TW201617637A - Hall sensor manufacturing method, hall sensor, and lens module - Google Patents

Abstract

The present invention pertains to a Hall sensor manufacturing method, a Hall sensor, and a lens module, the Hall sensor being low profile and small, and having little fluctuation in magnetic characteristics. A metal sheet on which lead terminals (21a-21d) are formed is disposed on a base material (30). A Hall element (10) is disposed in a region surrounded by the lead terminals. Electrode units (13a-13d) and the lead terminals are electrically connected by conducting wires. The Hall element, the conducting wires, and a second surface (M2) which is a surface connected to the conducting wires of the lead terminals are sealed by a sealing member, and the base material (30) is removed. A first surface (M1) which is on the side opposite the second surface of the lead terminals is caused to be exposed from the sealing member. The lead terminals have, on the second surface, a step (D) on the periphery of an elliptical shape or a polygonal shape with the center thereof being the position where the Hall element is placed. Each of the lead terminals has a first portion (N1) which is on the side close to the position where the Hall element is placed, and a second portion (N2) which is on the side far from such position. The height to the second surface in the first portion is made lower than the height to the second surface in the second portion.

Description

Hall sensor manufacturing method and Hall sensor and lens module

The invention relates to a method for manufacturing a Hall sensor and a Hall sensor and a lens module.

As a sensor for detecting a magnetic field, a magnetic sensor using a Hall element is known. For example, Patent Document 1 describes a magnetic sensor using an islandless structure having a sheet member (a magnetic sensor wafer such as a Hall element) and a method of manufacturing the same.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2014/091714

In addition, with the thinning and miniaturization of electronic equipment in recent years, a thinner and smaller Hall sensor is required. In order to make the magnetic sensor of the above Patent Document 1 thinner, it is effective to lower the height of the wire connecting the sheet member to the lead terminal. In order to lower the height of the wires, it is effective to lower the members of the chip and the lead terminals at a high position. In the case of the magnetic sensor of Patent Document 1, making the sheet member thinner is effective for thinning the entire magnetic sensor. Further, in order to make the magnetic sensor of Patent Document 1 smaller, it is effective to shorten the distance between the sheet member and the lead terminal. However, thinning the sheet member and shortening the distance between the sheet member and the lead terminal cause the following problems.

Fig. 1 is a cross-sectional structural view for explaining the subject of the Hall sensor of the present invention. figure 1 A diagram showing a part of the manufacturing steps of the Hall sensor, which shows the step of placing the Hall element 510 on the region surrounded by the lead terminals 525, 527 using the suction tool 600. The lead terminals 525 and 527 are placed on the substrate 530, and an insulating layer 540 is formed on the back surface of the Hall element 510. The Hall element 510 includes a magnetic induction portion 512 and electrode portions 513a and 513b. When the Hall element 510 is thin and the distance between the position where the Hall element 510 is placed and the lead terminals 525 and 527 is small, when the Hall element 510 is placed by using the suction tool 600, the suction tool 600 and the suction device 600 are provided. The lead terminals 525, 527 are in contact with each other. When the suction tool 600 is in contact with the lead terminals 525 and 527, the Hall element 510 is placed at a position different from the position normally placed. The uneven position of the Hall element 510 causes the position of the magnetic sensing portion 512 to be uneven, eventually resulting in uneven magnetic characteristics of the Hall sensor. Furthermore, A denotes a contact portion between the suction tool and the lead terminal.

The present invention has been made in view of such a problem, and an object thereof is to provide a method of manufacturing a Hall sensor which is thin and small, has few variations in magnetic characteristics, and a Hall sensor and a lens module.

According to an aspect of the invention, the following matters are taken as a feature.

(1) A Hall sensor comprising: a Hall element having a plurality of electrode portions; a plurality of external terminals disposed around the Hall element; and a plurality of wires, respectively And connecting the electrode portions of the plurality of electrode portions and the external terminals of the plurality of external terminals; and the sealing member sealing the Hall element, the plurality of wires, and the surface of the external terminals connected to the wires a first surface of the external terminal opposite to the second surface, which is exposed from a bottom surface of the sealing member, wherein the plurality of external terminals include at least a first external terminal, and the first external terminal is on the second surface And having a step on a periphery of a region surrounding the Hall element in a plan view, and the first external terminal has a first portion on a side close to the Hall element, and is away from the above a second portion on the side of the Hall element, and the second surface of the first portion of the first external terminal is used as a reference surface of the sealing member The height of the surface is formed to be lower than the height of the second surface to the second portion.

(1) wherein the Hall element has a bottom surface of the sealing member as a reference surface, and a highest point of the Hall element is disposed on the second portion of the first portion of the first external terminal. The surface is high and lower than the second surface of the second portion.

(3) The method of (1) or (2), wherein a height from the reference surface to a highest point of the Hall element is T, and the second portion of the second portion from the reference surface The height of the surface is set to p2, and the Hall element is placed at a position where p2 < T < 1.5 × p2.

In any one of (1) to (3), the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals are arranged to connect the first external terminals The virtual straight line of the third external terminal and the virtual straight line connecting the second external terminal and the fourth external terminal intersect in a plan view, and the Hall element has a rectangular shape in plan view and is disposed in a plan view. Four vertices of the Hall element are disposed in a region between the first external terminal and the second external terminal, a region between the second external terminal and the third external terminal, the third external terminal, and the fourth A region between the external terminals and a position of a region between the fourth external terminal and the first external terminal.

(5) The insulating layer is provided on any one of (1) to (4), wherein the insulating layer is disposed on a surface of the Hall element opposite to a surface on which the plurality of electrode portions are disposed, the insulating layer The bottom surface of the sealing member is exposed.

(6) The external terminal of the plurality of external terminals having the step on the second surface, wherein the external terminals are The first portion is provided on a side closer to the Hall element, and the second portion is provided on a side away from the Hall element, and the bottom surface of the sealing member is used as a reference surface, and the first portion of each of the external terminals is The height of the second surface is formed to be lower than the height of the second surface to the second portion.

(7), wherein (6), wherein each of the external terminals is formed on a periphery of a region having a circular shape, a polygonal shape, or a combination thereof in a shape of the Hall element as a center in a plan view Said step difference.

(8) A Hall sensor comprising: a Hall element having a plurality of electrode portions; a plurality of external terminals disposed around the Hall element; and a plurality of wires, respectively And connecting the electrode portions of the plurality of electrode portions and the external terminals of the plurality of external terminals; and the sealing member sealing the Hall element, the plurality of wires, and a surface of the external terminals connected to the wires a second surface; a first surface of the external terminal opposite to the second surface is exposed from a bottom surface of the sealing member, and each of the external terminals is connected to a second portion of the plurality of wires to be closer to the second portion Further, the first portion of the Hall element is formed such that a height of the second surface side of the second portion having the bottom surface of the sealing member as a reference surface is lower than a height of the bottom surface of the sealing member The difference in height of the second surface side of the 1st part.

(9), wherein the height from the bottom surface of the sealing member to the contact point between the electrode portion of the Hall element and the plurality of wires is lower than the surface of the sealing member as a reference surface The height of the second surface side of the first portion.

(10). (8) or (9), wherein the step is formed in a curved shape or a curved shape which is recessed toward the bottom surface side of the sealing member in a plan view.

In any one of (8) to (10), wherein each of the external terminals is in a shape of a circular shape, a polygonal shape, or a combination thereof in a shape of the Hall element in a plan view. On the periphery, the above-described step difference is formed.

The above-mentioned Hall element includes a substrate, magnetic induction provided on the substrate or in the substrate, and the plurality of electrode portions connected to the magnetic induction portion, and the plurality of electrode portions are provided. The insulating layer is disposed on a surface of the Hall element opposite to a surface on which the plurality of electrode portions are disposed, and the insulating layer is exposed from the bottom surface of the sealing member.

(13) A lens module comprising: the Hall sensor according to any one of (1) to (12), a lens mount to which a magnet is mounted, and the above-described external portion from the Hall sensor; end The drive signal of the sub-magnet to move the magnet.

(14) A method of manufacturing a Hall sensor, the Hall sensor comprising a plurality of external terminals, a Hall element having a plurality of electrode portions, and respective external terminals electrically connected to the plurality of external terminals a plurality of wires of the electrode portions of the plurality of electrode portions, the method for manufacturing the Hall sensor includes an external terminal arrangement step of disposing a metal plate on which the plurality of external terminals are formed on a substrate; Hall a component arrangement step of disposing the Hall element in a region surrounded by the plurality of external terminals; and a wire connecting step of electrically connecting the plurality of electrode portions and the plurality of external terminals by the plurality of wires; and sealing step The sealing member seals the Hall element, the plurality of wires, and the second surface of the external terminals connected to the wires, and an exposing step of removing the substrate to make the external terminals and the second surface The first surface on the opposite side is exposed from the sealing member; the plurality of external terminals include at least a first external terminal, and the first external terminal On the second surface, in a plan view, there is a step on the periphery of the elliptical or polygonal region centering on the position at which the Hall element is placed, and the first outer portion is bounded by the step difference The terminal has a first portion on a side close to a position on which the Hall element is placed, and a second portion on a side away from a position on which the Hall element is placed, wherein the first external terminal is disposed on the substrate In the upper case, the height of the second surface of the first portion is set to be lower than the height of the second surface of the second portion, with the surface of the substrate on which the metal plate is disposed as a reference surface .

(15) A method of manufacturing a Hall sensor, the Hall sensor comprising a plurality of external terminals, a Hall element having a plurality of electrode portions, and respective external terminals electrically connected to the plurality of external terminals a plurality of wires of the electrode portions of the plurality of electrode portions, the method for manufacturing the Hall sensor includes an external terminal arrangement step of disposing a metal plate on which the plurality of external terminals are formed on a substrate; Hall a component arrangement step of disposing the Hall element in an area surrounded by the plurality of external terminals; And electrically connecting the plurality of electrode portions to the plurality of external terminals by using the plurality of wires; and sealing step of connecting the Hall element, the plurality of wires, and the external terminals to the wires by using a sealing member That is, the second surface is sealed; and the exposing step is performed to remove the substrate, and the first surface of the external terminal opposite to the second surface is exposed from the sealing member; and the plurality of external terminals include at least the first outer portion a terminal, wherein the first external terminal is on the second surface, and has a step at a position corresponding to a shape of a front end of the suction device centering on a position at which the Hall element is placed in a plan view, with the step In the boundary, the first external terminal has a first portion on a side closer to a position on which the Hall element is placed, and a second portion on a side away from a position on which the Hall element is placed, wherein the first external terminal When the metal plate is disposed on the base material, the height of the surface of the first portion is set to be the surface of the base material on which the metal plate is placed as a reference surface To up to a height above the second surface of the second portion.

(16) or (15), wherein the Hall element disposing step includes the step of disposing the Hall element on a surface of the substrate on which the metal plate is disposed as a reference surface The highest point of the Hall element is higher than the second surface of the first portion of the first external terminal and lower than the second surface of the second portion.

(17) The method according to any one of (14) to (16) wherein the Hall element arranging step includes the step of setting a height from the reference surface to a highest point of the Hall element to T, The height of the second surface of the second portion from the reference surface is set to p2, and the Hall element is placed at a position where p2 < T < 1.5 × p2.

In any one of (14) to (17), the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals are arranged to connect the first external terminal The virtual straight line with the third external terminal and the virtual straight line connecting the second external terminal and the fourth external terminal intersect in a plan view, and the Hall element has a rectangular shape in plan view, and the Hall element arrangement step includes the following a step of arranging the Hall element so that four vertices of the Hall element are disposed on the first external terminal and in a plan view a region between the second external terminals, a region between the second external terminal and the third external terminal, a region between the third external terminal and the fourth external terminal, and the fourth external terminal and the The area between the first external terminals.

(19) The insulating layer forming step of forming an insulating layer between the substrate and the Hall element, wherein the exposing step comprises: sealing the insulating layer from the sealing layer The step of exposing the component.

(20) The external terminal of the plurality of external terminals having the step on the second surface, wherein the external terminals are The first portion is provided on a side closer to a position at which the Hall element is placed, and the second portion is provided on a side away from a position at which the Hall element is placed, and the external terminals are disposed on the substrate When the surface of the substrate on which the metal plate is disposed is used as a reference surface, the height of the second surface to the first portion of each of the external terminals is formed to be lower than the second portion of the second portion. The height of the face.

According to an aspect of the present invention, a method of manufacturing a Hall sensor with a thin and small size and a small variation in magnetic characteristics, and a Hall sensor and a lens module can be provided.

10‧‧‧ Hall element

11‧‧‧Substrate

12‧‧‧Magnetic induction department

13a‧‧‧Electrode

13b‧‧‧Electrode

13c‧‧‧Electrode

13d‧‧‧Electrode

21a‧‧‧Lead terminal

21b‧‧‧Lead terminal

21c‧‧‧Lead terminal

21d‧‧‧Lead terminal

30‧‧‧Substrate

31a‧‧‧Wire

31b‧‧‧Wire

31c‧‧‧Wire

31d‧‧‧Wire

40‧‧‧Insulation

50‧‧‧ Sealing members

60‧‧‧External plating

60a‧‧‧Outer plating

60b‧‧‧Outer plating

60c‧‧‧External plating

60d‧‧‧Outer plating

80‧‧‧Heat resistant film

90‧‧‧Mold mould

91‧‧‧ Lower mold

92‧‧‧Upper mold

93‧‧‧ cutting protective tape

100‧‧‧ Hall sensor

120‧‧‧Metal plates

130‧‧‧Adhesive layer

510‧‧‧ Hall element

512‧‧‧Magnetic induction department

513a‧‧‧Electrode

513b‧‧‧Electrode

525‧‧‧Lead terminal

527‧‧‧Lead terminal

530‧‧‧Substrate

540‧‧‧Insulation

600‧‧‧ suction

A‧‧‧Contacts

A‧‧‧1st connection point

B‧‧‧Area

B‧‧‧2nd connection point

D‧‧‧ step

E‧‧‧ bottom

Part of the surface of the Ga‧‧‧ surface after half etching

Part of the Gb‧‧‧ back half-etched

H‧‧‧ Hole Department

H1‧‧‧ Height

H2‧‧‧ height

M‧‧‧ datum

M1‧‧‧ first side

M2‧‧‧2nd

N1‧‧‧Part 1

N2‧‧‧ second part

P1‧‧‧ height

P2‧‧‧ height

S‧‧‧ side

T‧‧‧ highest point

T‧‧‧ Height

Fig. 1 is a cross-sectional structural view for explaining the subject of the Hall sensor of the present invention.

2(a) to 2(c) are views for explaining the configuration of the first embodiment of the Hall sensor of the present invention.

Figure 3 is an overall perspective view of the Hall sensor shown in Figures 2(a) through (c).

4(a) and (b) are structural diagrams of specific Hall elements.

Figure 5 is a cross-sectional view showing the structure of the Hall sensor of the present invention.

Fig. 6 (a) and (b) are views showing a metal plate used in the manufacture of the Hall sensor of the first embodiment.

7(a) to 7(e) are plan views showing the steps of a method of manufacturing a Hall sensor.

8(a) to (d) are cross-sectional views showing the steps of a method of manufacturing a Hall sensor.

In the following detailed description, numerous specific details are set forth However, it is clear that even without specific details, it can be implemented in one or more implementations. In addition, well-known structures and devices are also shown in the simplification of the drawings.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.

<Embodiment 1>

(constitution)

2(a) to 2(c) are views for explaining the configuration of the first embodiment of the Hall sensor of the present invention, and Fig. 2(a) is a cross-sectional view taken along line AA of Fig. 2(b), and Fig. 2(b) 2(a) is a top view of FIG. 2(a), and FIG. 3 is an overall perspective view of the Hall sensor shown in FIGS. 2(a) to (c). Further, Ga denotes a portion after the surface is half-etched, and Gb denotes a portion after the half etching is performed on the back surface.

The Hall sensor 100 according to the first embodiment includes a Hall element 10, a plurality of lead terminals 21a to 21d (external terminals), a plurality of wires 31a to 31d, and a sealing member 50.

The Hall element 10 includes a substrate 11, a magnetic sensing portion 12 provided on the substrate 11 (or in the substrate 11), and a plurality of electrode portions 13a to 13d connected to the magnetic sensing portion 12. Furthermore, in FIG. 2(a), the case where the magnetic induction portion 12 is provided on the substrate 11 is shown in an enlarged view.

Further, a plurality of lead terminals 21a to 21d are disposed along the periphery of the Hall element 10, that is, the bottom surface of the sealing member 50 so as to surround the four corners of the Hall element 10.

Further, the plurality of wires 31a to 31d are electrically connected to each of the electrode portions 13a to 13d of the plurality of electrode portions 13a to 13d and each of the lead terminals 21a to 21d of the plurality of lead terminals 21a to 21d.

Further, the sealing member 50 covers the Hall element 10, the plurality of lead terminals 21a to 21d, and the plurality of wires 31a to 31d. As the sealing member 50, a resin structure such as a mold resin is preferable. Pieces.

Further, each of the lead terminals 21a to 21d has a second surface M2 connected to the respective lead wires 31a to 31d and a first surface M1 opposite to the second surface M2. The first surface M1 is self-sealing from the bottom surface E of the sealing member 50. Exposed.

Further, any one of the plurality of lead terminals 21a to 21d, at least one of the lead terminals 21a to 21d, has a step D on the second surface M2. That is, the lead terminals have a step. It is preferable that all of the lead terminals of the lead terminals 21a to 21d have a step D on the second surface M2.

Further, with the step D as a boundary, the plurality of lead terminals 21a to 21d have the first portion N1 on the side close to the Hall element 10 of each of the lead terminals 21a to 21d having the step D, on the side away from the Hall element 10. The height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1 is lower than the second surface M2 from the bottom surface E of the sealing member 50 to the second surface M2 of the second portion N2. The height is p2.

In other words, the relationship between the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1 and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 of the second portion N2 has p1. <p2 relationship. Further, each of the wires 31a to 31d is connected to the second surface M2 of the second portion N2 of each of the lead terminals 21a to 21d having the step D.

In the present embodiment, the external terminals 21a to 21d are formed such that the second portion N2 to which the plurality of wires are connected is closer to the first portion N1 of the Hall element than the second portion N2, and the bottom surface E of the sealing member is formed as a reference. The height p2 of the second surface side of the second portion N2 of the surface is lower than the height difference p1 of the second surface side of the first portion N1 with the bottom surface E of the sealing member as the reference surface. The step is preferably a shape having a slope shape or a curved shape that is recessed toward the bottom surface side of the sealing member in the cross-sectional view. The step D has a flat upper surface and a lower surface, and the upper surface and the lower surface may be a bevel shape, a curved shape, or a combination thereof, or may be obtained from the upper surface in a bevel shape, a curved shape, or a combination thereof. To the end of the external terminal.

In other words, in general, the suction device is used when the Hall element 10 is placed at a specific position. The front end of the suction device is mostly elliptical or polygonal, in order to prevent the suction device and the plurality of leads The contact of the terminals 21a to 21d is provided with a step D on the periphery of an elliptical or polygonal region centered on the Hall element 10 in plan view. That is, in a plan view, a step D is provided at a position corresponding to the shape of the front end of the suction tool centering on the Hall element 10 and for arranging the Hall element. Further, since the front end of the suction tool is particularly round in shape, it is preferable to set the step D on the circumference centering on the Hall element 10 in order to prevent the contact of the suction tool. Further, a step D is formed on the periphery of the region surrounding the Hall element 10. The Hall element 10 may be provided on the periphery of a region having a circular shape, a polygonal shape, or a combination thereof in a plan view. Specifically, the periphery of the perfect circle region, the periphery of the elliptical region, the periphery of the polygonal region, and the periphery of the region in which the curved line and the straight line are combined may be cited.

Further, at least one of the plurality of lead terminals 21a to 21d has a step D and has a relationship of p1 < p2, whereby the wire can be prevented from being broken by contact with the edge of the lead terminal. Further, from the viewpoint of the strength of the entire Hall sensor, it is preferable to make the area of the first portion N1 on the lead terminal as small as possible.

When the second surface M2 of the lead terminal 21a has a plurality of steps, the step difference closest to the Hall element 10 is set to a step D, and the step D is set as a boundary, and the side closer to the Hall element 10 is provided. In the first portion N1, the side away from the Hall element 10 is referred to as a second portion N2. The same applies to the lead terminals 21b to 21d. The step D formed on the second surface M2 of the lead terminals 21a to 21d is sealed by the sealing member 50.

Further, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1 is configured to be lower than the height h1 from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10. In the case of this example, the highest point of the Hall element 10 is the electrode portions 13a to 13d, so that the height p1 is formed lower than the bottom surface E of the self-sealing member 50 to the respective electrode portions 13a to 13d of the Hall element 10. Height h1.

The height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1, the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 of the second portion N2, and The height h1 from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10 has a relationship of p1 < h1 < p2. In other words, the height h1 from the bottom surface E of the sealing member 50 to the contact point where the electrode portion of the Hall element contacts the plurality of wires is lower than the second surface side of the first portion N1 with the bottom surface E of the sealing member 50 as the reference surface. The height p1.

The Hall element 10 is thin, and the height from the bottom surface E of the self-sealing member 50 to the highest point of the Hall element 10 is lower than the height from the bottom surface E to the highest point of the lead terminals 21a to 21d. Since the front end is particularly easy to come into contact with the lead terminals 21a to 21d, the step D is particularly effective in the case of such a configuration.

Further, the height h1 from the bottom surface E of the sealing member 50 to each of the electrode portions 13a to 13d and the first connection point a of each of the wires 31a to 31d is configured to be lower than the bottom surface E of the self-sealing member 50 to each of the lead terminals 21a to 21d. The height h2 from the second connection point b of each of the wires 31a to 31d.

In other words, the height h1 from the bottom surface E of the sealing member 50 to the first connection point a and the height h2 from the bottom surface E of the sealing member 50 to the second connection point b have a relationship of h1 < h2.

Since the Hall sensor of the first embodiment has a relationship of h1 < h2, the wires 31a to 31d are less likely to come into contact with the edge of the substrate 11 of the Hall element, and leakage current is less likely to occur. Thereby, a Hall sensor that is thin and can accurately detect magnetic properties can be realized.

Further, the Hall sensor of the first embodiment has a structure in which the edge of the lead terminal is easily brought into contact with the lead wire, but the edge contact of the lead terminal is connected to only two portions of the lead terminal of the same potential. There is no particular problem with the status.

Further, the lead terminals 21a to 21d are exposed from the side surface S of the sealing member 50. In other words, since the lead terminals 21a to 21d are exposed from the side surface S of the sealing member 50, the portion exposed to the bottom surface of the lead terminals 21a to 21d (the bottom surface electrode) can be used, and the portion exposed to the side surface (side surface electrode) can be used. installation. In particular, the ratio of the side electrodes in the overall thickness can be increased, so that the mounting becomes easy. Further, the contact between the lead terminal and the solder is inferior, and the conduction cannot be obtained, and the mounting reliability is high. Further, the visibility of the visual inspection after solder mounting is improved, and it is possible to easily confirm whether or not welding is performed without any problem.

Further, the plurality of wires 31a to 31d are wired so that the plurality of electrode portions 13a to 13d are joined for the first time, and the second surface M2 of the second portion N2 of the plurality of lead terminals 21a to 21d is joined for the second time. Engage.

Thus, the wire bonding is performed from the lower side to the upper side, so that the metal wire is difficult to contact the edge of the Hall element. Thereby, even if the distance between the Hall element and the lead terminal is shortened, it is difficult to cause edge contact. Thereby, the distance between the Hall element and the lead terminal can be shortened, and miniaturization can be achieved.

Alternatively, the plurality of wires 31a to 31d are wired so that the second surface M2 of the second portion N2 of the plurality of lead terminals 21a to 21d is joined for the first time and the plurality of electrode portions 13a to 13d are joined for the second time. Engage.

In this way, the wire bonding is performed from the higher side to the lower side, so that the apex of the wire bonding can be reduced, and the thickness can be reduced.

Further, the plurality of wires 31a to 31d may have the plurality of electrode portions 13a to 13d being joined for the first time, and the second surface M2 of the first portion N1 of the plurality of lead terminals 21a to 21d may be joined for the second time. Wire bonding.

Further, the plurality of wires 31a to 31d may be such that the second surface M2 of the first portion N1 of the plurality of lead terminals 21a to 21d is joined for the first time, and the plurality of electrode portions 13a to 13d are joined for the second time. Wire bonding.

Further, an insulating layer 40 is further provided on the surface of the substrate 11 opposite to the surface on which the plurality of electrode portions 13a to 13d are provided. The insulating layer 40 is exposed from the bottom surface E of the sealing member 50.

In the first embodiment, examples of the insulating layer 40 include an insulating resin layer and an insulating sheet. The insulating layer 40 may be a resistor having a higher resistance than the Hall element. For example, it is preferable that the insulating layer 40 has a volume resistivity of 10 ⁸ to 10 ²⁰ (Ω·cm). More preferably, the volume resistivity of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω·cm). When the insulating layer 40 is several mm square and the thickness is several μm, the electric resistance of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω), and the resistance of the Hall element is usually about 10 ⁹ Ω or less, so that it has sufficient insulation.

In the insulating layer 40, it is more preferable to contain, for example, an epoxy-based thermosetting resin as a component thereof and cerium oxide (SiO ₂ ) as a filler. The insulating layer 40 is in contact with the back surface of the Hall element 10, that is, the surface opposite to the surface having the magnetic induction portion 12, and the back surface of the Hall element 10 is covered by the insulating layer 40. The back surface of the Hall element 10 is entirely covered by the insulating layer 40, which is preferable from the viewpoint of suppressing generation of leakage current. In the insulating layer 40, the thickness of the portion covering the back surface of the Hall element 10 is determined by the size of the filler, and is, for example, 5 μm or more.

The Hall element 10 has, for example, a semi-insulating gallium arsenide (GaAs) substrate 11, a magnetic induction portion (active layer) 12 including a semiconductor thin film formed on the GaAs substrate 11, and an electrode portion electrically connected to the magnetic induction portion 12. 13a to 13d. The magnetic induction portion 12 is, for example, a cross (intersection) type in plan view, and electrodes 13a to 13d are provided on the four distal end portions of the intersection. The pair of electrodes 13a and 13c facing the plan view phase are configured to cause a current to flow through the input terminal of the magnetic induction portion 12, and the other pair of electrodes facing the opposite sides of the line connecting the electrodes 13a and 13c in a plan view. 13b and 13d are output terminals for outputting a voltage from the magnetic induction unit 12. In order to reduce the thickness of the Hall element 10, the surface of the substrate 11 opposite to the surface on which the magnetic induction portion (active layer) 12 is provided may be polished. The size of the Hall element 10 is, for example, 0.1 mm or more and 0.4 mm or less in length, 0.1 mm or more and 0.4 mm or less in width, and 0.05 mm or more and 0.20 mm or less in thickness.

The Hall sensor 100 has an islandless structure and has a plurality of lead terminals 21a to 21d for obtaining electrical connection with the outside. As shown in FIG. 2(b), the lead terminals 21a to 21d are disposed around the Hall element 10, for example, near the four corners of the Hall sensor 100. For example, the lead terminal 21a and the lead terminal 21c are disposed to face each other with the Hall element 10 interposed therebetween. Moreover, the lead terminal 21b and the lead terminal 21d are arranged to face each other with the Hall element 10 interposed therebetween. Further, the lead terminals 21 to 21d are disposed so as to intersect the straight line (the imaginary line) connecting the lead terminal 21a and the lead terminal 21c and the straight line (the imaginary line) connecting the lead terminal 21b and the lead terminal 21d in a plan view.

In other words, the plurality of lead terminals include the first to fourth lead terminals, and the first to fourth lead terminals are such that a virtual straight line connecting the first lead terminal and the third lead terminal and the second lead terminal and the fourth lead terminal are connected The imaginary straight lines are arranged so as to intersect each other in a plan view.

The lead terminals 21a to 21d include, for example, a metal such as copper (Cu). Further, one of the surface side or the back surface of the lead terminals 21a to 21d may be etched (i.e., half-etched).

Further, although not shown, on the surfaces of the lead terminals 21a to 21d (on the upper side of FIG. 2(a)), the surfaces of the lead terminals 21a to 21d connected by the wires 31a to 31d are plated with Ag, and the self-electricity thereof is applied. It is preferred from the viewpoint of sexual connection.

Further, nickel (Ni)-palladium (Pd)-gold (Au) or the like may be applied to the surface and the back surface of the lead terminals 21a to 21d instead of the exterior plating layer 60. Although it is a Hall sensor, it can be implemented because it is not susceptible to a magnetic film, that is, a Ni plating film, because it has no island.

The wires 31a to 31d are wires for electrically connecting the electrode portions 13a to 13d of the Hall element 10 and the lead terminals 21a to 21d, respectively, and include, for example, gold (Au). As shown in Fig. 2(b), the lead wire 31a connects the lead terminal 21a and the electrode portion 13a, and the lead wire 31b connects the lead terminal 21b and the electrode portion 13b. Further, the lead wire 31c connects the lead terminal 21c and the electrode portion 13c, and the lead wire 31d connects the lead terminal 21d and the electrode 13d.

The sealing member 50 covers and protects at least the front surface side of the Hall element 10, the lead terminals 21a to 21d, that is, the side connected to the wire, and the wires 31a to 31d by resin sealing. The sealing member 50 contains, for example, an epoxy-based thermosetting resin and is resistant to high heat during reflow. Further, even when the sealing member 50 and the insulating layer 40 are, for example, the same epoxy-based thermosetting resin, the materials are different from each other. For example, the components contained are different, or even if the components are the same, the content ratio is different.

Further, as shown in FIG. 2(c), at the bottom side of the Hall sensor 100, that is, on the side of the wiring board, at least a part of the back surface of each of the lead terminals 21a to 21d and at least a part of the insulating layer 40 are respectively The sealing member 50 is exposed.

Further, the exterior plating layer 60 is formed on the lead terminals 21a to 21d exposed from the sealing member 50. The back. The exterior plating layer 60 contains, for example, tin (Sn) or the like.

According to this configuration, when the magnetic sensor (magnetic field) is detected using the Hall sensor 100, for example, the lead terminal 21a is connected to the power supply potential (+), and the lead terminal 21c is connected to the ground potential (GND) to cause current. The lead terminal 21a flows to the lead terminal 21c. Then, the potential difference V1-V2 between the lead terminals 21b and 21d (the Hall output voltage VH) is measured. The magnitude of the magnetic field is detected according to the magnitude of the Hall output voltage VH, and the direction of the magnetic field is detected based on the positive and negative of the Hall output voltage VH.

In other words, the lead terminal 21a is a power supply lead terminal that supplies a specific voltage to the Hall element 10. The lead terminal 21c is a ground lead terminal that supplies a ground potential to the Hall element 10. The lead terminals 21b and 21d are signal extraction lead terminals for taking out the Hall electromotive force signal of the Hall element 10.

4(a) and 4(b) are views showing a configuration of a specific Hall element, Fig. 4(a) is a cross-sectional view, and Fig. 4(b) is a plan view. However, the wires are not shown. In the figure, the symbol Ga indicates a portion where the surface is half-etched, and Gb indicates a portion after the half etching is performed on the back surface. 2(a) is a cross-sectional view taken along line A-A of FIG. 2(b), and FIG. 4(a) is a cross-sectional view taken along line B-B of FIG. 4(b).

In the Hall sensor shown in FIGS. 4(a) and 4(b), a lead terminal designed to have as little contact as the contact with the suction tool is used, and the surface of the lead terminal is half-etched. That is, the region where the suction device interferes is half-etched.

The Hall element of the Hall sensor shown in FIG. 4(b) is arranged to be rotated by 45 degrees with respect to the Hall element of the Hall sensor shown in FIG. 2(b). That is, the Hall element of the Hall sensor shown in FIG. 4(b) has a rectangular shape in plan view, and the Hall element is disposed such that the four vertices of the rectangle are respectively disposed on the lead terminal 21a in plan view. A region between the lead terminals 21b, a region between the lead terminal 21b and the lead terminal 21c, a region between the lead terminal 21c and the lead terminal 21d, and a region between the lead terminal 21d and the lead terminal 21a.

By arranging the Hall element in this direction, the Hall sensor can be made small overall. Chemical. However, if the Hall element is disposed in this way, the chuck is easily brought into contact with the lead terminal when the Hall element is placed. Therefore, when the Hall element is thus disposed, a step is set on the second surface M2 of the lead terminals 21a to 21d. D is particularly effective for preventing suction contact. Furthermore, the above rectangle includes a square.

In the first embodiment, the island-free structure in which the metal element island on which the Hall element 10 is placed is not present between the Hall element 10 and the bottom surface E of the sealing member 50 is mainly described. An island is provided between the Hall element 10 and the bottom surface E of the sealing member 50. Further, the island may be electrically connected to the ground lead terminal 21c. However, from the viewpoint of thinning, it is preferable that no island is provided between the Hall element 10 and the bottom surface E of the sealing member 50.

Further, in the first embodiment, the case where all of the plurality of lead terminals 21a to 21d have the step D has been described as an example, but the lead terminals 21a to 21d need not all have the step D, and the lead terminals 21a to 21d At least one of the lead terminals has a step D.

Further, in the first embodiment, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1 is from the bottom surface E of the sealing member 50 to the second surface M2 of the second portion N2. The height p2 and the relationship between the height h1 from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10 have a relationship of p1 < h1 < p2 as a center, but may be p2 < h1. Even if p2 < h1, the step D is effective for preventing contact of the suction tool. For example, in the case of p2<h1<1.5×p2, or the case of p2<h1<1.3×p2, p2<h1<1.1×p2, etc., when p2 and h1 are heights that are not excessively changed, the step difference D is particularly effective for preventing contact with the suction device. P2 is, for example, 0.05 mm or more and 0.20 mm or less, and h1 is, for example, 0.05 mm or more and 0.20 mm or less, and p1 is, for example, 0.02 mm or more and 0.15 mm or less.

In the first embodiment, the height h1 from the bottom surface E of the sealing member 50 to the first connection point a is equal to each of the electrode portions 13a to 13d. However, the self-sealing member 50 is described as an example. The height h1 from the bottom surface E to the first connection point a may be different in the electrode portions 13a to 13d. Also, similarly, from the bottom surface E of the self-sealing member 50 to the second connection point b The height h2 so far may be different among the lead terminals 21a to 21d. In the case where the electrode portion and the lead terminal connected to one common wire are one unit, at least one unit satisfies the height h1 < h2. However, it is preferable that the height h1 < h2 is satisfied in all the cells.

Figure 5 is a cross-sectional view showing the structure of the Hall sensor of the present invention. Since the base material 30 is described as a Hall element disposing step of the manufacturing method of the Hall sensor described below, the base material 30 is removed at the exposure step of exposing the first surface M1 of the lead terminals 21a to 21d. .

The Hall element 10 is disposed such that the highest point T of the Hall element 10 is higher than the second surface M2 of the first portion N1 of the lead terminal and is higher than the second portion N2 with the bottom surface of the sealing member 50 as the reference surface M. 2 positions with low M2. That is, the height t from the bottom surface E of the sealing member 50 to the highest point T of the Hall element 10, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1, and the self-sealing member 50 The height p2 from the bottom surface E to the second surface M2 of the second portion N2 has a relationship of p1 < t < p2.

Further, the plurality of lead terminals 21a to 21d include first to fourth lead terminals, and the first to fourth lead terminals are arranged such that a virtual straight line connecting the first lead terminal and the third lead terminal and the second lead terminal and the second lead terminal are connected The imaginary straight line of the 4-lead terminal crosses in a plan view. The Hall element 10 has a rectangular shape in a plan view, and the Hall element 10 is disposed in a region where the four apexes of the Hall element 10 are disposed between the first lead terminal and the second lead terminal in plan view, and the second lead a region between the terminal and the third lead terminal, a region between the third lead terminal and the fourth lead terminal, and a position of a region between the fourth lead terminal and the first lead terminal.

Further, the insulating layer 40 is disposed on a surface of the Hall element 10 opposite to the surface on which the plurality of electrode portions 13a to 13d are disposed, and the insulating layer 40 is exposed from the bottom surface E of the sealing member 50.

Further, each of the lead terminals has a step D on the second surface M2, and each of the lead terminals has a first portion N1 on the side close to the Hall element 10 and a side away from the Hall element 10 on the side of the step D. At the second portion N2, the bottom surface E of the sealing member 50 is used as the reference surface M, and The height p1 from the second surface M2 of the first portion N1 of the wire terminal is formed to be lower than the height p2 to the second surface M2 of the second portion N2. In other words, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 of the first portion N1 and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 of the second portion N2 have p1 < p2. Relationship.

The Hall sensor 100 has a size of, for example, 0.2 mm or more and 0.6 mm or less, a width of 0.4 mm or more and 1.2 mm or less, and a thickness of 0.1 mm or more and 0.3 mm or less.

(Production method)

6(a) and 6(b) are views showing a metal plate used in the manufacture of the Hall sensor of the first embodiment. Fig. 6(a) is a front view, and Fig. 6(b) is a rear view. The metal plate 120 has a structure in which the portions of the Hall sensors that are connected to the lead terminals are connected. In the figure, the symbol H indicates a hole portion, and the hatched portion indicates a half-etched region. The area surrounded by the dotted line is the area used in one Hall sensor, and the area between the dotted line and the broken line is the area B (the slit width) through which the cut teeth pass during cutting.

In the method of manufacturing a Hall sensor according to the first embodiment, the Hall sensor includes a plurality of lead terminals 21a to 21d, a Hall element 10 having a plurality of electrode portions 13a to 13d, and an electrical connection plural Each of the lead terminals of the lead terminals 21a to 21d and the plurality of wires 31a to 31d of the electrode portions of the plurality of electrode portions 13a to 13d, the method of manufacturing the Hall sensor includes: a lead terminal disposing step, which will form a plurality of The metal plates 120 of the lead terminals 21a to 21d are disposed on the substrate; the Hall element disposing step places the Hall element 10 in a region surrounded by the plurality of lead terminals 21a to 21d; and the connecting step uses a plurality of wires 31a to 31d. The plurality of electrode portions 13a to 13d are electrically connected to the plurality of lead terminals. In the sealing step, the Hall element 10, the plurality of wires 31a to 31d, and the surface of each of the lead terminals connected to the wires are the second member by the sealing member. The surface M2 is sealed; and the exposing step removes the substrate, and the first surface M1 of the lead terminal opposite to the second surface M2 is exposed from the sealing member 50.

Further, the plurality of lead terminals include at least the first lead terminal, and the first lead terminal is on the two sides On the M2, in the plan view, there is a step D on the periphery of the elliptical or polygonal region centering on the position at which the Hall element 10 is placed, with the step D as the boundary, and the first lead terminal is close to the load. The first portion N1 is provided on the side where the Hall element 10 is placed, and the second portion N2 is provided on the side away from the position on which the Hall element 10 is placed. When the first lead terminal is placed on the substrate, the base is formed. The surface of the metal plate 120 is placed on the reference surface M, and the height p1 to the second surface M2 of the first portion N1 is lower than the height p2 to the second surface M2 of the second portion N2. In other words, the height p1 up to the second surface M2 of the first portion N1 and the height p2 to the second surface M2 of the second portion N2 have a relationship of p1 < p2.

Further, the first lead terminal has a step D around the elliptical shape centering on the position at which the Hall element 10 is placed in plan view. Further, the lead terminal has a step D on the circumference centered on the position at which the Hall element 10 is placed in plan view.

The first lead terminal is on the second surface M2 and has a step D at a position corresponding to the shape of the front end of the suction device centered on the position at which the Hall element 10 is placed in a plan view, with the step D as a boundary. The lead terminal has a first portion N1 on a side closer to the position on which the Hall element 10 is placed, a second portion N2 on a side away from the position on which the Hall element 10 is placed, and a metal plate 120 disposed on the substrate 30. The surface is the reference surface M, and the height p1 from the second surface M2 of the first portion N1 of the lead terminal is formed to be lower than the height p2 to the second surface M2 of the second portion N2.

Further, the Hall element arranging step includes the step of arranging the Hall element 10 such that the highest point T of the Hall element 10 is higher than the lead terminal, with the surface of the substrate 30 on which the metal plate 120 is disposed as the reference surface M. The second surface M2 of the first portion N1 of 21a to 21d is higher than the second surface M2 of the second portion N2.

Further, the Hall element arranging step may include a step of arranging the Hall element 10 at a position where the highest point T of the Hall element 10 is higher than the second surface M2 of the second portion N2. Even if p2 < T, the step D is effective for preventing contact of the suction tool. For example, in the case of p2<T<1.5×p2, or the case of p2<T<1.3×p2, p2<T<1.1×p2 When the situation, such as p2 and T, is a case where the height is not excessively changed, the step D is particularly effective for preventing contact of the suction tool.

Further, the plurality of lead terminals 21a to 21d include first to fourth lead terminals, and the first to fourth lead terminals are arranged such that a virtual straight line connecting the first lead terminal and the third lead terminal and the second lead terminal and the second lead terminal are connected The imaginary straight line of the four lead terminals intersects in plan view, and the Hall element 10 has a rectangular shape in plan view, and the Hall element arranging step includes the step of arranging the Hall element 10 so as to make the Hall element 10 4 in plan view. The apex is disposed in a region between the first lead terminal and the second lead terminal, a region between the second lead terminal and the third lead terminal, a region between the third lead terminal and the fourth lead terminal, and a fourth lead The area between the terminal and the first lead terminal.

Further, an insulating layer forming step of forming the insulating layer 40 between the substrate 30 and the Hall element 10, and the exposing step includes a step of exposing the insulating layer 40 from the sealing member 50.

Further, each of the plurality of lead terminals has a step D on the second surface, and the step D is a boundary, and each of the lead terminals has the first portion N1 on the side on which the Hall element 10 is placed, and is away from The second portion N2 is provided on the side where the Hall element 10 is placed, and when the metal plate is placed on the substrate, the surface of the substrate 30 on which the metal plate 120 is placed is used as the reference surface M, and each of the lead terminals is placed on the substrate M. The height p1 from the second surface M2 of the first portion N1 of the lead terminal is formed to be lower than the height p2 to the second surface M2 of the second portion N2.

7(a) to 7(e) are plan views showing the steps of a method of manufacturing a Hall sensor. Further, in Figs. 7(a) to (e), the area between the broken line and the broken line is the area B (the slit width) through which the cut teeth are cut at the time of cutting.

As shown in FIG. 7(a), first, a metal plate 120 on which the lead terminals are formed is prepared. The metal plate 120 has a structure in which a plurality of lead terminals 21a to 21d shown in FIG. 2(b) are connected in the vertical direction and the lateral direction in plan view. The material of the metal plate 120 is, for example, copper.

Next, as shown in FIG. 7(b), on the back side of the metal plate 120, for example, one surface of the heat-resistant film 80 is attached as a substrate. One surface of the heat resistant film 80 is coated with, for example, an insulating property. Adhesive layer. In the adhesive layer, as a component thereof, for example, an anthrone resin is used as a substrate. The metal plate 120 is easily attached to the heat resistant film 80 by the adhesive layer. By the heat-resistant film 80 being attached to the back surface side of the metal plate 120, the penetration region through which the metal plate 120 penetrates is in a state in which the heat-resistant film 80 is clogged from the back side.

Further, as the heat-resistant film 80 which is a substrate, it is preferable to use a tape made of a resin having adhesiveness and heat resistance.

Regarding the adhesion, it is preferred that the thickness of the paste of the adhesive layer is thinner. Further, regarding heat resistance, it is required to be able to withstand a temperature of about 150 ° C to 200 ° C. As such a heat resistant film 80, for example, a polyimide tape can be used. The polyimide lens has a heat resistance against about 280 °C. Such a high heat-resistance polyimide tape can also be applied to the subsequent casting or wire bonding. Further, as the heat-resistant film 80, in addition to the polyimide film, the following tape may be used.

(1) Polyester tape, heat resistant temperature is about 130 ° C (but the heat resistant temperature is about 200 ° C depending on the conditions of use)

(2) Teflon (registered trademark) tape, heat resistant temperature of about 180 ° C

(3) PPS (polyphenylene sulfide), heat resistant temperature of about 160 ° C

(4) Glass cloth, heat resistant temperature is about 200 ° C

(5) Nome paper, heat resistant temperature is about 150~200°C

(6) Further, an aromatic polyamide or crepe paper can be used as the heat-resistant film 80.

Next, an insulating paste is applied to a region of the heat-resistant film 80 having the adhesive layer surrounded by the lead terminals 21a to 21d. Here, in the Hall sensor 100 after completion, the coating conditions of the insulating paste are adjusted so that one part of the back surface of the Hall element 10 is not exposed from the sealing member 50 such as a mold resin (for example, coating Range or thickness of coating, etc.).

Next, as shown in FIG. 7(c), the Hall element 10 is placed on the region of the heat-resistant film 80 coated with the insulating paste (that is, the die-bonding is performed). Then, heat treatment (that is, curing) is performed after bonding, and the insulating paste is cured to serve as the insulating layer 40.

Next, as shown in Fig. 7(d), one ends of the wires 31a to 31d are respectively connected to the respective lead terminals 21a to 21d, and the other ends of the wires 31a to 31d are respectively connected to the electrode portions 13a to 13d (i.e., wire bonding is performed). . Fig. 7(e) is a rear view of Fig. 7(d).

Then, the whole is sealed by the mold resin 50 (that is, resin sealing is performed). This resin sealing is performed, for example, using a transfer molding technique.

8(a) to (d) are cross-sectional views showing the steps of a method of manufacturing a Hall sensor. As shown in Fig. 8(a), a mold 90 having a lower mold 91 and an upper mold 92 is prepared, and a metal plate 120 after wire bonding is disposed in a cavity of the mold 90. Next, the heated and molten mold resin 50 is injected and filled into the cavity and the side of the heat-resistant film 80 having the adhesive layer 130 (i.e., the surface opposite to the metal plate 120). Thereby, at least the surface side of the Hall element 10 and the metal plate 120, and the wires 31a to 31d are resin-sealed. After the mold resin 50 is further heated and hardened, the mold resin 50 is taken out from the mold. Further, in any step after the resin sealing, for example, a symbol or the like (not shown) may be marked on the surface of the mold resin 50.

Next, as shown in FIG. 8(b), the heat-resistant film 80 is peeled off from the insulating layer 40 and the mold resin 50. Thereby, the insulating layer 40 remains on the back surface of the Hall element 10, and the heat resistant film 80 is peeled off from the insulating layer 40 and the mold resin 50.

Then, as shown in FIG. 8(c), the surface of the metal plate 120 exposed from the mold resin 50 (at least the back surface of each of the lead terminals 21a to 21d exposed from the mold resin 50) is subjected to exterior plating to form an exterior plating. The layers 60a to 60d are applied.

Next, as shown in Fig. 8(d), the cut protective tape is attached to the upper surface of the mold resin 50 (i.e., the side opposite to the surface of the Hall sensor 100 having the exterior plating layers 60a to 60d). 93. Then, for example, the doctor blade is relatively moved with respect to the metal plate 120 along the imaginary two-dot chain line shown in FIG. 7(e), and the mold resin 50 and the metal plate 120 are cut (ie, cut). That is, the mold resin 50 and the metal plate 120 are cut and diced for each of the plurality of Hall elements 10. The cut metal plate 120 becomes the lead terminals 21a to 21d.

Through the above steps, the Hall sensor 100 shown in Figs. 2(a) to (c) is completed.

<Embodiment 2>

Hereinafter, the second embodiment will be described. In the first embodiment described above, the case where the insulating paste is used as the insulating layer 40 covering the back surface of the Hall element 10 has been described. However, in the second embodiment, the insulating layer 40 is not limited to the insulating paste. As the insulating layer 40, for example, a die attach film, that is, a cut can be used. The adhesive layer of the adhesive crystal integrated film.

According to such a configuration, the following effects can be exhibited. That is, an adhesive layer of a die attach film is used as an insulating layer covering the back surface of the Hall element 10. Thereby, the coating step of the insulating paste can be omitted, so that the number of steps can be reduced.

<Embodiment 3>

The lens module of the present embodiment includes a Hall sensor, a lens holder to which a magnet is attached, and a drive coil for moving the magnet based on a Hall electromotive force signal which is an output signal from an external terminal of the Hall sensor. The Hall sensor of this embodiment is thin. The size is small and the magnetic characteristics are small, so that the magnetic field can be detected correctly. Therefore, the lens module can be miniaturized and the correct position detection can be performed. The Hall sensor of the present embodiment detects the magnetic field of the magnet attached to the lens holder, and causes a driving current to flow through the driving coil according to the detected output signal, thereby accurately performing auto focus control or Hand vibration correction control. Moreover, the Hall sensor of the present embodiment is thinned. The miniaturization makes it possible to position the Hall element inside the Hall sensor close to the magnet, thereby enabling better magnetic detection.

The present invention has been described with reference to the specific embodiments thereof, but is not intended to limit the invention. Various modifications of the disclosed embodiments will be apparent to those skilled in the <RTIgt; Therefore, it is to be understood that the scope of the invention is intended to cover such modifications and embodiments.

10‧‧‧ Hall element

11‧‧‧Substrate

12‧‧‧Magnetic induction department

13a‧‧‧Electrode

13c‧‧‧Electrode

21a‧‧‧Lead terminal

21c‧‧‧Lead terminal

30‧‧‧Substrate

40‧‧‧Insulation

D‧‧‧ step

M‧‧‧ datum

M1‧‧‧ first side

M2‧‧‧2nd

N1‧‧‧Part 1

N2‧‧‧ second part

P1‧‧‧ height

P2‧‧‧ height

T‧‧‧ Height

T‧‧‧ Height

Claims (20)

A Hall sensor includes: a Hall element having a plurality of electrode portions; a plurality of external terminals disposed around the Hall element; and a plurality of wires electrically connected to the plurality of wires Each of the electrode portions of the electrode portion and each of the external terminals of the plurality of external terminals; and a sealing member that seals the Hall element, the plurality of wires, and a second surface of the external terminal that is connected to the wire; a first surface of the external terminal opposite to the second surface is exposed from a bottom surface of the sealing member, the plurality of external terminals including at least a first external terminal, and the first external terminal is on the second surface, and Having a step on a periphery of a region surrounding the Hall element in a plan view, the first external terminal has a first portion on a side close to the Hall element, and is away from the Hall element The second portion has a second portion, and the height of the second surface to the first portion of the first external terminal is lower than the upper surface with the bottom surface of the sealing member as a reference surface Far above the height of the second surface of the second portion. The hall sensor according to claim 1, wherein the Hall element has a bottom surface of the sealing member as a reference surface, and a highest point of the Hall element is disposed above the first portion of the first external terminal. The second surface is higher and lower than the second surface of the second portion. The Hall sensor according to claim 1 or 2, wherein a height from the reference surface to a highest point of the Hall element is T, and the second portion of the second portion from the reference surface The height of the face is set to p2, and the above Hall element is placed at p2<T< 1.5 × p2 position. The Hall sensor according to any one of claims 1 to 3, wherein the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals are arranged to connect the first external terminal The virtual straight line with the third external terminal and the virtual straight line connecting the second external terminal and the fourth external terminal intersect in a plan view, and the Hall element has a rectangular shape in plan view, and is disposed in a plan view. Four vertices of the element are disposed in a region between the first external terminal and the second external terminal, a region between the second external terminal and the third external terminal, the third external terminal, and the fourth external a region between the terminals and a position of a region between the fourth external terminal and the first external terminal. The Hall sensor according to any one of claims 1 to 4, further comprising: an insulating layer disposed on a surface of the Hall element opposite to a surface on which the plurality of electrode portions are disposed, the insulating layer The layer is exposed from the bottom surface of the sealing member. The Hall sensor according to any one of claims 1 to 5, wherein each of the external terminals of the plurality of external terminals has the step difference on the second surface, and the external terminals are The first portion is provided on a side closer to the Hall element, and the second portion is provided on a side away from the Hall element, and the bottom surface of the sealing member is used as a reference surface, and the first portion of each of the external terminals is The height of the second surface is formed to be lower than the height of the second surface to the second portion. The Hall sensor according to claim 6, wherein each of the external terminals is formed on a periphery of a region having a circular shape, a polygonal shape, or a combination thereof in a shape of the Hall element in a plan view. Step difference. A Hall sensor having: a Hall element having a plurality of electrode portions; a plurality of external terminals disposed around the Hall element; and a plurality of wires electrically connected to the electrode portions of the plurality of electrode portions and the plurality of electrodes And an external member of the external terminal; and a sealing member that seals the Hall element, the plurality of wires, and a second surface of the external terminal that is connected to the wire; and the external surface of the external terminal The first surface on the opposite side is exposed from the bottom surface of the sealing member, and the external terminals are formed such that the second portion of the plurality of wires is closer to the first portion of the Hall element than the second portion. The height of the second surface side of the second portion having the bottom surface of the sealing member as a reference surface is lower than the height of the second surface side of the first portion having the bottom surface of the sealing member as a reference surface. The hall sensor of claim 8, wherein a height from a bottom surface of the sealing member to a contact point of the electrode portion of the Hall element contacting the plurality of wires is lower than a bottom surface of the sealing member The height of the second surface side of the first portion. A Hall sensor according to claim 8 or 9, wherein the step is formed in a curved shape or a curved shape which is recessed toward the bottom surface side of the sealing member in a plan view. The Hall sensor according to any one of claims 8 to 10, wherein each of the external terminals is in a shape of a circular shape, a polygonal shape, or a combination thereof in a shape of the Hall element in a plan view. On the periphery, the above-described step difference is formed. The Hall sensor according to any one of claims 8 to 11, wherein the Hall element has a substrate, a magnetic sensing portion disposed on the substrate or in the substrate, and the plurality of electrode portions connected to the magnetic sensing portion, An insulating layer is disposed on the Hall element and disposed above The surface of the plurality of electrode portions is the surface on the opposite side, and the insulating layer is exposed from the bottom surface of the sealing member. A lens module, comprising: the Hall sensor according to any one of claims 1 to 12; a lens holder to which a magnet is mounted; and a drive coil according to the external terminal from the Hall sensor The output signal causes the magnet to move. A Hall sensor manufacturing method, the Hall sensor includes a plurality of external terminals, a Hall element having a plurality of electrode portions, and respective external terminals electrically connected to the plurality of external terminals and the plurality of external terminals a plurality of wires of each electrode portion of the electrode portion, wherein the method of manufacturing the Hall sensor includes an external terminal disposing step of disposing a metal plate on which the plurality of external terminals are formed on a substrate, and a Hall element disposing step And arranging the Hall element in a region surrounded by the plurality of external terminals; and in the wire connecting step, electrically connecting the plurality of electrode portions and the plurality of external terminals by using the plurality of wires; and sealing step, using the sealing member a Hall element, the plurality of wires, and a second surface of the external terminal connected to the wire, wherein the second surface is sealed; and an exposing step of removing the substrate so that the external terminals are opposite to the second surface The first surface of the side is exposed from the sealing member; the plurality of external terminals include at least a first external terminal, and the first external terminal The second surface, and in plan view, having stepped to a position on the peripheral mounting of the Hall element as the elliptical shape or the center of the area of polygonal shape, The first external terminal has a first portion on a side close to a position on which the Hall element is placed, and a second portion on a side away from a position on which the Hall element is placed, the first external portion When the metal plate is placed on the substrate, the terminal is formed such that the surface of the substrate on which the metal plate is disposed is used as a reference surface, and the height of the second surface to the first portion is lower than The height of the second surface of the second portion. A Hall sensor manufacturing method, the Hall sensor includes a plurality of external terminals, a Hall element having a plurality of electrode portions, and respective external terminals electrically connected to the plurality of external terminals and the plurality of external terminals a plurality of wires of each electrode portion of the electrode portion, wherein the method of manufacturing the Hall sensor includes an external terminal disposing step of disposing a metal plate on which the plurality of external terminals are formed on a substrate, and a Hall element disposing step And arranging the Hall element in a region surrounded by the plurality of external terminals; and in the wire connecting step, electrically connecting the plurality of electrode portions and the plurality of external terminals by using the plurality of wires; and sealing step, using the sealing member a Hall element, the plurality of wires, and a second surface of the external terminal connected to the wire, wherein the second surface is sealed; and an exposing step of removing the substrate so that the external terminals are opposite to the second surface The first surface of the side is exposed from the sealing member; the plurality of external terminals include at least a first external terminal, and the first external terminal The second surface, and in a plan view, the shape of the tip to a position corresponding to the position of the suction tool is placed above the center of the Hall element having a stepped, The first external terminal has a first portion on a side close to a position on which the Hall element is placed, and a second portion on a side away from a position on which the Hall element is placed, the first external portion When the metal plate is placed on the base material, the height of the surface of the base material on the second surface is lower than the surface of the first surface. The height of the second surface of the second portion. The method of manufacturing a Hall sensor according to claim 14 or 15, wherein the Hall element arranging step comprises the step of: arranging the Hall element with a surface of the substrate on which the metal plate is disposed as a reference surface It is disposed at a position where the highest point of the Hall element is higher than the second surface of the first portion of the first external terminal and lower than the second surface of the second portion. The method of manufacturing a Hall sensor according to any one of claims 14 to 16, wherein the Hall element arranging step comprises the step of setting a height from the reference plane to a highest point of the Hall element. For T, the height of the second surface of the second portion from the reference surface is p2, and the Hall element is placed at a position where p2 < T < 1.5 × p2. The method of manufacturing a Hall sensor according to any one of claims 14 to 17, wherein the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals are arranged to connect the first A virtual straight line of the external terminal and the third external terminal intersects with a virtual straight line connecting the second external terminal and the fourth external terminal in a plan view, and the Hall element has a rectangular shape in a plan view, and the Hall element is disposed. The step includes disposing the Hall element such that four vertices of the Hall element are disposed between the first external terminal and the second external terminal in a plan view, and the second a region between the external terminal and the third external terminal, a region between the third external terminal and the fourth external terminal, and a region between the fourth external terminal and the first external terminal. The method of manufacturing a Hall sensor according to any one of claims 14 to 18, further comprising an insulating layer forming step of forming an insulating layer between said substrate and said Hall element, said exposing step comprising said insulating layer The step of exposing from the above sealing member. The method of manufacturing a Hall sensor according to any one of claims 14 to 19, wherein each of the external terminals of the plurality of external terminals has the step difference on the second surface, and the respective steps are defined by the step The external terminal has the first portion on a side close to a position at which the Hall element is placed, and has the second portion on a side away from a position at which the Hall element is placed, and the external terminals are disposed on the metal plate. In the case of the substrate, the surface of the substrate on which the metal plate is disposed is used as a reference surface, and the height of the second surface to the first portion of each of the external terminals is lower than the second portion. The height of the second surface above.