TW201618212A - 將半導體材料加工的方法與裝置 - Google Patents

將半導體材料加工的方法與裝置 Download PDF

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Publication number
TW201618212A
TW201618212A TW104125076A TW104125076A TW201618212A TW 201618212 A TW201618212 A TW 201618212A TW 104125076 A TW104125076 A TW 104125076A TW 104125076 A TW104125076 A TW 104125076A TW 201618212 A TW201618212 A TW 201618212A
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TW
Taiwan
Prior art keywords
semiconductor material
particles
cleaning
discharged
steps
Prior art date
Application number
TW104125076A
Other languages
English (en)
Chinese (zh)
Inventor
馬提亞斯 歐洛柏
Original Assignee
羅伯特博斯奇股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅伯特博斯奇股份有限公司 filed Critical 羅伯特博斯奇股份有限公司
Publication of TW201618212A publication Critical patent/TW201618212A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
TW104125076A 2014-08-05 2015-08-03 將半導體材料加工的方法與裝置 TW201618212A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014215404.9A DE102014215404A1 (de) 2014-08-05 2014-08-05 Verfahren und Vorrichtung zum Bearbeiten eines Halbleitermaterials

Publications (1)

Publication Number Publication Date
TW201618212A true TW201618212A (zh) 2016-05-16

Family

ID=53762178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125076A TW201618212A (zh) 2014-08-05 2015-08-03 將半導體材料加工的方法與裝置

Country Status (3)

Country Link
DE (1) DE102014215404A1 (de)
TW (1) TW201618212A (de)
WO (1) WO2016020242A1 (de)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677704A (en) * 1986-04-22 1987-07-07 Huggins Richard A Cleaning system for static charged semiconductor wafer surface
JPH06262150A (ja) * 1992-05-12 1994-09-20 Matsui Mfg Co 付着物除去方法とその装置
DE19906224B4 (de) * 1999-02-15 2006-05-24 Infineon Technologies Ag Abzugsvorrichtung
US6809809B2 (en) * 2000-11-15 2004-10-26 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
WO2003042072A1 (en) * 2001-10-19 2003-05-22 Infineon Technologies Ag A bag
JP5002471B2 (ja) * 2008-01-31 2012-08-15 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法、プログラム及びコンピュータ記憶媒体
DE102011052325A1 (de) * 2011-08-01 2013-02-07 Roth & Rau Ag Reinigungsmodul und Reinigungsverfahren für Substrate und/oder Substratträger

Also Published As

Publication number Publication date
WO2016020242A1 (de) 2016-02-11
DE102014215404A1 (de) 2016-02-11

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