JP2015032834A - 電子部品実装モジュール及びその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 238000007789 sealing Methods 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims description 43
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 description 9
- 239000000976 ink Substances 0.000 description 8
- 230000001788 irregular Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000482268 Zea mays subsp. mays Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
【解決手段】本発明に係る電子部品実装モジュール及びその製造方法では、先ず配線基板の所定領域内にテープを貼着すると共に、所定領域外に電子素子を設ける。次いで配線基板全体を覆うように封止体を形成する。その後、テープをテープの上の封止体と共に除去することで選択的封止を完了する。その後、封止体に電磁遮蔽層を形成すると共に所定領域内に光電素子を設ける。これにより、電子素子が電磁干渉を受けることから保護すると共に、封止体に被覆されることで生じる光電素子の動作への影響を回避する。
【選択図】図1E
Description
11、31 配線基板
111、311、511 接地パッド
112、312 側部接地パッド
12 実装平面
13、33、53 テープ
15、35、55 封止体
18 マスク層
19、39、59 電磁遮蔽層
21、41、61 電子素子
22、62 光電素子
37、57 インク
α 挟角
Claims (8)
- 第1の実装平面と、前記第1の実装平面に位置する少なくとも1つの第1の接地パッドと、前記第1の実装平面に位置する第1の所定領域とを含む配線基板と、
前記第1の所定領域以外の前記第1の実装平面に設けられる少なくとも1つの電子素子と、
各前記電子素子を被覆すると共に、前記第1の所定領域に面する側壁と前記第1の実装平面とで形成される挟角が85度〜90度である少なくとも1つの第1の封止体と、
各前記封止体を覆うと共に各前記接地パッドと電気的に接続される第1の電磁遮蔽層と
を含むことを特徴とする電子部品実装モジュール。 - 前記配線基板は、第2の実装平面と、前記第2の実装平面に位置する少なくとも1つの第2の接地パッドと、前記第2の実装平面に位置する第2の所定領域とを更に含み、
各前記電子素子は、前記第2の所定領域以外の前記第2の実装平面に設けられ、
前記電子部品実装モジュールは、
各前記電子素子を被覆すると共に、前記第2の所定領域に面する側壁と前記第2の実装平面とで形成される挟角が85度〜90度である少なくとも1つの第2の封止体と、
各前記第2の封止体を覆うと共に各前記第2の接地パッドと電気的に接続される第2の電磁遮蔽層と
を更に含むことを特徴とする請求項1に記載の電子部品実装モジュール。 - 前記配線基板は、前記配線基板の側辺に位置すると共に前記第1の電磁遮蔽層が電気的に接続される少なくとも1つの側部接地パッドを更に含むことを特徴とする請求項1に記載の電子部品実装モジュール。
- 第1の実装平面と、前記第1の実装平面に位置する少なくとも1つの第1の接地パッドと、前記第1の実装平面に位置する第1の所定領域とを含む配線基板を提供する工程と、
前記第1の所定領域内に第1のテープを貼着する工程と、
前記第1の所定領域以外の前記第1の実装平面に少なくとも1つの電子素子を設ける工程と、
前記第1の実装平面に、前記第1のテープと各前記電子素子とを覆う第1の封止体を形成する工程と、
前記第1の所定領域に位置する前記第1の封止体を除去する工程と、
前記第1のテープを除去する工程と、
前記第1の所定領域内に第1のマスク層を形成する工程と、
各前記第1の接地パッドと電気的に接続させる第1の電磁遮蔽層を形成する工程と、
前記第1のマスク層を除去する工程と、
前記第1の所定領域内に少なくとも1つの光電素子を設ける工程と
を含むことを特徴とする電子部品実装モジュールの製造方法。 - 第2の実装平面と、前記第2の実装平面に位置する少なくとも1つの第2の接地パッドと、前記第2の実装平面に位置する第2の所定領域とを含む前記配線基板を提供する工程と、
前記第2の所定領域内に第2のテープを貼着する工程と、
前記第2の所定領域以外の前記第2の実装平面に各前記電子素子を設ける工程と、
前記第2の実装平面に、前記第2のテープと各前記電子素子とを覆う第2の封止体を形成する工程と、
前記第2の所定領域に位置する前記第2の封止体を除去する工程と、
前記第2のテープを除去する工程と
を更に含むことを特徴とする請求項4に記載の電子部品実装モジュールの製造方法。 - 前記第1の所定領域内に前記第1のテープを貼着する前に、
前記配線基板の全面に完全な第1のテープを貼着する工程と、
各前記第1の接地パッドの上方に位置する前記完全な第1のテープにレーザーで溝を形成する工程と、
前記第1の所定領域以外に位置する前記完全な第1のテープを除去する工程と
を更に含むことを特徴とする請求項4に記載の電子部品実装モジュールの製造方法。 - 前記第1のテープを除去する工程において、前記第1のテープを加熱することで脱落させるを特徴とする請求項4に記載の電子部品実装モジュールの製造方法。
- 前記第1のテープはUVテープであり、
前記第1のテープを除去する工程において、前記第1のテープに紫外線を照射すること を特徴とする請求項4に記載の電子部品実装モジュールの製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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TW102127507 | 2013-07-31 | ||
TW102127507 | 2013-07-31 | ||
TW103105827A TW201505137A (zh) | 2013-07-31 | 2014-02-21 | 電子封裝模組及其製造方法 |
TW103105827 | 2014-02-21 |
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JP2015032834A true JP2015032834A (ja) | 2015-02-16 |
JP5844439B2 JP5844439B2 (ja) | 2016-01-20 |
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JP (1) | JP5844439B2 (ja) |
DE (1) | DE102014110301A1 (ja) |
FR (1) | FR3009476B1 (ja) |
TW (1) | TW201505137A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101661919B1 (ko) * | 2015-06-23 | 2016-10-04 | (주)파트론 | 반도체 패키지의 제조 방법 |
KR101670894B1 (ko) | 2015-05-27 | 2016-10-31 | (주)파트론 | 반도체 패키지의 제조 방법 |
WO2018030152A1 (ja) * | 2016-08-08 | 2018-02-15 | 株式会社村田製作所 | 回路モジュールおよび回路モジュールの製造方法 |
KR20190115388A (ko) * | 2018-04-02 | 2019-10-11 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
US11430742B2 (en) | 2018-04-02 | 2022-08-30 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
WO2023119884A1 (ja) * | 2021-12-24 | 2023-06-29 | 富士フイルム株式会社 | プリント基板の製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10236260B2 (en) * | 2016-06-30 | 2019-03-19 | Nxp Usa, Inc. | Shielded package with integrated antenna |
CN112654129B (zh) * | 2019-10-10 | 2021-11-16 | 庆鼎精密电子(淮安)有限公司 | 抗电磁干扰电路板及其制作方法 |
CN115332093A (zh) * | 2021-05-11 | 2022-11-11 | 江苏长电科技股份有限公司 | 分区电磁屏蔽封装结构的制造方法及封装结构 |
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JP2007059846A (ja) * | 2005-08-26 | 2007-03-08 | Matsushita Electric Works Ltd | 凹凸多層回路板モジュール及びその製造方法 |
WO2012023332A1 (ja) * | 2010-08-18 | 2012-02-23 | 株式会社 村田製作所 | 電子部品及びその製造方法 |
JP2012159935A (ja) * | 2011-01-31 | 2012-08-23 | Murata Mfg Co Ltd | 電子部品モジュール、電子部品モジュールの製造方法、多機能カード |
Family Cites Families (1)
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TWI502733B (zh) * | 2012-11-02 | 2015-10-01 | 環旭電子股份有限公司 | 電子封裝模組及其製造方法 |
-
2014
- 2014-02-21 TW TW103105827A patent/TW201505137A/zh unknown
- 2014-07-22 DE DE102014110301.7A patent/DE102014110301A1/de active Pending
- 2014-07-30 FR FR1457388A patent/FR3009476B1/fr active Active
- 2014-07-31 JP JP2014156811A patent/JP5844439B2/ja active Active
Patent Citations (3)
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JP2007059846A (ja) * | 2005-08-26 | 2007-03-08 | Matsushita Electric Works Ltd | 凹凸多層回路板モジュール及びその製造方法 |
WO2012023332A1 (ja) * | 2010-08-18 | 2012-02-23 | 株式会社 村田製作所 | 電子部品及びその製造方法 |
JP2012159935A (ja) * | 2011-01-31 | 2012-08-23 | Murata Mfg Co Ltd | 電子部品モジュール、電子部品モジュールの製造方法、多機能カード |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101670894B1 (ko) | 2015-05-27 | 2016-10-31 | (주)파트론 | 반도체 패키지의 제조 방법 |
KR101661919B1 (ko) * | 2015-06-23 | 2016-10-04 | (주)파트론 | 반도체 패키지의 제조 방법 |
WO2018030152A1 (ja) * | 2016-08-08 | 2018-02-15 | 株式会社村田製作所 | 回路モジュールおよび回路モジュールの製造方法 |
KR20190115388A (ko) * | 2018-04-02 | 2019-10-11 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
US11430742B2 (en) | 2018-04-02 | 2022-08-30 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
KR102505198B1 (ko) * | 2018-04-02 | 2023-03-02 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
WO2023119884A1 (ja) * | 2021-12-24 | 2023-06-29 | 富士フイルム株式会社 | プリント基板の製造方法 |
Also Published As
Publication number | Publication date |
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DE102014110301A1 (de) | 2015-02-05 |
FR3009476A1 (fr) | 2015-02-06 |
FR3009476B1 (fr) | 2018-02-16 |
TW201505137A (zh) | 2015-02-01 |
JP5844439B2 (ja) | 2016-01-20 |
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