TW201614832A - High electron mobility transistor with periodically carbon doped gallium nitride - Google Patents
High electron mobility transistor with periodically carbon doped gallium nitrideInfo
- Publication number
- TW201614832A TW201614832A TW103142638A TW103142638A TW201614832A TW 201614832 A TW201614832 A TW 201614832A TW 103142638 A TW103142638 A TW 103142638A TW 103142638 A TW103142638 A TW 103142638A TW 201614832 A TW201614832 A TW 201614832A
- Authority
- TW
- Taiwan
- Prior art keywords
- gallium nitride
- layers
- gan
- carbon doped
- doped gallium
- Prior art date
Links
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title abstract 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title abstract 6
- 229910002601 GaN Inorganic materials 0.000 title abstract 6
- 229910052799 carbon Inorganic materials 0.000 title abstract 6
- 238000000034 method Methods 0.000 abstract 4
- 238000010348 incorporation Methods 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/505,304 US9608103B2 (en) | 2014-10-02 | 2014-10-02 | High electron mobility transistor with periodically carbon doped gallium nitride |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614832A true TW201614832A (en) | 2016-04-16 |
TWI596764B TWI596764B (zh) | 2017-08-21 |
Family
ID=55633390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103142638A TWI596764B (zh) | 2014-10-02 | 2014-12-08 | 具有週期性摻雜碳之氮化鎵之高電子移動率電晶體 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9608103B2 (zh) |
JP (1) | JP6152124B2 (zh) |
CN (1) | CN106158946A (zh) |
TW (1) | TWI596764B (zh) |
Families Citing this family (11)
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US11335799B2 (en) * | 2015-03-26 | 2022-05-17 | Chih-Shu Huang | Group-III nitride semiconductor device and method for fabricating the same |
JP6582736B2 (ja) * | 2015-08-25 | 2019-10-02 | 富士電機株式会社 | 窒化物半導体装置の製造方法 |
CN106653839A (zh) * | 2016-09-27 | 2017-05-10 | 华南理工大学 | 具有调制碳掺杂氮化镓高阻层的hemt结构及其制备方法 |
CN106783950B (zh) * | 2016-12-19 | 2024-02-13 | 英诺赛科(珠海)科技有限公司 | 氮化镓半导体器件及其制备方法 |
CN108428741B (zh) * | 2017-02-14 | 2021-12-14 | 英诺赛科(珠海)科技有限公司 | 氮化镓半导体器件及其制作方法 |
US10211297B2 (en) * | 2017-05-03 | 2019-02-19 | Globalwafers Co., Ltd. | Semiconductor heterostructures and methods for forming same |
EP3486939B1 (en) | 2017-11-20 | 2020-04-01 | IMEC vzw | Method for forming a semiconductor structure for a gallium nitride channel device |
CN111146282B (zh) * | 2018-11-06 | 2023-03-28 | 世界先进积体电路股份有限公司 | 高电子迁移率晶体管装置及其制造方法 |
WO2020155096A1 (zh) | 2019-02-01 | 2020-08-06 | 苏州晶湛半导体有限公司 | 一种半导体结构及其制造方法 |
JP7120334B2 (ja) * | 2019-02-05 | 2022-08-17 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
CN115050817B (zh) * | 2022-08-15 | 2022-11-18 | 江西兆驰半导体有限公司 | 一种晶体管及其制备方法 |
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JP6239499B2 (ja) | 2012-03-16 | 2017-11-29 | 古河電気工業株式会社 | 半導体積層基板、半導体素子、およびその製造方法 |
JP5656930B2 (ja) * | 2012-07-05 | 2015-01-21 | 古河電気工業株式会社 | 窒化物系化合物半導体素子 |
JP6151487B2 (ja) | 2012-07-10 | 2017-06-21 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
KR20140013247A (ko) * | 2012-07-23 | 2014-02-05 | 삼성전자주식회사 | 질화물계 반도체 소자 및 그의 제조 방법 |
TWI489626B (zh) | 2012-08-24 | 2015-06-21 | Visual Photonics Epitaxy Co Ltd | Bipolar high electron mobility transistor |
JP6119165B2 (ja) | 2012-09-28 | 2017-04-26 | 富士通株式会社 | 半導体装置 |
TWI506788B (zh) * | 2012-12-25 | 2015-11-01 | Huga Optotech Inc | 場效電晶體 |
US20140209920A1 (en) * | 2013-01-31 | 2014-07-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | High Electron Mobility Transistor Structure |
US9245993B2 (en) * | 2013-03-15 | 2016-01-26 | Transphorm Inc. | Carbon doping semiconductor devices |
JP5787417B2 (ja) | 2013-05-14 | 2015-09-30 | コバレントマテリアル株式会社 | 窒化物半導体基板 |
US9245991B2 (en) * | 2013-08-12 | 2016-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing |
US20150137179A1 (en) * | 2013-11-19 | 2015-05-21 | Huga Optotech Inc. | Power device |
-
2014
- 2014-10-02 US US14/505,304 patent/US9608103B2/en active Active
- 2014-12-08 TW TW103142638A patent/TWI596764B/zh active
-
2015
- 2015-01-21 JP JP2015009070A patent/JP6152124B2/ja not_active Expired - Fee Related
- 2015-04-02 CN CN201510155907.XA patent/CN106158946A/zh not_active Withdrawn
Also Published As
Publication number | Publication date |
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CN106158946A (zh) | 2016-11-23 |
US9608103B2 (en) | 2017-03-28 |
JP6152124B2 (ja) | 2017-06-21 |
JP2016076681A (ja) | 2016-05-12 |
TWI596764B (zh) | 2017-08-21 |
US20160099345A1 (en) | 2016-04-07 |
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