JP6392882B2 - Hall sensor and lens module - Google Patents

Description

  The present invention relates to a hall sensor and a lens module.

  As a sensor for detecting a magnetic field, a magnetic sensor using a Hall element is known. The magnetic sensor described in Patent Document 1 is an islandless structure magnetic sensor using a pellet (magnetic sensor chip such as a Hall element), and can prevent an increase in leakage current even when the pellet is reduced in size and thickness. The present invention relates to a magnetic sensor. The magnetic sensor includes a pellet, a plurality of lead terminals disposed around the pellet, a plurality of lead wires electrically connecting the plurality of electrode portions and the plurality of lead terminals of the pellet, and a plurality of pellets. An insulating layer that covers the surface opposite to the surface having the electrode portion, and a resin member that covers the pellet and the plurality of conductive wires, and is connected to at least a part of the insulating layer and each of the conductive wires of the plurality of lead terminals. At least a part of the surface opposite to the surface is a magnetic sensor exposed from the resin member.

International Publication No. 2014/091714

By the way, with recent thinning and high functionality of electronic devices, there is a demand for a hall sensor that is thinner and capable of accurately detecting a magnetic field. In the magnetic sensor of Patent Document 1 described above, if the magnetic sensor is thinned, a problem may occur that the accuracy of magnetic field detection is reduced. The reason will be described below.
FIG. 1 is a diagram for explaining a problem of the Hall sensor according to the present invention. The hall sensor 400 includes a hall element 310, a lead terminal 325 serving as a power supply terminal arranged around the hall element 310, and a lead terminal 327 connected to a ground potential. Each electrode portion and each lead terminal provided on the Hall element 310 are connected by a conductive wire 343, and each lead terminal and the Hall element 310 are fixed by a mold resin 350. The lead terminals 325 and 327 are connected to the wiring pattern 451 of the wiring board 450 through solder (solder) 370. Reference numeral 440 indicates an insulating layer.

  In order to reduce the thickness of the magnetic sensor, it is necessary to make the height of the top of wire bonding as low as possible. However, in the magnetic sensor of Patent Document 1 described above, since the Hall element is located higher than the lead terminal, the wire is bent when the wire is bent or the top height is lowered. There was a problem that it was easy to contact the edge of the substrate of the Hall element. When the conducting wire contacts the edge of the substrate, a leak current is generated through the contact point between the conducting wire and the substrate and the electrode portion. When a leak current is generated, it appears as a drive current for the Hall element. The leak current appears as an offset current of the drive current of the Hall element. Since the offset current of the drive current appears as an offset voltage of the Hall element, there is a problem that magnetism cannot be detected accurately.

  The present invention has been made in view of such problems, and an object thereof is to provide a Hall sensor and a lens module that are thin and can detect magnetism accurately.

(1); possess a semi-insulating substrate, and the magnetic sensitive section disposed on the substrate or the substrate, and a plurality of electrode portions connected to said sensing section, the magnetic sensitivity surfaces of the substrate A Hall element in which the edge on the surface side on which is formed is not covered with the magnetic sensing part and the electrode part, a plurality of external terminals arranged around the Hall element, and each electrode of the plurality of electrode parts A plurality of conductors that electrically connect the external portion and each of the plurality of external terminals, and at least a part of the magnetically sensitive portion of the Hall element, the plurality of conductors, and the external terminals. Each external terminal has a second surface connected to each of the plurality of conductive wires, and a first surface opposite to the second surface, and surface is exposed from the bottom surface of the sealing member, the thickness of the Hall element, the thickness of the external terminal Remote thin, the height from the bottom surface of the sealing member to the first point of contact with the respective conductors and each of the electrode portions, the first from the bottom of the sealing member between the respective external terminals and the respective conductors by make lower than height of the second contact point, which is the lead and the hole sensor have edges and is difficulty to contact the substrate.

(2); In (1), each said external terminal is exposed from the side surface of the said sealing member.
(3) In (1) or (2), at least one of the plurality of external terminals has a step on the second surface, and the plurality of external terminals have the step. At the boundary, the external terminal having the step has a first part on the side close to the Hall element, has a second part on the side far from the Hall element, and the bottom of the sealing member The height from the bottom surface of the sealing member to the second surface in the first portion is lower than the height from the bottom surface of the sealing member to the second surface in the second portion, and each of the conductive wires has the step. The second terminal of the external terminal is connected at the second surface.
(4); a Hall element having a substrate, a magnetic sensitive part provided on or in the substrate, and a plurality of electrode parts connected to the magnetic sensitive part, and disposed around the Hall element A plurality of external terminals, a plurality of conductors electrically connecting each of the electrode portions of the plurality of electrode portions and each of the external terminals of the plurality of external terminals, the magnetically sensitive portion of the Hall element, the plurality of the plurality of external terminals A conductive member and a sealing member that covers at least a part of each of the external terminals, wherein each of the external terminals is connected to each of the plurality of conductive wires, and the second surface A first surface on the opposite side, the first surface exposed from the bottom surface of the sealing member, and a first contact between the electrode portions and the conductive wires from the bottom surface of the sealing member. The height to the point is from the bottom surface of the sealing member to the second contact point between each external terminal and each conductor. The at least one external terminal of the plurality of external terminals has a step in the second surface, and the plurality of external terminals have the step with the step as a boundary. Each external terminal has a first part on the side close to the Hall element, has a second part on the side far from the Hall element, and the first part in the first part from the bottom surface of the sealing member. The height to the second surface is lower than the height from the bottom surface of the sealing member to the second surface in the second portion, and each of the conductive wires has the second step of each of the external terminals having the step. It is a hall sensor connected with the 2nd surface in a part.

( 5 ); In (3) or (4) , the height from the bottom surface of the sealing member to the second surface in the first part is the height from the bottom surface of the sealing member to each of the electrode portions. Lower than that.
( 6 ); In any one of (3) to (5), the step is provided on a circumference surrounding the Hall element.
( 7 ); In any one of (1) to ( 6 ), the substrate further includes an insulating layer provided on a surface opposite to the surface on which the plurality of electrode portions are provided. It is exposed from the bottom surface of the sealing member.

( 8 ); In any one of (1) to ( 7 ), the plurality of external terminals include first to fourth external terminals, and the first to fourth external terminals are the first external terminals. A virtual straight line connecting the terminal and the third external terminal and a virtual straight line connecting the second external terminal and the fourth external terminal are arranged so as to intersect in plan view, and the Hall element The substrate is rectangular in plan view, and in plan view, the four vertices of the substrate of the Hall element are regions between the first external terminal and the second external terminal, and the second external Arranged in a region between the terminal and the third external terminal, a region between the third external terminal and the fourth external terminal, and a region between the fourth external terminal and the first external terminal Has been.

(9); semi-insulating substrate, magnetic sensitive sections provided on the substrate or the substrate, and have a electrode portion, the sense of the edge of the surface on which magnet part is formed of the substrate Hall elements not covered by the magnetic sensing portion and the electrode portion, external terminals disposed around the Hall elements, conductive wires connecting the electrode portions and the external terminals, and magnetic sensitivity of the Hall elements A sealing member that covers a second surface of the external terminal to which the conductive wire of the external terminal is connected, and the external terminal has a first surface opposite to the second surface that is sealed. It is exposed from the bottom surface of the stop member, and the thickness of the Hall element is smaller than the thickness of the external terminal, and the height from the bottom surface of the sealing member to the first contact point between the electrode portion and the conducting wire. Is the height from the bottom surface of the sealing member to the second contact point between the external terminal and the conducting wire. By Rimohiku Kusuru is the conductor and the Hall sensor have edges and is difficulty to contact the substrate.

( 10 ); In ( 9 ), the electrode portion includes first to fourth electrode portions, the external terminal includes first to fourth external terminals, and the conductive wire includes the first wire. To the fourth electrode portion and the first to fourth external terminals respectively connected to the first electrode portion from the bottom surface of the sealing member. The height to the first contact point with the conducting wire is lower than the height from the bottom surface of the sealing member to the second contact point between the first external terminal and the first conducting wire.
( 11 ); In ( 10 ), the height from the bottom surface of the sealing member to the third contact point between the second electrode portion and the second conducting wire is from the bottom surface of the sealing member to the first A fifth contact point between the third electrode portion and the third lead wire from the bottom surface of the sealing member, which is lower than the height of the second external terminal and the second lead wire to the fourth contact point. Is lower than the height from the bottom surface of the sealing member to the sixth contact point between the third external terminal and the third conductor, and from the bottom surface of the sealing member to the fourth The height from the bottom surface of the sealing member to the eighth contact point between the fourth external terminal and the fourth conductor is as high as the seventh contact point between the electrode portion and the fourth conductor. Lower than that.

( 12 ); In any one of ( 9 ) to ( 11 ), in the Hall element, the substrate is a GaAs substrate, and an insulating layer is provided on a surface opposite to the surface on which the electrode portion of the substrate is provided. Further, the electrode portion is connected to the magnetic sensing portion, and the insulating layer is exposed from the bottom surface of the sealing member.

( 13 ); The Hall sensor according to any one of ( 9 ) to ( 12 ), a lens holder to which a magnet is attached, and the magnet is moved based on an output signal from the external terminal of the Hall sensor. And a driving coil.

  According to one embodiment of the present invention, it is possible to provide a hall sensor and a lens module that are thin and can accurately detect magnetism.

FIG. 1 is a diagram for explaining a problem of the Hall sensor according to the present invention. FIGS. 2A to 2C are configuration diagrams for explaining the first embodiment of the Hall sensor according to the present invention. FIG. 3 is an overall perspective view of the Hall sensor shown in FIGS. 4A and 4B are configuration diagrams of specific Hall sensors. 5A and 5B are views showing a lead frame of the Hall sensor according to the first embodiment.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present invention. However, it will be apparent that one or more embodiments may be practiced without such specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Hereinafter, each embodiment of the present invention will be described with reference to the drawings.

<Embodiment 1>
FIGS. 2A to 2C are configuration diagrams for explaining the first embodiment of the Hall sensor according to the present invention. FIG. 2A is a cross-sectional view taken along line AA in FIG. 2 (b) is a plan view of FIG. 2 (a), FIG. 2 (c) is a bottom view of FIG. 2 (a), and FIG. 3 is an overall perspective view of the Hall sensor shown in FIGS. 2 (a) to 2 (c). Is shown. Ga represents a half-etched surface, and Gb represents a portion subjected to half-etching on the back surface.
The Hall sensor 100 according to the first embodiment includes a Hall element 10, a plurality of lead terminals 21a to 21d (first to fourth external terminals), a plurality of conductors 31a to 31d (first to fourth conductors), and a seal. The member 50 is provided.

The Hall element 10 includes a substrate 11, a magnetic sensing part 12 provided on the substrate 11 (or in the substrate 11), and a plurality of electrode parts 13 a to 13 d (first to fourth) connected to the magnetic sensing part 12. Electrode portion). In FIG. 2A, the case where the magnetic sensitive part 12 is provided on the substrate 11 is shown in an enlarged view.
The plurality of lead terminals 21 a to 21 d are arranged so as to surround the four corners of the Hall element 10 around the Hall element 10, that is, along the bottom surface of the sealing member 50. Further, it may be arranged in the four corner regions of the Hall sensor 100 in a top view.

The plurality of conductive wires 31a to 31d electrically connect each of the electrode portions 13a to 13d of the plurality of electrode portions 13a to 13d and each of the lead terminals 21a to 21d of the plurality of lead terminals 21a to 21d. .
The sealing member 50 covers the Hall element 10, the plurality of lead terminals 21a to 21d, and the plurality of conductive wires 31a to 31d.
Each lead terminal 21a to 21d has a second surface M2 connected to each of the conductive wires 31a to 31d and a first surface M1 opposite to the second surface M2, and this first surface. M1 is exposed from the bottom surface E of the sealing member 50.

  The height h1 from the bottom surface E of the sealing member 50 to the first contact point a between the electrode portions 13a to 13d and the conductive wires 31a to 31d is from the bottom surface E of the sealing member 50 to the lead terminals 21a to 21a. 21d and each conducting wire 31a thru | or 31d are comprised so that it may become lower than the height h2 to the 2nd contact point b. The Hall sensor has a rectangular shape, and is arranged so that the Hall element is included in the space between the adjacent external terminals in a cross-sectional view from the side surface S including the long side on the rectangular shape. From the viewpoint of miniaturization, the Hall element may be disposed at an angle of 45 degrees with respect to the side of the rectangular Hall sensor in a top view. In that case, when viewed in a cross-section from the side surface S including the long side on the rectangular shape, the space between the adjacent external terminals is arranged so that the Hall element is included in the height direction.

That is, the relationship between the height h1 from the bottom surface E of the sealing member 50 to the first contact point a and the height h2 from the bottom surface E of the sealing member 50 to the second contact point b is h1 <h2. Have the relationship.
Since the Hall sensor of Embodiment 1 has a relationship of h1 <h2, the conducting wires 31a to 31d are unlikely to contact the edge of the substrate 11 of the Hall element, and a leak current is unlikely to occur. Thereby, it is possible to realize a hall sensor that is thin and capable of accurately detecting magnetism.
The Hall sensor according to the first embodiment has a structure in which the contact between the edge of the lead terminal and the lead wire is likely to occur. However, with respect to the edge touch of the lead terminal, two lead wires are connected to the lead terminal having the same potential. There is no problem in particular. In the first embodiment, as a relationship between the height h1 and the height h2, h1 is preferably not less than 0.2 × h2 and less than h2. More preferably, it is 0.4 × h2 or more and less than h2, and further preferably 0.4 × h2 or more and 0.99 × h2. Furthermore, h1 may be not less than 0.4 × h2 and not more than 0.95 × h2.

  The lead terminals 21 a to 21 d are exposed from the side surface S of the sealing member 50. That is, since the lead terminals 21a to 21d are exposed from the side surface S of the sealing member 50, the portion exposed to the side surface (the bottom electrode) in addition to the portion exposed to the bottom surface of the lead terminals 21a to 21d (the bottom electrode). It can be mounted using side electrodes). In particular, since the ratio of the side electrodes in the entire thickness can be increased, mounting is facilitated. In addition, the contact between the lead terminal and the solder is poor, and it is less likely that continuity cannot be obtained. Furthermore, the visibility in the appearance inspection after solder mounting is improved, and it can be easily confirmed whether or not the soldering is performed without any problem.

In addition, at least one of the plurality of lead terminals 21a to 21d has a step D on the second surface M2. That is, the lead terminal has a step. All of the lead terminals 21a to 21d preferably have a step D on the second surface M2.
Further, the plurality of lead terminals 21a to 21d have the first portion N1 on the side close to the Hall element 10 of each lead terminal 21a to 21d having the step D with the step D as a boundary, and the side far from the Hall element 10 The height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first region N1 is the second portion N2 in the second region N2 from the bottom surface E of the sealing member 50. It is configured to be lower than the height p2 up to the second surface M2.

That is, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1, and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2. The relationship between and has a relationship of p1 <p2. The conductive wires 31a to 31d are connected by the second surface M2 in the second portion N2 of the lead terminals 21a to 21d having a step (D).
With such a configuration, it is possible to suppress the conductor from coming into contact with the edge of the lead terminal and being disconnected.

When there are a plurality of steps on the second surface M2 of the lead terminal 21a, the step closest to the Hall element 10 is defined as a step D, and the side closer to the Hall element 10 with the step D as a boundary is the first portion N1 and the Hall element The side far from 10 is defined as a second portion N2. The same applies to the lead terminals 21b to 21d. The step D formed on the second surface M2 of the lead terminals 21a to 21d is sealed with a sealing member 50.
Further, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first part N1 is configured to be lower than the height h1 from the bottom surface E of the sealing member 50 to each of the electrode portions 13a to 13d. Has been.

That is, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1, and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2. In addition, the relationship between the bottom surface E of the sealing member 50 and the height h1 from the electrode portions 13a to 13d has a relationship of p1 <h1 <p2.
With such a configuration, it is possible to further suppress the conductor from coming into contact with the edge of the lead terminal and being disconnected.
By the way, generally, a collet is used when the Hall element 10 is placed at a predetermined position, and a capillary is used when wire bonding the electrode portion of the Hall element and the lead terminal. With such a configuration, it is possible to prevent the collet from coming into contact with the lead terminal when the Hall element is placed. Further, it is possible to prevent the capillary from coming into contact with the lead terminal during wire bonding.

Further, a step D is provided on the circumference of an ellipse or polygon centered on the Hall element 10. That is, the step is provided on the circumference surrounding the Hall element. Since the tip of the collet or capillary is often elliptical or polygonal, it is better to make the step D also elliptical or polygonal. Therefore, the step D is provided in the elliptical or polygonal shape. Yes.
Since the tip of the collet or capillary is often circular, it is preferable to provide a step D on the circumference centered on the Hall element 10 in order to prevent contact of the collet or capillary.

The plurality of conductive wires 31a to 31d are wire-bonded such that the plurality of electrode portions 13a to 13d are the first bonding and the plurality of lead terminals 21a to 21d are the second bonding.
Thus, since wire bonding is performed from the lower side to the higher side, edge contact is less likely to occur. Thereby, even if the distance between the Hall element and the lead terminal is shortened, the edge contact hardly occurs. As a result, the distance between the Hall element and the lead terminal can be shortened, and the size can be reduced.

Alternatively, the plurality of conductive wires 31a to 31d are wire-bonded such that the plurality of lead terminals 21a to 21d are the first bonding and the plurality of electrode portions 13a to 13d are the second bonding.
Thus, since wire bonding is performed from the higher side to the lower side, the apex of the wire bonding can be lowered and the thickness can be reduced.
The substrate 11 further includes an insulating layer 40 provided on the surface opposite to the surface on which the plurality of electrode portions 13a to 13d are provided. The insulating layer 40 is exposed from the bottom surface E of the sealing member 50. The effect of providing the insulating layer 40 will be described in the second embodiment.

In the first embodiment, examples of the insulating layer 40 include an insulating resin layer and an insulating sheet. The insulating layer 40 may be any resistance that is higher than the resistance of the Hall element. For example, it is preferable that the volume resistivity of the insulating layer 40 is 10 ⁸ to 10 ²⁰ (Ω · cm). More preferably, the volume resistivity of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω · cm). When the insulating layer 40 is several mm square and has a thickness of several μm, the resistance of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω), and the resistance of the Hall element is usually about 10 ⁹ Ω or less. Insulating property.
More preferably, the insulating layer 40 includes, for example, an epoxy thermosetting resin and silica (SiO ₂ ) as a filler. The insulating layer 40 is in contact with the back surface of the Hall element 10, that is, the surface opposite to the surface having the magnetic sensing portion 12, and the back surface of the Hall element 10 is covered with the insulating layer 40. It is preferable from the viewpoint of suppressing the occurrence of leakage current that the entire back surface of the Hall element 10 is covered with the insulating layer 40. The thickness of the portion of the insulating layer 40 that covers the back surface of the Hall element 10 is determined by the filler size, and is, for example, 5 μm or more.

  The Hall element 10 is, for example, a magnetoelectric conversion element such as a Hall element. The Hall element 10 is electrically connected to, for example, a semi-insulating gallium arsenide (GaAs) substrate 11, a magnetic sensing part (active layer) 12 made of a semiconductor thin film formed on the GaAs substrate 11, and the magnetic sensing part 12. And electrode portions 13a to 13d connected to. The magnetic sensing part 12 is, for example, a cross shape in plan view, and electrodes 13a to 13d are provided on the four tip parts of the cross, respectively. A pair of electrodes 13a and 13c facing each other in plan view are input terminals for flowing current to the magnetic sensing portion 12, and another pair of electrodes 13b and 13d facing each other in a direction orthogonal to the line connecting the electrodes 13a and 13c in plan view. Is an output terminal for outputting a voltage from the magnetic sensing unit 12. In order to reduce the thickness of the Hall element 10, the surface of the substrate 11 opposite to the surface on which the magnetically sensitive portion (active layer) 12 is provided may be polished.

  The hall sensor 100 has an islandless structure and includes a plurality of lead terminals 21a to 21d for obtaining electrical connection with the outside. As illustrated in FIG. 2B, the lead terminals 21 a to 21 d are arranged around the Hall element 10, for example, near the four corners of the Hall sensor 100. For example, the lead terminal 21a and the lead terminal 21c are arranged so as to face each other with the Hall element 10 interposed therebetween. Further, the lead terminal 21b and the lead terminal 21d are arranged so as to face each other with the Hall element 10 interposed therebetween. Further, the lead terminals 21 to 21d are arranged such that a straight line (imaginary line) connecting the lead terminal 21a and the lead terminal 21c and a straight line (imaginary line) connecting the lead terminal 21b and the lead terminal 21d intersect in plan view. Each is arranged.

That is, the plurality of lead terminals include first to fourth lead terminals, and the first to fourth lead terminals include a virtual straight line connecting the first lead terminal and the third lead terminal and the second lead. The virtual straight line connecting the terminal and the fourth lead terminal is arranged so as to intersect in plan view.
The lead terminals 21a to 21d are made of a metal such as copper (Cu), for example. In addition, the lead terminals 21a to 21d may be etched (that is, half-etched) on the surface side or a part of the back surface.
Although not shown in the drawing, Ag plating is applied to the surfaces of the lead terminals 21a to 21d connected by the conducting wires 31a to 31d on the surface of the lead terminals 21a to 21d (the upper surface side in FIG. 2A). It is preferable from the viewpoint of electrical connection.

Further, the front and back surfaces of the lead terminals 21a to 21d may be plated with nickel (Ni) -palladium (Pd) -gold (Au) or the like instead of the exterior plating layer 60. Although it is a hall sensor, since it is islandless, it is difficult to be affected by the Ni plating film, which is a magnetic material, and can be implemented.
The conducting wires 31a to 31d are conducting wires that electrically connect the electrode portions 13a to 13d of the Hall element 10 and the lead terminals 21a to 21d, and are made of, for example, gold (Au). As shown in FIG. 2B, the conducting wire 31a connects the lead terminal 21a and the electrode portion 13a, and the conducting wire 31b connects the lead terminal 21b and the electrode portion 13b. Conductive wire 31c connects lead terminal 21c and electrode portion 13c, and conductive wire 31d connects lead terminal 21d and electrode 13d.

The sealing member 50 covers and protects the Hall element 10 and at least the surface side of the lead terminals 21a to 21d, that is, the surface connected to the conducting wire, and the conducting wires 31a to 31d with resin sealing. The sealing member 50 is made of, for example, an epoxy-based thermosetting resin and can withstand high heat during reflow. Note that the material of the sealing member 50 and the insulating layer 40 are different from each other even in the case of the same epoxy-based thermosetting resin. For example, the components to be contained are different, or the content ratio is different even if the components to be contained are the same.
Further, as shown in FIG. 2C, on the bottom surface side of the Hall sensor 100, that is, on the side mounted on the wiring board, at least a part of the back surface of each lead terminal 21a to 21d and at least a part of the insulating layer 40. Are exposed from the sealing member 50.

The exterior plating layer 60 is formed on the back surfaces of the lead terminals 21 a to 21 d exposed from the sealing member 50. The exterior plating layer 60 is made of, for example, tin (Sn).
With this configuration, when magnetism (magnetic field) is detected using the Hall sensor 100, for example, the lead terminal 21a is connected to the power supply potential (+) and the lead terminal 21c is connected to the ground potential (GND). Thus, a current is passed from the lead terminal 21a to the lead terminal 21c. Then, the potential difference V1-V2 (Hall output voltage VH) between the lead terminals 21b and 21d is measured. The magnitude of the magnetic field is detected from the magnitude of the Hall output voltage VH, and the direction of the magnetic field is detected from the positive / negative of the Hall output voltage VH.
That is, the lead terminal 21 a is a power supply lead terminal that supplies a predetermined voltage to the Hall element 10. The lead terminal 21 c is a ground lead terminal that supplies a ground potential to the Hall element 10. The lead terminals 21 b and 21 d are signal extraction lead terminals for extracting the Hall electromotive force signal of the Hall element 10.

4A and 4B are configuration diagrams of specific Hall elements, FIG. 4A shows a cross-sectional view, and FIG. 4B shows a top view. However, the conducting wire is not shown. In the figure, symbol Ga indicates a half-etched surface, and Gb indicates a portion subjected to half-etching on the back surface. 2A is a cross-sectional view taken along the line AA of FIG. 2B, but the cross-sectional view of FIG. 4A is a cross-sectional view taken along the line BB of FIG. 4B. Is shown.
The Hall sensor shown in FIGS. 4A and 4B uses a lead terminal designed to minimize contact with the collet, and the surface of the lead terminal is half-etched. That is, the area where the collet interferes is half-etched.

The Hall element of the Hall sensor shown in FIG. 4B is arranged to be rotated by 45 degrees with respect to the Hall element of the Hall sensor shown in FIG. That is, the Hall element of the Hall sensor shown in FIG. 4B is rectangular in plan view, and the four vertices of the rectangle are regions between the lead terminal 21a and the lead terminal 21b, the lead terminal 21b and the lead, respectively. Hall elements are arranged so as to be arranged in a region between the terminals 21c, a region between the lead terminals 21c and 21d, and a region between the lead terminals 21d and 21a.
By arranging the Hall elements in such a direction, it is possible to reduce the size of the Hall sensor as a whole. However, when the Hall element is arranged in this way, the collet is likely to come into contact with the lead terminal when the Hall element is placed. Therefore, it is preferable to provide a step D on the second surface M2 of the lead terminals 21a to 21d. The rectangle includes a square.

In the first embodiment, the description has focused on the islandless structure in which there is no metal island for placing the Hall element 10 between the Hall element 10 and the bottom surface E of the sealing member 50. An island may be provided between the bottom surface E of the sealing member 50. The island may be electrically connected to the ground lead terminal 21c. However, it is preferable not to provide an island between the Hall element 10 and the bottom surface E of the sealing member 50 from the viewpoint of thinning.
In the first embodiment, the case where the heights h1 from the bottom surface E of the sealing member 50 to the first connection point a are all equal in each of the electrode portions 13a to 13d has been described as an example. The height h1 from the bottom surface E to the first connection point a may be different in the electrode portions 13a to 13d. Similarly, the height h2 from the bottom surface E of the sealing member 50 to the second connection point b may be different for each lead terminal 21a to 21d. When the electrode part and the lead terminal connected to one common conducting wire are made into one unit, it is sufficient that at least one unit satisfies the height h1 <height h2. However, it is preferable that height h1 <height h2 is satisfied in all units.

5A and 5B are views showing the lead frame of the Hall sensor of the first embodiment. FIG. 5A is a front view, and FIG. 5B is a back view. The lead frame has a structure in which a portion serving as a lead terminal of each Hall sensor is connected by a metal plate. In the figure, symbol H indicates a hole, and the hatched portion indicates a half-etched region. A region surrounded by a dotted line is a region used by one Hall sensor, and a region between the dotted lines is a region through which dicing teeth pass during dicing.
The Hall sensor manufacturing method according to the first embodiment includes a step of preparing a lead frame in which a plurality of lead terminals are formed on one surface of a substrate, and a region surrounded by the plurality of lead terminals on one surface of the substrate. A step of placing a Hall element thinner than the thickness of the lead terminal through an insulating layer, and a step of electrically connecting a plurality of electrode portions of the Hall element and a plurality of lead terminals with a plurality of conductive wires, respectively. And a step of sealing the surface side on which the Hall element is placed with a sealing member, and a step of separating the base material from the sealing member and the insulating layer. In the step of separating the base material, An insulating layer is left on the surface opposite to the surface having the plurality of electrode portions. A specific manufacturing method is the same as that of Patent Document 1 described above except for the thickness of the Hall element.
In the step of preparing the lead frame, the lead frame shown in FIGS. 5A and 5B may be used. That is, you may use the lead frame which provided the level | step difference D in the surface on the opposite side to the surface which contacts a base material among the surfaces which a some lead terminal has.

<Embodiment 2>
The second embodiment will be described below. In the second embodiment, after the Hall sensor 100 is completed, for example, although not shown, a wiring board is prepared, and the Hall sensor 100 is mounted on one surface of the wiring board. In this mounting step, for example, the back surface of each of the lead terminals 21a to 21d that is exposed from the sealing member 50 and covered with the exterior plating layer 60 is wired on the wiring board via solder (not shown). Connect to pattern (not shown). This soldering can be performed by a reflow method, for example. In the reflow method, solder paste is applied (that is, printed) on the wiring pattern, and the hall sensor 100 is arranged on the wiring board so that the exterior plating layer 60 is overlaid thereon, and heat is applied to the solder paste in this state. This is a method of melting solder. A hall sensor device including a hall sensor 100, a wiring board to which the hall sensor 100 is attached, and solder for electrically connecting the lead terminals 21a to 21d of the hall sensor 100 to the wiring pattern of the wiring board after the mounting process. Is completed.

Such a configuration provides the following effects. That is, in the islandless hall sensor 100, the back surface of the hall element 10 is covered with the insulating layer 40. Thereby, when the Hall sensor 100 is attached to the wiring board, for example, even when the solder protrudes from the lead terminal (that is, the power supply terminal) 21a connected to the power supply potential to the lower part of the Hall element 10, the Hall element 10 ( It is possible to prevent a Schottky junction from being formed between the semiconductor) and the solder (metal), and to prevent current from flowing in the forward direction of this Schottky junction (ie, from the metal toward the semiconductor). Can do.
For example, even when a current flows in the direction of the power supply terminal 21a → the conducting wire 31a → the electrode portion 13a → the magnetic sensing portion 12 → the electrode portion 13c → the conducting wire 31c → the lead terminal 21c, the leakage current flows from the solder to the Hall element 10. Can be prevented. Thereby, generation | occurrence | production of an offset voltage is suppressed and it becomes possible to detect a magnetic field correctly.

<Embodiment 3>
The third embodiment will be described below. In the first and second embodiments described above, the case where the insulating paste is used as the insulating layer 40 covering the back surface of the Hall element 10 has been described. However, in Embodiment 3, the insulating layer 40 is not limited to the insulating paste. As the insulating layer 40, for example, a die attach film, that is, an adhesive layer of a dicing / die bonding integrated film may be used.
Such a configuration provides the following effects. That is, the adhesive layer of the die attach film is used as an insulating layer that covers the back surface of the Hall element 10. Thereby, since the application | coating process of insulating paste can be skipped, it can contribute to reduction of the number of processes.

<Embodiment 4>
The lens module of the present embodiment includes a Hall sensor, a lens holder to which a magnet is attached, and a drive coil that moves the magnet based on a Hall electromotive force signal that is an output signal from an external terminal of the Hall sensor. . Since the Hall sensor of this embodiment is thin and can detect magnetism accurately, the lens module can be miniaturized and accurate position detection can be performed. The magnetic field of the magnet attached to the lens holder is detected by the Hall sensor of the present embodiment, and based on the detected output signal, a driving current is passed through the driving coil to perform autofocus control and camera shake correction control with high accuracy. be able to. In addition, since the Hall sensor of the present embodiment is thin, the Hall element inside the Hall sensor and the magnet can be brought closer to each other, and more accurate magnetic detection is possible.

  As described above, the present invention has been described with reference to specific embodiments. However, the present invention is not intended to be limited by these descriptions. From the description of the invention, other embodiments of the invention will be apparent to persons skilled in the art, along with various variations of the disclosed embodiments. Therefore, it is to be understood that the claims encompass these modifications and embodiments that fall within the technical scope and spirit of the present invention.

DESCRIPTION OF SYMBOLS 10 Hall element 11 Board | substrate 12 Magnetosensitive part 13a thru | or 13d Electrode part (1st-4th electrode part)
21a to 21d Lead terminals (first to fourth external terminals)
31a thru | or 31d conducting wire (1st-4th conducting wire)
40 Insulating layer 50 Sealing members 60a to 60d Exterior plating layer 100 Hall sensor 310 Hall element 320 Lead frame 325 Lead terminal (power supply terminal)
327 Lead terminal (ground terminal)
343 Metal thin wire 350 Sealing member 370 Solder (solder)
451 wiring pattern 400 magnetic sensor 440 insulating layer 450 wiring board

Claims (13)

A semi-insulating substrate, and the magnetic sensitive section disposed on the substrate or the substrate, have a plurality of electrode portions connected to said sensing section, wherein the sensing section is formed of the substrate A Hall element whose edge on the surface side is not covered with the magnetic sensing part and the electrode part ,
A plurality of external terminals arranged around the Hall element;
A plurality of conductive wires for electrically connecting each electrode portion of the plurality of electrode portions and each external terminal of the plurality of external terminals;
A sealing member that covers at least a part of the magnetically sensitive portion of the Hall element, the plurality of conductive wires, and the external terminals;
Each of the external terminals has a second surface connected to each of the plurality of conductive wires, and a first surface opposite to the second surface,
The first surface is exposed from the bottom surface of the sealing member,
The thickness of the Hall element is thinner than the thickness of the external terminal,
The height from the bottom surface of the sealing member to the first point of contact with the respective conductor and the electrode portions, the second contact point of the from the bottom surface of the sealing member and the external terminal said each conductor by far than the height make lower, the conductor and the Hall sensor have edges and is difficulty to contact the substrate.   The Hall sensor according to claim 1, wherein each external terminal is exposed from a side surface of the sealing member. At least one of the plurality of external terminals has a step on the second surface,
The plurality of external terminals have a first portion on the side closer to the Hall element of each external terminal having the step with the step as a boundary, and a second portion on the side far from the Hall element. And
The height from the bottom surface of the sealing member to the second surface at the first portion is lower than the height from the bottom surface of the sealing member to the second surface at the second portion,
3. The Hall sensor according to claim 1, wherein each of the conductive wires is connected to the second surface of the second portion of each of the external terminals having the step.   A Hall element having a substrate, a magnetic sensing part provided on or in the substrate, and a plurality of electrode parts connected to the magnetic sensing part;
  A plurality of external terminals arranged around the Hall element;
  A plurality of conductive wires for electrically connecting each electrode portion of the plurality of electrode portions and each external terminal of the plurality of external terminals;
  A sealing member that covers at least a part of the magnetically sensitive portion of the Hall element, the plurality of conductive wires, and the external terminals;
  Each of the external terminals has a second surface connected to each of the plurality of conductive wires, and a first surface opposite to the second surface,
  The first surface is exposed from the bottom surface of the sealing member,
  The height from the bottom surface of the sealing member to the first contact point between each electrode portion and each conductive wire is the second contact point between each external terminal and each conductive wire from the bottom surface of the sealing member. Lower than the height of,
  At least one of the plurality of external terminals has a step on the second surface,
  The plurality of external terminals have a first portion on the side closer to the Hall element of each external terminal having the step with the step as a boundary, and a second portion on the side far from the Hall element. And
  The height from the bottom surface of the sealing member to the second surface at the first portion is lower than the height from the bottom surface of the sealing member to the second surface at the second portion,
  Each said conducting wire is a Hall sensor connected with the said 2nd surface in the said 2nd site | part of each said external terminal which has the said level | step difference. The height of the second surface, the hole sensor according from the bottom of the sealing member to the lower claim 3 or 4 than the height to the electrode portions in the first region from the bottom surface of the sealing member . The step, the Hall sensor according to any one of claims 3 to 5 are provided on the peripheral surrounding the Hall element. Further comprising an insulating layer provided on the surface opposite to the plurality of surfaces on which the electrode portion is provided in said substrate, said insulating layer, according to claim 1 is exposed from the bottom surface of the sealing member 6 The hall sensor according to any one of the above. The plurality of external terminals include first to fourth external terminals,
The first to fourth external terminals are:
The virtual straight line connecting the first external terminal and the third external terminal and the virtual straight line connecting the second external terminal and the fourth external terminal are arranged so as to intersect in plan view,
The substrate of the Hall element is rectangular in plan view, and in plan view, the four vertices of the substrate of the Hall element are regions between the first external terminal and the second external terminal, A region between the second external terminal and the third external terminal; a region between the third external terminal and the fourth external terminal; and a region between the fourth external terminal and the first external terminal. Hall sensor according to any one of claims 1 to 7 arranged in the region between. Semi-insulating substrate, magnetic sensitive sections provided on the substrate or the substrate, and have a electrode portion, the edge of the surface where the sensing section is formed of the substrate is the sensing section And a Hall element not covered with the electrode part ,
An external terminal disposed around the Hall element;
A conducting wire connecting the electrode part and the external terminal;
A magnetic member of the Hall element, the conductive wire, and a sealing member that covers a second surface to which the conductive wire of the external terminal is connected, and
In the external terminal, the first surface opposite to the second surface is exposed from the bottom surface of the sealing member,
The thickness of the Hall element is thinner than the thickness of the external terminal,
The height from the bottom surface of the sealing member to the first contact point between the electrode portion and the conducting wire is higher than the height from the bottom surface of the sealing member to the second contact point between the external terminal and the conducting wire. also by make lower, the conductor and the Hall sensor have edges and is difficulty to contact the substrate. The electrode portion has first to fourth electrode portions,
The external terminal has first to fourth external terminals,
The conductive wires include first to fourth conductive wires that connect the first to fourth electrode portions and the first to fourth external terminals, respectively.
The height from the bottom surface of the sealing member to the first contact point between the first electrode portion and the first conductor is from the bottom surface of the sealing member to the first external terminal and the first contact point. The hall sensor according to claim 9 , wherein the hall sensor is lower than a height to the second contact point with the conducting wire. The height from the bottom surface of the sealing member to the third contact point between the second electrode portion and the second conductor is from the bottom surface of the sealing member to the second external terminal and the second contact point. Lower than the height to the fourth contact point with the conductor,
The height from the bottom surface of the sealing member to the fifth contact point between the third electrode portion and the third conductor is from the bottom surface of the sealing member to the third external terminal and the third contact point. Lower than the height to the sixth contact point with the conductor,
The height from the bottom surface of the sealing member to the seventh contact point between the fourth electrode portion and the fourth conductor is from the bottom surface of the sealing member to the fourth external terminal and the fourth contact point. The Hall sensor according to claim 10 , wherein the Hall sensor is lower than a height up to an eighth contact point with the conducting wire. In the Hall element, the substrate is a GaAs substrate, and further includes an insulating layer on a surface opposite to the surface on which the electrode portion of the substrate is provided, and the electrode portion is connected to the magnetically sensitive portion,
The Hall sensor according to claim 9 , wherein the insulating layer is exposed from a bottom surface of the sealing member. The hall sensor according to any one of claims 9 to 12 ,
A lens holder with a magnet attached thereto;
A drive coil for moving the magnet based on an output signal from the external terminal of the Hall sensor;
A lens module comprising:

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