KR101868760B1 - Hall sensor manufacturing method, hall sensor, and lens module - Google Patents

Abstract

The present invention relates to a method of manufacturing a Hall sensor and a Hall sensor and a lens module which are thin and small and have small variations in magnetic characteristics. The metal plate on which the lead terminals 21a to 21d are formed is disposed on the substrate 30 and the Hall elements 10 are arranged in the region surrounded by the lead terminals and the electrode portions 13a to 13d and the lead terminals are electrically connected And the second surface (M2), which is a surface connected to the lead element, the lead wire and the lead terminal, is sealed with a sealing member, the base material (30) is removed, and the lead terminal The first surface M1 is exposed from the sealing member so that the lead terminal has a step D on the periphery of an ellipse or polygon centered on a position where the hall element is mounted on the second surface, And the second portion N2 on the far side, and the height to the second surface in the first portion is the height from the second surface N2 in the second portion to the height .

Description

HALL SENSOR MANUFACTURING METHOD, HALL SENSOR, AND LENS MODULE [0001]

The present invention relates to a method of manufacturing an Hall sensor, and a Hall sensor and a lens module.

As a sensor for detecting a magnetic field, a magnetic sensor using a Hall element is known. For example, Patent Document 1 describes an islandless structure magnetic sensor using a pellet (a magnetic sensor chip such as a Hall element) and a manufacturing method thereof.

International Publication No. 2014/091714

However, with the recent trend toward thinner and smaller electronic devices, a thinner and smaller Hall sensor is required. In order to make the magnetic sensor of Patent Document 1 described above thinner, it is effective to lower the height of the conductor connecting the pellet and the lead terminal. In order to reduce the height of the lead wire, it is effective to lower the member located at the higher position among the pellet and the lead terminals. In the case of the magnetic sensor of Patent Document 1, thinning of the pellet is effective for reducing the thickness of the entire magnetic sensor. In order to make the magnetic sensor of Patent Document 1 smaller, it is effective to narrow the distance between the pellet and the lead terminal. However, if the pellet is made thinner and the distance between the pellet and the lead terminal is narrowed, the following problems arise.

1 is a cross-sectional view for explaining a problem of the Hall sensor according to the present invention. 1 shows a part of a manufacturing process of a Hall sensor, and shows a process of stacking a Hall element 510 in a region surrounded by lead terminals 525 and 527 by using a collet 600. FIG. The lead terminals 525 and 527 are stacked on the substrate 530 and the insulating layer 540 is formed on the back surface of the Hall element 510. The Hall element 510 includes a potentiometer 512 and electrode portions 513a and 513b. When the hall element 510 is thin and the distance between the lead terminals 525 and 527 is small at the position where the hall element 510 is loaded and when the hall element 510 is loaded using the collet 600, There is a fear that the lead terminal 600 contacts the lead terminals 525 and 527. When the collet 600 contacts the lead terminals 525 and 527, there is a fear that the hall element 510 is loaded at a position different from the position where the hall element 510 is normally loaded. The variation of the position of the Hall element 510 leads to the variation of the position of the magnetoresistive element 512, which ultimately results in variation in the magnetic characteristics of the Hall sensor. In addition, A represents a contact point between the collet and the lead terminal.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to provide a method of manufacturing a Hall sensor and a Hall sensor and a lens module which are thin and small and have little variation in magnetic characteristics.

According to one aspect of the present invention, the following features are provided.

(One); A plurality of external terminals disposed around the Hall element; and a plurality of conductors for electrically connecting the respective electrode portions of the plurality of electrode portions and the external terminals of the plurality of external terminals, respectively, And a sealing member sealing the second surface, which is the surface connected to the lead of each of the external terminals, with the hole element, the plurality of conductors, and the sealing member which is located on the opposite side of the second surface Wherein the first surface is exposed from the bottom surface of the sealing member, and the plurality of external terminals include at least a first external terminal, and the first external terminal is disposed on the second surface, Wherein the first external terminal has a first portion on a side closer to the hole element with the step as a boundary and a second portion on a side farther from the hole element, Wherein a height of the first external terminal to the second surface of the first external terminal is lower than a height of the second surface of the first external terminal to the second surface with the bottom surface of the sealing member as a reference surface Is a Hall sensor.

(2); In the above-mentioned (1), the hole element has a bottom surface of the sealing member as a reference surface, the highest point of the hole element is higher than the second surface of the first portion of the first external terminal, Is disposed at a position lower than the second surface of the second portion.

(3); In the above-mentioned (1) or (2), it is preferable that a height from the reference surface to the highest point of the Hall element is T, a height of the second surface from the reference surface is p2 , And is arranged at a position where p2 < T < 1.5 x p2.

(4); Wherein the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals are connected to the first external terminal and the second external terminal, A virtual straight line connecting the third external terminal and a virtual straight line connecting the second external terminal and the fourth external terminal intersect when viewed from a plane, the hall element being rectangular in plan view, The four vertexes of the hall element are arranged in a region between the first external terminal and the second external terminal, a region between the second external terminal and the third external terminal, An area between the fourth external terminals, and a region disposed between the fourth external terminal and the first external terminal.

(5); The organic electroluminescent device according to any one of (1) to (4), further comprising an insulating layer disposed on a surface of the hole element opposite to the surface on which the plurality of electrode sections are disposed, Exposed from the bottom.

(6); Wherein each of the external terminals of the plurality of external terminals has the step on the second surface and the external terminals of the plurality of external terminals are connected to each other through the step, And the second portion on a side farther from the hall element than the first portion on the side closer to the first portion of the first terminal, The height to the surface is formed to be lower than the height to the second surface in the second portion.

(7); In the above (6), each stepped portion is formed on the periphery of a circle, a polygonal shape, or a combination of the shapes of the external terminals, centered on the hall element, in a plan view.

(8); A plurality of external terminals disposed around the Hall element; and a plurality of conductors for electrically connecting the respective electrode portions of the plurality of electrode portions and the external terminals of the plurality of external terminals, respectively, And a sealing member for sealing the second surface, which is a surface connected to the conductor, of the hole element, the plurality of conductors, and the respective external terminals, The first surface is exposed from the bottom surface of the sealing member and each of the external terminals is connected to a first portion closer to the hall element than the second portion from a second portion to which the plurality of conductors are connected, The height of the second surface side of the second portion with the bottom surface of the sealing member as a reference surface is higher than the height of the second surface side of the first portion with the bottom surface of the sealing member serving as the reference surface Is a Hall sensor that is stepped to form.

(9); (8), the height from the bottom surface of the sealing member to the contact point at which the electrode portion of the hall element and the plurality of conductors contact with each other is larger than a height Is higher than the height of the second surface.

(10); In the above (8) or (9), the step has a curved shape which is inclined or concave toward the bottom surface of the sealing member when viewed in cross section.

(11); Wherein each of the external terminals is formed on the periphery of an area of a circular shape, a polygonal shape, or a combination thereof, centered on the hall element, A step is formed.

(12); The Hall device according to any one of (8) to (11), wherein the Hall element has a potentiometer part provided on the substrate, the substrate or the substrate, and the plurality of electrode parts connected to the potentiometer part, And an insulating layer disposed on a surface opposite to a surface on which the electrode portion of the sealing member is disposed, wherein the insulating layer is exposed from the bottom surface of the sealing member.

(13); A hall sensor according to any one of (1) to (12), a lens holder with a magnet, and a drive coil for moving the magnet based on an output signal from the external terminal of the hall sensor Lens module.

(14); A Hall sensor comprising a plurality of external terminals, a Hall element having a plurality of electrode portions, and a plurality of conductors for electrically connecting the respective external terminals of the plurality of external terminals to the respective electrode portions of the plurality of electrode portions An external terminal disposing step of disposing a metal plate on which the plurality of external terminals are formed on a base material; a hall element disposing step of disposing the hall element in an area surrounded by the plurality of external terminals; And a second surface, which is a surface of each of the external terminals connected to the lead, is sealed with a sealing member A sealing step of removing the substrate and exposing a first surface of the external terminals opposite to the second surface from the sealing member Wherein the plurality of external terminals include at least a first external terminal, and the first external terminal is disposed on the second surface, and in a plane view, Wherein the first external terminal has a first portion on a side close to a position where the hall element is loaded with the step difference as a boundary, Wherein the first external terminal has a surface on which the metal plate is disposed as a reference surface when the metal plate is disposed on the substrate, Wherein the height of the second surface of the second portion is lower than the height of the second surface of the second portion.

(15); A Hall sensor comprising a plurality of external terminals, a Hall element having a plurality of electrode portions, and a plurality of conductors for electrically connecting the respective external terminals of the plurality of external terminals to the respective electrode portions of the plurality of electrode portions An external terminal disposing step of disposing a metal plate on which the plurality of external terminals are formed on a base material; a hall element disposing step of disposing the hall element in an area surrounded by the plurality of external terminals; And a second surface, which is a surface of each of the external terminals connected to the lead, is sealed with a sealing member A sealing step of removing the substrate and exposing a first surface of the external terminals opposite to the second surface from the sealing member Wherein the plurality of external terminals include at least a first external terminal, and the first external terminal is disposed on the second surface, and in a plane view, Wherein the first external terminal has a first portion on a side closer to a position where the hall element is stacked with the step difference as a boundary, Wherein the first external terminal has a surface on which the metal plate is disposed as a reference surface when the metal plate is disposed on the substrate, Wherein the height of the second surface of the second portion is lower than the height of the second surface of the second portion.

(16); The method of manufacturing a semiconductor device according to (14) or (15) above, wherein the step of arranging the Hall element comprises the step of arranging the Hall element on the surface of the substrate on which the metal plate is disposed, And a step of arranging the second portion at a position higher than the second surface in the first portion and lower than the second surface in the second portion.

(17); The method according to any one of (14) to (16) above, wherein the step of arranging the Hall element comprises the steps of: setting a height from the reference plane to a highest point of the Hall element to T, And arranging the hole element at a position where p2 < T < 1.5 x p2, where p2 is the height of the surface.

(18); The electronic device according to any one of (14) to (17), wherein the plurality of external terminals further include second to fourth external terminals, and the first to fourth external terminals are connected to the first external terminal A virtual straight line connecting the third external terminal and a virtual straight line connecting the second external terminal and the fourth external terminal intersect when viewed in a plan view, Wherein the four vertexes of the hall element are arranged in a region between the first external terminal and the second external terminal, a region between the second external terminal and the third external terminal, And disposing the Hall element in a region between the third external terminal and the fourth external terminal and in a region between the fourth external terminal and the first external terminal.

(19); The method according to any one of (14) to (18), further comprising an insulating layer forming step of forming an insulating layer between the base material and the hole element, wherein the exposing step comprises: .

(20); , Wherein each of the external terminals of the plurality of external terminals has the step on the second surface, and each of the external terminals is connected to the hole Wherein the first portion has the first portion on a side close to a position where the element is loaded and the second portion on a side far from the position where the hall element is loaded, and each of the external terminals, when the metal plate is arranged on the substrate, Wherein a height of each of the external terminals to the second surface of the first portion is greater than a height of the second surface of the second portion to the second surface, Respectively.

According to one aspect of the present invention, it is possible to provide a method of manufacturing a hall sensor and a Hall sensor and a lens module that are thin and small and have little variation in magnetic characteristics.

1 is a cross-sectional view for explaining a problem of the Hall sensor according to the present invention.
2 (a) to 2 (c) are diagrams for explaining a Hall sensor according to a first embodiment of the present invention.
Fig. 3 is an entire perspective view of the hall sensor shown in Figs. 2 (a) to 2 (c).
4 (a) and 4 (b) are diagrams showing concrete Hall elements.
5 is a cross-sectional view illustrating a Hall sensor according to the present invention.
6 (a) and 6 (b) are views showing a metal plate used for manufacturing the Hall sensor according to the first embodiment.
7 (a) to 7 (e) are plan views showing steps of a method for manufacturing an Hall sensor.
8 (a) to 8 (d) are cross-sectional views showing the steps of a method of manufacturing the Hall sensor.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the invention. However, it will be apparent that one or more embodiments may be practiced without these specific details. In addition, for the sake of brevity, well-known structures and devices are shown schematically.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.

&Lt; Embodiment 1 >

(Configuration)

2A to 2C are diagrams for explaining a Hall sensor according to a first embodiment of the present invention. Fig. 2A is a sectional view taken along the line AA in Fig. 2B, 2 (b) is a plan view of FIG. 2 (a), FIG. 2 (c) is a bottom view of FIG. 2 Showing the entire perspective view of the sensor. Ga denotes a half-etching of the surface, and Gb denotes a half-bottom of the backside.

The Hall sensor 100 of the first embodiment includes a Hall element 10, a plurality of lead terminals 21a to 21d (external terminals), a plurality of conductors 31a to 31d, and a sealing member 50 .

The Hall element 10 includes a substrate 11, a potentiometer 12 disposed on the substrate 11 (or within the substrate 11), and a plurality of electrode portions 13a to 13d. 2 (a), an enlarged view of the case where the potato portion 12 is provided on the substrate 11 is shown.

The plurality of lead terminals 21a to 21d are arranged so as to surround the four corners of the Hall element 10 along the circumference of the Hall element 10, that is, the bottom surface of the sealing member 50. [

The plurality of leads 31a to 31d are connected to each of the electrode portions 13a to 13d of the plurality of electrode portions 13a to 13d and the respective lead terminals 21a to 21d of the plurality of lead terminals 21a to 21d Are electrically connected to each other.

The sealing member 50 also covers the Hall element 10, the plurality of lead terminals 21a to 21d and the plurality of conductors 31a to 31d. As the sealing member 50, a resin member such as a molded resin is preferable.

Each of the lead terminals 21a to 21d has a second surface M2 connected to each of the conductors 31a to 31d and a first surface M1 on the opposite side to the second surface M2, Is exposed from the bottom surface E of the sealing member 50. As shown in Fig.

At least one of the lead terminals 21a to 21d of the plurality of lead terminals 21a to 21d has a step D on the second surface M2. That is, a step is formed in the lead terminal. It is preferable that all the lead terminals of the lead terminals 21a to 21d have a step D on the second surface M2.

The plurality of lead terminals 21a to 21d have the first portion N1 on the side closer to the Hall element 10 of each of the lead terminals 21a to 21d having the step D with the step difference D as a boundary, And the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 is equal to or less than the height p2 of the second portion N2 from the bottom surface E of the sealing member 50. [ 2 is lower than the height p2 of the second portion M2 to the second surface M2.

That is, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2 The relationship of height p2 has a relationship of p1 < p2. Each of the conductors 31a to 31d is connected to the second surface M2 of the second portion N2 of each of the lead terminals 21a to 21d having the step difference D. [

In the present embodiment, the external terminals 21a to 21d are connected to the first portion N1 closer to the Hall element than the second portion N2 from the second portion N2 to which the plurality of conductors are connected, and the bottom surface E of the sealing member to the reference surface The height p2 of the second surface N2 of the second portion N2 is greater than the height p1 of the second surface N2 of the first portion N1 having the bottom surface E of the sealing member as the reference surface. It is preferable that the step has a curved shape that is inclined or concave toward the bottom surface of the sealing member when viewed in cross section. The step D may have a flat top surface and a bottom surface, and may be inclined, curved, or a combination thereof between the top surface and the bottom surface, or may extend from the top surface to an end of the external terminal in an inclined surface shape, a curved shape, or a combination thereof.

In general, a collet is used when the Hall element 10 is placed at a predetermined position. In order to prevent the contact between the collet and the plurality of lead terminals 21a to 21d, the tip of the collet may be an elliptic shape or a polygonal shape, Or the step D is set on the periphery of the polygonal area. That is, in the plan view, the step D is set at a position corresponding to the shape of the tip of the collet used for arranging the Hall element, with the Hall element 10 as the center. Since the distal end of the collet is often in a circular shape in particular, it is desirable to set the step D on the circumference centered on the hall element 10 in order to prevent the collet from coming into contact. Further, the step D is formed on the periphery of the region surrounding the Hall element 10. They may be provided around the periphery of a circle, a polygonal shape, or a combination thereof when viewed in plan, with the hole element 10 as a center. Specifically, it may be a perimeter of a garden area, a perimeter of an elliptical area, a perimeter of a polygonal area, a perimeter of an area of a shape formed by combining a curve and a straight line, and the like.

In addition, since at least one lead terminal of the plurality of lead terminals 21a to 21d has the step D and p1 < p2, the lead wire can be prevented from coming into contact with the edge of the lead terminal and being disconnected Do. It is preferable that the area of the first portion N1 on the lead terminal is as small as possible from the strength surface of the whole hall sensor.

When the second surface M2 of the lead terminal 21a has a plurality of steps, the step closest to the Hall element 10 is referred to as a step D, the step D is defined as a boundary, 1 portion N1, and the side remote from the hall element 10 is referred to as a second portion N2. The same applies to the lead terminals 21b to 21d. The step D formed on the second surface M2 of the lead terminals 21a to 21d is sealed with the sealing member 50. [

The height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 is a height h1 from the bottom surface E of the sealing member 50 to the highest point of the hall element 10 . Since the highest point of the Hall element 10 in this example is the electrode portions 13a to 13d, the height p1 is set to be smaller than the height of the electrode portions 13a to 13d of the Hall element 10 from the bottom surface E of the sealing member 50, Is lower than the height h1.

The height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2 And the height h1 from the bottom surface E of the sealing member 50 to the highest point of the hall element 10 have the relationship p1 < h1 < p2. That is, the height h1 from the bottom surface E of the sealing member 50 to the contact point at which the electrode portions of the hall element and the plurality of conductors contact each other is smaller than the height h1 of the first portion N1 with the bottom surface E of the sealing member 50 as the reference surface. Is higher than the height p1 of the two sides.

The height from the bottom surface E of the sealing member 50 to the highest point of the hall element 10 is lower than the height from the bottom surface E to the highest point of the lead terminals 21a to 21d In particular, the tip of the collet is likely to contact the lead terminals 21a to 21d. Therefore, in this case, the step D is particularly effective.

The height h1 from the bottom surface E of the sealing member 50 to each of the electrode portions 13a to 13d and the first connection point a of each of the conductors 31a to 31d is set to be equal to a height h1 from the bottom surface E of the sealing member 50, Is lower than the height h2 of the first and second conductors 21a to 21d and the second connection point b of each of the conductors 31a to 31d.

That is, the height h1 from the bottom surface E of the sealing member 50 to the first connection point a and the height h2 from the bottom surface E of the sealing member 50 to the second connection point b have a relationship h1 <h2.

Since the Hall sensor of the first embodiment has the relationship of h1 <h2, it is difficult for the conductors 31a to 31d to contact the edge of the substrate 11 of the Hall element, and leakage current is hard to occur. Thereby, it is possible to realize a hall sensor which is thin and can magnetically detect accurately.

The edge sensor of the first embodiment has a structure in which contact between the edge of the lead terminal and the lead wire tends to occur easily. However, as for the edge touch of the lead terminal, in a state where two lead wires are connected to the lead terminal on the same potential There is no problem in particular.

Each of the lead terminals 21a to 21d is exposed from the side surface S of the sealing member 50. [ That is, since the lead terminals 21a to 21d are exposed from the side surface S of the sealing member 50, in addition to the portion (bottom electrode) exposed on the bottom surface of the lead terminals 21a to 21d, Side electrodes). In particular, since the ratio of the side electrodes in the entire thickness can be increased, the mounting becomes easy. In addition, since the contact between the lead terminal and the solder is poor, the case where the conduction is not taken becomes small, and the reliability of the mounting is high. Further, the visibility in the appearance inspection after the solder mounting is improved, and it can be easily confirmed whether or not the soldering can be carried out without problems.

The plurality of lead wires 31a to 31d are arranged such that the plurality of electrode portions 13a to 13d are the first bonding and the second surface M2 of the second portion N2 of the plurality of lead terminals 21a to 21d Is wire-bonded so as to be the second bonding.

Thus, wire bonding is performed from the low side to the high side, so that it is difficult for the wire to contact the edge of the Hall element. As a result, even if the distance between the Hall element and the lead terminal is shortened, it is difficult for edge contact to occur. As a result, the distance between the Hall element and the lead terminal can be shortened, and miniaturization becomes possible.

 Alternatively, the plurality of conductors 31a to 31d may be arranged such that the second surface M2 of the second portion N2 of the plurality of lead terminals 21a to 21d is the first bonding, and the plurality of electrode portions 13a to 13d, Is wire-bonded so as to be the second bonding.

As described above, since wire bonding is carried out from the higher side to the lower side, the apex of the wire bonding can be lowered and thinning becomes possible.

The plurality of lead wires 31a to 31d are arranged such that the plurality of electrode portions 13a to 13d are the first bonding and the second surface M2 of the first portion N1 of the plurality of lead terminals 21a to 21d May be wire-bonded so as to be the second bonding.

The plurality of conductors 31a to 31d are formed such that the second surface M2 of the first portion N1 of the plurality of lead terminals 21a to 21d is the first bonding and the plurality of electrode portions 13a to 13d, May be wire-bonded so as to be the second bonding.

The substrate 11 is further provided with an insulating layer 40 provided on a surface opposite to the surface on which the plurality of electrode portions 13a to 13d are provided. The insulating layer 40 is exposed from the bottom surface E of the sealing member 50.

In the first embodiment, the insulating layer 40 may be an insulating resin layer, an insulating sheet, or the like. The insulating layer 40 may have a resistance higher than that of the Hall element. For example, it is preferable that the volume resistivity of the insulating layer 40 is 10 ⁸ to 10 ²⁰ (Ω · cm). More preferably, the volume resistivity of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω · cm). The resistance of the insulating layer 40 is 10 ¹⁰ to 10 ¹⁸ (Ω), and the resistance of the Hall element is usually about 10 ⁹ Ω or less Therefore, it has sufficient insulation.

More preferably, the insulating layer 40 includes, for example, an epoxy thermosetting resin and silica (SiO ₂ ) as a filler. The insulating layer 40 is in contact with the back surface of the Hall element 10, that is, the surface opposite to the surface having the potato portion 12, and the back surface of the Hall element 10 is covered with the insulating layer 40 . It is preferable that the entire back surface of the Hall element 10 is covered with the insulating layer 40 from the viewpoint of suppressing the generation of leakage current. The thickness of the portion of the insulating layer 40 covering the back surface of the Hall element 10 is determined by the filler size and is, for example, 5 占 퐉 or more.

The Hall element 10 includes a semi-insulating gallium arsenide (GaAs) substrate 11, a demagnetizing portion (active layer) 12 including a semiconductor thin film formed on the GaAs substrate 11, And electrode portions 13a to 13d electrically connected to the electrodes 12a to 12d. The potato portion 12 is, for example, a cross-shaped in plan view, and electrodes 13a to 13d are provided on the four tip portions of the cross, respectively. A pair of electrodes 13a and 13c facing each other in a plan view is an input terminal for supplying a current to the potentiometer 12. The input terminal is connected to a line connecting the electrodes 13a and 13c, And the other pair of electrodes 13b and 13d are output terminals for outputting the voltage from the potentiometer 12. [ In order to reduce the thickness of the Hall element 10, it is sufficient to polish a surface opposite to the surface on which the potato portion (active layer) 12 of the substrate 11 is provided. The dimensions of the Hall element 10 are, for example, 0.1 mm or more and 0.4 mm or less in length, 0.1 mm or more and 0.4 mm or less in width, and 0.05 mm or more and 0.20 mm or less in thickness.

The Hall sensor 100 has an island-less structure and has a plurality of lead terminals 21a to 21d for obtaining electrical connection with the outside. The lead terminals 21a to 21d are arranged around the Hall element 10, for example, in the vicinity of the four corners of the hall sensor 100, as shown in Fig. 2 (b). For example, the lead terminal 21a and the lead terminal 21c are disposed so as to face each other with the Hall element 10 therebetween. The lead terminal 21b and the lead terminal 21d are arranged so as to face each other with the Hall element 10 therebetween. A straight line (imaginary line) connecting the lead terminal 21a and the lead terminal 21c and a straight line (imaginary line) connecting the lead terminal 21b and the lead terminal 21d cross each other when seen in a plan view, The lead terminals 21 to 21d are respectively disposed.

That is, the plurality of lead terminals include first to fourth lead terminals, and the first to fourth lead terminals are connected to a virtual straight line connecting the first lead terminal and the third lead terminal, And the imaginary straight lines connecting the lead terminals are arranged so as to intersect in a plan view.

The lead terminals 21a to 21d are made of a metal such as copper (Cu), for example. The lead terminals 21a to 21d may be etched (i.e., half-etched) on the side or a part of the back surface thereof.

Although not shown, on the surfaces of the lead terminals 21a to 21d connected to the leads 31a to 31d on the surface of the lead terminals 21a to 21d (the upper surface side in Fig. 2 (a)), Ag plating is preferable from the viewpoint of electrical connection.

Plating of nickel (Ni) -Padadium (Pd) -gold (Au) or the like may be performed instead of the plating layer 60 on the front and back surfaces of the lead terminals 21a to 21d. However, since it is island-free, it is difficult to be influenced by the Ni plating film, which is a magnetic body, so that it can be carried out.

The conductors 31a to 31d are conductors for electrically connecting the electrode portions 13a to 13d of the hall element 10 to the lead terminals 21a to 21d respectively and are made of gold for example. The lead 31a connects the lead terminal 21a and the electrode portion 13a and the lead 31b is connected to the lead terminal 21b and the electrode portion 13b as shown in Figure 2 (b) Respectively. The lead 31c connects the lead terminal 21c and the electrode portion 13c and the lead 31d connects the lead terminal 21d and the electrode 13d.

The sealing member 50 covers and protects the Hall element 10 and at least the surface side of the lead terminals 21a to 21d, that is, the side to be connected to the conductor, and the conductors 31a to 31d by resin sealing have. The sealing member 50 is made of, for example, an epoxy thermosetting resin, and is capable of withstanding the high temperature at the time of reflow. In addition, the sealing member 50 and the insulating layer 40 are different from each other even in the case of, for example, a thermosetting resin of the same epoxy system. For example, the contained ratios are different or the contained ratios are different even if the contained components are the same.

2 (c), at least a part of the back surface of each of the lead terminals 21a to 21d and the surface of the insulating layer (not shown) on the bottom surface side of the Hall sensor 100, 40 are exposed from the sealing member 50, respectively.

The outer plating layer 60 is formed on the back surface of the lead terminals 21a to 21d exposed from the sealing member 50. [ The outer plating layer 60 is made of, for example, tin (Sn) or the like.

With this configuration, when the magnetic sensor (magnetic field) is detected by using the hall sensor 100, for example, the lead terminal 21a is connected to the power supply potential (+) and the lead terminal 21c And is connected to the ground potential GND to pass a current from the lead terminal 21a to the lead terminal 21c. Then, the potential difference V1-V2 (Hall output voltage VH) between the lead terminals 21b and 21d is measured. The magnitude of the magnetic field is detected from the magnitude of the Hall output voltage VH and the direction of the magnetic field is detected from the positive and negative of the Hall output voltage VH.

That is, the lead terminal 21a is a power supply lead terminal for supplying a predetermined voltage to the Hall element 10. [ The lead terminal 21c is a ground lead terminal for supplying a ground potential to the hall element 10. [ The lead terminals 21b and 21d are lead terminals for extracting Hall electromotive force signals of the Hall element 10.

4 (a) and 4 (b) are structural diagrams of specific Hall elements. FIG. 4 (a) is a sectional view and FIG. 4 (b) is a top view. However, the conductors are not shown. In the figure, Ga denotes the half etching of the surface, and Gb denotes the half etching of the back side. 2 (a) is a cross-sectional view taken along the line AA of Fig. 2 (b), and Fig. 4 (a) is a cross-sectional view taken along the line BB of Fig. 4 .

The Hall sensors shown in Figs. 4 (a) and 4 (b) employ a lead terminal designed to have as little contact with the collet as possible, and the surface of the lead terminal is half-etched. That is, the area where the collet interferes is half-etched.

The Hall element of the Hall sensor shown in FIG. 4 (b) is arranged to rotate by 45 degrees with respect to the Hall element of the Hall sensor shown in FIG. 2 (b). That is, the Hall element of the Hall sensor shown in Fig. 4 (b) has a rectangular shape in plan view, and the four vertices of the rectangular shape are respectively connected to the lead terminal 21a and the lead terminal 21b A region between the lead terminal 21b and the lead terminal 21c and a region between the lead terminal 21c and the lead terminal 21d and a region between the lead terminal 21d and the lead terminal 21a And a Hall element is arranged so as to be arranged.

By arranging the Hall elements in such a direction, it becomes possible to downsize the entire hall sensor. However, when the Hall elements are arranged as described above, the collets easily contact the lead terminals when the Hall elements are stacked. Thus, when the Hall elements are arranged as described above, the step difference D Is particularly effective for preventing the contact of the collet. In addition, the rectangle includes a square.

Although the island-less structure in which the metal element is not provided for loading the Hall element 10 between the Hall element 10 and the bottom surface E of the sealing member 50 has been described in the first embodiment, And the bottom surface E of the sealing member 50 may be provided. The island may be electrically connected to the ground lead terminal 21c. However, it is preferable not to provide an island between the Hall element 10 and the bottom surface E of the sealing member 50 from the viewpoint of thinning.

In the first embodiment, all of the plurality of lead terminals 21a to 21d have the step difference D, but the lead terminals 21a to 21d do not have to have the step difference D, At least one of the lead terminals 21a to 21d may have the step difference D.

In the first embodiment, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 and the height p1 from the bottom surface E of the sealing member 50 in the second portion N2 The relationship between the height p2 to the second surface M2 and the height h1 from the bottom surface E of the sealing member 50 to the highest point of the hall element 10 has a relationship of p1 <h1 <p2 However, p2 < h1 may be used. Even if p2 < h1, the step D is effective for preventing contact of the collet. For example, in the case of p2 < h1 < 1.5 x p2 or p2 < h1 < 1.3 x p2, Is particularly effective for preventing contact of the collet. p2 is, for example, not less than 0.05 mm and not more than 0.20 mm, h1 is, for example, not less than 0.05 mm and not more than 0.20 mm, and p1 is, for example, not less than 0.02 mm and not more than 0.15 mm.

In the first embodiment, the case where the height h1 from the bottom surface E of the sealing member 50 to the first connection point a is equal to each other in each of the electrode portions 13a to 13d has been described as an example. However, The height h1 from the bottom surface E to the first connection point a may be different in the electrode portions 13a to 13d. Likewise, the height h2 from the bottom surface E of the sealing member 50 to the second connection point b may be different between the lead terminals 21a to 21d. In the case where the electrode portion and the lead terminal connected to one common lead are formed as one unit, the height h1 < h2 may be satisfied in at least one unit. However, it is preferable that the height h1 < h2 is satisfied in all the units.

5 is a cross-sectional view illustrating a Hall sensor according to the present invention. The substrate 30 is described because it is the hole element arranging step in the method of manufacturing the Hall sensor described below. The substrate 30 is provided with the lead terminals 21a to 21d in the exposure step of exposing the first surface M1 of the lead terminals 21a to 21d .

The hole element 10 has the bottom surface of the sealing member 50 as the reference surface M and the highest point T of the Hall element 10 is higher than the second surface M2 of the first portion N1 of the lead terminal, 2 position N2 of the second surface M2. That is, the height t from the bottom surface E of the sealing member 50 to the highest point T of the Hall element 10 and the height from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 p1 and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2 have a relationship p1 <t <p2.

The plurality of lead terminals 21a to 21d include first to fourth lead terminals, and the first to fourth lead terminals are connected to a virtual straight line connecting the first lead terminal and the third lead terminal, And a virtual straight line connecting the lead terminal and the fourth lead terminal is arranged so as to intersect in a plan view. The Hall element 10 has a rectangular shape in plan view and the Hall element 10 has four vertexes of the Hall element 10 as seen in a plan view in a plane between the first lead terminal and the second lead terminal A region between the second lead terminal and the third lead terminal, a region between the third lead terminal and the fourth lead terminal, and a region disposed between the fourth lead terminal and the first lead terminal.

The insulating layer 40 is disposed on a surface opposite to the surface on which the plurality of electrode portions 13a to 13d of the Hall element 10 are disposed. ) From the bottom surface E of the frame.

Each of the lead terminals has a step D on the second surface M2. Each lead terminal has a first portion N1 on the side near the Hall element 10 with the step D as a boundary, And the bottom surface E of the sealing member 50 is the reference surface M. The height p1 of each lead terminal to the second surface M2 in the first portion N1 is equal to the height of the second portion N2 on the second portion N2 Is smaller than the height p2 to the second surface M2 in the second surface M2. That is, the height p1 from the bottom surface E of the sealing member 50 to the second surface M2 in the first portion N1 and the height p2 from the bottom surface E of the sealing member 50 to the second surface M2 in the second portion N2 The height p2 has a relationship of p1 < p2.

The dimensions of the hall sensor 100 are, for example, 0.2 mm or more and 0.6 mm or less in length, 0.4 mm or more and 1.2 mm or less in width, and 0.1 mm or more and 0.3 mm or less in thickness.

(Manufacturing method)

6 (a) and 6 (b) are views showing a metal plate used for manufacturing the Hall sensor according to the first embodiment. 6 (a) is a front view, and Fig. 6 (b) is a rear view. The metal plate 120 has a structure in which a part serving as a lead terminal of each hall sensor is connected. In the drawing, reference character H denotes a hole portion, and a hatched portion denotes a half-etching region. The area surrounded by the dotted line is an area used by one Hall sensor, and the area between the dotted line and the dotted line is the area B (cuff width) through which the teeth of the dicing pass during dicing.

The Hall sensor manufacturing method of the first embodiment includes a plurality of lead terminals 21a to 21d, a Hall element 10 having a plurality of electrode portions 13a to 13d, a plurality of lead terminals 21a to 21d, And a plurality of leads (31a to 31d) for electrically connecting the respective lead terminals of the plurality of lead terminals (21a to 21d) and the respective electrode portions of the plurality of electrode portions (13a to 13d) A hole element arranging step of arranging the Hall element 10 in a region surrounded by the plurality of lead terminals 21a to 21d; 13a to 13d and a plurality of lead terminals by a plurality of leads 31a to 31d; a step of connecting the plurality of lead terminals 31a to 31d with the lead wires of the lead terminals; A sealing step of sealing the second surface M2 as a connecting surface with a sealing member, Remove and has exposure step of exposing the first surface M1 of the opposite side a second surface M2 of each of the lead terminals from the sealing member 50.

The plurality of lead terminals include at least a first lead terminal, and the first lead terminal is formed on the second surface M2 and in the shape of an ellipse centered on the position where the hall element 10 is loaded, The first lead terminal has a first portion N1 on the side closer to the position where the hall element 10 is loaded with the step difference D as a boundary and the first lead terminal has the step portion D on the periphery of the polygonal portion, And the first lead terminal has a surface on which the metal plate 120 of the base material is disposed as the reference surface M when the metal plate is disposed on the base material and the second portion N2 on the far side of the first portion N1 The height p1 from the second surface M2 to the second surface M2 is lower than the height p2 from the second surface M2 to the second surface M2. That is, the height p1 of the first portion N1 to the second surface M2 and the height p2 of the second portion N2 to the second surface M2 have a relationship of p1 < p2.

The first lead terminal has a step D on the periphery of the elliptical region centered on the position where the hall element 10 is mounted when viewed in plan view. The lead terminal has a step D on a circumference centered on a position where the hall element 10 is mounted when viewed from the plane.

The first lead terminal has a step D on the second surface M2 and at a position corresponding to the shape of the tip of the collet about the position where the hall element 10 is mounted when viewed from the plane, And a second portion N2 on a side farther from the position where the Hall element 10 is loaded and a second portion N2 on the side closer to the position where the Hall element 10 is loaded, And the height p1 of the lead terminal to the second surface M2 in the first portion N1 is the height p2 of the second portion N2 to the second surface M2 .

The hole element arranging step is a step in which the surface on which the metal plate 120 of the substrate 30 is disposed is set as the reference surface M and the Hall element 10 is positioned such that the highest point T of the Hall element 10 is the lead terminal 21a to 21d at a position higher than the second surface M2 in the first portion N1 and lower than the second surface M2 in the second portion N2.

The hole element arranging step may include a step of disposing the highest point T of the Hall element 10 at a position higher than the second surface M2 in the second portion N2. Even if p2 <T, the step D is effective for preventing contact of the collet. For example, in the case of p2 < T < 1.5 x p2 or p2 < T < 1.3 x p2, Is particularly effective for preventing contact of the collet.

The plurality of lead terminals 21a to 21d include first to fourth lead terminals, and the first to fourth lead terminals are connected to a virtual straight line connecting the first lead terminal and the third lead terminal, The imaginary straight line connecting the lead terminal and the fourth lead terminal is arranged so as to intersect when viewed in plan view, the Hall element 10 is rectangular in plan view, and the Hall element arranging step is, The region between the first lead terminal and the second lead terminal, the region between the second lead terminal and the third lead terminal, the region between the third lead terminal and the fourth lead terminal, And arranging the Hall element (10) so as to be disposed in a region between the lead terminal and the first lead terminal.

The step of forming the insulating layer 40 between the substrate 30 and the Hall element 10 includes a step of exposing the insulating layer 40 from the sealing member 50 .

Each of the lead terminals of the plurality of lead terminals has a step D on the second surface and each lead terminal has a first portion N1 on the side close to the position where the hall element 10 is mounted, And has a second portion N2 on a side farther from where the Hall element 10 is mounted and each lead terminal has a surface on which a metal plate 120 of the substrate 30 is placed when the metal plate is placed on the substrate, M, and the height p1 of each lead terminal to the second surface M2 of the first portion N1 is formed to be lower than the height p2 of the second portion N2 to the second surface M2.

7 (a) to 7 (e) are plan views showing steps of a method for manufacturing an Hall sensor. 7A to 7E, the area between the dotted line and the dotted line is the area B (cuff width) through which the teeth of dicing pass during dicing.

As shown in Fig. 7 (a), first, the metal plate 120 on which the above-described lead terminals are formed is prepared. This metal plate 120 has a structure in which a plurality of lead terminals 21a to 21d shown in Fig. 2 (b) are connected in a longitudinal direction and in a transverse direction when viewed in a plan view. The material of the metal plate 120 is, for example, copper.

Next, as shown in Fig. 7 (b), one side of the heat resistant film 80 is bonded to the back side of the metal plate 120, for example, as a base. On one side of the heat-resistant film 80, for example, an insulating adhesive layer is applied. The adhesive layer is, for example, a silicone resin as a base. The metal plate 120 is easily attached to the heat resistant film 80 by the adhesive layer. The heat resistant film 80 is adhered to the back side of the metal plate 120 so that the through region through which the metal plate 120 penetrates is covered with the heat resistant film 80 from the back side.

As the heat resistant film 80 as the substrate, it is preferable to use a tape made of a resin having adhesiveness and heat resistance.

As for the tackiness, it is preferable that the adhesive layer has a thinner pool thickness. Further, with respect to the heat resistance, it is necessary to be able to withstand a temperature of about 150 캜 to 200 캜. As such a heat resistant film 80, for example, a polyimide tape may be used. The polyimide tape has heat resistance capable of withstanding about 280 占 폚. Such a polyimide tape having high heat resistance can withstand the high heat applied at a later mold or wire bonding. As the heat resistant film 80, the following tape may be used in addition to the polyimide tape.

(1) a polyester tape; Heat-resistant temperature, about 130 ℃ (heat-resistant temperature up to about 200 ℃ depending on the use conditions)

(2) Teflon (TM) tape; Heat temperature: about 180 ℃

(3) PPS (polyphenylene sulfide); Heat temperature: about 160 ℃

(4) glass fibers; Heat temperature: about 200 ℃

(5) Nomex paper; Heat resistance temperature: about 150 to 200 DEG C

(6) In addition, aramid and crepe paper may be used as the heat resistant film 80.

Next, an insulating paste is applied to a region surrounded by the lead terminals 21a to 21d among the surfaces having the adhesive layer of the heat resistant film 80. [ Here, in order to prevent a part of the back surface of the hall element 10 from being exposed from the sealing member 50 such as a molded resin in the completed hall sensor 100, the coating conditions of the insulating paste (for example, And the thickness to be applied).

Next, as shown in Fig. 7 (c), the Hall element 10 is mounted (that is, die bonding is carried out) in the region where the insulating paste is applied, of the heat resistant film 80. After the bonding, heat treatment (i.e., curing) is performed, and the insulating paste is cured to form the insulating layer 40. [

7D, one end of each of the conductors 31a to 31d is connected to each of the lead terminals 21a to 21d, and the other end of each of the leads 31a to 31d is connected to the electrode portion 13a to 13d) (i.e., wire bonding is performed). 7 (e) is a back view of FIG. 7 (d).

Then, the whole is sealed with the mold resin 50 (that is, resin sealing is performed). This resin sealing is performed using, for example, a transfer mold technique.

8 (a) to 8 (d) are cross-sectional views showing the steps of a method of manufacturing the Hall sensor. 8A, a mold mold 90 having a lower mold 91 and an upper mold 92 is prepared, and a metal plate 120 (FIG. 8A) after wire bonding in the cavity of the mold metal 90 ). Subsequently, the molten mold resin 50 is injected into the side of the heat-resistant film 80 having the adhesive layer 130 (that is, the side bonded to the metal plate 120) in the cavity, do. Thus, the hole element 10, at least the surface side of the metal plate 120, and the conductors 31a to 31d are resin-sealed. When the mold resin 50 is further heated and cured, the mold resin 50 is taken out from the mold metal mold. Further, in the optional step after the resin sealing, the surface of the mold resin 50 may be marked with, for example, a mark (not shown).

Next, as shown in Fig. 8 (b), the heat resistant film 80 is peeled from the insulating layer 40 and the mold resin 50. Next, as shown in Fig. Thereby, the heat resistant film 80 is peeled from the insulating layer 40 and the mold resin 50 while leaving the insulating layer 40 on the back surface of the hole element 10.

As shown in Fig. 8 (c), the surface exposed from the mold resin 50 of the metal plate 120 (at least the mold resin 50 of each of the lead terminals 21a to 21d) The outer plating layers 60a to 60d are formed.

Next, as shown in Fig. 8 (d), a dicing tape (hereinafter referred to as &quot; dicing tape &quot;) is formed on the upper surface of the mold resin 50 93). Then, the mold resin 50 and the metal plate 120 are cut by relatively moving the blades with respect to the metal plate 120 along the hypothetical two-dot chain line shown in Fig. 7 (e) , And dicing is performed). That is, the mold resin 50 and the metal plate 120 are diced and individualized for each of the plurality of Hall elements 10. The diced metal plate 120 becomes the lead terminals 21a to 21d.

Through the above steps, the Hall sensor 100 shown in Figs. 2A to 2C is completed.

&Lt; Embodiment 2 >

 The second embodiment will be described below. In the first embodiment described above, the case where the insulating paste is used as the insulating layer 40 covering the back surface of the Hall element 10 has been described. However, in the second embodiment, the insulating layer 40 is not limited to an insulating paste. As the insulating layer 40, for example, a pressure-sensitive adhesive layer of a die attach film, that is, a dicing / die-bonding integrated film may be used.

With this configuration, the following effects are exhibited. That is, as the insulating layer covering the back surface of the Hall element 10, a pressure-sensitive adhesive layer of a die attach film is used. As a result, the step of applying the insulating paste can be omitted, which can contribute to a reduction in the number of steps.

&Lt; Embodiment 3 >

The lens module of the present embodiment includes a Hall sensor, a lens holder with a magnet, and a drive coil for moving the magnet based on a hall electromotive force signal which is an output signal from an external terminal of the hall sensor. The hall sensor of the present embodiment is thin and compact, and the variation of magnetic characteristics is small, so that the magnetic field can be accurately detected. As a result, the lens module can be downsized and accurate position detection can be performed. The magnetic field of the magnet attached to the lens holder is detected by the hall sensor of the present embodiment and the driving current is supplied to the driving coil based on the detected output signal to perform the autofocus control and the hand shake correction control with high accuracy . Further, since the Hall sensor of the present embodiment is thinner and smaller, it is possible to approach the position of the Hall element in the hall sensor with the magnet, thereby enabling more accurate magnetic detection.

While the present invention has been described with reference to particular embodiments, it is not intended to limit the invention to those embodiments. Other embodiments of the present invention will be apparent to those skilled in the art from the description of the present invention, along with various modifications of the disclosed embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications or embodiments as fall within the true spirit and scope of the invention.

10: Hall element
11: substrate
12: Potato section
13a to 13d:
21a to 21d: lead terminals
30: substrate
31a to 31d:
40: Insulating layer
50: sealing member
60a to 60d: external plating layer
80: Heat resistant film
90: Mold mold
91: Lower mold
92: upper mold
93: Dicing tape
100: Hall sensor
120: metal plate
130: adhesive layer
510: Hall element
512: Potato portion
513a and 513b:
525, 527: Lead terminal
530: substrate
540: Insulating layer
600: Collet

Claims (20)

A Hall element having first to fourth electrode portions,
First to fourth external terminals arranged around the Hall element,
First to fourth conductors for electrically connecting the respective electrode portions of the first to fourth electrode portions to respective external terminals of the first to fourth external terminals,
And a sealing member for sealing the second surface, which is the surface of the hall element, the first to fourth conductors, and the external terminals, which are connected to the conductors,
Wherein a first surface of each of the external terminals opposite to the second surface is exposed from a bottom surface of the sealing member,
Wherein each of the external terminals has a first portion and a second portion that are connected to the first to fourth conductors farther from the hall element than the first portion and that are connected to the second portion having the bottom surface of the sealing member as a reference surface Wherein a height of a second surface side of the sealing member is greater than a height of a second surface side of the first portion with the bottom surface of the sealing member as a reference surface,
Wherein the step is formed on the second surface and on the periphery of an elliptical shape centered on the hall element or a combination of elliptical and polygonal shapes when viewed in plan view,
And the sealing member seals each of the second surface of the first portion and the second surface of the second portion of each of the external terminals. The method according to claim 1,
Wherein a height from a bottom surface of the sealing member to the contact point at which the electrode portion of the hall element and the first to fourth conductive wires are in contact with the bottom surface of the sealing member is larger than a height Higher than the height, Hall sensor. 3. The method according to claim 1 or 2,
Wherein the step has a curved shape that is inclined or concave toward the bottom surface of the sealing member when viewed in cross section. 3. The method according to claim 1 or 2,
Wherein the Hall element includes a substrate, a potentiometer portion disposed on the substrate or within the substrate, and first to fourth electrode portions connected to the potentiometer portion,
And an insulating layer disposed on a surface of the Hall element opposite to a surface on which the first to fourth electrode portions are disposed,
And the insulating layer is exposed from the bottom surface of the sealing member. The first to fourth external terminals, the Hall element having the first to fourth electrode portions, and the external terminals of the first to fourth external terminals and the respective electrode portions of the first to fourth electrode portions, respectively A method of manufacturing an Hall sensor including first to fourth conductors,
An external terminal disposing step of disposing a metal plate on which the first to fourth external terminals are formed on a substrate;
A hole element arranging step of arranging the hole elements in an area surrounded by the first to fourth external terminals,
A lead wire connecting step of electrically connecting the first to fourth electrode parts and the first to fourth external terminals to the first to fourth leads,
A sealing step of sealing the first surface, the second surface, and the second surface, which are surfaces of the external terminals, which are connected to the conductor, with a sealing member;
And an exposure step of removing the substrate and exposing a first surface of each external terminal opposite to the second surface from the sealing member,
Wherein the first to fourth external terminals have a step on the second surface and on the periphery of an elliptical region centered on a position at which the hall element is mounted when viewed from a plane,
Wherein the first to fourth external terminals have a first portion on a side closer to a position where the hall element is stacked and a second portion on a far side in a position where the hall element is stacked,
Wherein the first to fourth external terminals are formed so that the height of the first surface to the second surface of the first surface is larger than the height of the second surface of the first surface, And the second surface is lower than the height of the second surface,
In the wire connection step, the first conductor is connected to the second surface of the second portion of the first external terminal,
In the sealing step, the second surface of the first external terminal in the first portion and the second surface of the first external terminal in the second portion are sealed with the sealing member, A method of manufacturing a sensor. The first to fourth external terminals, the Hall element having the first to fourth electrode portions, and the external terminals of the first to fourth external terminals and the respective electrode portions of the first to fourth electrode portions, respectively A method of manufacturing an Hall sensor including first to fourth conductors,
An external terminal disposing step of disposing a metal plate on which the first to fourth external terminals are formed on a substrate;
A hole element arranging step of arranging the hole elements in an area surrounded by the first to fourth external terminals,
A lead wire connecting step of electrically connecting the first to fourth electrode parts and the first to fourth external terminals to the first to fourth leads,
A sealing step of sealing the first surface, the second surface, and the second surface, which are surfaces of the external terminals, which are connected to the conductor, with a sealing member;
And an exposure step of removing the substrate and exposing a first surface of each external terminal opposite to the second surface from the sealing member,
The first to fourth external terminals have a step at a position corresponding to the shape of the tip of the collet about the position on which the hall element is stacked on the second surface and in a plane view,
Wherein the first to fourth external terminals have a first portion on a side closer to a position where the hall element is stacked and a second portion on a far side in a position where the hall element is stacked,
Wherein the first to fourth external terminals are formed so that the height of the first surface to the second surface of the first surface is larger than the height of the second surface of the first surface, And the second surface is lower than the height of the second surface,
In the wire connection step, the first conductor is connected to the second surface of the second portion of the first external terminal,
In the sealing step, the second surface of the first external terminal in the first portion and the second surface of the first external terminal in the second portion are sealed with the sealing member, A method of manufacturing a sensor. The method according to claim 5 or 6,
Wherein the hole element arranging step is a step of arranging the hole element in the base portion of the base member as a reference plane so that the highest point of the hall element is located at the second point of the second external terminal And a step of disposing the hole sensor at a position lower than the second surface in the second portion. The method according to claim 5 or 6,
Wherein the step of arranging the hole elements comprises the step of arranging the sealing member in a state that the height from the reference surface to the highest point of the hall element is T and the height of the second surface in the second portion is p2, and arranging the hall element at a position where p2 < T < 1.5 x p2. The method according to claim 5 or 6,
Wherein the first to fourth external terminals are formed so that a virtual straight line connecting the first external terminal and the third external terminal and a virtual straight line connecting the second external terminal and the fourth external terminal cross Lt; / RTI &gt;
The Hall element has a rectangular shape when seen in a plan view,
In the above-mentioned Hall element arranging step,
The four vertexes of the hall element are arranged in a region between the first external terminal and the second external terminal, a region between the second external terminal and the third external terminal, And arranging the hall element so as to be disposed in a region between the fourth external terminal and an area between the fourth external terminal and the first external terminal. The method according to claim 5 or 6,
And an insulating layer forming step of forming an insulating layer between the substrate and the hole element, wherein the exposing step includes a step of exposing the insulating layer from the sealing member. delete delete delete delete delete delete delete delete delete delete

Images