TW201505137A - 電子封裝模組及其製造方法 - Google Patents

電子封裝模組及其製造方法 Download PDF

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Publication number
TW201505137A
TW201505137A TW103105827A TW103105827A TW201505137A TW 201505137 A TW201505137 A TW 201505137A TW 103105827 A TW103105827 A TW 103105827A TW 103105827 A TW103105827 A TW 103105827A TW 201505137 A TW201505137 A TW 201505137A
Authority
TW
Taiwan
Prior art keywords
predetermined area
tape
circuit substrate
manufacturing
mold block
Prior art date
Application number
TW103105827A
Other languages
English (en)
Chinese (zh)
Inventor
Jen-Chun Chen
Tsung-Jung Cheng
Chia-Cheng Liu
Original Assignee
Universal Scient Ind Shanghai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Scient Ind Shanghai filed Critical Universal Scient Ind Shanghai
Priority to TW103105827A priority Critical patent/TW201505137A/zh
Priority to US14/332,970 priority patent/US9881875B2/en
Priority to DE102014110301.7A priority patent/DE102014110301A1/de
Priority to FR1457388A priority patent/FR3009476B1/fr
Priority to JP2014156811A priority patent/JP5844439B2/ja
Publication of TW201505137A publication Critical patent/TW201505137A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103105827A 2013-07-31 2014-02-21 電子封裝模組及其製造方法 TW201505137A (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW103105827A TW201505137A (zh) 2013-07-31 2014-02-21 電子封裝模組及其製造方法
US14/332,970 US9881875B2 (en) 2013-07-31 2014-07-16 Electronic module and method of making the same
DE102014110301.7A DE102014110301A1 (de) 2013-07-31 2014-07-22 Elektronisches Verpackungsmodul und sein Herstellungsverfahren
FR1457388A FR3009476B1 (fr) 2013-07-31 2014-07-30 Module electronique et procede de fabrication de celui-ci
JP2014156811A JP5844439B2 (ja) 2013-07-31 2014-07-31 電子部品実装モジュールの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102127507 2013-07-31
TW103105827A TW201505137A (zh) 2013-07-31 2014-02-21 電子封裝模組及其製造方法

Publications (1)

Publication Number Publication Date
TW201505137A true TW201505137A (zh) 2015-02-01

Family

ID=52342062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105827A TW201505137A (zh) 2013-07-31 2014-02-21 電子封裝模組及其製造方法

Country Status (4)

Country Link
JP (1) JP5844439B2 (ja)
DE (1) DE102014110301A1 (ja)
FR (1) FR3009476B1 (ja)
TW (1) TW201505137A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112654129A (zh) * 2019-10-10 2021-04-13 庆鼎精密电子（淮安）有限公司 抗电磁干扰电路板及其制作方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101670894B1 (ko) 2015-05-27 2016-10-31 (주)파트론 반도체 패키지의 제조 방법
KR101661919B1 (ko) * 2015-06-23 2016-10-04 (주)파트론 반도체 패키지의 제조 방법
US10236260B2 (en) * 2016-06-30 2019-03-19 Nxp Usa, Inc. Shielded package with integrated antenna
WO2018030152A1 (ja) * 2016-08-08 2018-02-15 株式会社村田製作所 回路モジュールおよび回路モジュールの製造方法
KR102505198B1 (ko) * 2018-04-02 2023-03-02 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US11251135B2 (en) 2018-04-02 2022-02-15 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same
WO2023119884A1 (ja) * 2021-12-24 2023-06-29 富士フイルム株式会社 プリント基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4175351B2 (ja) * 2005-08-26 2008-11-05 松下電工株式会社 凹凸多層回路板モジュール及びその製造方法
CN103053021A (zh) * 2010-08-18 2013-04-17 株式会社村田制作所 电子元器件及其制造方法
JP2012159935A (ja) * 2011-01-31 2012-08-23 Murata Mfg Co Ltd 電子部品モジュール、電子部品モジュールの製造方法、多機能カード
TWI502733B (zh) * 2012-11-02 2015-10-01 環旭電子股份有限公司 電子封裝模組及其製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112654129A (zh) * 2019-10-10 2021-04-13 庆鼎精密电子（淮安）有限公司 抗电磁干扰电路板及其制作方法
CN112654129B (zh) * 2019-10-10 2021-11-16 庆鼎精密电子（淮安）有限公司 抗电磁干扰电路板及其制作方法

Also Published As

Publication number Publication date
JP5844439B2 (ja) 2016-01-20
JP2015032834A (ja) 2015-02-16
FR3009476A1 (fr) 2015-02-06
FR3009476B1 (fr) 2018-02-16
DE102014110301A1 (de) 2015-02-05

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