TWI357381B - - Google Patents

Download PDF

Info

Publication number
TWI357381B
TWI357381B TW096146997A TW96146997A TWI357381B TW I357381 B TWI357381 B TW I357381B TW 096146997 A TW096146997 A TW 096146997A TW 96146997 A TW96146997 A TW 96146997A TW I357381 B TWI357381 B TW I357381B
Authority
TW
Taiwan
Prior art keywords
substrate
printing
screen
solder ball
mask
Prior art date
Application number
TW096146997A
Other languages
English (en)
Chinese (zh)
Other versions
TW200900246A (en
Inventor
Noriaki Mukai
Makoto Honma
Isao Abe
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200900246A publication Critical patent/TW200900246A/zh
Application granted granted Critical
Publication of TWI357381B publication Critical patent/TWI357381B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
  • Screen Printers (AREA)
TW096146997A 2006-12-15 2007-12-10 Screen printing device and bump forming method TW200900246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006337720A JP5018062B2 (ja) 2006-12-15 2006-12-15 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
TW200900246A TW200900246A (en) 2009-01-01
TWI357381B true TWI357381B (ko) 2012-02-01

Family

ID=39567121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096146997A TW200900246A (en) 2006-12-15 2007-12-10 Screen printing device and bump forming method

Country Status (4)

Country Link
JP (1) JP5018062B2 (ko)
KR (1) KR100941275B1 (ko)
CN (1) CN100524677C (ko)
TW (1) TW200900246A (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098434B2 (ja) * 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP5141521B2 (ja) * 2008-12-03 2013-02-13 株式会社日立プラントテクノロジー ハンダボール印刷機
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法
KR20100122643A (ko) 2009-05-13 2010-11-23 삼성전기주식회사 범프 인쇄장치
GB0919580D0 (en) 2009-11-09 2009-12-23 Dtg Int Gmbh Screen printing
JP5519729B2 (ja) * 2011-11-22 2014-06-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 印刷装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
CN103531559A (zh) * 2013-10-18 2014-01-22 上海纪元微科电子有限公司 倒装芯片键合结构及其形成方法
JP6003872B2 (ja) * 2013-11-22 2016-10-05 トヨタ自動車株式会社 ロータリースクリーン版及び二次電池の製造方法
JP6424334B2 (ja) * 2014-12-01 2018-11-21 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び部品実装ライン
CN105856817B (zh) * 2016-04-07 2018-12-28 益阳市富晖制衣有限公司 一种丝网印花机
JP2019196511A (ja) * 2018-05-08 2019-11-14 住友重機械工業株式会社 板処理装置及び板処理方法
TWI706866B (zh) * 2019-11-25 2020-10-11 倉和股份有限公司 具有震動結構的印刷網版系統及印刷方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180591B2 (ja) * 1994-12-02 2001-06-25 松下電器産業株式会社 半田ボールの搭載装置
JP3123370B2 (ja) * 1994-12-02 2001-01-09 松下電器産業株式会社 半田ボールの搭載装置
JP3648660B2 (ja) * 1997-05-23 2005-05-18 澁谷工業株式会社 半田ボールマウント装置
JP3779490B2 (ja) * 1998-05-29 2006-05-31 株式会社ルネサステクノロジ バンプ形成方法
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP3822834B2 (ja) * 2002-04-12 2006-09-20 新日本製鐵株式会社 リペア方法及び装置
TWI273666B (en) * 2004-06-30 2007-02-11 Athlete Fa Corp Method and device for mounting conductive ball
JP2006066413A (ja) * 2004-08-24 2006-03-09 Hitachi Metals Ltd 導電性ボールの搭載方法及び搭載装置並びにバンプ形成方法及びバンプ形成装置
KR20060133282A (ko) * 2005-06-20 2006-12-26 삼성테크윈 주식회사 기체흐름을 이용한 솔더 볼 범프 형성방법 및 형성장치
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法
JP5076922B2 (ja) * 2008-01-25 2012-11-21 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP4983737B2 (ja) * 2008-06-30 2012-07-25 株式会社日立プラントテクノロジー ハンダボール検査リペア装置およびハンダボール検査リペア方法
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置

Also Published As

Publication number Publication date
TW200900246A (en) 2009-01-01
JP2008153319A (ja) 2008-07-03
CN101207052A (zh) 2008-06-25
JP5018062B2 (ja) 2012-09-05
KR100941275B1 (ko) 2010-02-11
KR20080055715A (ko) 2008-06-19
CN100524677C (zh) 2009-08-05

Similar Documents

Publication Publication Date Title
TWI357381B (ko)
TWI293272B (en) Screen printing machine and printing method thereof
TWI480965B (zh) Solder ball inspection repair device and solder ball detection repair method
JP4744689B2 (ja) 粘性流体転写装置及び電子部品実装装置
TWI378750B (ko)
CN101045360B (zh) 丝网印刷装置
TWI351905B (ko)
JP4560682B2 (ja) 導電性ボール搭載装置
TWI573217B (zh) A substrate processing apparatus, a substrate processing system, and a substrate processing method
JP2009071109A (ja) 導電性ボールの搭載方法及び導電性ボール搭載装置
JPH0555748A (ja) 導電性ペースト充填装置
JP4560683B2 (ja) 導電性ボール配列装置
JP2010225968A (ja) 電子部品実装装置
JP2010129866A (ja) 導電性ボール搭載装置
TW201029080A (en) Solder ball printer
JP4252720B2 (ja) 電子部品実装方法
JP2003282640A (ja) 電子部品搭載装置および電子部品搭載方法
JP7399414B2 (ja) ボール搭載方法およびボール搭載装置
JP7489140B2 (ja) 検査・リペア装置
JP7072919B2 (ja) 基板処理装置
JP2022103230A (ja) 検査・リペア装置
JP2019192944A (ja) 基板処理装置
JP2003282639A (ja) 電子部品搭載装置および電子部品搭載方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees