JP5492027B2 - Organic EL device manufacturing apparatus and manufacturing method - Google Patents

Organic EL device manufacturing apparatus and manufacturing method Download PDF

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JP5492027B2
JP5492027B2 JP2010193831A JP2010193831A JP5492027B2 JP 5492027 B2 JP5492027 B2 JP 5492027B2 JP 2010193831 A JP2010193831 A JP 2010193831A JP 2010193831 A JP2010193831 A JP 2010193831A JP 5492027 B2 JP5492027 B2 JP 5492027B2
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substrate
vapor deposition
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JP2012054013A (en
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大樹 亀山
信広 韮沢
賢治 弓場
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Hitachi High Tech Corp
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本発明は、有機ＥＬデバイス製造装置及び製造方法に係り、特に、より均一な成膜を実現できる有機ＥＬデバイス製造装置及び製造方法に関する。   The present invention relates to an organic EL device manufacturing apparatus and a manufacturing method, and more particularly, to an organic EL device manufacturing apparatus and a manufacturing method that can realize more uniform film formation.

有機ＥＬデバイスを製造する有力な方法として真空蒸着法がある。真空蒸着を行なう場合、蒸着ステージにガラス基板などの基板(以下、単に基板という)を移載する必要がある。基板の搬送にロボットを用いた場合の移載方法として、特許文献１、２がある。   There exists a vacuum evaporation method as an influential method of manufacturing an organic EL device. When performing vacuum deposition, it is necessary to transfer a substrate such as a glass substrate (hereinafter simply referred to as a substrate) to the deposition stage. There are Patent Documents 1 and 2 as transfer methods when a robot is used for transporting a substrate.

特許文献１には、ロボットで基板を水平に搬送し、ステージに設けられた受けピンに水平に移載し、その後、水平の状態で蒸着する方法が開示されている。
特許文献２には、ロボットで基板を水平に搬送し、ステージに水平に移載し、その後、水平に載置した基板を直立または略直立に立てその状態で蒸着する方法が開示されている。 Patent Document 1 discloses a method in which a substrate is transported horizontally by a robot, transferred to a receiving pin provided on a stage, and then deposited in a horizontal state.
Patent Document 2 discloses a method in which a substrate is transported horizontally by a robot, transferred to a stage horizontally, and then the substrate placed horizontally is deposited in an upright or substantially upright state in that state.

特開平６−９７２６９号公報JP-A-6-97269 特開２０１０−６２０４３号公報JP 2010-62043 A

しかしながら、特許文献１に開示された受けピンを用いて、特許文献２に記載されているようにステージを水平から直立へ回転させようとすると、ステージ面は回転中心から円弧で移動する。その結果、受けピンとステージとが干渉する部分が生じ、干渉を避けるための逃げがステージに必要になる。また、受けピンを回転体に固定するかしないかに限らず、昇降ストロークによってはステージに搬送ロボットのアームを抜くための逃げが必要な場合がある。   However, when using the receiving pin disclosed in Patent Document 1 to rotate the stage from horizontal to upright as described in Patent Document 2, the stage surface moves in an arc from the center of rotation. As a result, a portion where the receiving pin and the stage interfere with each other occurs, and the stage needs to be escaped to avoid the interference. In addition, whether or not the receiving pin is fixed to the rotating body may be necessary depending on the lifting stroke, it may be necessary to escape to remove the arm of the transfer robot from the stage.

これらの逃げにより基板と蒸着ステージが密着する部分としない部分が生じ、基板の温度ムラなどの原因となり、成膜の均一性に大きな影響を与え、不良品の原因ともなる。特に表示装置用デバイスとして高精彩な画面を得ることができない。   Due to these escapes, a portion where the substrate and the vapor deposition stage are not in close contact with each other is generated, causing a temperature unevenness of the substrate, greatly affecting the uniformity of the film formation, and causing defective products. In particular, a high-definition screen cannot be obtained as a display device device.

従って、本発明の第１の目的は、より均一な成膜を実現できる有機ＥＬデバイス製造装置または製造方法を提供することである。
また、本発明の第２の目的は、高精彩なデバイスを製造できる有機ＥＬデバイス製造装置及び製造方法を提供することである。 Accordingly, a first object of the present invention is to provide an organic EL device manufacturing apparatus or manufacturing method capable of realizing more uniform film formation.
The second object of the present invention is to provide an organic EL device manufacturing apparatus and a manufacturing method capable of manufacturing a high-definition device.

本発明は上記の目的を達成するために、少なくとも以下の特徴を有する。   In order to achieve the above object, the present invention has at least the following features.

本発明は、複数の受けピンを介して基板を水平状態の蒸着ステージで受渡し、前記蒸着ステージを回転させて略直立姿勢または直立姿勢にし、真空チャンバ内で前記基板に蒸着材料を蒸着する有機ＥＬデバイス製造装置または製造方法において、前記複数の受けピンの先端より上方に前記蒸着ステージを移動し、前記基板を前記複数の受けピンから前記蒸着ステージに移載し、その状態で前記回転を行うことを第1の特徴とする。   The present invention provides an organic EL that delivers a substrate on a horizontal deposition stage via a plurality of receiving pins, rotates the deposition stage to a substantially upright position or an upright position, and deposits a deposition material on the substrate in a vacuum chamber. In the device manufacturing apparatus or the manufacturing method, the deposition stage is moved above the tips of the plurality of receiving pins, the substrate is transferred from the plurality of receiving pins to the deposition stage, and the rotation is performed in that state. Is the first feature.

また、本発明は、前記受けピンと前記蒸着ステージを一体になって前記回転を行なうことを第２の特徴とする。
さらに、本発明は、前記移動が前記回転の回転軸を有する支持部と前記蒸着ステージとの間に設けられた昇降機構によって行なわれることを第３の特徴とする。 The second feature of the present invention is that the receiving pin and the vapor deposition stage are integrally rotated.
Furthermore, the present invention has a third feature that the movement is performed by an elevating mechanism provided between the support portion having the rotation axis of rotation and the vapor deposition stage.

また、本発明は、前記略直立姿勢または直立姿勢にした後、前記昇降機構により前記基板の蒸着パターンを規定するマスクに近接させることを第４の特徴とする。
さらに、本発明は、前記基板と前記基板の蒸着パターンを規定するマスクとのアライメント後、前記昇降機構により前記基板を前記マスクに密着させることを第５の特徴とする。 In addition, the present invention has a fourth feature that, after the substantially upright posture or the upright posture is set, the raising / lowering mechanism is brought close to a mask defining a deposition pattern of the substrate.
Furthermore, the present invention is characterized in that the substrate is brought into close contact with the mask by the elevating mechanism after the alignment between the substrate and the mask defining the deposition pattern of the substrate.

また、本発明は、前記昇降機構の内部は前記真空チャンバの真空と隔離され、前記内部は中空部を有する前記支持部と、前記回転軸及び前記回転軸を回転させる回転機構とを介して大気に開放されていることを第６の特徴とする。
さらに、本発明は、前記昇降機構は前記支持部又は前記蒸着ステージの四隅に設けられていることを第７の特徴とする。 According to the present invention, the inside of the elevating mechanism is isolated from the vacuum of the vacuum chamber, and the inside is surrounded by the support portion having a hollow portion, the rotating shaft, and the rotating mechanism that rotates the rotating shaft. It is the sixth feature that it is open to the outside.
Furthermore, the present invention has as a seventh feature that the elevating mechanism is provided at four corners of the support portion or the vapor deposition stage.

本発明によれば、より均一な成膜を実現できる有機ＥＬデバイス製造装置または製造方法を提供できる。
また、本発明によれば、高精彩なデバイスを製造できる有機ＥＬデバイス製造装置及び成膜装置を提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the organic EL device manufacturing apparatus or manufacturing method which can implement | achieve more uniform film-forming can be provided.
Moreover, according to this invention, the organic EL device manufacturing apparatus and film-forming apparatus which can manufacture a high-definition device can be provided.

本発明の実施形態である真空蒸着チャンバと搬送チャンバの構成の模式図と動作説明図である。It is the schematic diagram and operation | movement explanatory drawing of a structure of the vacuum evaporation chamber which is embodiment of this invention, and a conveyance chamber. 本発明の特徴である第１の実施形態における受渡部の概略構成を示す模式図である。It is a schematic diagram which shows schematic structure of the delivery part in 1st Embodiment which is the characteristics of this invention. 受渡部を回転させるためのステージ回転機構の一実施形態を示す図である。It is a figure which shows one Embodiment of the stage rotation mechanism for rotating a delivery part. 本発明の昇降機構の一実施形態を示す模式図である。It is a schematic diagram which shows one Embodiment of the raising / lowering mechanism of this invention. 本発明の第１の実施形態である受渡部の動作フローを示す図である。It is a figure which shows the operation | movement flow of the delivery part which is the 1st Embodiment of this invention. 本発明の第１の実施形態である受渡部の動作説明図である。It is operation | movement explanatory drawing of the delivery part which is the 1st Embodiment of this invention. 本発明の第１の実施形態である受渡部の基板をマスクに密着させる動作説明図である。It is operation | movement explanatory drawing which closely_contact | adheres the board | substrate of the delivery part which is the 1st Embodiment of this invention to a mask. 本発明の第１及び第２の実施形態である受渡部を搬送ロボット側から見た図である。It is the figure which looked at the delivery part which is the 1st and 2nd embodiment of this invention from the conveyance robot side.

本発明の実施形態を図を用いて説明する。図１は、本発明の実施形態である真空蒸着チャンバ１と搬送チャンバ２の構成の模式図と動作説明図である。真空蒸着チャンバ１と搬送チャンバ２はゲート弁等(図示せず)で仕切られた別々の真空チャンバを構成している。   Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram and an operation explanatory diagram of a configuration of a vacuum deposition chamber 1 and a transfer chamber 2 according to an embodiment of the present invention. The vacuum deposition chamber 1 and the transfer chamber 2 constitute separate vacuum chambers partitioned by a gate valve or the like (not shown).

搬送チャンバ２内に設けられた搬送ロボット１０は、全体を上下に移動可能(図１の矢印１４参照)で、左右に旋回可能なリンク構造のアーム１１を有し、その先端には基板搬送用の櫛歯状ハンド１２を有する。   The transfer robot 10 provided in the transfer chamber 2 can move up and down as a whole (see the arrow 14 in FIG. 1), and has a link structure arm 11 that can be swung left and right. The comb-shaped hand 12 is provided.

一方、真空蒸着チャンバ１は、大別して発光材料を蒸発(昇華)させ基板５０に蒸着させる蒸着部７と、基板５０とシャドウマスク８１との位置合せを行い、基板５０の必要な部分に蒸着させるアライメント部８と、搬送ロボット１０と基板の受け渡しを行い、蒸着部７へ基板５０を直立させる蒸着ステージ２０とを有する。アライメント部８と受渡部９は右側Ｒラインと左側Ｌラインの２系統設ける。本実施形態では一方のライン(例えばＲライン)で蒸着している間に、他方のＬラインでは基板を搬出入し、基板５０とシャドウマスク８１とのアライメントをし、蒸着する準備を完了することができる。そのために、蒸着部７は、蒸着源７１を基板５０に蒸着させるための上下移動機構７６と共に、ライン間を移動させる左右移動機構７４とを有している。この処理を交互に行なうことによって、基板に蒸着させずに無駄に蒸発(昇華)している時間を減少させることができる。なお、蒸着源７１は、引出し図に示すように、蒸発した発光材料を噴出させる穴７３を列状に複数有する。   On the other hand, the vacuum deposition chamber 1 is roughly classified to align the deposition unit 7 that evaporates (sublimates) the luminescent material and deposits it on the substrate 50, the substrate 50 and the shadow mask 81, and deposits on a necessary portion of the substrate 50. An alignment unit 8, a transfer robot 10, and a deposition stage 20 that transfers the substrate and erects the substrate 50 to the deposition unit 7 are provided. The alignment unit 8 and the delivery unit 9 are provided in two systems, a right R line and a left L line. In this embodiment, while vapor deposition is performed on one line (for example, R line), the substrate is carried in and out on the other L line, the substrate 50 and the shadow mask 81 are aligned, and preparation for vapor deposition is completed. Can do. For this purpose, the vapor deposition unit 7 includes a vertical movement mechanism 76 for vapor deposition of the vapor deposition source 71 on the substrate 50 and a horizontal movement mechanism 74 that moves between the lines. By alternately performing this process, it is possible to reduce the time during which the vaporization (sublimation) is wasted without being deposited on the substrate. The vapor deposition source 71 has a plurality of holes 73 arranged in a row for ejecting the evaporated luminescent material, as shown in the drawing.

図２は本発明の特徴である受渡部９の概略構成を示す模式図である。図２は、搬送ロボット１０が前工程から基板５０を受渡部９に受け渡し、または、受渡部９から基板５０を受け取り、次の工程に受け渡す状態を示している。   FIG. 2 is a schematic diagram showing a schematic configuration of the delivery unit 9 which is a feature of the present invention. FIG. 2 shows a state where the transfer robot 10 delivers the substrate 50 from the previous process to the delivery unit 9 or receives the substrate 50 from the delivery unit 9 and delivers it to the next process.

受渡部９は基板５０を載置する蒸着ステージ２０を有する。蒸着ステージ２０は、回転軸２１に固定された支持部２２と、支持部２２に配置された昇降機構３０とを介して後述するステージ回転機構９０(図３参照)に接続される。
昇降機構３０は蒸着ステージ２０に３個以上、特に蒸着ステージ２０の四隅に近い所に配置するのが望ましい。３個以上であれば、それぞれを制御することによって、後述する基板５０とマスク８１とをアライメントするときや、基板５０をマスク８１に密着させるときに基板５０とマスク８１を平行に保つことができ、より均一な成膜をすることができる。また、四隅に近い所に配置することによって上記制御がより行ない易くなる。 The delivery unit 9 includes a vapor deposition stage 20 on which the substrate 50 is placed. The vapor deposition stage 20 is connected to a stage rotation mechanism 90 (see FIG. 3) described later via a support portion 22 fixed to the rotation shaft 21 and an elevating mechanism 30 disposed on the support portion 22.
It is desirable to arrange three or more lifting mechanisms 30 on the vapor deposition stage 20, particularly at positions near the four corners of the vapor deposition stage 20. If there are three or more, each can be controlled to keep the substrate 50 and the mask 81 parallel when aligning the substrate 50 and the mask 81, which will be described later, or when bringing the substrate 50 into close contact with the mask 81. More uniform film formation can be achieved. In addition, the above-described control can be performed more easily by disposing them near the four corners.

また、受けピン４０は支持部２２に固定されている。受けピン４０は基板５０の撓みが過大にならず、搬送ロボット１０の櫛歯状ハンド１２と干渉しない位置に複数個配置されている。蒸着ステージ２０には受けピン４０の配置に合わせ、受けピン４０の直径より僅かに大きい貫通穴２３が設けられている。回転軸２１および支持部２２は中空構造とし昇降機構３０などへの大気ＢＯＸを兼ねる。そのために、回転軸２１の中空部は後述するように真空蒸着チャンバ１の壁に設けられた真空シール部を介して大気に開放されている。   The receiving pin 40 is fixed to the support portion 22. A plurality of receiving pins 40 are arranged at positions where the bending of the substrate 50 is not excessive and does not interfere with the comb-like hand 12 of the transfer robot 10. The vapor deposition stage 20 is provided with a through hole 23 slightly larger than the diameter of the receiving pin 40 in accordance with the arrangement of the receiving pin 40. The rotating shaft 21 and the support portion 22 have a hollow structure and also serve as an atmospheric BOX to the lifting mechanism 30 and the like. Therefore, the hollow part of the rotating shaft 21 is open | released to air | atmosphere through the vacuum seal part provided in the wall of the vacuum evaporation chamber 1 so that it may mention later.

図３は、図１に示すＲラインと、回転軸２１、即ち受渡部９を回転させるためのステージ回転機構９０の一実施形態を示す図である。ステージ回転機構９０は、受渡部９に載置された基板５０と、支持部２２、支持部に固定されている受けピン４０、蒸着ステージ２０及び昇降機構３０を有する受渡部９とを一体にして、アライメント実施前にほぼ直立又は直立にし、蒸着し、蒸着終了後は水平状態に戻す機能を有する。   FIG. 3 is a diagram showing an embodiment of a stage rotation mechanism 90 for rotating the R line shown in FIG. 1 and the rotation shaft 21, that is, the delivery unit 9. The stage rotation mechanism 90 integrates the substrate 50 placed on the delivery unit 9, the support unit 22, the receiving pin 40 fixed to the support unit, the deposition stage 20, and the delivery unit 9 having the lifting mechanism 30. In addition, it has a function of being almost upright or standing upright before performing alignment, depositing, and returning to a horizontal state after the end of deposition.

図３において、蒸着ステージ回転機構９０は、蒸着ステージ２０を有する受渡部９を回転させる真空内配線リンク機構９１と、前記受渡部９を矢印Ａの方向に前記真空内配線リンク機構９１を介して回転駆動する回転駆動部９６とを有する。   In FIG. 3, the vapor deposition stage rotating mechanism 90 includes an in-vacuum wiring link mechanism 91 for rotating the delivery unit 9 having the vapor deposition stage 20, and the delivery unit 9 in the direction of arrow A via the in-vacuum wiring link mechanism 91. And a rotation driving unit 96 that rotates.

真空内配線リンク機構９１は受渡部９の回転軸２１の両側に設けられた第１リンク９１ｎ１と第２リンク９１ｎ２及びそれらを真空側から隔離し、その内部を大気雰囲気にするシール部９１ｓ１、９１ｓ２からなる。第１リンク９１ｎ１は、一端を回転支持台９６ｋに支持され、他端を受渡部９の回転軸２１に中空部を持つように接続されている。第１リンク９１ｎ１の真空チェンバ１との貫通部に第１リンク９１ｎ１を回転可能に支持し、その内部を真空側から隔離し、大気雰囲気にする第１シール部９１ｓ１を有する。一方、第２リンクｎ２は、一端を第１リンクｎ１と同様に中空部を持ち受渡部９の回転軸２１に、他端を図１に示す２つのラインの間に設けられた仕切り部１ａ(図１では図示せず)に設けられた支持部１ｂに第２シール部９１ｓ２を介して接続されている。第２シール部９１ｓ２は第１シール部９１ｓ１と同様に、第２リンク９１ｎ２を回転可能に支持し、その内部を真空側から隔離し、大気雰囲気としている。 Vacuum line link mechanism 91 is isolated from the first link 91n 1 and the second link 91n 2 and their vacuum side provided on both sides of the rotary shaft 21 of the delivery unit 9, the seal portion 91s to the inside air atmosphere 1, consisting of 91s 2. One end of the first link 91n 1 is supported by the rotation support base 96k, and the other end is connected to the rotation shaft 21 of the delivery unit 9 so as to have a hollow portion. The first link 91n 1 is rotatably supported in the through portion of the vacuum chamber 1 of the first link 91n 1, its internal isolated from the vacuum side, having a first sealing portion 91 s 1 to the atmosphere. On the other hand, the second link n 2 has a hollow portion at one end in the same manner as the first link n 1, and the partition portion provided between the two lines shown in FIG. 1a are connected via a second seal portion 91 s 2 to the supporting portion 1b provided (not shown in Figure 1). The second seal portion 91 s 2 in the same manner as the first seal portion 91 s 1, a second link 91n 2 is rotatably supported to isolate the interior from the vacuum side to the atmospheric air.

一方、回転駆動部９６は、大気側に設けられた回転用モータ９６mと、回転用モータ９６mの回転を前記第１リンク９１ｎ１に伝達する歯車９６ｈ１、９６ｈ２と、第１リンク９１ｎ１の一端を支持する回転支持台９６ｋとを有する。なお、回転用モータ９６mは大気側に設けられた制御装置６０で制御される。 On the other hand, the rotation drive unit 96 includes a rotation motor 96m provided on the atmosphere side, gears 96h 1 and 96h 2 that transmit the rotation of the rotation motor 96m to the first link 91n 1 , and the first link 91n 1 . And a rotary support 96k that supports one end. The rotation motor 96m is controlled by a control device 60 provided on the atmosphere side.

図４は本発明の昇降機構３０の一実施形態を示す模式図である。昇降機構３０は、大気ＢＯＸ３５と、大気ＢＯＸ３５に固定されたナットハウジング３６と、支持部２２に固定されナットハウジング３６内のナット(図示せず)を回転させるモータ３３と、ナットの回転により矢印Ｂのように上下するボールネジ軸３２と、ボールネジ軸３２に同軸に固定され他端を蒸着ステージ２０に固定された支持棒３７、支持棒３７をガイドする貫通孔を有するガイド３１と、大気ＢＯＸ３５内を真空にと隔離するベローズ３４とを有する。支持棒３７とガイド３１はスプラインあるいはボールブッシュなどで構成することができる。モータの駆動線３８は、中空部を有する支持部２２、回転軸２１、第１リンク９１ｎ１を介して大気側に取り出すことができる。また、中空部を介してモータ３３を空冷することによってモータ３３の発熱を抑えることができる。
なお、上記実施形態では、モータ３３を支持部２２に固定したが、蒸着ステージ２０に固定し、支持部２２側にベローズ３４を設けてもよい。 FIG. 4 is a schematic view showing an embodiment of the lifting mechanism 30 of the present invention. The elevating mechanism 30 includes an atmospheric BOX 35, a nut housing 36 fixed to the atmospheric BOX 35, a motor 33 that is fixed to the support 22 and rotates a nut (not shown) in the nut housing 36, and an arrow B by rotation of the nut. As shown above, the ball screw shaft 32 that moves up and down, the support rod 37 that is coaxially fixed to the ball screw shaft 32 and the other end is fixed to the vapor deposition stage 20, the guide 31 that has a through hole that guides the support rod 37, and the atmosphere BOX 35 And a bellows 34 that is isolated to a vacuum. The support rod 37 and the guide 31 can be constituted by a spline or a ball bush. Drive lines 38 of the motor can be taken out support portion 22 having a hollow portion, the rotary shaft 21, via the first link 91n 1 to the atmosphere. Further, the motor 33 can be prevented from generating heat by air-cooling the motor 33 through the hollow portion.
In the above-described embodiment, the motor 33 is fixed to the support unit 22. However, the motor 33 may be fixed to the vapor deposition stage 20 and the bellows 34 may be provided on the support unit 22 side.

図５は第１の実施形態である受渡部９の動作フローを示す図である。図６、図７は第１の実施形態における受渡部９の動作説明図である。図６は搬送ロボット１０との基板５０の受渡し時から基板ステージ２０を直立させるまでの受渡部９の動作説明図である。また、図７は基板５０をマスク８１に接近させるときの受渡部９の動作説明図である。   FIG. 5 is a diagram illustrating an operation flow of the delivery unit 9 according to the first embodiment. 6 and 7 are explanatory diagrams of the operation of the delivery unit 9 in the first embodiment. FIG. 6 is an operation explanatory diagram of the delivery unit 9 from the time when the substrate 50 is delivered to the transfer robot 10 to the time when the substrate stage 20 is brought upright. FIG. 7 is an explanatory view of the operation of the delivery unit 9 when the substrate 50 is brought close to the mask 81.

以下、受渡部９の動作フローを図６、図７を参照しながら図５を主体に説明する。まず、図６(ａ)に示すように、蒸着ステージ２０が受けピン４０上面より下がった位置で待機している状態で、搬送ロボット１０の櫛歯状ハンド１２が基板５０を蒸着ステージ２０の上に搬送する。(Step１)。前記待機位置は櫛歯状ハンド１２が引き抜ける位置に下がったときに、蒸着ステージ２０が櫛歯状ハンドと干渉しない位置である。その後、図６(ｂ)に示すように、櫛歯状ハンド１２が受けピン４０の間を下降し、受けピン４０に基板を移載し、さらに、櫛歯状ハンド１２が基板５０及び蒸着ステージ２０と干渉せずに引き抜ける位置まで下降する(Step２)。次に、図６(ｃ)に示すように、櫛歯状ハンド１２を受渡部９から引き抜き、蒸着ステージ２０が昇降機構３０により上昇し、基板５０の下面が蒸着ステージ２０の上面に接触し、基板５０を蒸着ステージ２０に移載し、さらに蒸着ステージ２０が蒸着ステージ２０の上面より受けピン４０の上面が僅かに低くなる位置まで上昇する（Step３）。この後、図６(ｄ)に示すように、蒸着ステージ２０は図３に示すステージ回転機構９０により図２に示す回転軸２１を中心に受けピン４０と蒸着ステージ２０が一体となって回転し、略直立姿勢または直立姿勢となる（Step４）。   Hereinafter, the operation flow of the delivery unit 9 will be described mainly with reference to FIG. 5 with reference to FIGS. First, as shown in FIG. 6A, the comb-like hand 12 of the transfer robot 10 holds the substrate 50 on the vapor deposition stage 20 while the vapor deposition stage 20 stands by at a position lower than the upper surface of the receiving pin 40. Transport to. (Step 1). The standby position is a position where the vapor deposition stage 20 does not interfere with the comb-shaped hand when the comb-shaped hand 12 is lowered to a position where it can be pulled out. Thereafter, as shown in FIG. 6B, the comb-like hand 12 descends between the receiving pins 40, and the substrate is transferred to the receiving pins 40. Further, the comb-like hand 12 receives the substrate 50 and the vapor deposition stage. It descends to a position where it can be pulled out without interfering with 20 (Step 2). Next, as shown in FIG. 6 (c), the comb-shaped hand 12 is pulled out from the delivery unit 9, the vapor deposition stage 20 is raised by the lifting mechanism 30, and the lower surface of the substrate 50 is in contact with the upper surface of the vapor deposition stage 20. The substrate 50 is transferred to the vapor deposition stage 20, and the vapor deposition stage 20 is raised to a position where the upper surface of the receiving pin 40 is slightly lower than the upper surface of the vapor deposition stage 20 (Step 3). Thereafter, as shown in FIG. 6D, the vapor deposition stage 20 is rotated integrally with the receiving pin 40 and the vapor deposition stage 20 around the rotation shaft 21 shown in FIG. 2 by the stage rotating mechanism 90 shown in FIG. Then, it becomes a substantially upright posture or an upright posture (Step 4).

次に、図７(ａ)から図７(ｂ)示すように、昇降機構３０により蒸着ステージ２０に保持されている基板５０をマスク８１から一定の距離、例えば０．５ｍｍ離れた位置まで接近させる（Step５）。その後、step５の状態で基板５０とマスク８１とのアライメント行なう（Step６）。アライメント終了後、昇降機構３０により基板５０をマスク８１に密着し、蒸着材料を基板に蒸着する（Step７）。蒸着後、昇降機構３０により基板５０をマスク８１から一定の距離を離し、図７(ａ)に示す元の位置に戻る(Step８）。その後、Step４からStep１の逆の動作を行い、蒸着した基板５０を真空蒸着チャンバ１から搬出する(Step９）。次に、Step1からStep９の動作を繰り返す。   Next, as shown in FIG. 7A to FIG. 7B, the substrate 50 held on the vapor deposition stage 20 is moved closer to a certain distance, for example, 0.5 mm away from the mask 81 by the elevating mechanism 30. (Step 5). Thereafter, the substrate 50 and the mask 81 are aligned in the state of step 5 (Step 6). After completion of the alignment, the substrate 50 is brought into close contact with the mask 81 by the elevating mechanism 30, and the deposition material is deposited on the substrate (Step 7). After the deposition, the substrate 50 is separated from the mask 81 by the elevating mechanism 30 and returned to the original position shown in FIG. 7A (Step 8). Thereafter, the reverse operation from Step 4 to Step 1 is performed, and the deposited substrate 50 is carried out of the vacuum deposition chamber 1 (Step 9). Next, the operation from Step 1 to Step 9 is repeated.

以上説明した第１の実施形態によれば、蒸着ステージ２０を上下させる昇降機構３０を支持部２２に設けることによって、基板５０を水平状態から直立させても、蒸着ステージ２０と受けピン４０との干渉をなくし、基板５０と蒸着ステージ２０と密着しない部分を極力低減でき、より均一な成膜を実現できる。   According to the first embodiment described above, the elevating mechanism 30 that moves the vapor deposition stage 20 up and down is provided on the support unit 22, so that the vapor deposition stage 20 and the receiving pin 40 can be connected to each other even when the substrate 50 is upright from the horizontal state. It is possible to eliminate interference and reduce a portion where the substrate 50 and the vapor deposition stage 20 are not in close contact with each other as much as possible, thereby realizing more uniform film formation.

また、以上説明した第１の実施形態によれば、蒸着ステージ２０を上下させる昇降機構３０を設けることによって、基板５０とマスク８１の密着性を高めることができ、成膜のボケを抑えることができる。   In addition, according to the first embodiment described above, by providing the elevating mechanism 30 that moves the vapor deposition stage 20 up and down, the adhesion between the substrate 50 and the mask 81 can be improved, and blurring of film formation can be suppressed. it can.

図８は受渡部９の第２の実施形態を示す図で、本発明の第１及び第２の実施形態である受渡部９を搬送ロボット１０側から見た図である。図８(ａ)は第１の実施形態において、図８(ｂ)は第２の実施形態において、蒸着ステージ２０が受けピン４０から基板を移載され、直立姿勢へ回転する前の状態を示す。第２の実施形態の受渡部９が第１の実施形態の受渡部９と異なる点は、第１の実施形態では受けピン４０が蒸着ステージ２０、昇降機構３０と一体になって回転するのに対し、第２の実施形態では受けピン４０は回転しない固定部４１に固定されており、即ち、受けピン４０は回転しなく、蒸着ステージ２０、昇降機構３０及び支持部２２が一体となって回転する。そのために、第２実施形態では、蒸着ステージ２０が受けピン４０と干渉しないように、昇降機構３０で蒸着ステージ２０を上昇させ蒸着ステージ２０が基板５０を受け取った後、さらに蒸着ステージ２０を受けピン４０の上方に上昇させる。   FIG. 8 is a diagram showing a second embodiment of the delivery unit 9 and is a view of the delivery unit 9 according to the first and second embodiments of the present invention as seen from the transport robot 10 side. FIG. 8A shows the state before the first embodiment, and FIG. 8B shows the state before the evaporation stage 20 is transferred from the receiving pin 40 and rotated to the upright posture in the second embodiment. . The delivery unit 9 of the second embodiment is different from the delivery unit 9 of the first embodiment in that the receiving pin 40 rotates integrally with the vapor deposition stage 20 and the lifting mechanism 30 in the first embodiment. On the other hand, in the second embodiment, the receiving pin 40 is fixed to a fixed portion 41 that does not rotate, that is, the receiving pin 40 does not rotate, and the vapor deposition stage 20, the elevating mechanism 30, and the support portion 22 rotate as a unit. To do. Therefore, in the second embodiment, after the vapor deposition stage 20 is raised by the elevating mechanism 30 and the vapor deposition stage 20 receives the substrate 50 so that the vapor deposition stage 20 does not interfere with the receiving pin 40, the vapor deposition stage 20 further receives the pin. Raise above 40.

第２の実施形態によれば、基板を水平から直立させても、蒸着ステージ２０と受けピン４０との干渉をなくし、基板５０と蒸着ステージ２０とが密着しない部分を極力低減し、より均一な成膜を実現できる。   According to the second embodiment, even when the substrate is erected from the horizontal, interference between the vapor deposition stage 20 and the receiving pin 40 is eliminated, and a portion where the substrate 50 and the vapor deposition stage 20 are not in close contact with each other is reduced as much as possible. Film formation can be realized.

また、第２の実施形態によれば、昇降機構３０を蒸着ステージ２０と共に回転させているので、基板５０とマスク８１の密着性を高めることができ、成膜のボケを抑えることがでる。   Further, according to the second embodiment, since the elevating mechanism 30 is rotated together with the vapor deposition stage 20, the adhesion between the substrate 50 and the mask 81 can be improved, and the film formation blur can be suppressed.

さらに、第２の実施形態によれば、受けピン４０を回転させないことにより、回転機構の負荷を低減できる。   Furthermore, according to the second embodiment, the load on the rotating mechanism can be reduced by not rotating the receiving pin 40.

１：真空蒸着チャンバ ２：搬送チャンバ
７：蒸着部 ８：アライメント部
９：受渡部 １０：搬送ロボット
１１：アーム １２：櫛歯状ハンド
２０：蒸着ステージ ２１：回転軸
２２：支持部 ２３：貫通穴
３０：昇降機構 ３１：ガイド３１
３２：ボールネジ ３３：モータ
３４：ベローズ ３５：大気ＢＯＸ
３６：ナットハウジング ３７：支持棒
３８：駆動線 ４０：受けピン
４１：固定部 ５０：基板
７１：蒸着源 ８１：マスク
９０：蒸着ステージ回転機構 ９１：真空内配線リンク機構
９６：回転駆動部。 1: Vacuum deposition chamber 2: Transfer chamber 7: Deposition unit 8: Alignment unit 9: Delivery unit 10: Transfer robot 11: Arm 12: Comb-shaped hand 20: Deposition stage 21: Rotating shaft 22: Support unit 23: Through hole 30: Lifting mechanism 31: Guide 31
32: Ball screw 33: Motor 34: Bellows 35: Atmospheric BOX
36: Nut housing 37: Support rod 38: Drive line 40: Receiving pin 41: Fixing part 50: Substrate 71: Deposition source 81: Mask 90: Deposition stage rotation mechanism 91: In-vacuum wiring link mechanism 96: Rotation drive part

Claims (8)

基板を載置する蒸着ステージを有し、前記蒸着ステージに複数の受けピンを介して前記基板を水平状態で受渡しする受渡部と、前記受渡部を回転させて略直立または直立姿勢にする回転機構と、真空チャンバ内で前記略直立姿勢で前記基板に蒸着材料を蒸着する蒸着手段とを有する有機ＥＬデバイス製造装置において、
前記受渡部は、前記蒸着ステージを上下させる昇降機構と、前記昇降機構を支持する支持部とを有し、前記複数の受けピンは前記支持部に固定され、前記回転機構は前記支持部の回転軸を回転させて前記受渡部を回転させることを特徴とする有機ＥＬデバイス製造装置。 A vapor deposition stage on which the substrate is placed; a delivery unit that delivers the substrate to the vapor deposition stage in a horizontal state via a plurality of receiving pins ; and a rotation mechanism that rotates the delivery unit to be in a substantially upright or upright posture. And an organic EL device manufacturing apparatus having a vapor deposition means for depositing a vapor deposition material on the substrate in the substantially upright posture in a vacuum chamber,
The delivery unit includes an elevating mechanism that moves the vapor deposition stage up and down, and a support unit that supports the elevating mechanism, the plurality of receiving pins are fixed to the support unit, and the rotation mechanism rotates the support unit An organic EL device manufacturing apparatus, wherein a shaft is rotated to rotate the delivery unit. 基板を載置する蒸着ステージを有し、前記蒸着ステージに複数の受けピンを介して前記基板を水平状態で受渡しする受渡部と、前記蒸着ステージを回転させて略直立または直立姿勢にする回転機構と、真空チャンバ内で前記略直立姿勢で前記基板に蒸着材料を蒸着する蒸着手段とを有する有機ＥＬデバイス製造装置において、
前記受渡部は、前記蒸着ステージを上下させる昇降機構と、前記昇降機構を支持する支持部と、前記支持部の下部に設けられ、前記複数の受けピンを固定する固定部とを有し、前記回転機構は前記支持部の回転軸を回転させて前記蒸着ステージを回転させ、前記固定部は前記支持部と共に回転しないことを特徴とする有機ＥＬデバイス製造装置。 A vapor deposition stage on which the substrate is placed; a delivery unit that delivers the substrate in a horizontal state to the vapor deposition stage via a plurality of receiving pins; and a rotation mechanism that rotates the vapor deposition stage into a substantially upright or upright posture. And an organic EL device manufacturing apparatus having a vapor deposition means for depositing a vapor deposition material on the substrate in the substantially upright posture in a vacuum chamber,
The delivery unit includes a lifting mechanism for raising and lowering the deposition stage, a support portion for supporting the lifting mechanism, provided at a lower portion of the supporting portion, a fixing portion for fixing the plurality of receiving pins, the An organic EL device manufacturing apparatus, wherein the rotation mechanism rotates the rotation axis of the support portion to rotate the vapor deposition stage, and the fixing portion does not rotate together with the support portion . 前記昇降機構の内部は前記真空チャンバの真空と隔離され、前記内部は中空部を有する前記支持部と、前記回転軸及び前記回転機構とを介して大気に開放されていることを特徴とする請求項１または２に記載の有機ＥＬデバイス製造装置。 The interior of the elevating mechanism is isolated from the vacuum of the vacuum chamber, and the interior is open to the atmosphere via the support portion having a hollow portion, the rotating shaft, and the rotating mechanism. Item 3. The organic EL device manufacturing apparatus according to Item 1 or 2 . 前記昇降機構は前記支持部又は前記蒸着ステージの四隅に設けられていることを特徴とする請求項１または２に記載の有機ＥＬデバイス製造装置。 The elevating mechanism of the organic EL device manufacturing apparatus according to claim 1 or 2, characterized in that provided at the four corners of the support or the evaporation stage. 前記昇降機構は駆動モータと、一端が蒸着ステージ側に固定されたボールネジと、前記昇降機構の前記駆動モータ側に固定されたナットと、を有することを特徴とする請求項１または２に記載の有機ＥＬデバイス製造装置。 The elevating mechanism includes a drive motor, a ball screw having one end fixed to the deposition stage side, according to claim 1 or 2, characterized in that it has a nut that is fixed to the driving motor side of the elevating mechanism Organic EL device manufacturing equipment. 前記略直立姿勢または直立姿勢において、前記昇降機構が前記基板の蒸着パターンを規定するマスクに近接させる機構を兼ねることを特徴とする請求項１乃至５のいずれかに記載の有機ＥＬデバイス製造装置。 In the substantially upright position or the upright position, the organic EL device manufacturing apparatus according to any one of claims 1 to 5 wherein the lifting mechanism is characterized in that also serves as a mechanism for close to mask defining a deposition pattern of the substrate. 複数の受けピンを介して基板を水平状態の蒸着ステージで受渡し、前記蒸着ステージを
回転させて略直立姿勢または直立姿勢にし、真空チャンバ内で前記基板に蒸着材料を蒸着
する有機ＥＬデバイス製造方法において、
前記複数の受けピンの先端より上方に前記蒸着ステージを移動し、前記基板を前記複数
の受けピンから前記蒸着ステージに移載し、その状態で前記回転を行うことを特徴とする
有機ＥＬデバイス製造方法。 In a method for manufacturing an organic EL device, a substrate is delivered through a plurality of receiving pins on a horizontal deposition stage, and the deposition stage is rotated to be in a substantially upright posture or an upright posture, and a deposition material is deposited on the substrate in a vacuum chamber. ,
Manufacturing the organic EL device, wherein the vapor deposition stage is moved above the tips of the plurality of receiving pins, the substrate is transferred from the plurality of receiving pins to the vapor deposition stage, and the rotation is performed in that state. Method. 前記基板と前記基板の蒸着パターンを規定するマスクとのアライメント後、前記蒸着ス
テージの昇降機構により前記基板を前記マスクに密着させることを特徴とする請求項７に
記載の有機ＥＬデバイス製造方法。 The organic EL device manufacturing method according to claim 7 , wherein after the alignment between the substrate and a mask defining a deposition pattern of the substrate, the substrate is brought into close contact with the mask by an elevating mechanism of the deposition stage.
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