TW201420254A - 焊錫球修復裝置 - Google Patents

焊錫球修復裝置 Download PDF

Info

Publication number
TW201420254A
TW201420254A TW102130879A TW102130879A TW201420254A TW 201420254 A TW201420254 A TW 201420254A TW 102130879 A TW102130879 A TW 102130879A TW 102130879 A TW102130879 A TW 102130879A TW 201420254 A TW201420254 A TW 201420254A
Authority
TW
Taiwan
Prior art keywords
solder ball
unit
flux
head
substrate
Prior art date
Application number
TW102130879A
Other languages
English (en)
Chinese (zh)
Inventor
Jin-Won Choi
Noriaki Mukai
Ki-Ju Lee
Yon-Ho You
Seung-Wan Kim
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201420254A publication Critical patent/TW201420254A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW102130879A 2012-11-22 2013-08-28 焊錫球修復裝置 TW201420254A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120133032A KR101442350B1 (ko) 2012-11-22 2012-11-22 솔더볼 리페어 장치

Publications (1)

Publication Number Publication Date
TW201420254A true TW201420254A (zh) 2014-06-01

Family

ID=50892680

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102130879A TW201420254A (zh) 2012-11-22 2013-08-28 焊錫球修復裝置

Country Status (3)

Country Link
JP (1) JP5680723B2 (ko)
KR (1) KR101442350B1 (ko)
TW (1) TW201420254A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101708594B1 (ko) * 2016-07-05 2017-02-20 변도영 기판 결함 리페어 장치
CN111515604B (zh) * 2020-05-13 2021-10-12 瑞安市异想天开科技有限公司 一种发动机引擎盖焊接用转运翻转机器及其使用方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232824B2 (ja) * 1993-10-22 2001-11-26 ソニー株式会社 熱圧着用ツール、バンプ形成方法およびリード接合方法
JPH09314324A (ja) * 1996-05-30 1997-12-09 Sony Corp 微細球体供給装置
KR100277312B1 (ko) 1998-02-27 2001-02-01 김종배 회전틸팅식솔더볼공급장치
KR100399894B1 (ko) 2000-12-30 2003-09-29 주식회사 하이닉스반도체 플럭스 돗팅장치
JP3854859B2 (ja) * 2001-12-11 2006-12-06 日立ビアメカニクス株式会社 導電性ボール搭載装置
JP2006135014A (ja) * 2004-11-04 2006-05-25 Waida Seisakusho:Kk 半田ボール発射装置及び半田ボール搭載システム
JP4338714B2 (ja) * 2006-03-14 2009-10-07 株式会社和井田製作所 半田ボール搭載装置、半田ボール搭載方法及び半田ボール搭載システム
JP5098434B2 (ja) * 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
KR101146689B1 (ko) 2011-04-13 2012-05-22 (주) 에스에스피 솔더볼 공급장치

Also Published As

Publication number Publication date
KR101442350B1 (ko) 2014-09-17
JP2014104511A (ja) 2014-06-09
KR20140065940A (ko) 2014-05-30
JP5680723B2 (ja) 2015-03-04

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