JP6085726B2 - Hall sensor manufacturing method, hall sensor, and lens module - Google Patents

Description

  The present invention relates to a Hall sensor manufacturing method, a Hall sensor, and a lens module.

  As a sensor for detecting a magnetic field, a magnetic sensor using a Hall element is known. For example, Patent Document 1 describes an islandless structure magnetic sensor using a pellet (magnetic sensor chip such as a Hall element) and a manufacturing method thereof.

International Publication No. 2014/091714

  By the way, with the recent thinning and miniaturization of electronic devices, a thinner and smaller Hall sensor is required. In order to make the magnetic sensor of Patent Document 1 described above thinner, it is effective to reduce the height of the conductive wire connecting the pellet and the lead terminal. In order to reduce the height of the conducting wire, it is effective to lower the member located at a higher position among the pellet and the lead terminal. In the case of the magnetic sensor of Patent Document 1, it is effective to make the pellet thinner to make the entire magnetic sensor thinner. In order to make the magnetic sensor of Patent Document 1 smaller, it is effective to reduce the distance between the pellet and the lead terminal. However, if the pellet is made thin and the distance between the pellet and the lead terminal is narrowed, the following problems occur.

  FIG. 1 is a cross-sectional configuration diagram for explaining a problem of the Hall sensor according to the present invention. FIG. 1 is a diagram showing a part of the manufacturing process of the Hall sensor, and shows a process of placing the Hall element 510 in a region surrounded by the lead terminals 525 and 527 using the collet 600. The lead terminals 525 and 527 are placed on the base material 530, and an insulating layer 540 is formed on the back surface of the Hall element 510. The Hall element 510 includes a magnetic sensing part 512 and electrode parts 513a and 513b. When the Hall element 510 is thin and the distance between the position where the Hall element 510 is placed and the lead terminals 525 and 527 is small, when the Hall element 510 is placed using the collet 600, the collet 600 becomes the lead terminal. 525 and 527 may be touched. When the collet 600 comes into contact with the lead terminals 525 and 527, the Hall element 510 may be placed at a position different from the position where the Hall element 510 is normally placed. Variation in the position of the Hall element 510 leads to variation in the position of the magnetic sensing part 512, and ultimately leads to variation in the magnetic characteristics of the Hall sensor. In addition, A has shown the contact location of a collet and a lead terminal.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a Hall sensor manufacturing method, a Hall sensor, and a lens module that are thin, small, and have little variation in magnetic characteristics. is there.

According to one aspect of the present invention, the following features are characterized.
(1); a Hall element having a plurality of electrode portions, a plurality of external terminals arranged around the Hall element, each electrode portion of the plurality of electrode portions, and each external terminal of the plurality of external terminals. A plurality of conductive wires that are electrically connected to each other, a sealing element that seals the Hall element, the plurality of conductive wires, and a second surface that is a surface connected to the conductive wires of each external terminal; The first surface of each external terminal opposite to the second surface is exposed from the bottom surface of the sealing member, and the plurality of external terminals include at least a first external terminal, The first external terminal has a step on the second surface and on the periphery of the region surrounding the Hall element in plan view, and the first external terminal has the step as a boundary. It has a first part on the side close to the Hall element and a second part on the side far from the Hall element. The height from the bottom surface of the sealing member to the second surface at the first portion of the first external terminal is higher than the height to the second surface at the second portion. A hall sensor connected to the second surface of the second part of the first external terminal, wherein the plurality of conductors includes at least a first conductor; is there.

(2); In (1), the Hall element has the highest point of the Hall element at the first portion of the first external terminal with the bottom surface of the sealing member as a reference plane. It is arranged at a position higher than the surface and lower than the second surface in the second part.
(3); Oite to (1), said Hall element, said as a reference surface a bottom surface of the sealing member, the height from the reference surface to the highest point of the Hall element T, from said reference plane The height of the second surface in the second portion is p2, and the second portion is arranged at a position where p2 <T <1.5 × p2.
(4); In any one of (1) to (3), the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals include the first The virtual straight line connecting the external terminal and the third external terminal and the virtual straight line connecting the second external terminal and the fourth external terminal are arranged so as to intersect in plan view, and the Hall element is The four vertices of the Hall element are regions between the first external terminal and the second external terminal, and the second external terminal and the third external surface. Arranged in the region between the external terminals, the region between the third external terminal and the fourth external terminal, and the region between the fourth external terminal and the first external terminal. Has been.

(5) In any one of (1) to (4), the Hall element includes an insulating layer disposed on a surface opposite to a surface on which the plurality of electrode portions are disposed, and the insulating layer includes: It is exposed from the bottom surface of the sealing member.
(6) In any one of (1) to (5), each external terminal of the plurality of external terminals has the step on the second surface, and each external terminal has the step as a boundary. , Having the first part on the side closer to the Hall element, having the second part on the side far from the Hall element, and using the bottom surface of the sealing member as a reference plane, the external terminals The height of the first part to the second surface is formed lower than the height of the second part to the second surface.
(7); In (6), each of the external terminals has the step formed on a circumference of a circular shape, a polygonal shape, or a combination thereof centered on the Hall element in plan view. ing.

(8); a Hall element having a plurality of electrode parts, a plurality of external terminals arranged around the Hall element, each electrode part of the plurality of electrode parts, and each external terminal of the plurality of external terminals. A plurality of conducting wires that are electrically connected to each other, and a sealing member that seals the Hall element, the plurality of conducting wires, and a second surface that is a surface connected to the conducting wires of each of the external terminals, A first surface opposite to the second surface of each external terminal is exposed from the bottom surface of the sealing member, and each external terminal is a second surface to which the plurality of conducting wires are connected. From the part to the first part closer to the Hall element than the second part, the height on the second surface side in the second part with the bottom surface of the sealing member as a reference surface is the sealing higher due stage than the height of the second surface side of the first portion and the reference surface to the bottom surface of the member A Hall sensor but is formed.

(9); In (8), the height from the bottom surface of the sealing member to the contact point where the electrode portion of the Hall element and the plurality of conductors contact each other is based on the bottom surface of the sealing member. It has higher than the height of the second surface side of the first portion.
(10); In (8) or (9), the step has a slope shape or a curved shape recessed in the bottom surface side of the sealing member in a sectional view.
(11); In any one of (8) to (10), each of the external terminals has a circular shape, a polygonal shape, or a combination thereof in a plan view centered on the Hall element. The step is formed on the circumference.

(12); In any one of (8) to (11), the Hall element includes a substrate, a magnetic sensing portion provided on or in the substrate, and the plurality of electrode portions connected to the magnetic sensing portion. And an insulating layer disposed on a surface opposite to a surface on which the plurality of electrode portions of the Hall element are disposed, and the insulating layer is exposed from the bottom surface of the sealing member.
(13); The magnet is moved based on the Hall sensor according to any one of (1) to (12), a lens holder to which a magnet is attached, and an output signal from the external terminal of the Hall sensor. And a driving coil.

  (14); a plurality of external terminals, a Hall element having a plurality of electrode portions, a plurality of lead wires electrically connecting the external terminals of the plurality of external terminals and the electrode portions of the plurality of electrode portions, respectively. A method of manufacturing a Hall sensor comprising: an external terminal arranging step of arranging a metal plate on which a plurality of external terminals are formed on a substrate; and arranging the Hall element in a region surrounded by the plurality of external terminals Hall element disposing step, conducting wire connecting step of electrically connecting the plurality of electrode portions and the plurality of external terminals with the plurality of conducting wires, the Hall element, the plurality of conducting wires, and the respective external terminals A sealing step of sealing the second surface, which is a surface connected to the conductive wire, with a sealing member, and removing the base material, and the second surface of each external terminal opposite to the second surface An exposing step of exposing one surface from the sealing member; The plurality of external terminals include at least a first external terminal, and the first external terminal is centered on a position where the Hall element is placed on the second surface and in plan view. The first external terminal has a first portion on a side near the position where the Hall element is placed, with the step as a boundary. And having a second part on the side far from the position where the Hall element is placed, and the first external terminal is formed on the base material when the metal plate is disposed on the base material. A hole in which the height to the second surface in the first portion is lower than the height to the second surface in the second portion, with the surface on which the metal plate is disposed as a reference surface. It is a manufacturing method of a sensor.

  (15); a plurality of external terminals, a hall element having a plurality of electrode portions, a plurality of lead wires electrically connecting the external terminals of the plurality of external terminals and the electrode portions of the plurality of electrode portions, respectively. A method of manufacturing a Hall sensor comprising: an external terminal arranging step of arranging a metal plate on which a plurality of external terminals are formed on a substrate; and arranging the Hall element in a region surrounded by the plurality of external terminals Hall element disposing step, conducting wire connecting step of electrically connecting the plurality of electrode portions and the plurality of external terminals with the plurality of conducting wires, the Hall element, the plurality of conducting wires, and the respective external terminals A sealing step of sealing the second surface, which is a surface connected to the conductive wire, with a sealing member, and removing the base material, and the second surface of each external terminal opposite to the second surface An exposing step of exposing one surface from the sealing member; The plurality of external terminals include at least a first external terminal, and the first external terminal is centered on a position where the Hall element is placed on the second surface and in plan view. And a step corresponding to the shape of the tip of the collet. The first external terminal has a first portion on the side close to the position where the Hall element is placed with the step as a boundary. And a second portion on the side far from the position where the Hall element is placed, and the first external terminal is arranged on the base when the metal plate is disposed on the base. A Hall sensor in which the height to the second surface in the first portion is lower than the height to the second surface in the second portion, with the surface on which the metal plate is disposed as a reference surface It is a manufacturing method.

(16) In (14) or (15), the Hall element placement step is characterized in that the Hall element is the highest point of the Hall element, with a surface on which the metal plate of the base is placed as a reference plane. And a step of disposing the first external terminal at a position that is higher than the second surface of the first portion and lower than the second surface of the second portion.
(17); In (14) or (15) , in the Hall element disposing step, the height from the reference plane to the highest point of the Hall element is defined as T, with the bottom surface of the sealing member as a reference plane. A step of disposing the Hall element at a position where p2 <T <1.5 × p2, where p2 is the height of the second surface at the second portion from the reference surface.

  (18); In any one of (14) to (17), the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals include the first The virtual straight line connecting the external terminal and the third external terminal and the virtual straight line connecting the second external terminal and the fourth external terminal are arranged so as to intersect in plan view, and the Hall element is It is rectangular in a plan view, and the Hall element disposing step is a plan view in which the four apexes of the Hall element are regions between the first external terminal and the second external terminal, A region between an external terminal and the third external terminal; a region between the third external terminal and the fourth external terminal; and a region between the fourth external terminal and the first external terminal. Disposing the Hall element to be disposed.

(19); In any one of (14) to (18), the method includes an insulating layer forming step of forming an insulating layer between the base material and the Hall element, and the exposing step includes sealing the insulating layer. Exposing from the member.
(20) In any one of (14) to (19), each external terminal of the plurality of external terminals has the step on the second surface, and each external terminal has the step as a boundary. , Having the first part on the side close to the position where the Hall element is placed, and having the second part on the side far from the position where the Hall element is placed, and each external terminal is When the metal plate is disposed on the base material, the surface of the base material on which the metal plate is disposed is used as a reference surface, and the height to the second surface of the first portion of each external terminal is high. Is formed lower than the height to the second surface in the second part.

  According to one embodiment of the present invention, it is possible to provide a Hall sensor manufacturing method, a Hall sensor, and a lens module that are thin, small, and have little variation in magnetic characteristics.

FIG. 1 is a cross-sectional configuration diagram for explaining a problem of the Hall sensor according to the present invention. FIGS. 2A to 2C are configuration diagrams for explaining the first embodiment of the Hall sensor according to the present invention. FIG. 3 is an overall perspective view of the Hall sensor shown in FIGS. 4A and 4B are configuration diagrams of specific Hall elements. FIG. 5 is a cross-sectional configuration diagram for explaining the Hall sensor according to the present invention. 6A and 6B are views showing a metal plate used for manufacturing the Hall sensor of the first embodiment. 7A to 7E are plan views showing the steps of the Hall sensor manufacturing method. 8A to 8D are cross-sectional views showing the steps of the Hall sensor manufacturing method.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present invention. However, it will be apparent that one or more embodiments may be practiced without such specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Hereinafter, each embodiment of the present invention will be described with reference to the drawings.

<Embodiment 1>
(Constitution)
FIGS. 2A to 2C are configuration diagrams for explaining the first embodiment of the Hall sensor according to the present invention. FIG. 2A is a cross-sectional view taken along line AA in FIG. 2 (b) is a plan view of FIG. 2 (a), FIG. 2 (c) is a bottom view of FIG. 2 (a), and FIG. 3 is an overall perspective view of the Hall sensor shown in FIGS. 2 (a) to 2 (c). Is shown. Ga represents a half-etched surface, and Gb represents a portion subjected to half-etching on the back surface.

The Hall sensor 100 according to the first embodiment includes a Hall element 10, a plurality of lead terminals 21a to 21d (external terminals), a plurality of conducting wires 31a to 31d, and a sealing member 50.
The Hall element 10 includes a substrate 11, a magnetic sensing part 12 provided on the substrate 11 (or in the substrate 11), and a plurality of electrode parts 13 a to 13 d connected to the magnetic sensing part 12. . In FIG. 2A, the case where the magnetic sensitive part 12 is provided on the substrate 11 is shown in an enlarged view.
The plurality of lead terminals 21 a to 21 d are arranged so as to surround the four corners of the Hall element 10 around the Hall element 10, that is, along the bottom surface of the sealing member 50.

The plurality of conductive wires 31a to 31d electrically connect each of the electrode portions 13a to 13d of the plurality of electrode portions 13a to 13d and each of the lead terminals 21a to 21d of the plurality of lead terminals 21a to 21d. .
The sealing member 50 covers the Hall element 10, the plurality of lead terminals 21a to 21d, and the plurality of conductive wires 31a to 31d. The sealing member 50 is preferably a resin member such as a mold resin.
Each lead terminal 21a to 21d has a second surface M2 connected to each of the conductive wires 31a to 31d and a first surface M1 opposite to the second surface M2, and this first surface. M1 is exposed from the bottom surface E of the sealing member 50.

In addition, at least one of the plurality of lead terminals 21a to 21d has a step D on the second surface M2. That is, the lead terminal has a step. All of the lead terminals 21a to 21d preferably have a step D on the second surface M2.
Further, the plurality of lead terminals 21a to 21d have the first portion N1 on the side close to the Hall element 10 of each lead terminal 21a to 21d having the step D with the step D as a boundary, and the side far from the Hall element 10 The height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first region N1 is the second portion N2 in the second region N2 from the bottom surface E of the sealing member 50. It is configured to be lower than the height p2 up to the second surface M2.

In the present embodiment, the external terminals 21a to 21d are connected to the bottom surface E of the sealing member from the second portion N2 to which the plurality of conductive wires are connected to the first portion N1 closer to the Hall element than the second portion N2. the height p2 of the second face of the second portion N2 with a reference surface, higher rather than the height p1 of the second face of the first portion N1 which is a reference plane bottom surface E of the sealing member A step is formed. The step is preferably in a form having a slope shape or a curved shape recessed in the bottom surface side of the sealing member in a sectional view. The step D may have a flat upper surface and a lower surface, and a space between the upper surface and the lower surface may be a slope shape, a curved shape, or a combination thereof, and a slope shape, a curved shape, or a combination thereof from the upper surface. You may reach the end of the external terminal.

  By the way, generally, a collet is used when placing the Hall element 10 at a predetermined position. Since the tip of the collet is often elliptical or polygonal, in order to prevent contact between the collet and the plurality of lead terminals 21a to 21d, an elliptical or polygonal region centered on the Hall element 10 in plan view A step D is provided on the circumference. That is, the step D is provided at a position corresponding to the shape of the tip of the collet used when arranging the Hall element in the plan view. Further, since the tip of the collet is often circular, it is preferable to provide a step D on the circumference centered on the Hall element 10 in order to prevent the collet from contacting. The step D is formed on the periphery of the region surrounding the Hall element 10. It may be provided on the circumference of a region having a circular shape, a polygonal shape, or a combination thereof in plan view with the Hall element 10 as the center. Specific examples include the circumference of a perfect circle area, the circumference of an elliptical area, the circumference of a polygonal area, and the circumference of an area having a combination of a curve and a straight line.

In addition, since at least one of the plurality of lead terminals 21a to 21d has a step D and has a relationship of p1 <p2, the conducting wire contacts the edge of the lead terminal and breaks. It is possible to suppress this. Moreover, it is preferable that the area of the 1st site | part N1 on a lead terminal shall be made as small as possible from the surface of the intensity | strength of the whole Hall sensor.
When there are a plurality of steps on the second surface M2 of the lead terminal 21a, the step closest to the Hall element 10 is defined as a step D, and the side closer to the Hall element 10 with the step D as a boundary is the first portion N1 and the Hall element The side far from 10 is defined as a second portion N2. The same applies to the lead terminals 21b to 21d. The step D formed on the second surface M2 of the lead terminals 21a to 21d is sealed with a sealing member 50.

Further, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 is lower than the height h1 from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10. It is configured. In the case of this example, since the highest point of the Hall element 10 is each electrode portion 13a to 13d, the height p1 is a height h1 from the bottom surface E of the sealing member 50 to each electrode portion 13a to 13d of the Hall element 10. It is configured lower than.
A height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first region N1, a height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second region N2, The height h1 from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10 has a relationship of p1 <h1 <p2. That is, the height h1 from the bottom surface E of the sealing member 50 to the contact point where the electrode portion of the Hall element and the plurality of conductors contact each other is the first portion N1 in the first region N1 with the bottom surface E of the sealing member 50 as the reference surface. It has higher than the second adhesive surface height p1.

Particularly in the case where the Hall element 10 is thin and the height from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10 is lower than the height from the bottom surface E to the highest point of the lead terminals 21a to 21d. The tip D is particularly effective in the case of such a configuration because the tip of the contact is easily brought into contact with the lead terminals 21a to 21d.
In addition, the height h1 from the bottom surface E of the sealing member 50 to the first connection point a between each of the electrode portions 13a to 13d and each of the conductive wires 31a to 31d is from the bottom surface E of the sealing member 50 to each of the lead terminals 21a to 21a. 21d and each conducting wire 31a thru | or 31d are comprised so that it may become lower than the height h2 to the 2nd connection point b.

That is, the height h1 from the bottom surface E of the sealing member 50 to the first connection point a and the height h2 from the bottom surface E of the sealing member 50 to the second connection point b are in a relationship of h1 <h2. have.
Since the Hall sensor of Embodiment 1 has a relationship of h1 <h2, the conducting wires 31a to 31d are unlikely to contact the edge of the substrate 11 of the Hall element, and a leak current is unlikely to occur. Thereby, it is possible to realize a hall sensor that is thin and capable of accurately detecting magnetism.
The Hall sensor according to the first embodiment has a structure in which the contact between the edge of the lead terminal and the lead wire is likely to occur. However, with respect to the edge touch of the lead terminal, two lead wires are connected to the lead terminal having the same potential. There is no problem in particular.

  The lead terminals 21 a to 21 d are exposed from the side surface S of the sealing member 50. That is, since the lead terminals 21a to 21d are exposed from the side surface S of the sealing member 50, the portion exposed to the side surface (the bottom electrode) in addition to the portion exposed to the bottom surface of the lead terminals 21a to 21d (the bottom electrode). It can be mounted using side electrodes). In particular, since the ratio of the side electrodes in the entire thickness can be increased, mounting is facilitated. In addition, the contact between the lead terminal and the solder is poor, and it is less likely that continuity cannot be obtained, and the mounting reliability is high. Furthermore, the visibility in the appearance inspection after solder mounting is improved, and it can be easily confirmed whether or not the soldering is performed without any problem.

In the plurality of conductive wires 31a to 31d, the plurality of electrode portions 13a to 13d are the first bonding, and the second surface M2 in the second portion N2 of the plurality of lead terminals 21a to 21d is the second bonding. Wire bonding is performed so that
Thus, since wire bonding is performed from the lower side to the higher side, the wire is less likely to contact the edge of the Hall element. Thereby, even if the distance between the Hall element and the lead terminal is shortened, the edge contact hardly occurs. As a result, the distance between the Hall element and the lead terminal can be shortened, and the size can be reduced.
Alternatively, in the plurality of conductive wires 31a to 31d, the second surface M2 in the second portion N2 of the plurality of lead terminals 21a to 21d is the first bonding, and the plurality of electrode portions 13a to 13d are the second bonding. Wire bonding is performed so that

Thus, since wire bonding is performed from the higher side to the lower side, the apex of the wire bonding can be lowered and the thickness can be reduced.
Further, in the plurality of conductive wires 31a to 31d, the plurality of electrode portions 13a to 13d are the first bonding, and the second surface M2 in the first portion N1 of the plurality of lead terminals 21a to 21d is the second bonding. You may wire-bond so that it may become.
In the plurality of conductive wires 31a to 31d, the second surface M2 in the first portion N1 of the plurality of lead terminals 21a to 21d is the first bonding, and the plurality of electrode portions 13a to 13d are the second bonding. You may wire-bond so that it may become.
The substrate 11 further includes an insulating layer 40 provided on the surface opposite to the surface on which the plurality of electrode portions 13a to 13d are provided. The insulating layer 40 is exposed from the bottom surface E of the sealing member 50.

In the first embodiment, examples of the insulating layer 40 include an insulating resin layer and an insulating sheet. The insulating layer 40 may be any resistance that is higher than the resistance of the Hall element. For example, it is preferable that the volume resistivity of the insulating layer 40 is 10 ⁸ to 10 ²⁰ (Ω · cm). More preferably, the volume resistivity of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω · cm). When the insulating layer 40 is several mm square and has a thickness of several μm, the resistance of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω), and the resistance of the Hall element is usually about 10 ⁹ Ω or less. Insulating property.
More preferably, the insulating layer 40 includes, for example, an epoxy thermosetting resin and silica (SiO ₂ ) as a filler. The insulating layer 40 is in contact with the back surface of the Hall element 10, that is, the surface opposite to the surface having the magnetic sensing portion 12, and the back surface of the Hall element 10 is covered with the insulating layer 40. It is preferable from the viewpoint of suppressing the occurrence of leakage current that the entire back surface of the Hall element 10 is covered with the insulating layer 40. The thickness of the portion of the insulating layer 40 that covers the back surface of the Hall element 10 is determined by the filler size, and is, for example, 5 μm or more.

  The Hall element 10 is electrically connected to, for example, a semi-insulating gallium arsenide (GaAs) substrate 11, a magnetic sensing part (active layer) 12 made of a semiconductor thin film formed on the GaAs substrate 11, and the magnetic sensing part 12. And electrode portions 13a to 13d connected to. The magnetic sensing part 12 is, for example, a cross shape in plan view, and electrodes 13a to 13d are provided on the four tip parts of the cross, respectively. A pair of electrodes 13a and 13c facing each other in plan view are input terminals for flowing current to the magnetic sensing portion 12, and another pair of electrodes 13b and 13d facing each other in a direction orthogonal to the line connecting the electrodes 13a and 13c in plan view. Is an output terminal for outputting a voltage from the magnetic sensing unit 12. In order to reduce the thickness of the Hall element 10, the surface of the substrate 11 opposite to the surface on which the magnetically sensitive portion (active layer) 12 is provided may be polished. The dimensions of the Hall element 10 are, for example, a length of 0.1 mm to 0.4 mm, a width of 0.1 mm to 0.4 mm, and a thickness of 0.05 mm to 0.20 mm.

  The hall sensor 100 has an islandless structure and includes a plurality of lead terminals 21a to 21d for obtaining electrical connection with the outside. As illustrated in FIG. 2B, the lead terminals 21 a to 21 d are arranged around the Hall element 10, for example, near the four corners of the Hall sensor 100. For example, the lead terminal 21a and the lead terminal 21c are arranged so as to face each other with the Hall element 10 interposed therebetween. Further, the lead terminal 21b and the lead terminal 21d are arranged so as to face each other with the Hall element 10 interposed therebetween. Further, the lead terminals 21 to 21d are arranged such that a straight line (imaginary line) connecting the lead terminal 21a and the lead terminal 21c and a straight line (imaginary line) connecting the lead terminal 21b and the lead terminal 21d intersect in plan view. Each is arranged.

That is, the plurality of lead terminals include first to fourth lead terminals, and the first to fourth lead terminals include a virtual straight line connecting the first lead terminal and the third lead terminal and the second lead. The virtual straight line connecting the terminal and the fourth lead terminal is arranged so as to intersect in plan view.
The lead terminals 21a to 21d are made of a metal such as copper (Cu), for example. In addition, the lead terminals 21a to 21d may be etched (that is, half-etched) on the surface side or a part of the back surface.
Although not shown in the drawing, Ag plating is applied to the surfaces of the lead terminals 21a to 21d connected by the conducting wires 31a to 31d on the surface of the lead terminals 21a to 21d (the upper surface side in FIG. 2A). It is preferable from the viewpoint of electrical connection.

Further, the front and back surfaces of the lead terminals 21a to 21d may be plated with nickel (Ni) -palladium (Pd) -gold (Au) or the like instead of the exterior plating layer 60. Although it is a hall sensor, since it is islandless, it is difficult to be affected by the Ni plating film, which is a magnetic material, and can be implemented.
The conducting wires 31a to 31d are conducting wires that electrically connect the electrode portions 13a to 13d of the Hall element 10 and the lead terminals 21a to 21d, and are made of, for example, gold (Au). As shown in FIG. 2B, the conducting wire 31a connects the lead terminal 21a and the electrode portion 13a, and the conducting wire 31b connects the lead terminal 21b and the electrode portion 13b. Conductive wire 31c connects lead terminal 21c and electrode portion 13c, and conductive wire 31d connects lead terminal 21d and electrode 13d.

The sealing member 50 covers and protects the Hall element 10 and at least the surface side of the lead terminals 21a to 21d, that is, the surface connected to the conducting wire, and the conducting wires 31a to 31d with resin sealing. The sealing member 50 is made of, for example, an epoxy-based thermosetting resin and can withstand high heat during reflow. Note that the material of the sealing member 50 and the insulating layer 40 are different from each other even in the case of the same epoxy-based thermosetting resin. For example, the components to be contained are different, or the content ratio is different even if the components to be contained are the same.
Further, as shown in FIG. 2C, on the bottom side of the Hall sensor 100, that is, the side mounted on the wiring board, at least a part of the back surface of each lead terminal 21a to 21d and at least a part of the insulating layer 40. Are exposed from the sealing member 50.

The exterior plating layer 60 is formed on the back surfaces of the lead terminals 21 a to 21 d exposed from the sealing member 50. The exterior plating layer 60 is made of, for example, tin (Sn).
With this configuration, when magnetism (magnetic field) is detected using the Hall sensor 100, for example, the lead terminal 21a is connected to the power supply potential (+) and the lead terminal 21c is connected to the ground potential (GND). Thus, a current is passed from the lead terminal 21a to the lead terminal 21c. Then, the potential difference V1-V2 (Hall output voltage VH) between the lead terminals 21b and 21d is measured. The magnitude of the magnetic field is detected from the magnitude of the Hall output voltage VH, and the direction of the magnetic field is detected from the positive / negative of the Hall output voltage VH.
That is, the lead terminal 21 a is a power supply lead terminal that supplies a predetermined voltage to the Hall element 10. The lead terminal 21 c is a ground lead terminal that supplies a ground potential to the Hall element 10. The lead terminals 21 b and 21 d are signal extraction lead terminals for extracting the Hall electromotive force signal of the Hall element 10.

4A and 4B are configuration diagrams of specific Hall elements, FIG. 4A shows a cross-sectional view, and FIG. 4B shows a top view. However, the conducting wire is not shown. In the figure, symbol Ga indicates a half-etched surface, and Gb indicates a portion subjected to half-etching on the back surface. 2A is a cross-sectional view taken along the line AA of FIG. 2B, but the cross-sectional view of FIG. 4A is a cross-sectional view taken along the line BB of FIG. 4B. Is shown.
The Hall sensor shown in FIGS. 4A and 4B uses a lead terminal designed so as to minimize contact with the collet, and the surface of the lead terminal is half-etched. That is, the area where the collet interferes is half-etched.

The Hall element of the Hall sensor shown in FIG. 4B is arranged to be rotated by 45 degrees with respect to the Hall element of the Hall sensor shown in FIG. That is, the Hall element of the Hall sensor shown in FIG. 4B has a rectangular shape in plan view, and four vertices of the rectangle are regions between the lead terminals 21a and 21b in plan view, respectively. The Hall elements are arranged so as to be arranged in a region between the lead terminals 21b and 21c, a region between the lead terminals 21c and 21d, and a region between the lead terminals 21d and 21a. .
By arranging the Hall elements in such a direction, it is possible to reduce the size of the Hall sensor as a whole. However, when the Hall element is arranged in this way, the collet is likely to come into contact with the lead terminal when the Hall element is placed. Therefore, when the Hall element is arranged in this way, a step is formed on the second surface M2 of the lead terminals 21a to 21d. Providing D is particularly effective for preventing collet contact. The rectangle includes a square.

In the first embodiment, the description has focused on the islandless structure in which there is no metal island for placing the Hall element 10 between the Hall element 10 and the bottom surface E of the sealing member 50. An island may be provided between the bottom surface E of the sealing member 50. The island may be electrically connected to the ground lead terminal 21c. However, it is preferable not to provide an island between the Hall element 10 and the bottom surface E of the sealing member 50 from the viewpoint of thinning.
In the first embodiment, the case where all of the plurality of lead terminals 21a to 21d have the step D has been described as an example. It is sufficient that at least one of the lead terminals has the step D.

  In the first embodiment, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 and the second surface in the second portion N2 from the bottom surface E of the sealing member 50 are as follows. The description will focus on the case where the relationship between the height p2 up to M2 and the height h1 from the bottom surface E of the sealing member 50 to the highest point of the Hall element 10 has a relationship of p1 <h1 <p2. However, p2 <h1 may be sufficient. Even if p2 <h1, the step D is effective for preventing collet contact. For example, when p2 <h1 <1.5 × p2, when p2 <h1 <1.3 × p2, or when p2 <h1 <1.1 × p2, p2 and h1 are not so different. In the case of height, the step D is particularly effective for preventing collet contact. For example, p2 is 0.05 mm to 0.20 mm, h1 is 0.05 mm to 0.20 mm, and p1 is 0.02 mm to 0.15 mm, for example.

  In the first embodiment, the case where the heights h1 from the bottom surface E of the sealing member 50 to the first connection point a are all equal in each of the electrode portions 13a to 13d has been described as an example. The height h1 from the bottom surface E to the first connection point a may be different in the electrode portions 13a to 13d. Similarly, the height h2 from the bottom surface E of the sealing member 50 to the second connection point b may be different for each lead terminal 21a to 21d. When the electrode part and the lead terminal connected to one common conducting wire are made into one unit, it is sufficient that at least one unit satisfies the height h1 <h2. However, it is preferable that the height h1 <h2 is satisfied in all units.

FIG. 5 is a cross-sectional configuration diagram for explaining the Hall sensor according to the present invention. Although the base material 30 is described because it is a Hall element arrangement process in the Hall sensor manufacturing method described later, the base material 30 is removed during the exposure process of exposing the first surfaces M1 of the lead terminals 21a to 21d. The
The hall element 10 has the bottom surface of the sealing member 50 as a reference plane M, and the highest point T of the hall element 10 is higher than the second face M2 in the first part N1 of the lead terminal, and in the second part N2. It arrange | positions in the position lower than the 2nd surface M2. That is, a height t from the bottom surface E of the sealing member 50 to the highest point T of the Hall element 10, a height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1, The height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2 has a relationship of p1 <t <p2.

The plurality of lead terminals 21a to 21d include first to fourth lead terminals, and the first to fourth lead terminals include an imaginary straight line connecting the first lead terminal and the third lead terminal and the first lead terminal. The virtual straight lines connecting the two lead terminals and the fourth lead terminal are arranged so as to intersect in plan view. The Hall element 10 has a rectangular shape in plan view, and the Hall element 10 has four vertices in the plan view in the region between the first lead terminal and the second lead terminal. At a position arranged in a region between the lead terminal and the third lead terminal, a region between the third lead terminal and the fourth lead terminal, and a region between the fourth lead terminal and the first lead terminal. Has been placed.
In addition, an insulating layer 40 is provided on a surface opposite to the surface on which the plurality of electrode portions 13 a to 13 d of the Hall element 10 are disposed, and the insulating layer 40 is exposed from the bottom surface E of the sealing member 50. ing.

Each lead terminal has a step D on the second surface M2, and each lead terminal has a first portion N1 on the side closer to the Hall element 10 with the step D as a boundary. The height p1 from the first portion N1 of each lead terminal to the second surface M2 with the second portion N2 on the far side and the bottom surface E of the sealing member 50 as the reference plane M is the second portion. It is formed lower than the height p2 up to the second surface M2 in N2. That is, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1, and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2. And p1 <p2.
The dimensions of the Hall sensor 100 are, for example, a length of 0.2 mm to 0.6 mm, a width of 0.4 mm to 1.2 mm, and a thickness of 0.1 mm to 0.3 mm.

(Production method)
6A and 6B are views showing a metal plate used for manufacturing the Hall sensor of the first embodiment. 6A is a front view, and FIG. 6B is a back view. The metal plate 120 has a structure in which portions serving as lead terminals of the hall sensors are connected. In the figure, symbol H indicates a hole, and the hatched portion indicates a half-etched region. A region surrounded by a dotted line is a region used by one Hall sensor, and a region between the dotted lines is a region B (kerf width) through which dicing teeth pass during dicing.

  The Hall sensor manufacturing method of Embodiment 1 includes a plurality of lead terminals 21a to 21d, a Hall element 10 having a plurality of electrode portions 13a to 13d, each lead terminal of the plurality of lead terminals 21a to 21d, and a plurality of electrodes. A method of manufacturing a Hall sensor comprising a plurality of conducting wires 31a to 31d that electrically connect the electrode portions of the portions 13a to 13d, respectively, wherein the metal plate 120 on which the plurality of lead terminals 21a to 21d are formed is a base material A lead terminal arranging step arranged above, a Hall element arranging step arranging the Hall element 10 in a region surrounded by the plurality of lead terminals 21a to 21d, a plurality of electrode portions 13a to 13d and a plurality of lead terminals. Connection process of electrically connecting with conducting wires 31a to 31d, Hall element 10, a plurality of conducting wires 31a to 31d, and lead terminals A sealing step of sealing the second surface M2 that is a surface connected to the conductive wire with a sealing member, and a first surface M1 on the opposite side of the second surface M2 of each lead terminal by removing the base material. And an exposing step of exposing from the sealing member 50.

  The plurality of lead terminals include at least a first lead terminal, and the first lead terminal is centered on a position where the Hall element 10 is placed on the second surface M2 and in plan view. A step D is formed on the circumference of the elliptical or polygonal region, and the first lead terminal has the first portion N1 on the side close to the position where the Hall element 10 is placed with the step D as a boundary. The second element N2 is provided on the side far from the position where the Hall element 10 is placed, and the first lead terminal has the metal plate 120 of the base when the metal plate is disposed on the base. The height p1 up to the second surface M2 in the first part N1 is lower than the height p2 up to the second face M2 in the second part N2 with the surface to be arranged as the reference plane M. That is, the height p1 up to the second surface M2 in the first part N1 and the height p2 up to the second surface M2 in the second part N2 have a relationship of p1 <p2.

In addition, the first lead terminal has a step D on the periphery of an elliptical region centered on the position where the Hall element 10 is placed in plan view. Further, the lead terminal has a step D on a circumference centered on a position where the Hall element 10 is placed in a plan view.
The first lead terminal has a step D on the second surface M2 and at a position corresponding to the shape of the tip of the collet centered on the position where the Hall element 10 is placed in plan view. The terminal has a first portion N1 on the side near the position where the Hall element 10 is placed, with the step D as a boundary, and a second portion N2 on the side far from the position where the Hall element 10 is placed. The height p1 to the second surface M2 of the first portion N1 of the lead terminal is the second surface of the second portion N2 with the surface on which the metal plate 120 of the substrate 30 is disposed as the reference surface M. It is formed lower than the height p2 up to M2.

Further, in the hall element arrangement step, the surface of the base material 30 on which the metal plate 120 is arranged is defined as the reference plane M, and the hall element 10 is the highest point T of the hall element 10 at the first of the lead terminals 21a to 21d. And a step of disposing at a position that is higher than the second surface M2 in the portion N1 and lower than the second surface M2 in the second portion N2.
Note that the hall element arrangement step may include a step of arranging the highest point T of the hall element 10 at a position higher than the second surface M2 in the second portion N2. Even if p2 <T, the step D is effective in preventing collet contact. For example, when p2 <T <1.5 × p2, or when p2 <T <1.3 × p2, or when p2 <T <1.1 × p2, p2 and T are not so different. In the case of height, the step D is particularly effective for preventing collet contact.

  The plurality of lead terminals 21a to 21d include first to fourth lead terminals, and the first to fourth lead terminals include an imaginary straight line connecting the first lead terminal and the third lead terminal and the first lead terminal. An imaginary straight line connecting the two lead terminals and the fourth lead terminal is arranged so as to intersect in plan view, the Hall element 10 is rectangular in plan view, and the Hall element arrangement step is in plan view, The four vertices of the Hall element 10 are the region between the first lead terminal and the second lead terminal, the region between the second lead terminal and the third lead terminal, the third lead terminal and the fourth lead terminal. A step of disposing the Hall element so as to be disposed in a region between the lead terminals and a region between the fourth lead terminal and the first lead terminal.

In addition, an insulating layer forming step of forming the insulating layer 40 between the base material 30 and the Hall element 10 is included, and the exposing step includes a step of exposing the insulating layer 40 from the sealing member 50.
Each lead terminal of the plurality of lead terminals has a step D on the second surface, and each lead terminal has a first step on the side closer to the position where the Hall element 10 is placed with the step D as a boundary. It has the part N1, has the second part N2 on the side far from the position where the Hall element 10 is placed, and each lead terminal is a metal of the base material 30 when the metal plate is arranged on the base material. Using the surface on which the plate 120 is disposed as a reference plane M, the height p1 of each lead terminal to the second surface M2 in the first portion N1 is higher than the height p2 to the second surface M2 in the second portion N2. Is also formed low.

7A to 7E are plan views showing the steps of the Hall sensor manufacturing method. 7A to 7E, a region between dotted lines is a region B (kerf width) through which dicing teeth pass during dicing.
As shown in FIG. 7A, first, the metal plate 120 on which the lead terminals described above are formed is prepared. The metal plate 120 has a structure in which a plurality of lead terminals 21a to 21d shown in FIG. 2B are connected in the vertical direction and the horizontal direction in plan view. The material of the metal plate 120 is, for example, copper.

  Next, as shown in FIG.7 (b), the one surface of the heat resistant film 80 is affixed on the back surface side of the metal plate 120 as a base material, for example. For example, an insulating adhesive layer is applied to one surface of the heat resistant film 80. The adhesive layer is based on, for example, a silicone resin as a component. This adhesive layer makes it easy to attach the metal plate 120 to the heat resistant film 80. By sticking the heat resistant film 80 to the back surface side of the metal plate 120, the penetrating region penetrating the metal plate 120 is closed with the heat resistant film 80 from the back surface side.

In addition, as the heat resistant film 80 which is a base material, it is preferable to use the resin-made tape which has adhesiveness and has heat resistance.
About adhesiveness, the one where the paste thickness of the adhesion layer is thinner is preferable. Moreover, about heat resistance, it is required to endure the temperature of about 150 to 200 degreeC. As such a heat resistant film 80, for example, a polyimide tape can be used. The polyimide tape has heat resistance that can withstand about 280 ° C. Such a polyimide tape having high heat resistance can withstand high heat applied during subsequent molding or wire bonding. In addition to the polyimide tape, the following tape may be used as the heat resistant film 80.

(1) Polyester tape; heat-resistant temperature, about 130 ° C (however, the heat-resistant temperature reaches about 200 ° C depending on the use conditions)
(2) Teflon (registered trademark) tape; heat-resistant temperature: about 180 ° C
(3) PPS (polyphenylene sulfide); heat-resistant temperature: about 160 ° C
(4) Glass cloth; heat-resistant temperature: about 200 ° C
(5) Nomek paper; heat-resistant temperature: about 150-200 ° C
(6) In addition, aramid and crepe paper can be used as the heat resistant film 80.

Next, an insulating paste is applied to the area surrounded by the lead terminals 21a to 21d on the surface of the heat resistant film 80 having the adhesive layer. Here, in the completed Hall sensor 100, the application conditions of the insulating paste (for example, the range to be applied and the application) are applied so that a part of the back surface of the Hall element 10 is not exposed from the sealing member 50 such as mold resin. To adjust the thickness.
Next, as shown in FIG. 7C, the Hall element 10 is placed in a region of the heat resistant film 80 where the insulating paste is applied (that is, die bonding is performed). Then, heat treatment (that is, curing) is performed after bonding, and the insulating paste is cured to form the insulating layer 40.
Next, as shown in FIG. 7D, one end of each of the conducting wires 31a to 31d is connected to each of the lead terminals 21a to 21d, and the other end of each of the conducting wires 31a to 31d is connected to each of the electrode portions 13a to 13d (that is, Wire bonding). FIG.7 (e) is a reverse view of FIG.7 (d).
Then, the whole is sealed with the mold resin 50 (that is, resin sealing is performed). This resin sealing is performed using, for example, a transfer mold technique.

  8A to 8D are cross-sectional views showing the steps of the Hall sensor manufacturing method. As shown in FIG. 8A, a mold die 90 including a lower die 91 and an upper die 92 is prepared, and a metal plate 120 after wire bonding is disposed in the cavity of the mold die 90. Next, the mold resin 50 heated and melted is injected into the surface of the heat resistant film 80 on the side having the adhesive layer 130 (that is, the surface bonded to the metal plate 120) and filled. Thereby, the Hall element 10, at least the surface side of the metal plate 120, and the conducting wires 31a to 31d are resin-sealed. When the mold resin 50 is further heated and cured, the mold resin 50 is taken out from the mold. In addition, you may mark a code | symbol etc. (not shown) on the surface of the mold resin 50 by arbitrary processes after resin sealing.

Next, as shown in FIG. 8B, the heat resistant film 80 is peeled from the insulating layer 40 and the mold resin 50. Thereby, the heat resistant film 80 is peeled from the insulating layer 40 and the mold resin 50 while leaving the insulating layer 40 on the back surface of the Hall element 10.
Then, as shown in FIG. 8C, exterior plating is applied to the surface of the metal plate 120 exposed from the mold resin 50 (at least the back surface exposed from the mold resin 50 of each lead terminal 21a to 21d). Then, exterior plating layers 60a to 60d are formed.
Next, as shown in FIG. 8D, a dicing tape 93 is affixed to the upper surface of the mold resin 50 (ie, the surface opposite to the surface having the exterior plating layers 60a to 60d of the Hall sensor 100). Then, for example, the blade is moved relative to the metal plate 120 along the virtual two-dot chain line shown in FIG. 7E to cut the mold resin 50 and the metal plate 120 (that is, dicing). I do). That is, the mold resin 50 and the metal plate 120 are diced for each of the plurality of Hall elements 10 and separated into individual pieces. The diced metal plate 120 becomes the lead terminals 21a to 21d.
Through the above steps, the Hall sensor 100 shown in FIGS. 2A to 2C is completed.

<Embodiment 2>
The second embodiment will be described below. In the first embodiment described above, the case where the insulating paste is used as the insulating layer 40 covering the back surface of the Hall element 10 has been described. However, in the second embodiment, the insulating layer 40 is not limited to the insulating paste. As the insulating layer 40, for example, a die attach film, that is, an adhesive layer of a dicing / die bonding integrated film may be used.
Such a configuration provides the following effects. That is, the adhesive layer of the die attach film is used as an insulating layer that covers the back surface of the Hall element 10. Thereby, since the application | coating process of insulating paste can be skipped, it can contribute to reduction of the number of processes.

<Embodiment 3>
The lens module of the present embodiment includes a Hall sensor, a lens holder to which a magnet is attached, and a drive coil that moves the magnet based on a Hall electromotive force signal that is an output signal from an external terminal of the Hall sensor. . The Hall sensor of the present embodiment is thin and small and has a small variation in magnetic characteristics, so that it can accurately detect a magnetic field. Therefore, the lens module can be reduced in size, and accurate position detection can be performed. The magnetic field of the magnet attached to the lens holder is detected by the Hall sensor of the present embodiment, and based on the detected output signal, a driving current is passed through the driving coil to perform autofocus control and camera shake correction control with high accuracy. be able to. In addition, since the Hall sensor of the present embodiment is thin and downsized, the Hall element inside the Hall sensor and the magnet can be brought closer to each other, and more accurate magnetic detection is possible.

  As described above, the present invention has been described with reference to specific embodiments. However, the present invention is not intended to be limited by these descriptions. From the description of the invention, other embodiments of the invention will be apparent to persons skilled in the art, along with various variations of the disclosed embodiments. Therefore, it is to be understood that the claims encompass these modifications and embodiments that fall within the technical scope and spirit of the present invention.

DESCRIPTION OF SYMBOLS 10 Hall element 11 Board | substrate 12 Magnetosensitive part 13a thru | or 13d Electrode part 21a thru | or 21d Lead terminal 30 Base material 31a thru | or 31d Conductor 40 Insulating layer 50 Sealing member 60a thru | or 60d Exterior plating layer 80 Heat resistant film 90 Mold die 91 Lower mold Mold 92 Upper mold 93 Dicing tape 100 Hall sensor 120 Metal plate 130 Adhesive layer 510 Hall element 512 Magnetic sensing portion 513a, 513b Electrode portion 525, 527 Lead terminal 530 Base material 540 Insulating layer 600 Collet

Claims (20)

A Hall element having a plurality of electrode portions;
A plurality of external terminals arranged around the Hall element;
A plurality of conductive wires for electrically connecting each electrode portion of the plurality of electrode portions and each external terminal of the plurality of external terminals;
A sealing member that seals the Hall element, the plurality of conductive wires, and a second surface that is a surface connected to the conductive wires of each external terminal;
The first surface opposite to the second surface of each external terminal is exposed from the bottom surface of the sealing member,
The plurality of external terminals include at least a first external terminal;
The first external terminal has a step on the second surface and on a periphery of the region surrounding the Hall element in plan view.
The first external terminal has a first portion on the side closer to the Hall element, and a second portion on the side far from the Hall element, with the step as a boundary,
Using the bottom surface of the sealing member as a reference surface, the height of the first external terminal to the second surface at the first portion is lower than the height to the second surface at the second portion. Formed ,
The plurality of conducting wires include at least a first conducting wire, and the first conducting wire is connected to the second surface of the second part of the first external terminal .   In the Hall element, the highest point of the Hall element is higher than the second surface of the first portion of the first external terminal with the bottom surface of the sealing member as a reference plane, and the second element The hall sensor according to claim 1, wherein the hall sensor is disposed at a position lower than the second surface in the part. The Hall element has a bottom surface of the sealing member as a reference surface, a height from the reference surface to the highest point of the Hall element is T, and a height of the second surface at the second portion from the reference surface The hall sensor according to claim 1, wherein the hall sensor is disposed at a position where p2 <T <1.5 × p2, where p2 is p2. The plurality of external terminals further include second to fourth external terminals,
The first to fourth external terminals are planar with a virtual straight line connecting the first external terminal and the third external terminal and a virtual straight line connecting the second external terminal and the fourth external terminal. It is arranged to intersect with the eye,
The Hall element has a rectangular shape in plan view, and in plan view, the four vertices of the Hall element are regions between the first external terminal and the second external terminal, and the second external terminal. And a region between the third external terminal, a region between the third external terminal and the fourth external terminal, and a region between the fourth external terminal and the first external terminal. The hall sensor according to claim 1, wherein the hall sensor is disposed at a position.   The insulating layer disposed on a surface opposite to the surface on which the plurality of electrode portions of the Hall element are disposed, and the insulating layer is exposed from the bottom surface of the sealing member. 5. The hall sensor according to any one of 4 above. Each external terminal of the plurality of external terminals has the step on the second surface,
Each external terminal has the first part on the side closer to the Hall element, the second part on the side far from the Hall element, with the step as a boundary,
Using the bottom surface of the sealing member as a reference surface, the height of each external terminal to the second surface at the first portion is lower than the height to the second surface at the second portion. The hall sensor according to any one of claims 1 to 5.   The hall | hole of Claim 6 in which each said external terminal has the said level | step difference formed in the circumference | surroundings of the area | region of the shape of circular shape, polygonal shape centering on the said Hall element, or those combination shape by planar view. Sensor. A Hall element having a plurality of electrode portions;
A plurality of external terminals arranged around the Hall element;
A plurality of conductive wires for electrically connecting each electrode portion of the plurality of electrode portions and each external terminal of the plurality of external terminals;
A sealing member that seals the Hall element, the plurality of conductive wires, and a second surface that is a surface connected to the conductive wires of each external terminal;
The first surface opposite to the second surface of each external terminal is exposed from the bottom surface of the sealing member,
Each of the external terminals has a bottom surface of the sealing member as a reference surface, from the second part to which the plurality of conductive wires are connected to the first part closer to the Hall element than the second part. A hall sensor in which a height difference on the second surface side in the second portion is formed to be higher than a height on the second surface side in the first portion with the bottom surface of the sealing member as a reference surface.   The height from the bottom surface of the sealing member to the contact point where the electrode portion of the Hall element and the plurality of conductors contact each other is the second surface in the first region with the bottom surface of the sealing member as a reference surface The hall sensor according to claim 8, wherein the hall sensor is higher than a side height.   The Hall sensor according to claim 8 or 9, wherein the step has a slope shape or a curved shape that is recessed toward the bottom surface of the sealing member in a cross-sectional view.   Each said external terminal is the planar view, and the said level | step difference is formed on the circumference | surroundings of the area | region of the shape of circular shape, polygonal shape, or those combination centering on the said Hall element. The hall sensor according to any one of claims. The Hall element has a substrate, a magnetic sensing portion provided on or in the substrate, the plurality of electrode portions connected to the magnetic sensing portion,
An insulating layer disposed on a surface opposite to a surface on which the plurality of electrode portions of the Hall element are disposed;
The Hall sensor according to claim 8, wherein the insulating layer is exposed from the bottom surface of the sealing member. The Hall sensor according to any one of claims 1 to 12,
A lens holder with a magnet attached thereto;
A drive coil for moving the magnet based on an output signal from the external terminal of the Hall sensor;
A lens module comprising: Hall sensor comprising a plurality of external terminals, a Hall element having a plurality of electrode portions, and a plurality of lead wires electrically connecting the external terminals of the plurality of external terminals and the electrode portions of the plurality of electrode portions, respectively. A manufacturing method of
An external terminal placement step of placing a metal plate on which a plurality of external terminals are formed on a substrate;
A hall element arrangement step of arranging the hall element in a region surrounded by the plurality of external terminals;
A conductor connection step for electrically connecting the plurality of electrode portions and the plurality of external terminals with the plurality of conductors;
A sealing step of sealing the Hall element, the plurality of conductive wires, and a second surface that is a surface connected to the conductive wires of each external terminal with a sealing member;
An exposure step of removing the base material and exposing the first surface opposite to the second surface of each external terminal from the sealing member,
The plurality of external terminals include at least a first external terminal;
The first external terminal has a step on the periphery of an elliptical or polygonal region centered on the position where the Hall element is placed on the second surface and in plan view.
The first external terminal has a first portion on a side near the position where the Hall element is placed, with the step being a boundary, and a second portion on the side far from the position where the Hall element is placed. Having a site of
When the metal plate is disposed on the base material, the first external terminal has a surface on which the metal plate of the base material is disposed as a reference surface to the second surface in the first portion. The manufacturing method of the Hall sensor is formed so that the height of the sensor is lower than the height of the second part to the second surface. Hall sensor comprising a plurality of external terminals, a Hall element having a plurality of electrode portions, and a plurality of lead wires electrically connecting the external terminals of the plurality of external terminals and the electrode portions of the plurality of electrode portions, respectively. A manufacturing method of
An external terminal placement step of placing a metal plate on which a plurality of external terminals are formed on a substrate;
A hall element arrangement step of arranging the hall element in a region surrounded by the plurality of external terminals;
A conductor connection step for electrically connecting the plurality of electrode portions and the plurality of external terminals with the plurality of conductors;
A sealing step of sealing the Hall element, the plurality of conductive wires, and a second surface that is a surface connected to the conductive wires of each external terminal with a sealing member;
An exposure step of removing the base material and exposing the first surface opposite to the second surface of each external terminal from the sealing member,
The plurality of external terminals include at least a first external terminal;
The first external terminal has a step on the second surface and in a position corresponding to the shape of the tip of the collet centered on the position where the Hall element is placed in plan view.
The first external terminal has a first portion on a side near the position where the Hall element is placed, with the step being a boundary, and a second portion on the side far from the position where the Hall element is placed. Having a site of
When the metal plate is disposed on the base material, the first external terminal has a surface on which the metal plate of the base material is disposed as a reference surface to the second surface in the first portion. The manufacturing method of the Hall sensor is formed so that the height of the sensor is lower than the height of the second part to the second surface.   In the hall element placement step, the surface of the base material on which the metal plate is placed is used as a reference plane, and the hall element is located at the highest point of the first external terminal. The method of manufacturing a hall sensor according to claim 14, further comprising a step of disposing at a position that is higher than the second surface of the second portion and lower than the second surface of the second portion. In the hall element arrangement step, with the bottom surface of the sealing member as a reference plane, the height from the reference plane to the highest point of the hall element is T, and the second surface in the second portion from the reference plane 16. The method of manufacturing a hall sensor according to claim 14, further comprising a step of arranging the hall element at a position where p2 <T <1.5 × p2, where p2 is a height. The plurality of external terminals further include second to fourth external terminals,
The first to fourth external terminals are planar with a virtual straight line connecting the first external terminal and the third external terminal and a virtual straight line connecting the second external terminal and the fourth external terminal. It is arranged to intersect with the eye,
The Hall element is rectangular in plan view,
The hall element arrangement step includes
In plan view, the four vertices of the Hall element are a region between the first external terminal and the second external terminal, a region between the second external terminal and the third external terminal, And disposing the Hall element so as to be disposed in a region between a third external terminal and the fourth external terminal and a region between the fourth external terminal and the first external terminal. Item 18. The method for manufacturing a Hall sensor according to any one of Items 14 to 17.   The insulating layer forming step of forming an insulating layer between the base material and the Hall element is included, and the exposing step includes a step of exposing the insulating layer from the sealing member. A method for manufacturing the Hall sensor according to Item 1. Each external terminal of the plurality of external terminals has the step on the second surface,
Each of the external terminals has the first part on the side close to the position where the Hall element is placed with the step as a boundary, and the second terminal on the side far from the position where the Hall element is placed. Having a site of
When each of the external terminals is disposed on the substrate, the surface of the substrate on which the metal plate is disposed is used as a reference surface. The method for manufacturing a Hall sensor according to any one of claims 14 to 19, wherein a height to two surfaces is formed lower than a height to the second surface in the second part.

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