JP5844439B2 - 電子部品実装モジュールの製造方法 - Google Patents
電子部品実装モジュールの製造方法 Download PDFInfo
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- JP5844439B2 JP5844439B2 JP2014156811A JP2014156811A JP5844439B2 JP 5844439 B2 JP5844439 B2 JP 5844439B2 JP 2014156811 A JP2014156811 A JP 2014156811A JP 2014156811 A JP2014156811 A JP 2014156811A JP 5844439 B2 JP5844439 B2 JP 5844439B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 42
- 238000007789 sealing Methods 0.000 claims description 63
- 238000000034 method Methods 0.000 claims description 42
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 9
- 239000000976 ink Substances 0.000 description 8
- 230000001788 irregular Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000482268 Zea mays subsp. mays Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
11、31 配線基板
111、311、511 接地パッド
112、312 側部接地パッド
12 実装平面
13、33、53 テープ
15、35、55 封止体
18 マスク層
19、39、59 電磁遮蔽層
21、41、61 電子素子
22、62 光電素子
37、57 インク
α 挟角
Claims (5)
- 第1の実装平面と、前記第1の実装平面に位置する少なくとも1つの第1の接地パッドと、前記第1の実装平面に位置する第1の所定領域とを含む配線基板を提供する工程と、
前記第1の所定領域内に第1のテープを貼着する工程と、
前記第1の所定領域以外の前記第1の実装平面に少なくとも1つの電子素子を設ける工程と、
前記第1の実装平面に、前記第1のテープと各前記電子素子とを覆う第1の封止体を形成する工程と、
前記第1の所定領域に位置する前記第1の封止体を除去する工程と、
前記第1のテープを除去する工程と、
前記第1の所定領域内に第1のマスク層を形成する工程と、
各前記第1の接地パッドと電気的に接続させる第1の電磁遮蔽層を形成する工程と、
前記第1のマスク層を除去する工程と、
前記第1の所定領域内に少なくとも1つの光電素子を設ける工程と
を含むことを特徴とする電子部品実装モジュールの製造方法。 - 第2の実装平面と、前記第2の実装平面に位置する少なくとも1つの第2の接地パッドと、前記第2の実装平面に位置する第2の所定領域とを含む前記配線基板を提供する工程と、
前記第2の所定領域内に第2のテープを貼着する工程と、
前記第2の所定領域以外の前記第2の実装平面に各前記電子素子を設ける工程と、
前記第2の実装平面に、前記第2のテープと各前記電子素子とを覆う第2の封止体を形成する工程と、
前記第2の所定領域に位置する前記第2の封止体を除去する工程と、
前記第2のテープを除去する工程と
を更に含むことを特徴とする請求項1に記載の電子部品実装モジュールの製造方法。 - 前記第1の所定領域内に前記第1のテープを貼着する前に、
前記配線基板の全面に完全な第1のテープを貼着する工程と、
各前記第1の接地パッドの上方に位置する前記完全な第1のテープにレーザーで溝を形成する工程と、
前記第1の所定領域以外に位置する前記完全な第1のテープを除去する工程と
を更に含むことを特徴とする請求項1に記載の電子部品実装モジュールの製造方法。 - 前記第1のテープを除去する工程において、前記第1のテープを加熱することで脱落させることを特徴とする請求項1に記載の電子部品実装モジュールの製造方法。
- 前記第1のテープはUVテープであり、
前記第1のテープを除去する工程において、前記第1のテープに紫外線を照射することを特徴とする請求項1に記載の電子部品実装モジュールの製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102127507 | 2013-07-31 | ||
TW102127507 | 2013-07-31 | ||
TW103105827A TW201505137A (zh) | 2013-07-31 | 2014-02-21 | 電子封裝模組及其製造方法 |
TW103105827 | 2014-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015032834A JP2015032834A (ja) | 2015-02-16 |
JP5844439B2 true JP5844439B2 (ja) | 2016-01-20 |
Family
ID=52342062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014156811A Active JP5844439B2 (ja) | 2013-07-31 | 2014-07-31 | 電子部品実装モジュールの製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5844439B2 (ja) |
DE (1) | DE102014110301A1 (ja) |
FR (1) | FR3009476B1 (ja) |
TW (1) | TW201505137A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11251135B2 (en) | 2018-04-02 | 2022-02-15 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101670894B1 (ko) | 2015-05-27 | 2016-10-31 | (주)파트론 | 반도체 패키지의 제조 방법 |
KR101661919B1 (ko) * | 2015-06-23 | 2016-10-04 | (주)파트론 | 반도체 패키지의 제조 방법 |
US10236260B2 (en) * | 2016-06-30 | 2019-03-19 | Nxp Usa, Inc. | Shielded package with integrated antenna |
WO2018030152A1 (ja) * | 2016-08-08 | 2018-02-15 | 株式会社村田製作所 | 回路モジュールおよび回路モジュールの製造方法 |
KR102505198B1 (ko) * | 2018-04-02 | 2023-03-02 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
CN112654129B (zh) * | 2019-10-10 | 2021-11-16 | 庆鼎精密电子(淮安)有限公司 | 抗电磁干扰电路板及其制作方法 |
WO2023119884A1 (ja) * | 2021-12-24 | 2023-06-29 | 富士フイルム株式会社 | プリント基板の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4175351B2 (ja) * | 2005-08-26 | 2008-11-05 | 松下電工株式会社 | 凹凸多層回路板モジュール及びその製造方法 |
WO2012023332A1 (ja) * | 2010-08-18 | 2012-02-23 | 株式会社 村田製作所 | 電子部品及びその製造方法 |
JP2012159935A (ja) * | 2011-01-31 | 2012-08-23 | Murata Mfg Co Ltd | 電子部品モジュール、電子部品モジュールの製造方法、多機能カード |
TWI502733B (zh) * | 2012-11-02 | 2015-10-01 | 環旭電子股份有限公司 | 電子封裝模組及其製造方法 |
-
2014
- 2014-02-21 TW TW103105827A patent/TW201505137A/zh unknown
- 2014-07-22 DE DE102014110301.7A patent/DE102014110301A1/de active Pending
- 2014-07-30 FR FR1457388A patent/FR3009476B1/fr active Active
- 2014-07-31 JP JP2014156811A patent/JP5844439B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11251135B2 (en) | 2018-04-02 | 2022-02-15 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
US11430742B2 (en) | 2018-04-02 | 2022-08-30 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
DE102014110301A1 (de) | 2015-02-05 |
FR3009476B1 (fr) | 2018-02-16 |
FR3009476A1 (fr) | 2015-02-06 |
TW201505137A (zh) | 2015-02-01 |
JP2015032834A (ja) | 2015-02-16 |
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