TW201422684A - 含二氧化矽粒子之硬化性組合物與其硬化物，及使用彼等之半導體密封材 - Google Patents

含二氧化矽粒子之硬化性組合物與其硬化物，及使用彼等之半導體密封材 Download PDF

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Publication number
TW201422684A
TW201422684A TW102137825A TW102137825A TW201422684A TW 201422684 A TW201422684 A TW 201422684A TW 102137825 A TW102137825 A TW 102137825A TW 102137825 A TW102137825 A TW 102137825A TW 201422684 A TW201422684 A TW 201422684A
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Taiwan
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group
formula
integer
compound
represented
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TW102137825A
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English (en)
Chinese (zh)
Inventor
Hiroshi Eguchi
Kazuhiro Yamanaka
Yu Matsuno
Katsuhiro Akiyama
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Central Glass Co Ltd
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Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of TW201422684A publication Critical patent/TW201422684A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/008—Additives improving gas barrier properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW102137825A 2012-10-18 2013-10-18 含二氧化矽粒子之硬化性組合物與其硬化物，及使用彼等之半導體密封材 TW201422684A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012230629 2012-10-18
JP2013210632A JP6213123B2 (ja) 2012-10-18 2013-10-08 シリカ粒子を含む硬化性組成物およびその硬化物、並びにそれを用いた半導体封止材

Publications (1)

Publication Number Publication Date
TW201422684A true TW201422684A (zh) 2014-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137825A TW201422684A (zh) 2012-10-18 2013-10-18 含二氧化矽粒子之硬化性組合物與其硬化物，及使用彼等之半導體密封材

Country Status (3)

Country Link
JP (1) JP6213123B2 (ja)
TW (1) TW201422684A (ja)
WO (1) WO2014061517A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI677536B (zh) * 2017-08-16 2019-11-21 日商旭化成股份有限公司 矽醇組成物、硬化物、接著劑、使矽醇組成物硬化之方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858027B2 (ja) * 2013-03-07 2016-02-10 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
WO2018061754A1 (ja) * 2016-09-30 2018-04-05 日産化学工業株式会社 架橋性オルガノポリシロキサン組成物、その硬化物及びｌｅｄ装置
JP7176180B2 (ja) * 2017-11-10 2022-11-22 信越化学工業株式会社 付加硬化性液状シリコーンゴム組成物
JP7053514B2 (ja) * 2019-02-07 2022-04-12 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の硬化物、及び光学素子
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11106658A (ja) * 1997-09-24 1999-04-20 Dow Corning Asia Kk 光学的に透明な水素シルセスキオキサン樹脂組成物、その製造方法及び酸化ケイ素膜
JP4826160B2 (ja) * 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
JP4935972B2 (ja) * 2005-12-21 2012-05-23 Ｊｓｒ株式会社 光半導体封止用組成物、その製造法および光半導体封止材
JPWO2007119627A1 (ja) * 2006-04-10 2009-08-27 宇部興産株式会社 硬化性組成物、シルセスキオキサン硬化物、及びこれらの製造方法
US8399592B2 (en) * 2007-04-17 2013-03-19 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
JP2009173760A (ja) * 2008-01-23 2009-08-06 Kaneka Corp 液状多面体構造ポリシロキサン系化合物および該化合物を用いた組成物と硬化物。
JP6011230B2 (ja) * 2011-10-25 2016-10-19 セントラル硝子株式会社 シロキサン系組成物およびその硬化物ならびにその用途

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI677536B (zh) * 2017-08-16 2019-11-21 日商旭化成股份有限公司 矽醇組成物、硬化物、接著劑、使矽醇組成物硬化之方法

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WO2014061517A1 (ja) 2014-04-24
JP2014098146A (ja) 2014-05-29
JP6213123B2 (ja) 2017-10-18

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