TW201438888A - 表面處理銅箔 - Google Patents

表面處理銅箔 Download PDF

Info

Publication number
TW201438888A
TW201438888A TW103105233A TW103105233A TW201438888A TW 201438888 A TW201438888 A TW 201438888A TW 103105233 A TW103105233 A TW 103105233A TW 103105233 A TW103105233 A TW 103105233A TW 201438888 A TW201438888 A TW 201438888A
Authority
TW
Taiwan
Prior art keywords
copper foil
rust
film
adhesion
compound
Prior art date
Application number
TW103105233A
Other languages
English (en)
Chinese (zh)
Inventor
Takahiro Tsuruta
Kensaku Shinozaki
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201438888A publication Critical patent/TW201438888A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW103105233A 2013-03-28 2014-02-18 表面處理銅箔 TW201438888A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013069193 2013-03-28

Publications (1)

Publication Number Publication Date
TW201438888A true TW201438888A (zh) 2014-10-16

Family

ID=51623363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105233A TW201438888A (zh) 2013-03-28 2014-02-18 表面處理銅箔

Country Status (3)

Country Link
JP (1) JPWO2014156362A1 (ja)
TW (1) TW201438888A (ja)
WO (1) WO2014156362A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021145344A1 (ja) * 2020-01-17 2021-07-22 富士フイルム株式会社 非水電解質二次電池、集電体、及び非水電解質二次電池の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2717041B2 (ja) * 1992-04-20 1998-02-18 日鉱金属株式会社 銅および銅合金の表面処理方法
JP2796214B2 (ja) * 1992-04-28 1998-09-10 日鉱金属株式会社 銅および銅合金の変色防止処理方法
JPH0688258A (ja) * 1992-09-07 1994-03-29 Kobe Steel Ltd 銅又は銅合金材の２段防錆処理方法
JPH06279463A (ja) * 1993-03-29 1994-10-04 Japan Energy Corp 新規ベンゾトリアゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
JP3202827B2 (ja) * 1993-03-29 2001-08-27 株式会社ジャパンエナジー 新規アゾール系シラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
JPH06279464A (ja) * 1993-03-30 1994-10-04 Japan Energy Corp 新規アゾール系シラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
JPH07309846A (ja) * 1994-05-20 1995-11-28 Japan Energy Corp 新規ベンゾトリアゾールフッ素シラン誘導体及びその製造方法並びにそれを用いる表面処理剤
JPH08125330A (ja) * 1994-08-30 1996-05-17 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔
JPH1180976A (ja) * 1997-09-03 1999-03-26 Mitsubishi Gas Chem Co Inc 金属の乾燥方法
JPH11106785A (ja) * 1997-10-02 1999-04-20 Fuji Photo Film Co Ltd 平版印刷機給水ローラー用洗浄剤
JP2003301286A (ja) * 2002-04-11 2003-10-24 Hitachi Cable Ltd 銅材の圧延加工方法
KR20050006218A (ko) * 2002-05-01 2005-01-15 오츠카 가가쿠 가부시키가이샤 방청제 및 그것을 사용하는 방청방법
JP4675649B2 (ja) * 2005-03-07 2011-04-27 新日鐵化学株式会社 トリアジン誘導体及びその製造方法並びに金属表面処理剤
JP4242915B2 (ja) * 2007-06-14 2009-03-25 メック株式会社 銅表面処理剤及び表面処理方法
CN102713006A (zh) * 2009-12-25 2012-10-03 古河电气工业株式会社 铜箔及铜箔的制造方法
JP2011134651A (ja) * 2009-12-25 2011-07-07 Furukawa Electric Co Ltd:The 非水溶媒二次電池負極集電体用銅箔その製造方法及び非水溶媒二次電池負極電極の製造方法
JP2011168854A (ja) * 2010-02-19 2011-09-01 Hitachi Cable Ltd 金属部材の防錆膜形成方法
US8382270B2 (en) * 2010-06-14 2013-02-26 Xerox Corporation Contact leveling using low surface tension aqueous solutions
JP5512585B2 (ja) * 2011-03-30 2014-06-04 Ｊｘ日鉱日石金属株式会社 銅箔及びそれを用いたリチウムイオン二次電池用負極集電体及び負極材、ならびにリチウムイオン二次電池

Also Published As

Publication number Publication date
WO2014156362A1 (ja) 2014-10-02
JPWO2014156362A1 (ja) 2017-02-16

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