TW201420254A - Solder ball repair apparatus - Google Patents

Abstract

The present invention relates to a solder ball repair apparatus. The solder ball repair apparatus of the present invention includes: a head transfer unit horizontally transferred along a support above a substrate; and a head unit installed under the head transfer unit to be rotated by a rotation axis and picking up a solder ball from the head transfer unit during rotation of the rotation axis to inject the solder ball in a solder ball loss position on the substrate.

Description

Solder ball repairing device

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a solder ball repair apparatus, and more particularly to a solder ball repair apparatus capable of additionally emitting a lost solder ball by rotation of a cylindrical head.

In recent years, in the manufacture of electronic products, a flip-chip type component mounting method has been mainly used as a method of mounting electronic components on a substrate. The flip chip type component mounting method forms solder bumps on a substrate and electrically connects the electronic components, for example, the integrated circuit wafers are disposed on the solder bumps.

In particular, examples of central processing units (CPUs) and graphics processing units require processing a large amount of data, rapidly increasing the use of flip chip bonding methods, rather than the conventional wire bonding method. A flip-chip connection method directly connects a substrate and an electronic component by solder bumps to improve contact resistance.

Similarly, a solder bump for directly electrically connecting an electronic component (such as a central processing unit) and a substrate may be formed by printing a solder paste or the like on a substrate through a mask, and Perform a reflow process Reflow process; a method of forming a solder bump by mounting a solder ball on a substrate, or directly applying a molten solder paste on a substrate, or by injecting a molten solder paste to an exposed space of a mask And carry out a reflow process. The solder bumps protruding from the substrate are connected to a pad to form an electrical connection, wherein the pad is formed on a lower surface of the electronic component (eg, a central processing unit).

Meanwhile, in the above method, when a solder ball is ejected to a substrate or a solder ball is mounted on a mask opening in the substrate to form a solder bump, in some cases, the solder ball is Not being ejected to the substrate. On the other hand, in a state where the solder ball is not emitted to the substrate, there is a problem in that a solder bump is formed through a reflow process, so that the substrate is manufactured in a state in which the solder bump is lost.

In order to overcome these problems, devices for automatically additionally projecting a solder ball have been developed, but such devices may be inefficient and may have difficulty in additionally emitting solder balls to the correct position.

Prior Art: U.S. Patent Application No. 6,911,388.

The present invention has been developed to overcome the above problems, and therefore, it is an object of the present invention to provide a solder ball repairing apparatus. The solder ball repairing device causes an additional shot of a solder ball to a substrate by rotating a cylindrical head so that solder balls that are not ejected or lost are ejected to the substrate, wherein both sides of the cylindrical head have A solder ball pick-up unit and a flux dotting unit.

Furthermore, another object of the present invention is to provide a solder ball repair device. The solder ball repairing device can accurately perform a special injection of a solder ball and form a flux at a position where a bump is formed by mounting a camera under a cylindrical head.

According to a first aspect of the present invention, a solder ball repairing apparatus is provided, comprising: a head transfer unit being horizontally transferred along a support, and the support portion is on a substrate And a head unit disposed under the suction head transfer unit to rotate by a rotating shaft, and during the rotation of the rotating shaft, the picking head unit picks up a solder ball from the picking head transfer unit to A solder ball is emitted from a position on the substrate where the solder ball is lost.

At this time, the suction head transfer unit may have a solder ball storage unit and a flux storage unit on both sides, and the pickup head unit may further include a rotating shaft composed of a cam shaft and a cylindrical head; a solder ball picking unit And a flux adhering unit, and the solder ball picking unit and the flux adhering unit extend to both ends of the cylindrical head; and a camera attached to the under the cylindrical head.

The suction head transfer unit may further comprise a control unit, and when the camera captures an exposed surface of a pad of the substrate, the control unit generates a stop signal; and when the camera captures the pad of the solder ball mounted on the substrate, the control unit Generate a mobile signal.

Moreover, the solder ball picking unit and the flux sticking unit are maintained in a horizontal state when the picking head transfer unit is stopped, and therefore, the extended end points of the solder ball picking unit and the flux sticking unit can be combined with the solder ball storage unit and the flux storage unit. contact. At this time, the flux adhering unit can be stored by clockwise rotation of a rotating shaft. There is a flux in the flux storage unit coated on the pad of the substrate; and the solder ball pick-up unit can fix the solder ball stored in the solder ball storage unit to the pad of the substrate by counterclockwise rotation of the rotating shaft on.

Furthermore, the solder ball picking unit may comprise a housing; a pusher driven by the elastic, and the pusher is located in the housing; a pair of elastic members, and the pair of elastic members and the push The inner end of the device is coupled; and a pair of plates are used to compress the pair of elastic members, respectively.

Moreover, the solder ball pick-up unit can inject and draw air around the pusher, wherein the pusher is disposed in the housing; and the solder ball pick-up unit provides or draws air in the housing by driving the motor, wherein the motor is disposed in the cylindrical head or The cylindrical head is externally and the housing is disposed on the cylindrical head.

At the same time, a first plate member of the pair of plate members of the solder ball pick-up unit may be in contact with a protruding portion of the cam shaft to maintain a second elastic member in contact with a second plate member in a compressed state, and A first elastic member is maintained between the first plate member and the second plate member without being compressed. At this time, the rigidity of the first elastic member is preferably higher than the rigidity of the second elastic member.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

100‧‧‧ solder ball repairing device

110‧‧‧Sucking head transfer unit

111‧‧‧ solder ball storage unit

111a‧‧‧ shot hole

112‧‧‧ Flux storage unit

112a‧‧‧Stained trough

120‧‧‧Sucking head unit

130‧‧‧Rotary axis

131‧‧‧Cylindrical head

132‧‧‧Camshaft

132a‧‧‧ protruding parts

140‧‧‧ solder ball picking unit

141‧‧‧Shell

142‧‧‧ Pusher

143‧‧‧Flexible components

143a‧‧‧First elastic member

143b‧‧‧Second elastic member

144‧‧‧paired boards

144a‧‧‧First board

144b‧‧‧second board

150‧‧‧flux adhesion unit

160‧‧‧ camera

200‧‧‧Substrate

201‧‧‧ cushion

202‧‧‧solder layer

210‧‧‧ solder balls

300‧‧‧Support

Figure 1 is a diagram showing the overall configuration of a solder ball repairing apparatus in accordance with the present invention.

2A-2C are diagrams showing the job configuration of the solder ball repairing device according to the present invention Figure.

Figure 3 is a cross-sectional view showing a solder ball repairing apparatus in accordance with the present invention.

4A-4B are cross-sectional views showing the solder ball repairing apparatus according to the present invention with a flux attached thereto.

5A-5B are cross-sectional views showing a solder ball repairing apparatus according to the present invention when a solder ball is ejected.

Fig. 6 is a cross-sectional view showing the application of the solder ball picking unit of the solder ball repairing apparatus according to the present invention.

7A-7D are diagrams showing the operational state of the solder ball picking unit of the solder ball repairing apparatus according to the present invention.

8A-8B are schematic diagrams showing the solder ball pick-up unit disposed in the pick-up head unit picking up the solder ball and the flux adhering unit adhering the flux according to an embodiment of the invention.

First, Fig. 1 is an overall configuration diagram of a solder ball repairing apparatus in accordance with the present invention.

As shown, the solder ball repairing apparatus 100 according to the present invention may include a pick-up head transfer unit 110 and a pick-up head unit 120 that are horizontally transferred over a substrate 200, wherein the pick-up head unit 120 is located at the pick-up head transfer unit. The inner portion 110 is rotatably coupled.

The suction head transfer unit 110 can be horizontally transferred along a support portion 300, and the support portion 300 is disposed above the substrate 200. At this time, a moving member, such as a track, may be provided on the support portion 300 to enable the suction head transfer unit 110 to It is enough to move to the left and right along the track of the support portion 300. A solder ball storage unit 110 and a flux storage unit 115 may be provided on both sides of the pickup transfer unit 110 to store a plurality of solder balls and fluxes, respectively.

The pickup head unit 120 rotates about a rotation axis 130, wherein the rotation shaft 130 is located in the suction head transfer unit 110, and the suction head unit may include the rotation shaft 130. A solder ball picking unit 140 and a flux adhering unit 150 extend to both sides of the rotating shaft 130, and a camera 160 is attached below the rotating shaft 130. At this time, the rotating shaft 130 may include a cylindrical head 131 and a cam shaft 132 such that the cylindrical head 131 can rotate about the cam shaft 132.

The suction head unit 120 and the suction head transfer unit 110 are integrally transmitted over the support portion 300, and the transmission through the suction head transfer unit 110 and the rotation of the suction head transfer unit 110 are simultaneously performed. At this time, the cylindrical head 130 located in the suction head unit 120 can be rotated to the left or right at an angle of 90 degrees, 180 degrees, and 360 degrees.

Furthermore, the camera 160 mounted to the pick-up head unit 120 captures an upper surface of the substrate 200 located below. At this time, the camera 160 is horizontally moved above the substrate 200 according to the movement of the pickup head unit 120, and by this horizontal movement, the camera 160 can photograph the upper surface of the substrate 200.

After a reflow process, the solder balls 210 are mounted on the upper surface of the substrate 200 at regular intervals, and constitute solder bumps corresponding to the positions, and are electrically connected to the pads of the electronic components mounted on the substrate 200, wherein The reflow process is in a state of being mounted on the upper surface of the substrate.

At the same time, a plurality of solder balls 210 may be mounted on the substrate 200 via various methods described in the prior art described above. The solder ball 210 is mainly installed by the following method, and a mask is placed on the substrate or the solder ball is emitted through an opening, wherein the opening is formed in a solder resist (SR).

Furthermore, in order to form fixed-spaced solder bumps through the reflow process after the solder balls are mounted, the solder balls should be ejected to the substrate without loss. However, in some cases, some of the solder balls may be lost during the process of injecting the solder balls, and when the substrate of the solder balls is lost through the reflow process, defects of the substrate may occur.

Therefore, for the solder ball 210 lost on the substrate 200, it is checked whether or not the solder ball is ejected, and at the same time, the solder ball is additionally ejected to the position where the solder ball is lost through the solder ball repairing apparatus 100 according to the present invention.

Similarly, with the operation configuration diagram of one of FIG. 2A-2C and the configuration diagram of FIG. 1, the operation structure of the solder ball repairing apparatus of the present invention is described below, and the solder ball repairing apparatus is used for additionally projecting solder balls. 210 to the substrate 200.

2A-2C is a job configuration diagram of the solder ball repairing apparatus in accordance with the present invention. First, the solder ball 210 is ejected onto the substrate 200, and the substrate 200 is disposed under the solder ball repairing device 100 before a reflow process. The solder ball repairing device 100 is used to check whether the solder ball 210 is lost on the substrate 200 or the solder ball 210 is defective.

At this time, the solder ball repairing apparatus 100 slides over the substrate 200 to the left and right to find the lost position of the solder ball 210, and the lost position of the solder ball 210 is inspected through the camera 160 disposed under the cylindrical head 131. Here Thereafter, when the lost position of the solder ball 210 is determined, the pick-up head transfer unit 110 moving along the support portion 300 is stopped, and the pick-up head unit 120 is rotated in the pick-up head transfer unit 110 to project the solder ball 210 to the lost position.

At the same time, the solder ball picking unit 140 and the flux adhering unit 150 on both sides of the cylindrical head 131 are provided by rotating the cylindrical head 131 of the rotating shaft 130. The pick-up head unit 120 uses the solder ball pick-up unit 140 and the flux-adhering unit 150 to additionally inject the flux and the solder balls 210 to the position where the solder balls 210 are lost, wherein the pick-up head unit 120 is disposed in the pick-up head transfer unit 110.

That is, the suction head unit 120 located in the suction head transfer unit 110 provides the cylindrical head 131. The cylindrical head 131 is rotated to the left or right to apply flux to the upper surface of the substrate 200 through the flux adhering unit 150, and the cylindrical head 131 additionally emits the solder ball 210 through the solder ball picking unit 140 to the flux which has been applied with the flux. Substrate.

Similarly, when the repair of the solder ball at the position where the solder ball 210 is lost is completed, the pick-up head transfer unit 110 is again moved in one direction, please refer to FIG. 2c to check the position of the other lost solder ball through the camera 160. The camera 160 is located in the pickup unit 120. Moreover, when the position where the solder ball is lost is found again, the suction head transfer unit 110 stops at the corresponding position, and the above-described solder ball repair process by the rotation of the suction head unit 120 is repeated. Further, when the defective solder ball is ejected onto the substrate, the defective solder ball is removed by the rotation of the suction head unit 120, and then a good solder ball is additionally injected to the position where the solder ball has been removed.

A solder ball repair method using a solder ball repairing device will be described below, together with Figures 3 through 5A-5B, to clearly illustrate the solder ball firing process.

Figure 3 is a cross-sectional view of a solder ball repairing apparatus in accordance with the present invention. 4A-4B is a cross-sectional view showing a solder ball repairing apparatus according to the present invention when a flux is adhered thereto. 5A-5B is a cross-sectional view of the solder ball repairing apparatus according to the present invention when a solder ball is ejected.

As shown in FIGS. 3 to 5A-5B, a spacer 201 is formed over the substrate 200, and a solder resist layer (SR) 202 is provided over the spacer 201 such that a central portion of the spacer 201 is exposed. The solder ball 210 is projected out of the exposed portion of the liner 201. Further, the substrate 200 from which the solder balls 210 are ejected is disposed under the solder ball repairing apparatus 100, so that the solder ball repairing apparatus 100 may find a position where the solder balls are lost on the substrate 200.

Figure 3 is a cross-sectional view showing the solder ball repairing device in a stopped state when the position of the missing solder ball on the substrate is found. As shown, the solder ball repairing apparatus 100 is capable of photographing the upper surface of the substrate 200 through the camera 160 to find the missing position of the solder ball 210, wherein the camera 160 is provided by the pick-up head unit 120, and the pick-up head unit 120 is located at the pick-up head transfer unit. Within 110.

When the camera 160 photographs that the surface of the liner 201 is exposed between the solder resist layers 202 instead of the solder balls, the pickup transfer unit 110 that moves horizontally along the support portion 300 stops at the corresponding upper position. At this point, the suction head passes The movement or stopping of the unit 110 can be performed by a control unit (not shown). When the camera 160 captures an image of the exposed surface of the pad 201, the control unit generates a stop signal; when the camera 160 captures the solder The ball, the control unit generates a mobile signal.

Meanwhile, as shown in FIG. 3, when the pickup transfer unit 110 stays above the upper surface of the substrate 200, the solder ball picking unit 140 and the flux adhering unit 150 are maintained in a horizontal state, wherein the solder ball picking unit 140 and the flux The adhering unit 150 extends to both sides of the cylindrical head 131 of the pickup head unit 120, and the camera 160 is positioned below the cylindrical head 131. At this time, the extended end points of the solder ball picking unit 140 and the flux adhering unit 150 are maintained in contact with the solder ball storage unit 111 and the flux storage unit 112, respectively, wherein the solder ball storage unit 111 and the flux storage unit 112 are Both sides of the suction head transfer unit 110 are provided.

After that, as shown in FIGS. 4A-4B, the flux adhering unit 150 can be rotated to the upper surface side of the substrate 200 by the rotation of the cylindrical head 131; and the flux is applied by the rotation of the cylindrical head 131 to The liner 201 is exposed while the liner 201 is exposed on the upper surface of the substrate 200. The extended end of the flux adhering unit 150 is connected to the flux storage unit 112 to absorb or absorb a specific amount of flux, and the extended end of the flux adhering unit 150 is rotated by the rotation of the cylindrical head 131. To the upper surface of the liner 201 of the substrate 200, the flux adhered to the extended end of the flux adhering unit 150 can be applied to the upper surface of the liner 201. At this time, the cylindrical head 131 can be rotated clockwise to enable the flux adhering unit 150 to be rotated to the upper surface of the liner 201, but to position the flux adhering unit 150 on the liner 201. The direction of rotation is not limited to sticking in a clockwise direction.

Meanwhile, after the flux is applied to the liner 201 of the substrate 200, as shown in FIGS. 5A-5B, the solder ball picking unit 140 is rotated by the rotation of the cylindrical head 131 to the upper surface side of the substrate 200, so that the solder is soldered. The ball picking unit 140 is capable of applying a solder ball 210 over the pad 201 of the substrate 200. The solder ball 210 stored in the solder ball storage unit 111 is attached to the extended end of the solder ball picking unit 140 by suction pressure, and the solder ball picking unit 140 to which the solder ball 210 is attached is rotated by the cylindrical head 131. The surface is rotated to the upper surface of the substrate 200 so that the solder ball 210 attached to the solder ball pick-up unit 140 can be ejected to the upper surface of the spacer 201. At this time, the cylindrical head 131 can be rotated counterclockwise to enable the solder ball picking unit 140 to be rotated to the upper surface of the spacer 201, however, this rotational direction need not be limited to the counterclockwise direction.

Similarly, the solder ball repairing process is performed by rotating the solder ball picking unit 140 and the flux adhering unit 150 to complete the solder ball repairing process on the substrate 200, wherein the solder ball picking unit 140 and the flux adhering unit 150 extend to Both sides of the head unit 120 are sucked, and the pickup head unit 120 is rotated by 90 degrees on the substrate 200 in the opposite direction (clockwise or counterclockwise) to additionally inject flux and solder balls. After the repair process, the solder ball repairing device 100 is horizontally moved on the substrate, as shown in FIG. 3, to check the lost position of the next solder ball through the camera 160.

Meanwhile, the structure and operational relationship of the solder ball picking unit 140 will be described, and the solder ball picking unit 140 is a constituent element of the picking head unit 120 of the solder ball repairing apparatus 100 according to the embodiment of the present invention. First of all, Figure 6 is in accordance with this A cross-sectional view of a solder ball pick-up unit of a solder ball repairing apparatus according to an embodiment of the invention is applied, and FIGS. 7A-7D are operational state diagrams of a solder ball pick-up unit of a solder ball repairing apparatus according to an embodiment of the present invention.

As shown, the solder ball picking unit 140 according to an embodiment of the present invention is utilized in the picking head unit 120 of the solder ball repairing apparatus 100, wherein the solder ball picking unit 140 may include a housing 141; The 142 is located in the housing 141; a pair of elastic members 143, and the pair of elastic members are coupled to the inner ends of the pushers 142; and a pair of plates 144 for compressing the pair of elastic members 143 .

Here, the elastic member 143 may be repeatedly compressed and released (stretched) via a cam shaft 132, and the cam shaft 132 is in contact with the first plate member 144a of the pair of plates 144 located in the housing 141.

Further, in the solder ball picking unit 140, air is injected or drawn into the pusher 142, and the pusher 142 is located in the housing 141. Also, a motor (not shown) may be disposed within the cylindrical head 131 or outside the cylindrical head 131 to provide air or to draw air within the housing 141, and the housing 141 is disposed to the solder ball picking unit 140.

Then, the solder ball picking unit 140 rotates along the cylindrical head 131 to repeatedly supply and suck air in the housing 141, so that the picking up and ejecting of the solder balls 210 on the substrate can be performed, wherein the cylindrical head 131 and the cam shaft 132 joints.

More specifically, as shown in FIGS. 7A to 7C, the solder ball picking unit 140 of the pickup head unit 120 can be rotated in a horizontal state (Fig. 7A). Turn (Fig. 7B) to pick up the solder balls from the solder ball storage unit and move to a vertical state (Fig. 7c) to mount the picked solder balls on the substrate pads.

In the horizontal state of the solder ball picking unit 140 shown in FIG. 7A, a first plate member 144a located in the housing 141 is in contact with the outer peripheral surface of the cam shaft 132, and the air sucked outside the pusher 142 is disposed in the air. The second plate member 144b between the elastic members 143 is engaged such that the inside of the housing 141 is maintained in a vacuum state. Therefore, the solder ball 210 can be picked up by the end of the solder ball picking unit 140.

At this time, the solder ball 210 of the solder ball pick-up unit 140 picks up the solder balls stored in the solder ball storage unit 111 by the suction of air, and the solder ball storage unit 111 is in the pick-up head transfer unit 110.

Further, in the rotated state of the solder ball picking unit 140 shown in FIG. 4B, when the first plate member 144a is in contact with the surface around the outside of the cam shaft 132, the first plate member 144a is rotated in the clockwise direction, and the first plate The piece 144a is located within the solder ball picking unit 140. In the vertical state of the solder ball pick-up unit 140 shown in FIG. 7C, the first plate member 144a located in the solder ball pick-up unit 140 is in contact with the convex portion 132a of the cam shaft 132, so that the elastic member 143 can be elastically moved; By the movement of the elastic member 143, the pusher 142 is engaged with the second plate member 144b that is ejected to the front of the solder ball picking unit 140, so that the solder ball 210 can be mounted to the exposed position of the pad 201 of the substrate 200.

At this time, when air is injected into the pusher 142 located in the casing 141, the solder balls 210 attached to the end of the casing 141 can be easily separated.

Meanwhile, the 7D figure is for explaining the difference in height when the substrate 200 occurs. At the time, the compression relationship of the elastic member 143 is as shown in Fig. 7C, and the height difference of the solder ball picking unit 140 in the vertical state.

When the solder ball pick-up unit 140 shown in FIGS. 7C and 7D is in a vertical state, when the solder ball 210 is mounted on the pad 201 of the substrate 200, a second elastic member 143b is maintained in a compressed state and a second state. The plate member 144b is in contact, and maintains a first elastic member 143a interposed between the first plate member 144a and the second plate member 144b in a state of being not compressed, that is, in a released state.

In any event, when the mounting height difference of the substrate 200 occurs as shown in FIG. 7d, that is, when the distance between the solder ball picking unit 140 and the upper surface of the substrate 200 is smaller than the design, the solder ball 210 may be mounted. A shock occurs at the end of the pusher 142 at the pad 201 of the substrate 200, wherein the end of the pusher 142 grasps the solder ball 210, and this shock applied to the end of the pusher 142 can be compressed by the first elastic member 143a. Absorbed.

At this time, when the distance between the solder ball picking unit 140 and the substrate 200 is maintained at a typical design position as shown in FIG. 7C, only the second elastic member 143b is elastically driven, and the first elastic member 143a does not occur. deformation. When the distance between the solder ball picking device 140 and the substrate 200 is shortened to the design position, the first elastic member 143a other than the second elastic member 143b is deformed to occur at the time of a shock. The amount of shock applied to the pusher 142 is absorbed by the first resilient member 143a to avoid bending or damage to the pusher 142.

Therefore, by adding the first elastic member 143a of the pair of elastic members The rigidity of the first elastic member 143a is greater than the rigidity of the second elastic member 143b, so that the final amount of vibration applied to the pusher can be absorbed by the first elastic member 143a, wherein the pair of elastic members are located in the solder ball picking Within unit 140.

Meanwhile, FIGS. 8A-8B are schematic views showing that the solder ball pick-up unit provided in the pick-up head unit picks up the solder ball and the flux adhering unit adheres the flux according to an embodiment of the present invention. As shown, through the solder ball storage unit 111 and the flux storage unit 112, the solder ball picking unit 140 and the flux adhering unit 150 can provide a solder ball and a flux, wherein the solder ball storage unit 111 and the flux storage unit 112 It is provided on both sides of the suction head transfer unit 110, and is in a state of being horizontally engaged with the cylindrical head.

First, the solder ball picking unit 140 having the solder balls is supplied through the solder ball storage unit 111. The solder ball storage unit 111 may be provided below one side of the pickup transfer unit 110, and an ejection hole 111a for emitting the solder ball may be formed on the inner surface of the solder ball storage unit 111. The plurality of solder balls 210 may be stored in the solder ball storage unit 111, and the solder balls 210 may be ejected one by one through the exit holes 111a. At this time, at least one of the lower surface, the both side surfaces, and an upper surface of the solder ball storage unit 111 is formed into a porous surface having a plurality of air inlet holes, and the porous surface is passed through to make the plurality of solder balls It moves floatingly and is emitted through the injection hole 111a. Further, the solder ball pick-up unit 140 picks up the solder ball that is ejected through the exit hole 111a by vacuum pressure, wherein the vacuum pressure is generated in front of the solder ball pick-up unit 140 because the vacuum state inside the casing 141 is maintained.

Meanwhile, the flux storage unit 112 may be provided under the other side of the suction head transfer unit 110; and the end of the flux adhering unit 150 passes through a dotting groove 112a, the adhesion groove 112a may be It is formed on the inner surface of the flux storage unit 112. The paste flux can be stored in the flux storage unit 112, and the flux can be exposed through the adhesion groove 112a. At this time, the adhesion groove 112a of the flux storage unit 112 may be formed as a part of the porous groove or may be made of a liquid absorbing material such as a sponge, so that a characteristic amount of the flux can exist on the surface of the adhesion groove 112a. And when the end of the flux adhering unit 150 is rotated to pass through the sinking groove 112a, a certain amount of flux may adhere to the end of the flux adhering unit 150, so that the flux can be applied to the pad 201 of the substrate 200. Upper surface.

At this time, the solder ball ejection structure of the solder ball storage unit 111 and the flux ejection structure of the flux storage unit 112 are shown as an example in the figure, and the embodiment of the solder ball picking unit 140 and the flux adhering unit 150 are changed. The injection structure can be changed without being limited thereto.

As described above, in order to form a solder bump on the substrate to emit the solder ball, the solder ball repairing apparatus according to the present invention can easily additionally project the solder ball to the substrate on which the solder ball is lost. Therefore, the present invention can prevent the solder from being unfilled. Substrate defects caused by the ball.

Furthermore, since the solder ball repairing device of the present invention moves in one direction, it searches for a solder ball whose substrate has not been filled, and continuously applies flux and fills the solder ball by the rotation of the pick-up head unit, wherein the pick-up head unit Is rotating in the suction head transfer unit, so the present invention may reduce the repair of the solder ball between.

And, since the solder ball repairing apparatus of the present invention can absorb the external shock applied to the pusher by mounting the pair of plates and the elastic member in the solder ball picking unit, the external shock is from the solder ball engaged with the end of the pusher. Therefore, the present invention may prevent damage or bending of the pusher.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧ solder ball repairing device

110‧‧‧Sucking head transfer unit

111‧‧‧ solder ball storage unit

112‧‧‧ Flux storage unit

120‧‧‧Sucking head unit

130‧‧‧Rotary axis

131‧‧‧Cylindrical head

132‧‧‧Camshaft

140‧‧‧ solder ball picking unit

150‧‧‧flux adhesion unit

160‧‧‧ camera

200‧‧‧Substrate

210‧‧‧ solder balls

300‧‧‧Support

Claims (17)

A solder ball repairing device comprising: a suction head transfer unit horizontally transferred along a support portion, wherein the support portion is attached to a substrate; and a suction head unit disposed under the suction head transfer unit Rotating by a rotating shaft, and during the rotation of the rotating shaft, the pick-up head unit picks up a solder ball from the pick-up head transfer unit to eject the solder ball to a position on the substrate where the solder ball is lost. The solder ball repairing device of claim 1, wherein the suction head transfer unit has a solder ball storage unit and a flux storage unit on both sides. The solder ball repairing device of claim 2, wherein the suction head unit comprises: a rotating shaft composed of a cam shaft and a cylindrical head; and a solder ball picking unit and a flux adhering unit, The solder ball picking unit and the flux adhering unit extend to both ends of the cylindrical head; and a camera mounted to the cylindrical head to photograph the upper surface of the substrate. The solder ball repairing device of claim 3, wherein the cylindrical head rotates about the cam shaft to the right or left at 90 degrees, 180 degrees or 360 degrees. The solder ball repairing device of claim 3, wherein the picking head transfer unit further comprises a control unit, wherein the control unit generates a stop when the camera captures an exposed surface of a pad of the substrate Signal; when the camera The pad is mounted on the substrate, and the control unit generates a movement signal. The solder ball repairing device according to claim 3, wherein the solder ball picking unit and the flux adhering unit maintain a horizontal state when the picking head transfer unit is stopped, and the solder ball picking unit and the assisting An extended end of the flux adhering unit is in contact with the solder ball storage unit and the flux storage unit. The solder ball repairing device of claim 5, wherein the flux adhering unit applies the flux to the spacer of the substrate by a clockwise rotation of a rotating shaft, wherein the flux is Stored in the flux storage unit. The solder ball repairing device of claim 5, wherein the solder ball picking unit mounts the solder ball on the pad of the substrate by counterclockwise rotation of the rotating shaft, wherein the solder ball is stored in The solder ball storage unit. The solder ball repairing device of claim 3, wherein the solder ball picking unit comprises: a housing; and a pusher that is elastically driven and the pusher is located in the housing; And a pair of elastic members coupled to the inner ends of the pusher; and a pair of plates for compressing the pair of elastic members, respectively. The solder ball repairing device of claim 9, wherein the solder ball picking unit injects and draws air around the pusher, wherein the pushing The solder ball pick-up unit is configured to drive air to the housing or to suck air in the housing by driving a motor disposed in the cylinder head or outside the cylinder head, and the housing is disposed on the housing On the cylinder head. The solder ball repairing device of claim 9, wherein a first plate member of the pair of plate members of the solder ball picking unit is in contact with a protruding portion of the cam shaft to maintain a second elasticity The member is in contact with a second plate member in a compressed state, and maintains a first elastic member interposed between the first plate member and the second plate member without being compressed. The solder ball repairing device of claim 11, wherein the first elastic member has a higher rigidity than the second elastic member. The solder ball repairing device of claim 2, wherein the solder ball storage unit is provided below a side of the suction head transfer unit, and the solder ball storage unit has an exit hole on an inner surface to emit The solder ball. The solder ball repairing device of claim 13, wherein at least one of the lower surface and the two side surfaces or an upper surface of the solder ball storage unit is a porous surface having a plurality of air inlet holes. The solder ball repairing device of claim 3, wherein the flux storage unit is provided under one other side of the suction head transfer unit, and the flux storage unit has an attached surface on the inner surface. a groove through which the end of the flux adhering unit passes. The solder ball repairing device of claim 15, wherein the dipping groove is formed in the form of a porous groove or is made of a liquid absorbing material. The solder ball repairing device of claim 3, wherein the pick-up head unit is disposed under the pick-up head transfer unit, and the camera disposed in the pick-up head unit is directly disposed on the cylinder Below the head.