TW201614832A - High electron mobility transistor with periodically carbon doped gallium nitride - Google Patents

High electron mobility transistor with periodically carbon doped gallium nitride

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Publication number
TW201614832A
TW201614832A TW103142638A TW103142638A TW201614832A TW 201614832 A TW201614832 A TW 201614832A TW 103142638 A TW103142638 A TW 103142638A TW 103142638 A TW103142638 A TW 103142638A TW 201614832 A TW201614832 A TW 201614832A
Authority
TW
Taiwan
Prior art keywords
gallium nitride
layers
gan
carbon doped
doped gallium
Prior art date
Application number
TW103142638A
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English (en)
Other versions
TWI596764B (zh
Inventor
Jeffrey Craig Ramer
Karl Knieriem
Original Assignee
Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of TW201614832A publication Critical patent/TW201614832A/zh
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Publication of TWI596764B publication Critical patent/TWI596764B/zh

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
TW103142638A 2014-10-02 2014-12-08 具有週期性摻雜碳之氮化鎵之高電子移動率電晶體 TWI596764B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/505,304 US9608103B2 (en) 2014-10-02 2014-10-02 High electron mobility transistor with periodically carbon doped gallium nitride

Publications (2)

Publication Number Publication Date
TW201614832A true TW201614832A (en) 2016-04-16
TWI596764B TWI596764B (zh) 2017-08-21

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US (1) US9608103B2 (zh)
JP (1) JP6152124B2 (zh)
CN (1) CN106158946A (zh)
TW (1) TWI596764B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11335799B2 (en) * 2015-03-26 2022-05-17 Chih-Shu Huang Group-III nitride semiconductor device and method for fabricating the same
JP6582736B2 (ja) * 2015-08-25 2019-10-02 富士電機株式会社 窒化物半導体装置の製造方法
CN106653839A (zh) * 2016-09-27 2017-05-10 华南理工大学 具有调制碳掺杂氮化镓高阻层的hemt结构及其制备方法
CN106783950B (zh) * 2016-12-19 2024-02-13 英诺赛科(珠海)科技有限公司 氮化镓半导体器件及其制备方法
CN108428741B (zh) * 2017-02-14 2021-12-14 英诺赛科(珠海)科技有限公司 氮化镓半导体器件及其制作方法
US10211297B2 (en) * 2017-05-03 2019-02-19 Globalwafers Co., Ltd. Semiconductor heterostructures and methods for forming same
EP3486939B1 (en) 2017-11-20 2020-04-01 IMEC vzw Method for forming a semiconductor structure for a gallium nitride channel device
CN111146282B (zh) * 2018-11-06 2023-03-28 世界先进积体电路股份有限公司 高电子迁移率晶体管装置及其制造方法
WO2020155096A1 (zh) 2019-02-01 2020-08-06 苏州晶湛半导体有限公司 一种半导体结构及其制造方法
JP7120334B2 (ja) * 2019-02-05 2022-08-17 三菱電機株式会社 半導体装置および半導体装置の製造方法
CN115050817B (zh) * 2022-08-15 2022-11-18 江西兆驰半导体有限公司 一种晶体管及其制备方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4792814B2 (ja) * 2005-05-26 2011-10-12 住友電気工業株式会社 高電子移動度トランジスタ、電界効果トランジスタ、エピタキシャル基板、エピタキシャル基板を作製する方法およびiii族窒化物系トランジスタを作製する方法
US8399911B2 (en) 2006-06-07 2013-03-19 Imec Enhancement mode field effect device and the method of production thereof
US8421119B2 (en) * 2006-09-13 2013-04-16 Rohm Co., Ltd. GaN related compound semiconductor element and process for producing the same and device having the same
JP5224311B2 (ja) 2007-01-05 2013-07-03 古河電気工業株式会社 半導体電子デバイス
JP2009081406A (ja) 2007-09-27 2009-04-16 Showa Denko Kk Iii族窒化物半導体発光素子及びその製造方法、並びにランプ
JP5167081B2 (ja) 2008-11-13 2013-03-21 パナソニック株式会社 窒化物半導体デバイス
JP2010123725A (ja) 2008-11-19 2010-06-03 Sanken Electric Co Ltd 化合物半導体基板及び該化合物半導体基板を用いた半導体装置
JP4519196B2 (ja) 2008-11-27 2010-08-04 Dowaエレクトロニクス株式会社 電子デバイス用エピタキシャル基板およびその製造方法
JP4677499B2 (ja) * 2008-12-15 2011-04-27 Dowaエレクトロニクス株式会社 電子デバイス用エピタキシャル基板およびその製造方法
JP5697012B2 (ja) * 2009-03-31 2015-04-08 古河電気工業株式会社 溝の形成方法、および電界効果トランジスタの製造方法
CN102460664B (zh) * 2009-05-11 2014-08-13 同和电子科技有限公司 电子器件用外延衬底及其制造方法
JP5188545B2 (ja) * 2009-09-14 2013-04-24 コバレントマテリアル株式会社 化合物半導体基板
JP2011166067A (ja) * 2010-02-15 2011-08-25 Panasonic Corp 窒化物半導体装置
JP2012009630A (ja) * 2010-06-24 2012-01-12 Panasonic Corp 窒化物半導体装置及び窒化物半導体装置の製造方法
WO2012066701A1 (ja) 2010-11-19 2012-05-24 パナソニック株式会社 窒化物半導体装置
JP5788296B2 (ja) 2011-02-22 2015-09-30 コバレントマテリアル株式会社 窒化物半導体基板及びその製造方法
US20120248577A1 (en) * 2011-04-04 2012-10-04 Epowersoft Inc. Controlled Doping in III-V Materials
JP2013026321A (ja) * 2011-07-19 2013-02-04 Sharp Corp 窒化物系半導体層を含むエピタキシャルウエハ
KR101175183B1 (ko) * 2011-08-08 2012-08-17 일진머티리얼즈 주식회사 전류 확산 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법
JP5546514B2 (ja) * 2011-09-20 2014-07-09 古河電気工業株式会社 窒化物半導体素子及び製造方法
US9099388B2 (en) * 2011-10-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. III-V multi-channel FinFETs
KR101262726B1 (ko) * 2011-12-30 2013-05-09 일진엘이디(주) 탄소 도핑된 p형 질화물층을 포함하는 질화물계 발광소자 제조 방법
JP6239499B2 (ja) 2012-03-16 2017-11-29 古河電気工業株式会社 半導体積層基板、半導体素子、およびその製造方法
JP5656930B2 (ja) * 2012-07-05 2015-01-21 古河電気工業株式会社 窒化物系化合物半導体素子
JP6151487B2 (ja) 2012-07-10 2017-06-21 富士通株式会社 化合物半導体装置及びその製造方法
KR20140013247A (ko) * 2012-07-23 2014-02-05 삼성전자주식회사 질화물계 반도체 소자 및 그의 제조 방법
TWI489626B (zh) 2012-08-24 2015-06-21 Visual Photonics Epitaxy Co Ltd Bipolar high electron mobility transistor
JP6119165B2 (ja) 2012-09-28 2017-04-26 富士通株式会社 半導体装置
TWI506788B (zh) * 2012-12-25 2015-11-01 Huga Optotech Inc 場效電晶體
US20140209920A1 (en) * 2013-01-31 2014-07-31 Taiwan Semiconductor Manufacturing Co., Ltd. High Electron Mobility Transistor Structure
US9245993B2 (en) * 2013-03-15 2016-01-26 Transphorm Inc. Carbon doping semiconductor devices
JP5787417B2 (ja) 2013-05-14 2015-09-30 コバレントマテリアル株式会社 窒化物半導体基板
US9245991B2 (en) * 2013-08-12 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing
US20150137179A1 (en) * 2013-11-19 2015-05-21 Huga Optotech Inc. Power device

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TWI596764B (zh) 2017-08-21
US20160099345A1 (en) 2016-04-07

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