JP6928463B2 - Hall element module - Google Patents

Description

The present invention relates to a Hall element module.

Patent Document 1 discloses an example of a Hall element module having a built-in Hall element. The Hall element module disclosed in the document includes a lead that conducts with the Hall element, and a resin package that covers the Hall element and a part of the lead.

There is an even greater demand for miniaturization of such Hall element modules. In the Hall element module of the same document, the arrangement of the Hall element and the lead and the shape of each are not sufficient for miniaturization.

Japanese Unexamined Patent Publication No. 2013-197386

The present invention has been conceived under the above-mentioned circumstances, and an object of the present invention is to provide a Hall element module capable of miniaturization.

The Hall element module provided by the present invention includes a Hall element having an element front surface and an element back surface, a terminal portion that conducts with the Hall element and is separated from the Hall element in a thickness direction, and the Hall element and the terminal. A Hall element module comprising a resin package that covers at least a part of each portion, wherein the resin package is perpendicular to the thickness direction and perpendicular to each other in the thickness direction. The terminal portion has a rectangular shape having four sides along the second direction, the terminal portion has a terminal back surface that faces the thickness direction and is exposed from the resin package, and the edge of the terminal back surface has the thickness. It is characterized by having a terminal back surface inclined portion that faces the Hall element and is inclined with respect to the first direction and the second direction in a longitudinal view.

In the practice of the present invention, the terminal portion preferably has a terminal surface facing the side opposite to the back surface of the terminal in the thickness direction, and the terminal surface is the Hall element in the thickness direction. It has terminal surface inclined portions that face each other and are inclined with respect to the first direction and the second direction.

In the practice of the present invention, the terminal surface inclined portion is preferably closer to the Hall element than the terminal back surface inclined portion, and the terminal portion is the terminal surface inclined portion and the terminal back surface inclined portion in the thickness direction. It has a terminal first thin-walled portion that is located between the terminals and is thinner than the distance between the terminal front surface and the terminal back surface.

In the practice of the present invention, the inclined portion on the front surface of the terminal and the inclined portion on the back surface of the terminal are preferably parallel to each other.

In the practice of the present invention, the edge of the back surface of the terminal preferably has a tip of the back surface of the terminal which is connected to the inclined portion of the back surface of the terminal and which is along the second direction and is located closest to the Hall element side in the first direction. However, the length of the inclined portion on the back surface of the terminal is longer than the length of the tip end portion on the back surface of the terminal.

In the practice of the present invention, the edge of the terminal surface preferably has a terminal surface tip portion connected to the terminal surface inclined portion and along the second direction and located closest to the Hall element side in the first direction. However, the length of the terminal surface inclined portion is longer than the length of the terminal surface tip portion.

In the practice of the present invention, the tip of the terminal surface and the tip of the back of the terminal are preferably aligned with each other in the thickness direction.

In the practice of the present invention, preferably, the edge of the back surface of the terminal has a side portion of the back surface of the terminal connected to the inclined portion of the back surface of the terminal and along the first direction, and the edge of the back surface of the terminal is the surface of the terminal. It has a terminal front surface side portion connected to the inclined portion and along the first direction, and the terminal surface inclined portion is separated from the terminal back surface inclined portion in a thickness direction view from the terminal back surface inclined portion. The terminal portion is located between the terminal front surface side portion and the terminal back surface side portion in the thickness direction, and is thinner than the distance between the terminal front surface and the terminal back surface portion. It has a second thin wall portion.

In the practice of the present invention, the side portion on the front surface of the terminal and the side portion on the back surface of the terminal are preferably parallel to each other.

In the practice of the present invention, the terminal portion preferably has a terminal third thin-walled portion that is connected to the terminal second thin-walled portion and extends in the first direction on the side opposite to the Hall element.

In carrying out the present invention, it is preferable to further include an island portion having an island surface on which the Hall element is mounted and an island back surface exposed from the resin package.

In the practice of the present invention, the edge of the back surface of the island preferably has an inclined portion on the back surface of the island that faces the inclined portion on the back surface of the terminal and is inclined with respect to the first direction and the second direction.

In the practice of the present invention, the inclined portion on the back surface of the island is preferably parallel to the inclined portion on the back surface of the terminal.

In the practice of the present invention, the edge of the island surface preferably has an island surface inclined portion that faces the terminal surface inclined portion and is inclined with respect to the first direction and the second direction.

In the practice of the present invention, the island surface inclined portion and the island back surface inclined portion are preferably parallel to each other.

In the practice of the present invention, the island surface inclined portion is preferably closer to the terminal portion than the island back surface inclined portion, and the island portion is the island surface inclined portion and the island back surface inclined portion in the thickness direction. It has an island first thin-walled portion that is located between the island and is thinner than the distance between the island surface and the island back surface.

In the practice of the present invention, the island portion preferably has an island second thin-walled portion connected to the island first thin-walled portion and extending in the second direction.

In the practice of the present invention, the four terminal portions surrounding the island portion are preferably provided.

In the practice of the present invention, preferably, the distance between the terminal surface inclined portion and the island surface inclined portion is smaller than the distance between the terminal surface side portions of the terminal portions adjacent to each other in the second direction. Is.

In the practice of the present invention, preferably, the distance between the terminal surface tip portion and the island second thin-walled portion in the first direction is such that the terminal surface side portions of the terminal portions adjacent to each other in the second direction. It is less than the distance between them.

In the practice of the present invention, a connecting thin-walled portion that connects the terminal portion and the island portion is preferably provided.

In the practice of the present invention, the back surface of the device is preferably exposed from the resin package.

In the practice of the present invention, preferably, the Hall element is square in the thickness direction and its diagonal line is arranged along the first direction and the second direction.

Other features and advantages of the present invention will become more apparent with the detailed description given below with reference to the accompanying drawings.

It is a perspective view which shows the Hall element module based on 1st Embodiment of this invention. It is a top view which shows the Hall element module of FIG. It is a bottom view which shows the Hall element module of FIG. It is a front view which shows the Hall element module of FIG. It is a side view which shows the Hall element module of FIG. It is sectional drawing which follows the VI-VI line of FIG. It is sectional drawing which follows the line VII-VII of FIG. It is sectional drawing which follows the line VIII-VIII of FIG. It is sectional drawing which follows the IX-IX line of FIG. It is a block diagram of the circuit to which the Hall element of FIG. 1 is applied. It is sectional drawing which shows an example of the manufacturing method of the Hall element module of FIG. It is a top view which shows an example of the manufacturing method of the Hall element module of FIG. It is sectional drawing which follows the XIII-XIII line of FIG. It is sectional drawing which shows an example of the manufacturing method of the Hall element module of FIG. It is sectional drawing which shows an example of the manufacturing method of the Hall element module of FIG. It is sectional drawing which shows an example of the manufacturing method of the Hall element module of FIG. It is sectional drawing along the VI-VI line of FIG. 2 which shows the modification of the Hall element module of FIG. It is a top view which shows the Hall element module based on 2nd Embodiment of this invention. FIG. 8 is a cross-sectional view taken along the line XXIX-XXIX of FIG. It is a top view which shows the Hall element module based on 3rd Embodiment of this invention. It is a top view which shows the Hall element module based on 4th Embodiment of this invention. FIG. 2 is a cross-sectional view taken along the line XXII-XXII of FIG. It is a top view which shows the Hall element module based on 5th Embodiment of this invention. It is a bottom view which shows the Hall element module of FIG. It is sectional drawing which follows the XXV-XXV line of FIG. FIG. 3 is a cross-sectional view taken along the line XXVI-XXVI of FIG. 23. It is a top view which shows the Hall element module based on 6th Embodiment of this invention. It is a partially enlarged plan view which shows the modification of the Hall element module of FIG. 27. It is a partially enlarged plan view which shows the modification of the Hall element module of FIG. 27. It is a bottom view which shows the Hall element module of FIG. FIG. 2 is a cross-sectional view taken along the line XXXI-XXXXI of FIG. 27. FIG. 2 is a cross-sectional view taken along the line XXXII-XXXII of FIG. 27. It is a top view which shows the Hall element module based on 7th Embodiment of this invention. It is a bottom view which shows the Hall element module of FIG. 33.

A embodiment for carrying out the present invention (hereinafter referred to as “the embodiment”) will be specifically described with reference to the drawings.

[First Embodiment]
1 to 10 show a Hall element module A1 based on the first embodiment of the present invention. The Hall element module A1 of the present embodiment includes four terminal portions 1, an island portion 2, a Hall element 3, four wires 4, and a resin package 5.

FIG. 1 is a perspective view showing the Hall element module A1. FIG. 2 is a plan view showing the Hall element module A1. FIG. 3 is a bottom view showing the Hall element module A1. FIG. 4 is a front view showing the Hall element module A1. FIG. 5 is a side view showing the Hall element module A1. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG. FIG. 9 is a cross-sectional view taken along the line IX-IX of FIG. FIG. 10 is a block diagram of a circuit to which the Hall element module A1 is applied. In these figures, the x direction is the first direction of the present invention, the y direction is the second direction of the present invention, and the z direction is the thickness direction of the present invention. Both the x and y directions are perpendicular to the z direction. Further, the x-direction and the y-direction are perpendicular to each other. For convenience of understanding, the resin package 5 is shown by an imaginary line in FIGS. 1 and 2.

The Hall element module A1 has a rectangular shape having four sides along the x-direction and the y-direction in the z-direction view. The size of the Hall element module A1 is not particularly limited, and in the present embodiment, the x-direction dimension is 0.6 to 1.0 mm, the y-direction dimension is 0.3 to 0.5 mm, and the z-direction dimension (thickness) is It is set to 0.2 to 0.4 mm, for example, the x-direction dimension is 0.8 mm, the y-direction dimension is 0.4 mm, and the z-direction dimension (thickness) is 0.23 mm.

The four terminal portions 1 and the island portion 2 are formed by appropriately cutting a metal lead frame that has been subjected to patterning such as etching. The materials of the terminal portion 1 and the island portion 2 are not particularly limited, and Cu is exemplified. In the present embodiment, the terminal portion 1 and the island portion 2 are formed of the same lead frame, and have the same maximum thickness. The maximum thickness of the terminal portion 1 and the island portion 2 is not particularly limited, and in the present embodiment, it is 0.06 mm to 0.1 mm, for example, 0.08 mm.

The four terminal portions 1 are separated from the island portion 2 and the Hall element 3 in the z-direction view. In the present embodiment, two terminal portions 1 are arranged apart from each other in the x direction with the island portion 2 and the Hall element 3 interposed therebetween. Further, on one side of the island portion 2 and the Hall element 3 in the x direction, two wires 4 are arranged so as to face each other in the y direction. In the present embodiment, the four terminal portions 1 have substantially the same configuration, but each may have a different configuration.

The terminal portion 1 includes a terminal front surface 11, a terminal back surface 12, a terminal first thin-walled portion 13, a terminal second thin-walled portion 14, a terminal third thin-walled portion 15, a terminal side exposed surface 16, a terminal inclined surface 131, and a terminal first intermediate. It has a surface 132, a terminal side surface 141, a terminal second intermediate surface 142, a terminal rear surface 151, and a terminal rear surface 151.

The terminal surface 11 is a surface facing upward in the z direction. The terminal back surface 12 is a surface facing downward in the z direction. The terminal back surface 12 is exposed from the resin package 5 and is used as a mounting terminal when the Hall element module A1 is mounted on a circuit board or the like. In the present embodiment, the terminal front surface 11 is formed with a plating layer 119 made of Ni, Pd, Au, etc., and the terminal back surface 12 is formed with a plating layer 129 made of Ni, Pd, Au, etc. There is. The plating layer 119 and the plating layer 129 may not be formed.

As shown in FIG. 2, the edge of the terminal surface 11 has a terminal surface inclined portion 111, a terminal surface tip portion 112, and a terminal surface side portion 113. The terminal surface inclined portion 111 faces the Hall element 3 in the z direction and is inclined with respect to the x direction and the y direction. In the illustrated example, the terminal surface inclined portion 111 has an angle of 45 ° with respect to the x direction and the y direction. The terminal surface tip portion 112 is connected to the terminal surface inclined portion 111, is located along the y direction and is located closest to the Hall element 3 in the x direction. The terminal surface side portion 113 is a portion connected to the terminal surface inclined portion 111 and along the x direction. The terminal surface inclined portion 111 may have a curved shape as a whole due to a manufacturing method such as etching.

As shown in FIG. 3, the edge of the terminal back surface 12 has a terminal back surface inclined portion 121, a terminal back surface tip portion 122, a terminal back surface side portion 123, and a terminal back surface rear portion 124. The terminal back surface inclined portion 121 faces the Hall element 3 in the z direction and is inclined with respect to the x direction and the y direction. In the illustrated example, the terminal back surface inclined portion 121 has an angle of 45 ° with respect to the x direction and the y direction, and is parallel to the terminal surface inclined portion 111. The terminal back surface tip portion 122 is connected to the terminal back surface inclined portion 121, is located along the y direction and is located closest to the Hall element 3 in the x direction. The terminal back surface side portion 123 is a portion connected to the terminal back surface inclined portion 121 and along the x direction. The terminal back surface rear portion 124 is connected to the terminal back surface side portion 123, is located on the side opposite to the terminal back surface tip portion 122 in the x direction, and is along the y direction. The terminal back surface inclined portion 121 may have a curved shape as a whole due to a manufacturing method such as etching.

As shown in FIGS. 2, 3 and 7, the terminal front surface inclined portion 111 is closer to the Hall element 3 in the z-direction view than the terminal back surface inclined portion 121. The terminal first thin-walled portion 13 is located between the terminal front surface inclined portion 111 and the terminal back surface inclined portion 121 in the z direction, and is the distance between the terminal front surface 11 and the terminal back surface 12 of the terminal portion 1. It is a part that is thinner than the maximum thickness. The terminal inclined surface 131 is a surface connected to the terminal surface inclined portion 111 and along the z direction. The dimension of the terminal inclined surface 131 in the z direction is smaller than the maximum thickness of the terminal portion 1, and in the present embodiment, it is about 1/4 to 1/2 of the maximum thickness. The terminal first intermediate surface 132 is connected to the terminal inclined surface 131 and the terminal back surface inclined portion 121. The shape of the terminal first intermediate surface 132 is not particularly limited, and in the case of the illustrated example, it is a shape having a concave curved surface recessed inward. The terminal first intermediate surface 132 may be an inclined surface or may have a shape in which a plurality of planes are combined.

As shown in FIGS. 1 to 3, the terminal front end portion 112 and the terminal back surface tip portion 122 coincide with each other in the z-direction view. Therefore, no step or inclined surface is set between the terminal front end 112 and the terminal back end 122.

As shown in FIGS. 2, 3 and 9, the terminal front side portion 113 is closer to the terminal portion 1 arranged to face the terminal back surface side portion 123 in the y direction than the terminal back surface side portion 123. The terminal second thin-walled portion 14 is located between the terminal front surface side portion 113 and the terminal back surface side portion 123 in the z direction, and is the distance between the terminal front surface 11 and the terminal back surface 12. It is a portion thinner than the maximum thickness of 1. The terminal side surface 141 is a surface connected to the terminal surface side portion 113 and along the z direction. The dimension of the terminal side direction 141 in the z direction is smaller than the maximum thickness of the terminal portion 1, and in the present embodiment, it is about 1/4 to 1/2 of the maximum thickness. The terminal second intermediate surface 142 is connected to the terminal side side 141 and the terminal back surface side portion 123. The shape of the terminal second intermediate surface 142 is not particularly limited, and in the case of the illustrated example, it is a shape having a concave curved surface recessed inward. The terminal second intermediate surface 142 may be an inclined surface or may have a shape in which a plurality of planes are combined.

The terminal third thin-walled portion 15 is connected to the terminal second thin-walled portion 14 and extends in the x direction to the opposite side of the Hall element 3. The terminal rear surface 151 is an end surface of the terminal third thin-walled portion 15, and is exposed in the x direction from the resin package 5 as shown in FIG. The dimension of the terminal rear surface 151 in the z direction is smaller than the maximum thickness of the terminal portion 1, and in the present embodiment, it is about 1/4 to 1/2 of the maximum thickness.

The terminal side exposed surface 16 is located on the side opposite to the terminal front side portion 113 and the terminal back surface side portion 123 in the y direction, and in the present embodiment, faces the side opposite to the terminal side side 141. ing. As shown in FIG. 4, the terminal side exposed surface 16 is exposed in the y direction from the resin package 5. In the present embodiment, the dimension of the terminal side exposed surface 16 in the z direction is the same as the maximum thickness of the terminal portion 1.

The island portion 2 includes an island front surface 21, an island back surface 22, an island first thin-walled portion 23, an island second thin-walled portion 24, an island side 231 and an island first intermediate surface 232, an island side exposed surface 241 and an island second intermediate. It has a surface 242.

The island surface 21 is a surface facing upward in the z direction. The island back surface 22 is a surface facing downward in the z direction. The island back surface 22 is exposed from the resin package 5. In the present embodiment, the island surface 21 is formed with a plating layer 219 made of Ni, Pd, Au, etc., and the island back surface 22 is formed with a plating layer 229 made of Ni, Pd, Au, etc. There is. The plating layer 219 and the plating layer 229 may not be formed.

As shown in FIG. 2, the edge of the island surface 21 has four island surface inclined portions 211. The island surface inclined portion 211 faces the terminal surface inclined portion 111 of the terminal portion 1 in the z direction, and is inclined with respect to the x direction and the y direction. In the illustrated example, the island surface inclined portion 211 has an angle of 45 ° with respect to the x direction and the y direction. That is, in the present embodiment, the island surface inclined portion 211 is parallel to the terminal surface inclined portion 111 of the terminal portion 1. The island surface inclined portion 211 may have a curved shape as a whole due to a manufacturing method such as etching. The envelopes of the four island surface inclined portions 211 have a rectangular shape whose diagonal lines are along the x-direction and the y-direction in the z-direction view.

As shown in FIG. 3, the edge of the island back surface 22 has four island back surface inclined portions 221 and an island back surface parallel portion 222. The island back surface inclined portion 221 faces the terminal back surface inclined portion 121 of the terminal portion 1 in the z direction, and is inclined with respect to the x direction and the y direction. In the illustrated example, the island back surface inclined portion 221 has an angle of 45 ° with respect to the x direction and the y direction, and is parallel to the island surface inclined portion 211. The island back surface parallel portion 222 is located at one end in the y direction and is along the x direction. The envelopes of the four island backside inclined portions 221 have a rectangular shape whose diagonal lines are along the x-direction and the y-direction in the z-direction view. The island back surface inclined portion 221 may have a curved shape as a whole due to a manufacturing method such as etching.

As shown in FIGS. 2, 3 and 7, the island front surface inclined portion 211 is closer to the terminal portion 1 arranged to face each other in the z-direction view than the island back surface inclined portion 221. The island first thin-walled portion 23 is located between the island front surface inclined portion 211 and the island back surface inclined portion 221 in the z direction, and is the distance between the island surface 21 and the island back surface 22 of the island portion 2. It is a part that is thinner than the maximum thickness. The island side direction 231 is a surface connected to the island surface inclined portion 211 and along the z direction. The dimension of the island side 231 in the z direction is smaller than the maximum thickness of the island portion 2, and in the present embodiment, it is about 1/4 to 1/2 of the maximum thickness. The island first intermediate surface 232 is connected to the island side direction 231 and the island back surface inclined portion 221. The shape of the island first intermediate surface 232 is not particularly limited, and in the case of the illustrated example, it is a shape having a concave curved surface recessed inward. The island first intermediate surface 232 may be an inclined surface or may have a shape in which a plurality of planes are combined.

As shown in FIGS. 2, 3 and 8, the island second thin-walled portion 24 is connected to the island first thin-walled portion 23 and extends in the y direction. The island side exposed surface 241 is an end surface of the island second thin-walled portion 24, and is exposed in the y direction from the resin package 5 as shown in FIGS. 4 and 8. The dimension of the island side exposed surface 241 in the z direction is smaller than the maximum thickness of the island portion 2, which is the distance between the island surface 21 and the island back surface 22, and in the present embodiment, the maximum thickness is 1 It is about / 4 to 1/2. The island second intermediate surface 242 is connected to the island side exposed surface 241 and the island back surface 22. The shape of the island second intermediate surface 242 is not particularly limited, and in the case of the illustrated example, it is a shape having a concave curved surface recessed inward. The island second intermediate surface 242 may be an inclined surface or may have a shape in which a plurality of planes are combined.

In the present embodiment, as shown in FIG. 2, the length d1 of the terminal surface inclined portion 111 is larger than the length d2 of the terminal surface tip portion 112. Further, the distance d3 between the terminal surface side portions 113 of the terminal portions 1 facing each other in the y direction is larger than the distance d4 between the terminal surface inclined portions 111 facing each other and the island surface inclined portion 211. be. Further, the distance d3 is larger than the distance d5 between the opposite terminal surface tip portion 112 and the island second thin-walled portion 24. In the present embodiment, the distance d3 is about 0.1 mm, and the distance d4 and the distance d5 are both about 0.07 mm. Further, as shown in FIG. 7, the distance d6 between the terminal surface inclined portion 111 and the terminal back surface inclined portion 121 in the z direction is between the island surface inclined portion 211 and the island back surface inclined portion 221 in the z direction view. Is smaller than the distance d7. Further, as shown in FIG. 9, the distance d8 between the terminal front side side portion 113 and the terminal back surface side portion 123 in the z-direction view is larger than the distance d6 in FIG. For example, the distance d6 is about 0.01 to 0.03 mm, the distance d7 is about 0.07 mm, and the distance d8 is about 0.05 mm.

The Hall element 3 has an element body 31 and four electrode pads 32, and has a rectangular shape in the z-direction view. In the present embodiment, the Hall element 3 is mounted on the island surface 21 of the island portion 2 in a posture in which the diagonal lines are along the x-direction and the y-direction. The length of one side of the Hall element 3 in the z-direction is, for example, about 0.19 mm, the length of the island back surface inclined portion 221 is about 0.14 mm, and the length of the island surface inclined portion 211 is about 0.28 mm. be. In the present embodiment, the island back surface 22 is included in the Hall element 3 in the z-direction view. In the cross-sectional view of FIG. 6 and the like, the electrode pad 32 is omitted.

The element body 31 is made of a semiconductor material and is a portion where the Hall effect is exhibited. The element main body 31 has an element front surface 311 and an element back surface 312. The element surface 311 is a surface of the island portion 2 facing the same side as the island surface 21, and is parallel to the island surface 21 in the illustrated example. The element back surface 312 faces the side opposite to the element surface 311 and is bonded to the island surface 21 by a bonding material 39 such as an insulating bonding material or a conductive bonding material. In the present embodiment, Ag paste is selected as the bonding material 39. The four electrode pads 32 are formed on the element surface 311 and include two electrode pads 32 for inputting a drive current to the Hall element 3 and two electrode pads 32 for outputting an output voltage (Hall voltage). It consists of.

The four wires 4 make the four terminal portions 1 and the Hall element 3 conductive. The wire 4 is bonded to the electrode pad 32 of the Hall element 3 and the terminal surface 11 of the terminal portion 1, respectively. The wire 4 is made of, for example, Au.

As shown in FIGS. 2 and 6, the wire 4 has a first bonding portion 41 and a second bonding portion 42. In the present embodiment, the first bonding portion 41 is a portion of the wire 4 bonded to the terminal surface 11 of the terminal portion 1. The second bonding portion 42 is a portion of the wire 4 bonded to the electrode pad 32 of the Hall element 3. Further, in the present embodiment, a bump portion 43 interposed between the second bonding portion 42 and the electrode pad 32 is provided. Prior to the formation of the second bonding portion 42, the bump portion 43 is formed by partially melting the wire material for forming the wire 4 and attaching it to the electrode pad 32 as a ball-shaped mass. However, such a configuration is an example of the configuration of the wire 4, and the wire 4 can have various configurations. In the present embodiment, as shown in FIGS. 2 and 9, the first bonding portion 41 intersects the terminal back surface side portion 123 in the z direction, and both the terminal back surface 12 and the terminal second thin-walled portion 14 It overlaps with.

The resin package 5 covers a part of each of the four terminal parts 1, a part of the island part 2, the Hall element 3, and the four wires 4. The resin package 5 is made of an insulating resin, for example, an epoxy resin mixed with a filler. As shown in FIGS. 1 to 9, the resin package 5 has a resin front surface 51, a resin back surface 52, a pair of resin first side surfaces 53, and a pair of resin second side surfaces 54. The resin package 5 has a rectangular shape having four sides along the x-direction and the y-direction in the z-direction.

The resin surface 51 is a surface of the resin package 5 that faces the same side as the terminal surface 11 and the island surface 21 in the z direction. The resin back surface 52 is a surface facing the opposite side of the resin surface 51 in the z direction. The pair of resin first side surfaces 53 are along the z direction and the x direction, and face each other in the y direction. The pair of resin second side surfaces 54 are along the z direction and the y direction, and face each other in the x direction.

In this embodiment, the resin back surface 52, the terminal back surface 12, and the island back surface 22 are flush with each other. Further, the resin first side surface 53, the terminal side exposed surface 16 and the island side exposed surface 241 are flush with each other. Further, the resin second side surface 54 and the terminal rear surface 151 are flush with each other.

Next, an example of a circuit to which the Hall element module A1 is applied will be described with reference to FIG. FIG. 10 is a block diagram of a circuit to which the Hall element module A1 is applied.

As shown in FIG. 10, the circuit is composed of a Hall element module A1, an integrated circuit 710, and a controlled object 72. Examples of the control target 72 include a light source for a display of a mobile phone, a DC motor, and the like. The integrated circuit 710 includes a device drive region 711, a voltage detection region 712, and a control region 713. The device drive region 711 is a region in which a Hall current is passed through the Hall element 3 of the Hall element module A1. The voltage detection region 712 is a region for detecting the electromotive force (Hall voltage) appearing in the Hall element 3 due to the Hall effect. The control area 713 is an area for controlling the operation of the control target 72. Now, when the magnet 73 is brought close to the Hall element module A1, the magnetic flux density changes, so that an electromotive force appears in the Hall element 3 due to the Hall effect. The electromotive force is detected by the voltage detection region 712. The voltage detection region 712 transmits this detection result to the control region 713. The control area 713 controls (starts, stops, etc.) the operation of the controlled object 72 based on the transmitted detection result.

Next, an example of a method for manufacturing the Hall element module A1 will be described below with reference to FIGS. 11 to 16.

First, as shown in FIG. 11, the frame material 10A is prepared. The frame material 10A is formed by forming a plating layer 103 of Ni, Pd, Au or the like and a plating layer 104 on both sides of a base material made of, for example, Cu. The frame material 10A has a front surface 101 and a back surface 102 facing opposite sides in the z direction.

Next, the lead frame 10 shown in FIGS. 12 and 13 is formed by patterning the frame material 10A. The lead frame 10 is formed by appropriately connecting the terminal portion 1 and the island portion 2 constituting the Hall element module A1. In the cutting step described later, by cutting along the cutting line 81, a terminal portion 1 and an island portion 2 capable of forming a plurality of Hall element modules A1 can be obtained from the lead frame 10. Therefore, as shown in the drawing, the lead frame 10 has a terminal front surface 11, a terminal back surface 12, an element main body 31, a terminal second thin-walled portion 14, and a terminal third thin-walled portion 15, which are parts of the terminal portion 1 and the island portion 2. , The island front surface 21, the island back surface 22, the island first thin-walled portion 23, and the island second thin-walled portion 24.

Next, as shown in FIG. 14, the Hall element 3 is mounted. This step is performed by joining the element back surface 312 of the element body 31 of the Hall element 3 to the island surface 21 of the island portion 2 with a bonding material 39 such as Ag paste, for example.

Then, as shown in FIG. 15, the wire 4 is bonded. Bonding of the wire 4 is performed using, for example, a wire material made of Au. In the present embodiment, one end of the wire material is first melted and attached to the electrode pad 32 of the Hall element 3. As a result, the bump portion 43 is formed on the electrode pad 32. Then, one end of the wire material is melted again and adhered to the terminal surface 11 of the terminal portion 1. As a result, the first bonding portion 41 is formed. Next, the other portion of the wire material is joined to the bump portion 43 on the electrode pad 32 by using ultrasonic waves or the like. As a result, the second bonding portion 42 is formed.

Next, the resin package 5 is formed as shown in FIG. The illustrated resin package 5 is integrally formed over a region for forming a plurality of Hall element modules A1. After that, the lead frame 10 and the resin package 5 are cut along the cutting line 81. As a result, a plurality of Hall element modules A1 shown in FIGS. 1 to 9 can be obtained.

Next, the action and effect of the Hall element module A1 will be described.

According to the present embodiment, as shown in FIG. 3, a terminal back surface inclined portion 121 is formed on the terminal back surface 12 of the terminal portion 1. The terminal back surface inclined portion 121 faces the Hall element 3 in the z direction and is inclined with respect to the x direction and the y direction. Therefore, it is possible to prevent the shortest distance between the terminal back surface 12 and the Hall element 3 in the z-direction view from becoming unreasonably small while bringing the center position of the terminal portion 1 closer to the Hall element 3. Therefore, the Hall element module A1 can be miniaturized.

Further, as shown in FIG. 2, a terminal surface inclined portion 111 is formed on the terminal surface 11 of the terminal portion 1. The terminal surface inclined portion 111 faces the Hall element 3 in the z direction and is inclined with respect to the x direction and the y direction. Therefore, it is possible to prevent the shortest distance between the terminal surface 11 and the Hall element 3 in the z-direction view from becoming unreasonably small while bringing the center position of the terminal portion 1 closer to the Hall element 3. Therefore, the Hall element module A1 can be miniaturized.

Further, the terminal front surface inclined portion 111 is closer to the Hall element 3 than the terminal back surface inclined portion 121, and the terminal portion 1 is assumed to have the terminal first thin-walled portion 13. The lower surface of the terminal first thin-walled portion 13 in the z direction is covered with the resin package 5. As a result, it is possible to prevent the terminal portion 1 from falling off from the resin package 5 downward in the z direction.

Since the terminal front surface inclined portion 111 and the terminal back surface inclined portion 121 are parallel to each other, the terminal first thin-walled portion 13 having a uniform width is formed. This is preferable in order to prevent the terminal portion 1 from falling off from the resin package 5.

The length d1 of the terminal surface inclined portion 111 is longer than the length d2 of the terminal surface tip portion 112. This is suitable for reducing the y-direction dimension of the terminal portion 1 and thus the Hall element module A1 while avoiding an unreasonably short distance between the terminal surface 11 and the Hall element 3 (island portion 2). There is. Further, in the present embodiment, the length of the terminal back surface inclined portion 121 is larger than the length of the terminal back surface tip portion 122, which is preferable for miniaturization of the Hall element module A1.

In the present embodiment, the terminal front end 112 and the terminal back end 122 coincide with each other in the z-direction view. As a result, it is possible to prevent the terminal portion 1 and the island portion 2 from being excessively close to each other.

Since the terminal portion 1 has the terminal second thin-walled portion 14, it is possible to more reliably prevent the terminal portion 1 from falling off from the resin package 5. It is preferable that the terminal portion 1 has the terminal third thin-walled portion 15 in order to prevent the terminal portion 1 from falling off from the resin package 5.

Since the island back surface 22 of the island portion 2 has the island back surface inclined portion 221 so that the center of the terminal portion 1 and the center of the island portion 2 are brought close to each other, the shortest distance between the terminal back surface 12 and the island back surface 22 is unreasonably small. Can be avoided. Further, since the island surface 21 has the island surface inclined portion 211, the shortest distance between the terminal surface 11 and the island surface 21 becomes unreasonably small while bringing the center of the terminal portion 1 and the center of the island portion 2 closer to each other. Can be avoided.

By providing the island portion 2 with the island first thin-walled portion 23, it is possible to prevent the island portion 2 from falling off from the resin package 5. Further, it is preferable that the island portion 2 has the island second thin-walled portion 24 in order to prevent the island portion 2 from falling off from the resin package 5.

As shown in FIGS. 7 and 9, the distance d6, which is the protruding distance of the terminal first thin-walled portion 13, is the protruding distance d7, which is the protruding distance of the island first thin-walled portion 23, and the protruding distance of the terminal second thin-walled portion 14. It is smaller than the distance d8. This is preferable to prevent the terminal portion 1 from falling off from the resin package 5 by the terminal first thin-walled portion 13 and to prevent the shortest distance between the terminal portion 1 and the island portion 2 from becoming unreasonably small. ..

As shown in FIG. 2, the distance d3 is larger than the distance d4 and the distance d5. The distance d3 is the distance between the terminal surface side portions 113. The terminal surface side portion 113 is relatively separated from the island portion 2 and the Hall element 3. Even if such a distance d3 is relatively large, the miniaturization of the Hall element module A1 is hardly hindered. Moreover, by making the distance d3 relatively large, the effect of promoting the wraparound of the resin material when forming the resin package 5 can be expected. On the other hand, as the distance d4 and the distance d5 become larger, the miniaturization of the Hall element module A1 is hindered. In the present embodiment, the Hall element module A1 is intended to be miniaturized by making the distance d4 and the distance d5 relatively small. The minimum dimensions of the distance d4 and the distance d5 are empirically about the maximum thickness of the terminal portion 1 and the island portion 2. That is, the configuration in which the thickness of the terminal portion 1 and the island portion 2 is 0.08 mm and the distance d3 is 0.1 mm is an indication that, for example, the above-mentioned resin material is intended to wrap around.

The configuration in which the diagonal lines of the Hall element 3 are along the x-direction and the y-direction is such that the island portion 2 having the island surface inclined portion 211 and the island back surface parallel portion 222 is mounted on the terminal surface inclined portion 111 and the terminal back surface inclined portion. It is advantageous for avoiding interference with the terminal portion 1 having 121, and is preferable for miniaturization of the Hall element module A1.

As shown in FIGS. 2 and 9, the first bonding portion 41 intersects the terminal back surface side portion 123 in the z-direction view, and overlaps both the terminal back surface 12 and the terminal second thin-walled portion 14. As a result, when the wire 4 is bonded, the portion of the terminal portion 1 that overlaps with the terminal back surface 12 in the z direction can appropriately receive the force applied from the capillary or the like for bonding, and the bonding operation can be performed. Can be prevented from becoming unstable. On the other hand, since a part of the first bonding portion 41 overlaps with the terminal second thin wall portion 14, the first bonding portion 41 is arranged on the center side in the y direction. As a result, the first bonding portion 41 is too close to the resin first side surface 53 of the resin package 5, so that the resin package 5 is locally thinned, and the wire 4 is erroneously cut in the above-mentioned cutting step. Can be avoided.

17 to 34 show modifications and other embodiments of the present invention. In these figures, elements that are the same as or similar to the Hall element module A1 are designated by the same reference numerals as those of the Hall element module A1.

FIG. 17 is a cross-sectional view showing a modified example of the Hall element module A1. In this modification, the configuration of the wire 4 is different from that of the Hall element module A1. In the wire 4 of this modification, the first bonding portion 41 is bonded to the electrode pad 32 of the Hall element 3, and the second bonding portion 42 is bonded to the terminal surface 11 of the terminal portion 1. The Hall element module A1 can be miniaturized even by such a modification. The example shown in FIG. 6 is more advantageous for reducing the z-direction dimension of the Hall element module A1, but the arrangement of the first bonding portion 41 and the second bonding portion 42 can be appropriately selected. The same applies to the embodiment.

[Second Embodiment]
18 and 19 show the Hall element module A2 based on the second embodiment of the present invention. The Hall element module A2 is different from the Hall element module A1 in that it includes a connecting thin portion 29.

The connecting thin-walled portion 29 connects one terminal portion 1 and the island portion 2. That is, the terminal portion 1 and the island portion 2 at the lower left in the figure of FIG. 18 are integrally formed together with the connecting thin-walled portion 29. More specifically, the connecting thin-walled portion 29 connects the terminal first thin-walled portion 13 of the terminal portion 1 and the island first thin-walled portion 23 of the island portion 2. The z-direction dimension (thickness) of the connecting thin-walled portion 29 is smaller than the maximum thickness of the terminal portion 1 and the island portion 2, and the lower part in the z-direction is covered with the resin package 5.

The Hall element module A2 can also be miniaturized according to such an embodiment. Further, by connecting the terminal portion 1 and the island portion 2 by the connecting thin-walled portion 29, it is possible to increase the rigidity of the island portion 2 during the manufacturing process and after completion.

[Third Embodiment]
FIG. 20 shows a Hall element module A3 based on the third embodiment of the present invention. The Hall element module A3 is different from the Hall element module A1 in the shapes of the terminal portion 1 and the island portion 2.

The edge of the terminal portion 1 of the present embodiment does not have the terminal surface inclined portion 111. That is, the terminal surface tip portion 112 and the terminal surface side portion 113 are connected.

The island portion 2 of the present embodiment has an island surface orthogonal portion 210 having a pair of edge edges of the island surface 21. The pair of island surface orthogonal portions 210 are arranged along the y direction and separated from each other in the x direction.

The Hall element 3 of the present embodiment is mounted on the island surface 21 in a posture in which the four sides are along the x-direction and the y-direction.

Even in such an embodiment, the Hall element module A3 can be downsized because the terminal back surface inclined portion 121 is formed on the edge of the terminal back surface 12 of the terminal portion 1.

[Fourth Embodiment]
21 and 22 show the Hall element module A4 based on the fourth embodiment of the present invention. The Hall element module A4 is different from the Hall element module A1 in that the island portion 2 is not provided.

In the Hall element 3, the element back surface 312 is exposed downward from the resin back surface 52 of the resin package 5 in the z direction. In the illustrated example, an insulating layer 38 is formed on the element main body 31, and the insulating layer 38 constitutes the device back surface 312.

The terminal portion 1 has a shape in which the terminal front surface 11 and the terminal back surface 12 coincide with each other in the z-direction view. That is, although the edge of the terminal front surface 11 has the terminal front surface inclined portion 111 and the end edge of the terminal back surface 12 has the terminal back surface inclined portion 121, the terminal first thin-walled portion 13, the terminal second thin-walled portion 14, and the terminal first 3 The thin portion 15 is not formed.

In the manufacture of such a Hall element module A4, for example, a plurality of terminal portions 1 and a Hall element 3 are mounted on a base material (not shown), the wires 4 are bonded, and then the resin package 5 is formed. Then, the Hall element module A4 is obtained by peeling the base material from the terminal portion 1, the Hall element 3, and the resin package 5.

The Hall element module A4 can also be miniaturized according to such an embodiment.

[Fifth Embodiment]
23 to 26 show the Hall element module A5 based on the fifth embodiment of the present invention. The Hall element module A5 is different from the Hall element module A1 in the shapes of the terminal portion 1 and the island portion 2.

As shown in FIG. 23, the edge of the island surface 21 of the island portion 2 has an island surface convex portion 212 facing the terminal portion 1 in the z direction. The island surface convex portion 212 has a shape protruding toward each terminal portion 1. In the present embodiment, the island surface convex portion 212 is formed by a curved line. In addition, in the present embodiment, the shape of the island surface 21 excluding the island second thin-walled portion 24 is an ellipse with the x direction as the long axis. The shape of the island surface 21 excluding the island second thin-walled portion 24 may be circular.

Further, as shown in FIG. 23, the distance between one side of the Hall element 3 and the edge of the island surface convex portion 212 in the direction orthogonal to one side of the Hall element 3 in the z-direction is at least two lengths. (Length La and length Lb shown in FIG. 23) are present. In the present embodiment, the length La is set longer than the length Lb.

As shown in FIG. 24, the edge of the island back surface 22 of the island portion 2 has an island back surface parallel portion 222 and an island back surface curved portion 223. The island back surface parallel portion 222 is parallel in the x direction like the Hall element module A1. The island back surface curved portion 223 is a continuous curved portion, and both ends thereof are connected to the island back surface parallel portion 222. The shape of the island back surface 22 may be the same as that of the Hall element module A1.

As shown in FIGS. 25 and 26, the island side direction 231 is a surface connected to the island surface convex portion 212 and along the z direction. In the present embodiment, the island side 231 is a curved surface protruding toward the terminal portion 1 in the z-direction view.

As shown in FIG. 23, the edge of the terminal surface 11 of the terminal portion 1 has a terminal surface recess 115 facing the island surface convex portion 212 of the island surface 21 in the z direction. The terminal surface recess 115 is a portion corresponding to the terminal surface inclined portion 111 described above. The terminal surface recess 115 is formed by a curved line recessed inward of the terminal portion 1. Therefore, the shape of the terminal surface concave portion 115 corresponds to the island surface convex portion 212 of the island portion 2.

As shown in FIG. 24, the edge of the terminal back surface 12 of the terminal portion 1 has a terminal back surface recess 125 facing the island portion 2 in the z direction. The terminal back surface recess 125 is a portion corresponding to the terminal back surface inclined portion 121 described above. The terminal back surface recess 125 is formed by a curved line recessed inward of the terminal portion 1.

As shown in FIGS. 23 and 24, the terminal back surface recess 125 overlaps the terminal surface recess 115 in the z-direction view. Therefore, in the present embodiment, the terminal concave surface 115 is connected to the terminal front surface recess 115 and the terminal back surface recess 125 in the z direction, and the terminal concave surface 133 along the z direction appears in the terminal portion 1 in the terminal portion 1. The terminal concave surface 133 is a curved surface that is recessed inward of the terminal portion 1 in the z-direction view. Further, the terminal concave surface 133 is smoothly connected to the terminal inclined surface 131. The terminal portion 1 according to the present embodiment does not have the terminal first thin-walled portion 13 described above.

As shown in FIGS. 23 and 24, the terminal portion 1 includes a terminal thin portion 18. The terminal thin-walled portion 18 according to the present embodiment is a portion corresponding to the terminal second thin-walled portion 14 and the terminal third thin-walled portion 15 described above. The thickness of the terminal thin portion 18 is thinner than the maximum thickness of the terminal portion 1, which is the distance between the terminal front surface 11 and the terminal back surface 12, and the thickness is about 1/4 to 1/2 of the maximum thickness. Is. Further, the terminal thin portion 18 has a part of the terminal surface 11.

As shown in FIG. 23, the distance d3 between the terminal surface side portions 113 of the terminal portions 1 arranged to face each other in the y direction is the distance d4 between the terminal surface concave portions 115 facing each other and the island surface convex portion 212. Is greater than. Further, the distance d4 is equal to the distance d5 between the terminal surface tip portions 112 facing each other and the island second thin-walled portion 24.

The Hall element 3 has a rectangular shape in the z-direction view. Like the Hall element module A1, the Hall element 3 is mounted on the island surface 21 so that its diagonal lines are along the x-direction and the y-direction.

Next, the action and effect of the Hall element module A5 will be described.

According to the present embodiment, as shown in FIG. 23, the edge of the island surface 21 of the island portion 2 faces the terminal portion 1 and projects toward the terminal portion 1 in the z-direction, and the island surface convex portion 212 Have. By adopting such a configuration, it is possible to reduce the size of the Hall element module A5 while securing the area of the island surface 21 on which the Hall element 3 is mounted.

The island surface convex portion 212 is formed by a curved line. In the present embodiment, the shape of the island surface 21 excluding the island second thin-walled portion 24 is an ellipse with the x direction as the long axis. Further, the edge of the terminal surface 11 of the terminal portion 1 has a terminal surface concave portion 115 that faces the island surface convex portion 212 of the island surface 21 and is recessed inward of the terminal portion 1 in the z direction. With such a configuration, when the terminal portion 1 is brought closer to the Hall element 3 in order to reduce the size of the Hall element module A5, the shortest distance between the terminal portion 1 and the island portion 2 in the z-direction view becomes unreasonable. It doesn't get smaller. Further, the Hall element 3 is mounted on the island surface 21 so that its diagonal lines are along the x-direction and the y-direction. However, regardless of such postures, the Hall element 3 is mounted on the island surface even in various postures. It does not protrude from 21. Therefore, the Hall element module A5 can be downsized.

Here, as shown in FIG. 14, when the Hall element 3 is mounted on the island surface 21 by die bonding, the bonding material 39 expands in a circular shape in the z-direction view. Therefore, by taking the shape of the island surface 21 in this way, the bonding material 39 spread on the island surface 21 is completely adhered to the element back surface 312 of the Hall element 3 in the z-direction view. Therefore, it is possible to improve the bonding strength of the Hall element 3 with respect to the island portion 2.

[Sixth Embodiment]
27 to 32 show the Hall element module A6 based on the sixth embodiment of the present invention. The Hall element module A6 is different from the Hall element module A1 in the shapes of the terminal portion 1 and the island portion 2.

As shown in FIG. 27, the edge of the island surface 21 of the island portion 2 has an island surface recess 213 facing the terminal portion 1 in the z direction. The island surface recess 213 has an inwardly recessed shape so as to overlap the element body 31 of the Hall element 3 in the z-direction view. In the present embodiment, the island surface recess 213 has an L-shaped bend in the z-direction view.

As shown in FIG. 27, the edge of the island surface 21 of the island portion 2 has an island surface tip portion 214 facing in the x direction. Both ends of the island surface tip portion 214 are connected to the island surface recess 213. In the present embodiment, the island surface tip portion 214 has a sharp shape in the x direction. The shape of the island surface tip portion 214 may be an arc shape as shown in FIG. 28 or a linear shape as shown in FIG. 29.

As shown in FIG. 30, the edge of the island back surface 22 of the island portion 2 is composed of four island back surface inclined portions 221 and an island back surface parallel portion 222. Therefore, the shape of the island back surface 22 is the same as that of the Hall element module A1. Further, as shown in FIGS. 31 and 32, the island side direction 231 is a surface connected to the island surface recess 213 and the island surface tip portion 214 and along the z direction. In the present embodiment, the island side 231 is a curved surface having a portion protruding in the x direction and a portion recessed inward so as to overlap the Hall element 3 in the z-direction view.

As shown in FIG. 27, the edge of the terminal surface 11 of the terminal portion 1 has a terminal surface inclined portion 111 facing the island surface recess 213 of the island surface 21 in the z direction. Like the Hall element module A1, the terminal surface inclined portion 111 faces the Hall element 3 in the z direction and is inclined with respect to the x direction and the y direction. Further, the edge of the terminal surface 11 has a terminal surface tip portion 112 connected to the terminal surface inclined portion 111. In the present embodiment, the terminal surface tip portion 112 has an L shape along both the x direction and the y direction.

As shown in FIG. 30, the terminal back surface 12 of the terminal portion 1 does not have the terminal back surface inclined portion 121 described above. That is, the terminal back surface tip portion 122 and the terminal back surface side portion 123 are connected. Therefore, the shape of the terminal back surface 12 according to the present embodiment is rectangular.

As shown in FIGS. 27 and 30, the terminal portion 1 includes a terminal thin portion 18. The terminal thin-walled portion 18 according to the present embodiment is a portion corresponding to the terminal first thin-walled portion 13, the terminal second thin-walled portion 14, and the terminal third thin-walled portion 15 described above. The thickness of the terminal thin portion 18 is thinner than the maximum thickness of the terminal portion 1, which is the distance between the terminal front surface 11 and the terminal back surface 12, and the thickness is about 1/4 to 1/2 of the maximum thickness. Is. Further, the terminal thin portion 18 has a part of the terminal surface 11.

As shown in FIGS. 27 and 30, the terminal portion 1 includes a terminal protruding portion 19 projecting from the terminal thin portion 18 toward the island surface recess 213 in the z direction. The terminal protrusion 19 is a triangular columnar portion sandwiched between the terminal front end 112, the terminal back end 122, and the terminal back side side 123 in the z direction. Further, the terminal protrusion 19 has a part of each of the terminal front surface 11 and the terminal back surface 12. The thickness of the terminal protrusion 19 is equal to the maximum thickness of the terminal portion 1, which is the distance between the terminal front surface 11 and the terminal back surface 12.

The Hall element 3 has a rectangular shape in the z-direction view. Like the Hall element module A1, the Hall element 3 is mounted on the island surface 21 so that its diagonal lines are along the x-direction and the y-direction.

Next, the action and effect of the Hall element module A6 will be described.

According to the present embodiment, as shown in FIG. 27, the edge of the island surface 21 of the island portion 2 is an island recessed inward so as to face the terminal portion 1 and overlap the Hall element 3 in the z-direction view. It has a surface recess 213. With such a configuration, when the terminal portion 1 is brought closer to the Hall element 3 in order to reduce the size of the Hall element module A6, the shortest distance between the terminal portion 1 and the island portion 2 in the z-direction view is unreasonable. It doesn't get smaller. Therefore, the Hall element module A6 can be miniaturized.

The terminal portion 1 includes a terminal protruding portion 19 projecting from the terminal thin portion 18 toward the island surface recess 213 of the island surface 21 in the z direction. Therefore, it is possible to increase the area of both the terminal front surface 11 and the terminal back surface 12 while reducing the size of the Hall element module A6. By expanding the area of the terminal surface 11, the bonding strength between the terminal portion 1 and the wire 4 (first bonding portion 41 or second bonding portion 42) is improved. Further, by increasing the area of the terminal back surface 12, the mounting strength of the Hall element module A6 on the circuit board is improved.

[7th Embodiment]
33 and 34 show a Hall element module A7 based on the seventh embodiment of the present invention. The Hall element module A7 has a different island portion 2 from the Hall element module A1.

As shown in FIGS. 33 and 34, the shape of the island portion 2 is the same as the shape of the island portion 2 of the Hall element module A6 described above. Further, the shape of the island surface tip portion 214 described above is not only the shape sharpened in the x direction shown in FIG. 33 as in the Hall element module A6, but also the arc shape shown in FIG. 28 and the linear shape shown in FIG. 29. You may.

The Hall element module A7 can also be miniaturized according to such an embodiment. The specific action and effect of the Hall element module A7 is the same as that of the Hall element module A1.

The Hall element module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the Hall element module according to the present invention can be freely redesigned.

The technical configuration of the Hall element module provided by the present invention will be described below.

[Appendix 1A]
Hall element and
An island portion having an island surface on which the Hall element is mounted, and an island portion.
A terminal portion that conducts to the Hall element and is separated from the Hall element in the thickness direction.
A Hall element module including a part of each of the island portion and the terminal portion and a resin package covering the Hall element.
A Hall element module characterized in that the edge of the island surface has an island surface convex portion that faces the terminal portion and projects toward the terminal portion in the thickness direction.
[Appendix 2A]
The Hall element module according to Appendix 1A, wherein the island surface convex portion is formed of a curved line.
[Appendix 3A]
The terminal portion has a terminal surface facing in the same direction as the island surface.
The Hall element module according to Appendix 1A or 2A, wherein the edge of the terminal surface has a concave wire portion that faces the island surface and is recessed inward in the terminal portion in the thickness direction.
[Appendix 4A]
The terminal portion has a terminal back surface that faces the side opposite to the terminal surface in the thickness direction, has a part of the terminal surface, and is thicker than the distance between the terminal surface and the terminal back surface. The Hall element module according to Appendix 3A, which includes a thin-walled terminal.
[Appendix 5A]
The island portion has an island back surface that faces the opposite side of the island surface in the thickness direction and is exposed from the resin package.
The Hall element module according to any one of Appendix 1A to 4A, wherein the edge of the island back surface has an island back surface parallel portion parallel to the first direction.
[Appendix 6A]
The Hall element according to any one of Supplementary note 1A to 5A, wherein the Hall element has a square shape in the thickness direction and its diagonal line is arranged along the first direction and the second direction. Hall element module.
[Appendix 1B]
Hall element and
An island portion having an island surface on which the Hall element is mounted, and an island portion.
A terminal portion that conducts to the Hall element and is separated from the Hall element in the thickness direction.
A Hall element module including a part of each of the island portion and the terminal portion and a resin package covering the Hall element.
A Hall element module characterized in that an edge of the island surface has an island surface recess that is recessed inward so as to face the terminal portion and overlap the Hall element in the thickness direction.
[Appendix 2B]
The Hall element module according to Appendix 1B, wherein the island surface recess has a bent shape in the thickness direction.
[Appendix 3B]
The Hall element module according to Appendix 2B, wherein the Hall element has a square shape in the thickness direction and its diagonal lines are arranged along the first direction and the second direction.
[Appendix 4B]
The terminal portion has a terminal back surface that faces the side opposite to the terminal surface in the thickness direction, has a part of the terminal surface, and is thicker than the distance between the terminal surface and the terminal back surface. The Hall element module according to Appendix 3B, which includes a thin-walled terminal.
[Appendix 5B]
The Hall element module according to Appendix 4B, wherein the terminal portion includes a terminal protruding portion that protrudes from the terminal thin portion toward the concave wire portion in the thickness direction.

A1 to A7: Hall element module 1: Terminal part 2: Island part 3: Hall element 4: Wire 5: Resin package 10: Lead frame 10A: Frame material 11: Terminal surface 12: Terminal back surface 13: Terminal first thin-walled part 14 : Terminal 2nd thin-walled part 15: Terminal 3rd thin-walled part 16: Terminal side exposed surface 18: Terminal thin-walled part 19: Terminal protruding part 21: Island surface 22: Island back surface 23: Island 1st thin-walled part 24: Island 2nd Thin-walled part 29: Connected thin-walled part 31: Element body 32: Electrode pad 38: Insulation layer 39: Bonding material 41: First bonding part 42: Second bonding part 43: Bump part 51: Resin surface 52: Resin back surface 53: Resin first Side surface 54: Resin second side surface 72: Control target 73: Magnet 81: Cutting line 101: Front surface 102: Back surface 103, 104: Plating layer 111: Terminal surface inclined portion 112: Terminal surface tip portion 113: Terminal surface side portion 115 : Terminal front surface recess 119: Plating layer 121: Terminal back surface inclined portion 122: Terminal back surface tip portion 123: Terminal back surface side portion 124: Terminal back surface rear portion 125: Terminal back surface recess 129: Plating layer 131: Terminal inclined surface 132: Terminal First intermediate surface 133: Terminal concave surface 141: Terminal side direction 142: Terminal second intermediate surface 151: Terminal rear surface 210: Island surface orthogonal portion 211: Island surface inclined portion 212: Island surface convex portion 213: Island surface concave portion 214: Island surface tip 219: Plating layer 221: Island back surface inclined part 222: Island back surface parallel part 223: Island back surface curved part 229: Plating layer 231: Island side 232: Island first intermediate surface 241: Island side exposed surface 242 : Island second intermediate surface 311: Element front surface 312: Element back surface 710: Integrated circuit 711: Device drive area 712: Voltage detection area 713: Control area d1, d2: Length d3 to d8: Distance La, Lb: Length

Claims (22)

A Hall element having an element front surface and an element back surface, and
A terminal portion that conducts with the Hall element and is separated from the Hall element in the thickness direction.
A resin package that covers at least a part of the Hall element and the terminal portion,
It is a Hall element module equipped with
The resin package has a rectangular shape having four sides along the first direction and the second direction, which are perpendicular to the thickness direction and perpendicular to each other in the thickness direction.
The terminal portion has a terminal back surface that faces the thickness direction and is exposed from the resin package.
The edge of the back surface of the terminal has an inclined portion on the back surface of the terminal, a tip end portion on the back surface of the terminal, a side portion on the back surface of the terminal, and a rear portion on the back surface of the terminal.
The inclined portion on the back surface of the terminal faces the Hall element in the thickness direction and is inclined with respect to the first direction and the second direction.
The tip of the back surface of the terminal is connected to the inclined portion of the back surface of the terminal and follows the second direction, and is located closest to the Hall element in the first direction.
The terminal back surface side portion is connected to the terminal back surface inclined portion and is located along the first direction and is located farther from the Hall element than the terminal back surface inclined portion in the first direction.
The rear portion of the back surface of the terminal is connected to the side portion of the back surface of the terminal and is located along the second direction and is located farthest from the Hall element in the first direction.
The length of the terminal back surface inclined portion is longer than the length of the terminal back surface tip portion.
A Hall element module characterized in that the end portion of the rear portion of the back surface of the terminal connected to the side portion of the back surface of the terminal has a convex curve. The terminal unit may have a terminal surface facing the side opposite to the terminal back surface in the thickness direction,
The Hall element module according to claim 1, wherein the terminal surface has a terminal surface inclined portion that faces the Hall element in the thickness direction and is inclined with respect to the first direction and the second direction. The terminal surface inclined portions is located closer to the Hall element than the terminal back side inclined portion,
The terminal portion is configured to positioned between the viewed in the thickness direction and the terminal surface inclined portion the terminal back side inclined portion, the reduced thickness terminal than the distance between the terminal back surface and the terminal surface 1 The Hall element module according to claim 2, which has a thin portion. The Hall element module according to claim 3 , wherein the terminal surface inclined portion is parallel to the terminal back surface inclined portion. The edge of the terminal surface is connected to the terminal surface inclined portion and is along the second direction, and has a terminal surface tip portion located closest to the Hall element in the first direction.
The Hall element module according to claim 3 or 4, wherein the length of the terminal surface inclined portion is longer than the length of the terminal surface tip portion. The Hall element module according to claim 5 , wherein the terminal front end portion coincides with the terminal back surface end portion in the thickness direction. The edge of the terminal surface has a terminal surface side portion connected to the terminal surface inclined portion and along the first direction.
In the thickness direction view, the terminal front surface inclined portion is separated from the terminal back surface inclined portion .
The terminal portion is located between the terminal front surface side portion and the terminal back surface side portion in the thickness direction, and is thinner than the distance between the terminal front surface and the terminal back surface portion. The Hall element module according to claim 5 or 6 , which has a second thin-walled portion of the terminal. The Hall element module according to claim 7 , wherein the terminal front side portion is parallel to the terminal back surface side portion. The Hall element module according to claim 7 or 8 , wherein the terminal portion has a terminal third thin-walled portion connected to the terminal second thin-walled portion and extending in the first direction on the side opposite to the Hall element. The Hall element module according to claim 9 , further comprising an island portion having an island surface on which the Hall element is mounted and an island back surface exposed from the resin package. The Hall element module according to claim 10 , wherein the edge of the back surface of the island has an inclined portion on the back surface of the island that faces the inclined portion on the back surface of the terminal and is inclined with respect to the first direction and the second direction. The Hall element module according to claim 11, wherein the island back surface inclined portion is parallel to the terminal back surface inclined portion. The Hall element module according to claim 11 or 12 , wherein the edge of the island surface faces the terminal surface inclined portion and has an island surface inclined portion inclined with respect to the first direction and the second direction. The Hall element module according to claim 13 , wherein the island surface inclined portion is parallel to the island back surface inclined portion. The island front surface inclined portion is located closer to the terminal portion than the island back surface inclined portion.
The island portion is located between the island surface inclined portion and the island back surface inclined portion in the thickness direction, and is thinner than the distance between the island surface and the island back surface. 1 The Hall element module according to claim 13 or 14 , which has a thin portion. The Hall element module according to claim 15 , wherein the island portion has an island second thin-walled portion connected to the island first thin-walled portion and extends in the second direction. The Hall element module according to claim 16, further comprising the four terminal portions surrounding the island portion. The 17th aspect of the invention, wherein the distance between the terminal surface inclined portion and the island surface inclined portion is smaller than the distance between the terminal surface side portions of the terminal portions adjacent to each other in the second direction. Hall element module. The distance between the terminal surface tip portion and the island second thin-walled portion in the first direction is smaller than the distance between the terminal surface side portions of the terminal portions adjacent to each other in the second direction. The Hall element module according to claim 17 or 18. The Hall element module according to any one of claims 10 to 19 , further comprising a connecting thin-walled portion that connects the terminal portion and the island portion. The Hall element module according to any one of claims 1 to 9, wherein the back surface of the element is exposed from the resin package. The Hall element according to any one of claims 1 to 21, wherein the Hall element is square in the thickness direction and its diagonal line is arranged along the first direction and the second direction. module.

Images