TW201330162A - Apparatus for manufacturing organic el device, and apparatus for forming film - Google Patents

Abstract

PURPOSE: An apparatus for manufacturing organic EL device and an apparatus for forming a film are provided to implement an organic EL device having a cluster structure and short length. CONSTITUTION: In an apparatus for manufacturing organic EL device and an apparatus for forming a film, a vacuum chamber comprises a processing unit depositing a material on a substrate(6). A transfer chamber loads and unloads a substrate. A transfer chamber transfers the substrate between the transfer chamber and the processing unit. The processing unit is installed in one vacuum chamber or a plurality of vacuum chamber. At least two processing units are adjacent to each other on one side of the transfer unit. The processing unit includes a substrate controller rotating the substrate to face with a shadow mask.

Description

Manufacturing device and angle correcting mechanism of organic electroluminescent device

The present invention relates to a manufacturing apparatus and an angle correcting mechanism for an organic electroluminescence device, and more particularly to a manufacturing apparatus for an organic electroluminescence device that is suitable for transporting a large substrate, and is suitable for manufacturing an organic electroluminescence device by a vapor deposition method, and an angle correction mechanism for correcting the posture of the substrate.

As a display device, an organic electroluminescence device is attracting attention, and as a powerful method for manufacturing it, there is a vacuum evaporation method. For fabricating an organic electroluminescent device, not only a layer of luminescent material (electroluminescent layer) but also an electrode sandwiching structure is formed above the anode, in order to form a hole implant layer or a transport layer above the cathode. In order to form a multilayer structure in which a material such as an electron-implanting layer or a transport layer is formed as a thin film, the manufacturing apparatus of the organic electroluminescent device is constructed by a group having a plurality of processing chambers and a plurality of connections. As such a prior art, there is a constitution as follows.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-027213

However, in the conventional group structure, each processing unit is arranged in a radial shape, and the processing units between the groups are arranged at intervals without interference, and it is necessary to lengthen the distance between the groups, and it is necessary to The whole line has a long-term problem. In particular, the substrate size recently used in the display device is also 1500 mm × 1850 mm, and the line length is further lengthened. Further, the radial arrangement is ineffective in generating space between the group and the processing unit.

However, the group of the present invention refers to a configuration in which a plurality of substrate processing units and substrate carrying-in portions are provided on at least one side of the direction in which the substrate is transported.

Accordingly, a first object of the present invention is to provide a manufacturing apparatus or a manufacturing method, or a film forming apparatus or a film forming method, which has a group structure and can shorten a line length of an organic electroluminescence device.

Further, a second object of the present invention is to provide a manufacturing apparatus or the same manufacturing method, or a film forming apparatus or a film forming method, which has a group structure, a space efficiency, and an organic electroluminescence device.

The present invention has at least the following features in order to achieve the above object.

The present invention has an inlet for transporting the substrate via the first comb-shaped shank, a transport port for transporting the substrate via the second comb-shaped shank, and a plurality of support columns for supporting the substrate, and fixing a plurality of the support columns, a support column rotating table that supports the rotation of the substrate, and a rotary driving means for rotating the support column rotating table in a plane parallel to the substrate, and avoiding the plurality of support columns, and The first comb The angle correcting means of the means for avoiding interference between the toothed shank and at least one of the second comb-shaped shanks is the first feature.

Further, the above-described avoidance means may be such that the plurality of support columns are arranged in a matrix without interfering with at least one of the first comb-shaped shank and the second comb-shaped shank.

Further, the above-described avoidance means includes: a vertical driving means for vertically positioning the support column rotating table on which the substrate is placed, and a plurality of convex portions provided in parallel with the upper portion of the support column rotating table, and having a plurality of convex portions between the convex portions The comb-shaped shank of the first and the second comb-shaped shank may be inserted, and a plurality of substrate mounting stages for supporting the movable groove may be provided.

Further, in order to achieve the above object, the present invention has a vacuum processing chamber provided with a processing portion for vapor-depositing a vapor deposition material on a substrate, and an angle correction mechanism having the first feature for carrying in or out the substrate. The teaching apparatus of the organic electroluminescent device of the teaching room and the conveying means for transporting the substrate between the receiving chamber and the processing unit and the vacuum processing chamber is the second feature.

Furthermore, the present invention has a vacuum processing chamber having a processing portion for vapor-depositing a vapor deposition material on a substrate, and a receiving chamber for transporting or transporting the substrate, and transporting the substrate in the receiving room. a group of vacuum processing chambers for transporting means between the processing unit and the receiving chamber; and a transport load chamber that carries the substrate into the load chamber and transports the load from the substrate, and is configured Transportation of the transport system carrying the aforementioned substrate to and from the load chamber from the aforementioned loading into the load chamber In the portion, the manufacturing apparatus of the organic electroluminescence device having the angle correction mechanism of the first feature is the third feature.

According to the present invention, it is possible to provide a manufacturing apparatus or a manufacturing method having a group structure, an organic electroluminescence device capable of shortening the line length, or a film forming apparatus or a film forming method.

Further, according to the present invention, it is possible to provide a manufacturing apparatus or a manufacturing method, or a film forming apparatus or a film forming method, which has a group structure, a space efficiency, and an organic electroluminescence device.

1‧‧‧Processing room

1bu‧‧‧vacuum evaporation chamber

2‧‧‧Transportation room

3‧‧‧Load group

4‧‧‧Receiving room

4H‧‧‧ Angle Correction Mechanism

4D‧‧‧The reception desk of the reception room

4P‧‧‧Substitute support pins

5‧‧‧Transporting robotic arm

6‧‧‧Substrate

7‧‧‧Decanting Department

8‧‧‧Adjustment Department

9‧‧‧Handling Department

10‧‧‧ gate valve

11‧‧‧ Spacer

31‧‧‧Load room

81‧‧‧ mask

71‧‧‧vapor deposition source

100‧‧‧Manufacturing device for organic electroluminescent device

A~D‧‧‧ group

Fig. 1 is a view showing a manufacturing apparatus of an organic electroluminescence device according to an embodiment of the present invention.

Fig. 2 is a view showing an outline of a configuration of a transport chamber 2 and a processing chamber 1 according to an embodiment of the present invention.

Fig. 3 is a schematic view and an operation explanatory view showing a configuration of a transport chamber and a processing chamber according to an embodiment of the present invention.

Fig. 4 is a view for explaining the necessity of the angle correcting mechanism.

Fig. 5 is a view showing a first embodiment of the angle correction mechanism according to the first embodiment of the present invention.

Fig. 6 is a view showing a second embodiment of the angle correction mechanism according to the first embodiment of the present invention.

Figure 7 is a view showing the processing of the processing chamber 1 according to the first embodiment of the present invention. Diagram of the process.

Figure 8 is a view showing an example of a mask.

Fig. 9 is a view for explaining an embodiment of (3) of the present invention.

The first embodiment of the invention will be described with reference to Figs. 1 to 7 . The manufacturing device of the organic electroluminescence device not only forms a layer of luminescent material (electroluminescence layer), but also has a structure of electrode clamping, and above the anode, a hole implantation layer or a transport layer is formed above the cathode. Various materials forming an electron inlay layer or a transport layer are used as a multilayer structure formed of a film, and a substrate is cleaned. Fig. 1 is a view showing an example of a manufacturing apparatus.

In the manufacturing apparatus 100 of the organic electroluminescence device of the present embodiment, the group of the substrate 6 is processed by the load group 3 of the substrate 6 (hereinafter referred to as a substrate) to be processed. ~D), consisting of 2 groups or groups and load group 3, or 5 sets of receiving rooms 4 between the next project (sealing project). At the rear of the next process, at least the unloading chamber (not shown) of the load chamber 31 to be described later is provided in order to carry out the substrate.

The load group 3 is formed by a load chamber 31 having a gate valve 10 for maintaining a vacuum before and after, and a transfer robot 3R that receives the substrate 6 from the load chamber 31 and rotates the substrate 6 into the reception chamber 4a. Each of the load chambers 31 and the receiving chambers 4 has a gate valve 10 in front and rear, and controls the gate valve 10 to maintain a vacuum, and the substrate is received in the load group 3 or the next group.

The manufacturing apparatus 100 of the organic electroluminescence device is not a radial shape, but a group having a rectangular or square shape is arranged in series with respect to the transport direction indicated by the arrow in FIG. 1 . Each group (A to D) has a transport chamber 2 having one transport robot arm 5, and a substrate that receives the substrate from the transport robot 5, and is disposed on the upper and lower processing chambers 1 on a plane for performing specific processing. (The first added words a to d are display groups, the second added words u, and d are displayed on the lower side. The following words are added to the English word, the lower case is displayed, and the upper case is displayed.) Each of the processing chambers has two processing units arranged in parallel with respect to the transport direction indicated by the arrow. For example, as will be described later, the processing units 1buL and 1buR are provided in the processing chamber 1bu of the vacuum deposition chamber. The same is true in other processing rooms. In Fig. 1, since the symbols are complicated, only the word L (left side) and R (right side) are added to the processing chambers 1bu and 1cu. A gate valve 10 is provided in each of the processing chambers 2 and the processing chamber 1 .

FIG. 2 is a view showing the outline of the configuration of the transport chamber 2 and the processing chamber 1. The configuration of the processing chamber 1 differs depending on the processing contents, but a vacuum vapor deposition chamber 1bu in which an electroluminescent layer is formed by vacuum evaporation of the luminescent material is exemplified. Fig. 3 is a schematic view and an operation explanatory view showing a configuration of a transport chamber 2b and a vacuum vapor deposition chamber 1bu. In the transport robot arm 5 of Fig. 2, the whole body can be moved up and down (see arrow 53 in Fig. 3), and the crossbar 51 can be rotated to the left and right link structures, and the front end is supported by two substrates in the upper and lower sections. A comb-like handle 52 is used. When the upper and lower stages are used, the upper system is used for the transport, and the lower system is used for the transport, and the operator can be transported to and from the processor at the same time. Processing content as two handles or as one handle And decided. In the following description, in order to simplify the description, one handle will be described.

On the other hand, the vacuum vapor deposition chamber 1bu is substantially formed by evaporating the luminescent material, vapor-deposited on the vapor deposition portion 7 of the substrate 6, and the adjustment portion 8 which is required to be vapor-deposited on the substrate 6, and the transfer robot 5 and the substrate. The substrate 6 is moved to the processing and receiving unit 9 of the vapor deposition unit 7. The adjustment unit 8 and the process receiving unit 9 are provided with 8L and 9L located in the left processing unit and 8R and 9R located in the right processing unit. The processing and receiving unit 9 has a comb-shaped handle portion 91 that can receive the substrate 6 without interfering with the comb-shaped handle portion 52 of the transport robot arm 5, and has a means 94 for fixing the substrate 6, and the comb-shaped handle portion 91 The substrate surface control means 92 is rotated so that the substrate 6 is erected and moved to the adjustment portion 8 or the vapor deposition portion 7 to face it. As means for the above fixing, it is considered to be a case of vacuum, and a means of electromagnetic adsorption or clamping is used.

The adjustment unit 8 has a mask 81M as shown in FIG. 8, a mask 81 formed by the frame 81F, and an adjustment drive shown in FIG. 2 for adjusting the position of the substrate 6 and the mask 81 via the positioning marks 84 on the substrate. Section 83.

The vapor deposition unit 7 has a left and right drive base 74 that moves the evaporation source 71 along the rail 76 in the up-and-down direction up/down driving means 72 and the evaporation source 71 to move between the left and right adjustment sections along the rail 75. The evaporation source 71 is a luminescent material having a vapor deposition material therein, and when the vapor deposition material (not shown) is controlled by heating, a stable evaporation rate is obtained, and as shown in the diagram of FIG. 3, it is arranged in a line shape. The plurality of injection nozzles 73 are configured to be sprayed. If necessary, it is stabilized vapor deposition, and the additive is simultaneously heated and evaporated.

In the above embodiment, the transport robot 5 is configured to simplify the mechanism having a vacuum as much as possible, to move the entire body up and down, and to rotate the base portion, and to expand and contract the comb-shaped handle portion 52 into a radial shape. 3 degrees of freedom are constructed. Therefore, as shown in FIG. 4, the substrate 6 is transported in parallel to the receiving room 4b as indicated by a broken line, and when the transport robot 5b transports the substrate 6 directly to the processing and receiving unit 9buL, the substrate 6 is processed. The receiving unit 9buL is provided with a state of a certain angle α L obliquely. In order to cope with this, it is necessary to (1) as shown by the solid line in FIG. 4, the rectangular substrate 6 is overlapped in parallel with respect to the processing and receiving portion 1buL, and the aforementioned α L is corrected by the transport system, or (2) Increase the degree of freedom of transporting the robot arm 5, or (3) correct it in the vapor deposition section.

First, the present embodiment of (1) will be described. Therefore, in the above description of the embodiment, the transport system is constituted by the load chamber 31 of the load group 3, the transport robot 5R, the reception room 4, the transport robot 5 of the transport chamber 2, and the processing chamber 1. The receiving section 9 is processed. At least one of the corrections needs to be made. However, it is preferable that the vacuum chamber is as simple as possible, and it is preferable to perform correction in the load chamber 31 or the reception room 4. The configuration of the load chamber 31 or the reception chamber 4 is substantially the same, and the reception chamber 4 is taken as an example.

Fig. 5 is a view showing the angle correcting mechanism of the receiving room 4 as a first embodiment of the angle correcting means. Fig. 5(a) is a plan view from above when the comb-shaped handle 52 of the transport robot 5 is inserted into the reception room 4, and Fig. 5(b) is a side view showing the reception room 4.

The receiving room 4 has a gate valve that is disposed at the exit of the substrate disposed on both sides 10I, 10E, and a mounting table 4D having a plurality of support pins 4P, and an angle correcting mechanism 4H, wherein the angle correcting mechanism 4H is supported by the mounting table support portion 4S of the mounting table 4D, and the mounting table supporting portion 4S is left and right The rotary rotary drive motor 4KM and the magnetic seal 3J of the seal stage support portion 4S are formed.

In such a mechanism, as shown by the broken line in FIG. 5(a), the transport robot arm 5a of the group A is placed on the mounting table 4D in the non-rotating state, and placed in a state parallel to the mounting table. Thereafter, the transport robot arm 5b is transported by being superimposed on the processing and receiving unit 1buL shown in FIG. In this case, as described above, the processing and receiving unit 9buL may be transported from the transport robot arm 5b so that the rotation of the substrate 6 by α L degrees is right.

When the operation flow is seen, first, the gate valve 10I is opened in the closed state of the gate valve 10E, and the substrate is transported from the opening portion 10IK of the gate valve via the comb-shaped shank portion 52a of the transport robot arm 5a, and placed on the mounting table 4D. After the comb-shaped shank portion 52a is withdrawn, the valve body 10IB is closed, and the mounting table 4D is rotated by α to the right by the angle correction mechanism 4H. Thereafter, the gate valve 10E is opened, the comb-shaped shank portion 52b of the transport robot arm 5b is inserted from the opening portion 10EK, and the substrate 6 is lifted up and transported. The transport robot arm 5a rotates the base thereof in the direction of the process receiving portion 1buL, and adjusts the length of the link while placing the substrate 6 on the process receiving portion 9buL.

In the above description, the case where the substrate 6 is carried in the parallel state to the receiving chamber 4 and is placed on the mounting table 4D will be described. However, the case where the substrate 6 has the angle β is provided for the comb-shaped handle of the substrate 6. In terms of 52b The angle is α L. Control the angle of the stage 4D.

In the present embodiment, after the angle correction is performed, the mounting table 4D can be inserted between the mounting table 4D and the substrate 6 without interfering with the support pin 4P, and the thickness of the support pin 4P can be determined. The number and width of the combs of the spacer and the comb-shaped handle 52 are equal to each other. In Fig. 5(a), the state of the substrate 6 after the angle correction and the support pin 4P at this time are displayed in a solid line, and the broken line indicates the state before the angle correction.

Fig. 6 is a view showing a second embodiment of the angle correcting mechanism in the receiving room 4.

In the first embodiment, the conveyance range of the transport robot 5b, that is, the carry-in angle α L or the like is restricted via the size of the aforementioned support pin. As will be described later, the configuration of each group is the same, and when the size of the substrate to be transported is constant, the angle α L or the like can be made constant. In this case, the first embodiment is that the mechanism is simple and superior. However, in the case where this is not the case, in the first embodiment, how many restrictions occur. Therefore, the angle correcting mechanism 4H of the second embodiment has a mechanism that rotates only the substrate 6 without rotating the mounting table 4D. As a result, the shape of the transport path of the transport robot 5b is constant, and it can be adjusted to any angle, and the width of the comb handle 52b can be reduced, and the corresponding substrate size can be enlarged.

In Fig. 6, the angle correcting mechanism is a support pin 4P, and a support pin rotating table 4KD for fixing the support pin, and the support pin rotating table 4KD is rotated by the rotary table support portion 4SJ to the right and left rotary drive motor 4KM. And make it move up and down the upper drive motor 4JM. However, the 4V system is used for sealing the upper and lower movements of the rotary table support 4SJ. Bellows. On the other hand, the mounting table 4D is fixed, and its cross section has a convex portion 4DT of the support substrate 6 as shown in Fig. 6(a). Further, the mounting table 4D is provided with a support pin as a rotatable support pin 4P or a movable groove 4SK for a support pin group.

In such a mechanism, first, the transport robot arm 5a is carried into the reception chamber 4b, and the substrate 6 is placed on the convex portion 4DT of the mounting table 4D. At this time, the support pin 4P is located at the lowest position at the same time as the support pin rotating table 4KD. Thereafter, the support pin rotating table 4KD is raised to support the pin 4P supporting the substrate 6, and the support pin rotating table 4KD is rotated at a desired angle, for example, α L , and the supporting pin rotating table 4KD is lowered in the state thereof, and the substrate 6 is placed. On the mounting table 4D. Next, the transport robot 5b is carried in, and the substrate 6 is gripped and transported from the reception room 4b.

As described above, in the present embodiment, even if the transport robot arm 5b is at any angle, the convex portion 4DT of the mounting table 4D can often be used as the transport path. However, in the present embodiment, the substrate 6 is placed on the elongated convex portion 4DT, but a linear support pin may be placed and placed.

As described above, according to the present embodiment, it is possible to provide the angle correction mechanism for changing the conveyance angle of the substrate, and to connect the group structure having the rectangular processing chambers in series, thereby shortening the entire line length. A manufacturing apparatus of an organic electroluminescence device and a method of manufacturing the same.

Further, according to the present embodiment, it is possible to provide a manufacturing apparatus or a manufacturing method of an organic electroluminescence device which can realize a line configuration having the above-described group structure and which is excellent in space efficiency.

In the above description, for example, the relationship between α R and α L is not considered. Too clear.

Accordingly, if the angle correcting mechanism is provided in each of the receiving portions 4, it can correspond to the size of each group or each processing chamber or the substrate size.

In a series of processes, as shown in FIG. 3, in each of the processing chambers of FIG. 1, or in one of the processing chambers, a plurality of processing units can be formed in the same shape and in the same arrangement.

For example, in the embodiment of FIG. 1, the groups A to D are of the same shape and the same arrangement, and the two processing chambers disposed above each group are also line symmetrical with respect to the transport direction, and are processed in one. The two processing sections of the chamber are also in the transport direction and are line symmetrical for the vertical lines. Therefore, the transport robot 5 is disposed in the transport chamber and is disposed strictly in the middle of the group. As a result, α R and α L in FIG. 4 are α R=−α L=α, and in the processing chamber 1bd, the relationship with the processing chamber 1bu is crossed, and in the processing receiving unit 9bdR, the value of α is taken. In the processing and receiving unit 9bdL, the value of -α is taken.

Therefore, firstly, the angle correcting mechanism of the receiving room 4 is a process of the same size substrate, and it is not necessary to take a continuous value, for example, a value of two values of a certain angle ±α. In this case, the first embodiment of the first embodiment is effective.

In this case, in the same group, when the substrate 6 is transported from the process receiving portion from α to -α or from -α to α, it is necessary to perform angle correction in the reception room 4 in contact with the group. .

In the embodiment shown in Fig. 1, as will be described later, the processing of the two processing units in the same processing chamber is the same. Then, in the same group, It is transported to a processing department having a process from α to α or from -α to -α. Moreover, the correction angle of each group is ±α and is the same, a substrate is at all correction angles α, and the next substrate is at all correction angles -α, from the manufacturing apparatus 100 of the organic electroluminescent device. Transport to the port of transport to handle and transport. In this case, it is only necessary to perform an angle correction on the upstream side as much as possible. If the foregoing preconditions are not changed, it is not necessary to perform angle correction in the downstream. Of course, it is necessary to set the angle correction mechanism when the aforementioned preconditions are changed.

The candidate load chamber 31 and the reception room 4a in the present embodiment are used. Although the same mechanism as that of the reception room may be provided in the load chamber 31, it may be carried in an angle of ±α in advance when the load chamber 31 carries the substrate 6. Further, as for the load chamber 31, the substrates are not carried in, but are carried in units of cassettes in which a plurality of sheets are accommodated, and for the upper load chamber 31, cassettes having an angle of α may be arranged, and for the lower side, The load chamber 31 may also be provided with a cassette having an angle of -α.

According to the present embodiment, since the two lines can be connected in parallel, the entire production line is long in appearance, but the unit length for the production amount can be shortened compared with the conventional one.

Next, (2) describes an embodiment of a method for increasing the degree of freedom in transporting the robot arm. The degree of freedom in rotating the comb-shaped shank 52 of the transport robot 5 shown in FIG. 5 to the left and right is provided. For example, the degree of freedom is set at the connecting portion 52J of the crossbar of the comb-shaped handle 52. It is not preferable to newly install a mechanism that moves in the vacuum chamber, but the same effects as those of the first embodiment described above can be obtained.

Before explaining the method of correcting the vapor deposition section in (3), the processing chamber 1 shown in FIGS. 1 to 3 will be described as the substrate 6 in which the reception chamber 4 or the upward flow angle correction is performed, using FIG. The processing is carried out in the processing and receiving unit 9, and vacuum evaporation is performed until the processing is performed. After the process, the process is carried out on the diagonal of the same group as described above, and the same vapor deposition process is performed.

In the vacuum vapor deposition apparatus of the present embodiment, the substrate 6 is vertically erected and transported to the adjustment unit 8 to perform vapor deposition. The lower surface of the substrate 6 during transport is a vapor deposition surface, and it is necessary to invert it. However, the upper surface is a vapor deposition surface, and it is only erected vertically.

Next, in the present embodiment, the vacuum vapor deposition process flow will be described in detail with reference to FIG. In FIG. 3, when the substrate 6 is present, it is indicated by a solid line.

First, in the R line, the substrate 6R is carried, the substrate 6R is erected vertically, and moved to the adjustment portion 8R, and the substrate 6 and the mask 81 are positionally adjusted (StepR1 to StepR3). At this time, since the substrate is transported as the upper surface of the vapor deposition surface, the position adjustment can be performed immediately without reversing. The position adjustment is as shown in the export diagram of FIG. 3, and is photographed by the CCD camera 86. The positioning mark 84 provided on the substrate 6 is present at the center of the window 85 provided in the mask 81M, via the mask 81R. The adjustment drive unit 83 performs the control. This vapor deposition is, for example, a material that emits red (R) color. As shown in FIG. 8, a portion corresponding to the R of the mask 81M is opened with a window, and a portion thereof is vapor-deposited. The size of this window varies depending on the color, but the average width is 50 μm and the height is 150 μm. Mask The thickness of 81M is 40 μm, and there is a tendency to become thinner in the future.

When the position adjustment is completed, the vapor deposition source 71 is moved to the R line side (StepL0), and then the linear vapor deposition source 71 is moved up or down to perform vapor deposition (Step R4). In the R-line vapor deposition, the processing of StepR1 to StepR3 is performed in the same manner as the L line and the R line. In other words, the other substrate 6L is carried, the substrate 6L is erected vertically, and moved to the adjustment portion 8L to adjust the position of the shield cover 81L. When the vapor deposition of the substrate 6R of the R line is completed, the vapor deposition source 71 moves to the L line (StepR4), and the substrate 6 on the L line is vapor-deposited (Step L4). At this time, when the vapor deposition source 71 is completely out of the vapor deposition range of the R line, when the substrate 6R is separated from the adjustment portion 8R, there is a possibility that vapor deposition is not required, and after the complete appearance, the substrate is started. The processing operation of the processing chamber 1 of 6R is followed by preparation for entering the new substrate 6R. In order to avoid the aforementioned unnecessary vapor deposition, a partition plate 11 is provided between the lines. However, Figure 3 shows the states of StepR4 and StepL1. In other words, in the R line, vapor deposition is started, and in the L line, the substrate is transferred to the vacuum deposition chamber 1bu.

Thereafter, when the above-described flow is continuously performed, in addition to the moving time of the evaporation portion 7, vapor deposition can be performed without using a vapor deposition material. When the time required for vapor deposition is slightly shorter than the other processing time, and if the moving time of the evaporation source 71 is 5 seconds, the vapor deposition time of the conventional one minute is reduced to 5 in the present embodiment. second. According to the above-described embodiment, as shown in FIG. 6, the processing cycle of one processing substrate in the vacuum vapor deposition chamber 1bu is substantially the vapor deposition time + the moving time of the evaporation source 71, and the productivity can be improved. If the processing time is evaluated by the aforementioned conditions, In the case of 2 minutes in the present invention, in the present invention, it is 1 minute and 5 seconds, and the productivity for 1 chamber can be increased to about 2 times.

The above (1) and (2) embodiments are described in which the vapor deposition surface of all the substrates 6 is transported as an upper surface, and the substrate can be vapor-deposited in an upright shield to erect the substrate. In other vapor deposition methods, there are substrates, and the masks are all performed horizontally. In many cases, as shown in Fig. 9, the vapor deposition surface is used as the lower surface, and the vapor deposition treatment is performed from below. In this case, the method of correcting in the vapor deposition section of (3) is also effective.

In such an embodiment, in order to transport the substrate-treated surface to the lower surface, the substrate 6 is placed in a dedicated container, and both ends of the substrate are transported. The angle adjustment mechanism can be applied to the method described in the above embodiment.

In addition, since the substrate is formed to be vertical and vapor-deposited, the position adjustment mechanism of the mask is complicated, and it is difficult to rotate the processing and receiving unit 9 in the processing chamber 1. However, the substrate processing surface is horizontal. The mechanism shown in FIG. 5 is provided in the process receiving portion 9, and the correction angle is constant. As shown in FIG. 9, the adjustment portion 7 is provided at an angle thereof, and the evaporation source 71 is matched with the angle thereof. At the time of scanning, the angle correction can be performed substantially.

According to this embodiment, the same effects as those of the previous embodiment can be obtained.

Accordingly, the present invention can be applied regardless of the posture of the mask through different vapor deposition surface postures.

Further, in the above description, the organic electroluminescence device has been described by way of example, but it is also applicable to evaporation in the same background as the organic electroluminescence device. Film forming apparatus and film forming method for processing.

4H‧‧‧ Angle Correction Mechanism

4D‧‧‧The reception desk of the reception room

4P‧‧‧Substitute support pins

4S‧‧‧Station Support Department

4J‧‧‧Magnetic seal

4KM‧‧‧Rotary drive motor

6‧‧‧Substrate

10I, 10E‧‧‧ gate valve

10IK‧‧‧ openings

10IB‧‧‧Close the valve body

10EK‧‧‧ openings

52‧‧‧ comb handle

52J‧‧‧Connecting Department

Claims (8)

An angle correction mechanism comprising: a transport inlet that is carried into a substrate via a first comb-shaped shank; an transport port that transports the substrate via a second comb-shaped shank, and a plurality of supports for the substrate a supporting column, and a fixed plurality of the supporting columns, a supporting column rotating table supporting the rotation of the substrate, and a rotating driving means for rotating the support column rotating table in a plane parallel to the substrate, and avoiding and plural The support column and the avoiding means for interfering with at least one of the first comb-shaped shank and the second comb-shaped shank. The angle correction mechanism of claim 1, wherein the avoidance means is such that the plurality of support columns do not interfere with at least one of the first comb-shaped shank and the second comb-shaped shank , configured in a matrix. The angle correction mechanism according to claim 1, wherein the avoidance means includes: an upper and lower driving means for vertically positioning the support column rotating table on which the substrate is placed, and a parallel upper portion of the support column rotating table; The plurality of convex portions may be inserted between the convex portions and the second comb-shaped shank, and include a plurality of substrate mounting tables for supporting the movable grooves. If you apply for any of the scope of items 1 to 3 of the patent scope The correction mechanism includes: a turntable support portion that is vertically provided on the pillar turntable; a rotary drive motor that rotates the turntable support portion; and a sealing means that vacuum-seals the turntable support portion. The angle correction mechanism according to claim 3, wherein the rotation driving means includes: a rotary table support portion that is vertically provided on the support column rotary table; a rotary drive motor that rotates the rotary table support portion; and a vacuum seal The sealing means of the turntable support portion includes: a vertical drive motor that supports the rotary table support portion up and down, and a sealing means provided on the rotary table support portion to perform a sealing grease belly. The angle correction mechanism according to any one of the items 1 to 3, wherein the gate valve is separately provided at the inlet and the outlet. A manufacturing apparatus of an organic electroluminescence device, comprising: a vacuum processing chamber in which a vapor deposition material is vapor-deposited on a processing portion of a substrate; and the substrate is carried in or out, and has a patent application scope item 1 The reception room of the angle correction mechanism according to any one of the sixth aspect, and the transportation means for transporting the substrate between the reception room and the processing unit, and a vacuum processing room. A manufacturing apparatus for an organic electroluminescence device, characterized in that: a vacuum processing chamber in which a vapor deposition material is vapor-deposited on a processing portion of a substrate; and a reception chamber in which the substrate is carried in or out, and a group of vacuum processing chambers for transporting the substrate between the receiving chamber and the processing unit; and different from the receiving chamber, having a transporting load into the load chamber and transporting the substrate The load chamber is provided, and an angle correction according to any one of the first to sixth aspects of the patent application is provided in a transport unit that constitutes a transport system that transports the substrate from the transport load chamber to the transport load chamber. mechanism.