総量(100質量部)に対して、40〜60質量部である、樹脂組成物。
- 充填材(C)をさらに含有する、請求項1に記載の樹脂組成物。
- 前記一般式(1)で表されるエポキシ樹脂(B)以外のエポキシ樹脂、マレイミド化合物、フェノール樹脂、オキセタン樹脂、ベンゾオキサジン化合物、及び重合可能な不飽和基を有する化合物からなる群より選択される1種又は2種以上を、さらに含有する、請求項1又は2に記載の樹脂組成物。
- 前記充填材(C)の含有量が、前記樹脂組成物中の樹脂固形分の総量(100質量部)に対して、50〜1600質量部である、請求項2に記載の樹脂組成物。
- 基材と、該基材に含浸又は塗布された、請求項1〜4のいずれか一項に記載の樹脂組成物と、を有する、プリプレグ。
- 1枚の又は2枚以上を積層した、請求項5に記載のプリプレグと、該プリプレグの片面又は両面に積層成形された金属箔と、を有する、金属箔張積層板。
- シート基材と、該シート基材の片面又は両面に塗工及び乾燥された、請求項1〜4のいずれか一項に記載の樹脂組成物と、を有する、樹脂シート。
- 請求項1〜4のいずれか一項に記載の樹脂組成物を含む絶縁層と、該絶縁層の片面又は両面に形成された導体層と、を有する、プリント配線板。
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