TW201502192A - 硬化性環氧樹脂組成物 - Google Patents

硬化性環氧樹脂組成物 Download PDF

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Publication number
TW201502192A
TW201502192A TW103119195A TW103119195A TW201502192A TW 201502192 A TW201502192 A TW 201502192A TW 103119195 A TW103119195 A TW 103119195A TW 103119195 A TW103119195 A TW 103119195A TW 201502192 A TW201502192 A TW 201502192A
Authority
TW
Taiwan
Prior art keywords
resin composition
epoxy resin
curable epoxy
compound
group
Prior art date
Application number
TW103119195A
Other languages
English (en)
Chinese (zh)
Inventor
Naofumi Takabayashi
Hirose Suzuki
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of TW201502192A publication Critical patent/TW201502192A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/06—Triglycidylisocyanurates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
TW103119195A 2013-06-03 2014-06-03 硬化性環氧樹脂組成物 TW201502192A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013117060 2013-06-03

Publications (1)

Publication Number Publication Date
TW201502192A true TW201502192A (zh) 2015-01-16

Family

ID=52008156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103119195A TW201502192A (zh) 2013-06-03 2014-06-03 硬化性環氧樹脂組成物

Country Status (3)

Country Link
JP (2) JP6460985B2 (ja)
TW (1) TW201502192A (ja)
WO (1) WO2014196515A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6204420B2 (ja) 2015-08-07 2017-09-27 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
JP6657716B2 (ja) * 2015-09-29 2020-03-04 日立化成株式会社 封止用液状組成物、封止材、及び電子部品装置
JP6576991B2 (ja) * 2017-08-30 2019-09-18 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
JP7047539B2 (ja) * 2018-03-30 2022-04-05 味の素株式会社 樹脂組成物及びその硬化体
JP7322368B2 (ja) * 2018-09-14 2023-08-08 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7329320B2 (ja) * 2018-11-01 2023-08-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP7502895B2 (ja) 2020-05-20 2024-06-19 株式会社ダイセル 光半導体素子用封止材、及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3477111B2 (ja) * 1999-06-01 2003-12-10 四国化成工業株式会社 熱硬化性エポキシ樹脂組成物
JP4177013B2 (ja) * 2002-04-03 2008-11-05 ダイセル化学工業株式会社 熱硬化型エポキシ樹脂組成物の硬化方法、硬化物及びその用途
JP2006131850A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd 熱硬化性組成物
JP4810911B2 (ja) * 2005-07-26 2011-11-09 パナソニック電工株式会社 エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス
JP5298411B2 (ja) * 2006-08-14 2013-09-25 三菱化学株式会社 エポキシ樹脂組成物およびその用途
TWI464193B (zh) * 2007-03-15 2014-12-11 Nippon Steel & Sumikin Chem Co Oxetane resin composition, optical materials and optical semiconductor packaging materials
JP2008260853A (ja) * 2007-04-12 2008-10-30 Hitachi Chem Co Ltd 新規硬化性樹脂とその製造方法、及びエポキシ樹脂組成物、電子部品装置
JP2009007404A (ja) * 2007-06-26 2009-01-15 Showa Denko Kk カチオン重合性組成物および該組成物を硬化して得られる硬化物
JP2009098187A (ja) * 2007-10-12 2009-05-07 Sekisui Chem Co Ltd 光学部品用接着剤
JP2010018797A (ja) * 2008-06-11 2010-01-28 Sekisui Chem Co Ltd 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤
JP2010248387A (ja) * 2009-04-16 2010-11-04 Sekisui Chem Co Ltd 光学部材用光硬化性樹脂組成物、接着剤、及び、タッチパネル
JP5638812B2 (ja) * 2010-02-01 2014-12-10 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP2012001690A (ja) * 2010-06-21 2012-01-05 Adeka Corp 光硬化性樹脂組成物
JP2012092309A (ja) * 2010-09-29 2012-05-17 Shikoku Chem Corp エポキシ樹脂組成物
JP2012077257A (ja) * 2010-10-06 2012-04-19 Daicel Corp 硬化物の製造方法及び硬化物
JP5680668B2 (ja) * 2010-11-05 2015-03-04 株式会社日本触媒 カチオン硬化性樹脂組成物
WO2012124780A1 (ja) * 2011-03-16 2012-09-20 東レ株式会社 エポキシ樹脂組成物およびその製造方法ならびにそれを用いた半導体装置
JP2012236972A (ja) * 2011-04-25 2012-12-06 Unitika Ltd 樹脂組成物

Also Published As

Publication number Publication date
WO2014196515A1 (ja) 2014-12-11
JP6460985B2 (ja) 2019-01-30
JP2019023316A (ja) 2019-02-14
JPWO2014196515A1 (ja) 2017-02-23

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